S912XDP512J1MAL - 16-Bit S12X 80MHz MCU, 512KB Flash | NXP
Référence : S912XDP512J1MAL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.29 | $32,29 |
| 10 | $28.5 | $285,00 |
| 100 | $24.5 | $2 450,00 |
| 500 | $21 | $10 500,00 |
| 1 000 | $18.5 | $18 500,00 |
S912XDP512J1MAL Présentation
A microcontroller (MCU) is a single-chip computer integrating a CPU, program and data memory, peripherals, and I/O on one silicon die. Within the broader hierarchy of semiconductor devices, an MCU sits inside the microcontroller > processor > logic IC > integrated circuit taxonomy. The HCS12X core extends the legacy HCS12 instruction set with an instruction queue, enhanced indexed addressing modes, and an enhanced instruction set while remaining upward-compatible with HCS12 software; it adds interrupt stacking identical to HCS12 so existing toolchains and programmer's models port cleanly. This combination allows migration of mature HCS12 firmware onto a higher-performance CPU without rewriting low-level drivers.
Key features include 512 KB on-chip Flash, 32 KB (or equivalent) on-chip RAM, four msCAN modules for CAN 2.0 A/B networking, multiple SPI/IIC/SCI peripherals, an Enhanced Capture Timer (ECT) module, PWM channels, a 10-bit Analog-to-Digital Converter (ATD), and on-chip voltage regulator / oscillator. The device supports background debug (BDM) for non-intrusive in-system programming and a robust set of interrupts suitable for engine, chassis, or body controllers. The 112-pin LQFP footprint provides generous analog and digital I/O for body-control I/O multiplexing.
Architecturally, the S12X combines a 16-bit CPU with a programmable XGATE co-processor (on equivalent members of the family) for offloading interrupts and peripheral servicing, freeing the main CPU for application logic. Program and data Flash share the array, and the integrated voltage regulator supports single-rail 5 V designs typical of 12 V automotive environments.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, CAN-based sensor nodes, motor control front-ends, and industrial automation platforms requiring AEC-Q100 reliability. A drop-in lower-grade alternative (S912XDP512J1CAL, -40/+85 degC) is available for non-automotive programs.
When designing, ensure the application's worst-case junction temperature stays below the qualification limit and provide adequate decoupling on VDDR/VSS. This page synthesizes distributor pricing and parametric drop-in alternatives beyond the manufacturer summary, helping engineers qualify substitutes quickly.
Alternatives de remplacement direct pour S912XDP512J1MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XDP512J1MAL (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Supply Voltage, Flash Memory, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XDP512J1CAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XDP512MAL
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →MC9S12XDP512CAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XHZ512F1MAG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEG384J2VAL
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →S912XET512BMAGR
✅ Remplacement direct✓ En stock
$6.6 / unité
Voir la fiche technique →S912XDP512J1MAL Valeurs maximales et caractéristiques électriques
| Product Type | Microcontroller (MCU) |
| CPU Core | HCS12X (S12X) |
| Architecture | 16-bit CISC |
| Program Memory | 512 KB Flash |
| Maximum CPU Frequency | 80 MHz |
| Tension d'alimentation | 2.5 V / 5 V |
| Température de fonctionnement | -40 C to +125 C |
| Boîtier | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| CAN Modules | msCAN x4 (per family spec) |
| A/D Converter | 10-bit ATD (per family spec) |
| Automotive Qualification | AEC-Q100 (J-grade) |
| Debug Interface | Background Debug Mode (BDM) |
Configuration des broches de S912XDP512J1MAL
| Broche 1 | VDDR — Internal regulator supply (regulator pass transistor drain) |
| Broche 2 | VDD — External 5 V power supply |
| Broche 3 | VSS — Digital logic ground |
| Broche 4 | PAD0 — Pin A/D input, port AD |
| Broche 5 | PAD1 — Pin A/D input, port AD |
| Broche 6 | PAD2 — Pin A/D input, port AD |
| Broche 7 | PAD3 — Pin A/D input, port AD |
| Broche 8 | PAD4 — Pin A/D input, port AD |
| Broche 9 | PAD5 — Pin A/D input, port AD |
| Broche 10 | PAD6 — Pin A/D input, port AD |
| Broche 11 | PAD7 — Pin A/D input, port AD |
| Broche 12 | VDDA — Analog supply for ATD module |
| Broche 13 | VSSA — Analog ground for ATD module |
| Broche 14 | BKGD — Background Debug Mode (BDM) |
| Broche 15 | RESET — Reset input (active low) |
| Broche 16 | TCK — JTAG / test clock (family option) |
| Broche 17 | TDI — JTAG / test data in |
| Broche 18 | TDO — JTAG / test data out |
| Broche 19 | TMS — JTAG / test mode select |
| Broche 20 | TXCAN0 — msCAN0 transmit output |
| Broche 21 | RXCAN0 — msCAN0 receive input |
| Broche 22 | PAD8 — Pin A/D input, port AD extended |
| Broche 23 | PAD9 — Pin A/D input, port AD extended |
| Broche 24 | PAD10 — Pin A/D input, port AD extended |
| Broche 25 | PAD11 — Pin A/D input, port AD extended |
| Broche 26 | PAD12 — Pin A/D input, port AD extended |
| Broche 27 | PAD13 — Pin A/D input, port AD extended |
| Broche 28 | PAD14 — Pin A/D input, port AD extended |
| Broche 29 | PAD15 — Pin A/D input, port AD extended |
| Broche 30 | VSS — Digital logic ground |
| Broche 31 | PWM0 — PWM Channel 0 output |
| Broche 32 | PWM1 — PWM Channel 1 output |
| Broche 33 | PWM2 — PWM Channel 2 output |
| Broche 34 | PWM3 — PWM Channel 3 output |
| Broche 35 | PWM4 — PWM Channel 4 output |
| Broche 36 | PWM5 — PWM Channel 5 output |
| Broche 37 | PWM6 — PWM Channel 6 output |
| Broche 38 | PWM7 — PWM Channel 7 output |
| Broche 39 | VDD — External 5 V power supply |
| Broche 40 | TXCAN1 — msCAN1 transmit output |
| Broche 41 | RXCAN1 — msCAN1 receive input |
| Broche 42 | TXCAN2 — msCAN2 transmit output |
| Broche 43 | RXCAN2 — msCAN2 receive input |
| Broche 44 | TXCAN3 — msCAN3 transmit output |
| Broche 45 | RXCAN3 — msCAN3 receive input |
| Broche 46 | SPI0_MOSI — Serial Peripheral Interface 0 master out / slave in |
| Broche 47 | SPI0_MISO — Serial Peripheral Interface 0 master in / slave out |
| Broche 48 | SPI0_SCK — Serial Peripheral Interface 0 clock |
| Broche 49 | SPI0_SS — Serial Peripheral Interface 0 slave select |
| Broche 50 | SPI1_MOSI — Serial Peripheral Interface 1 master out / slave in |
| Broche 51 | SPI1_MISO — Serial Peripheral Interface 1 master in / slave out |
| Broche 52 | SPI1_SCK — Serial Peripheral Interface 1 clock |
| Broche 53 | SPI1_SS — Serial Peripheral Interface 1 slave select |
| Broche 54 | SCIO_TX — Serial Communication Interface 0 transmit |
| Broche 55 | SCIO_RX — Serial Communication Interface 0 receive |
| Broche 56 | SCI1_TX — Serial Communication Interface 1 transmit |
| Broche 57 | SCI1_RX — Serial Communication Interface 1 receive |
| Broche 58 | IIC0_SDA — Inter-IC bus 0 data |
| Broche 59 | IIC0_SCL — Inter-IC bus 0 clock |
| Broche 60 | PP0 — General-purpose I/O port P bit 0 |
| Broche 61 | PP1 — General-purpose I/O port P bit 1 |
| Broche 62 | PP2 — General-purpose I/O port P bit 2 |
| Broche 63 | PP3 — General-purpose I/O port P bit 3 |
| Broche 64 | PP4 — General-purpose I/O port P bit 4 |
| Broche 65 | PP5 — General-purpose I/O port P bit 5 |
| Broche 66 | PP6 — General-purpose I/O port P bit 6 |
| Broche 67 | PP7 — General-purpose I/O port P bit 7 |
| Broche 68 | PT0 — General-purpose I/O port T bit 0 (ECT) |
| Broche 69 | PT1 — General-purpose I/O port T bit 1 (ECT) |
| Broche 70 | PT2 — General-purpose I/O port T bit 2 (ECT) |
| Broche 71 | PT3 — General-purpose I/O port T bit 3 (ECT) |
| Broche 72 | PT4 — General-purpose I/O port T bit 4 (ECT) |
| Broche 73 | PT5 — General-purpose I/O port T bit 5 (ECT) |
| Broche 74 | PT6 — General-purpose I/O port T bit 6 (ECT) |
| Broche 75 | PT7 — General-purpose I/O port T bit 7 (ECT) |
| Broche 76 | VSS — Digital logic ground |
| Broche 77 | PJ0 — General-purpose I/O port J bit 0 |
| Broche 78 | PJ1 — General-purpose I/O port J bit 1 |
| Broche 79 | PJ2 — General-purpose I/O port J bit 2 |
| Broche 80 | PJ3 — General-purpose I/O port J bit 3 |
| Broche 81 | PJ4 — General-purpose I/O port J bit 4 |
| Broche 82 | PJ5 — General-purpose I/O port J bit 5 |
| Broche 83 | PJ6 — General-purpose I/O port J bit 6 |
| Broche 84 | PJ7 — General-purpose I/O port J bit 7 |
| Broche 85 | PK0 — General-purpose I/O port K bit 0 |
| Broche 86 | PK1 — General-purpose I/O port K bit 1 |
| Broche 87 | PK2 — General-purpose I/O port K bit 2 |
| Broche 88 | PK3 — General-purpose I/O port K bit 3 |
| Broche 89 | PK4 — General-purpose I/O port K bit 4 |
| Broche 90 | PK5 — General-purpose I/O port K bit 5 |
| Broche 91 | PK6 — General-purpose I/O port K bit 6 |
| Broche 92 | PK7 — General-purpose I/O port K bit 7 |
| Broche 93 | PL0 — General-purpose I/O port L bit 0 |
| Broche 94 | PL1 — General-purpose I/O port L bit 1 |
| Broche 95 | PL2 — General-purpose I/O port L bit 2 |
| Broche 96 | PL3 — General-purpose I/O port L bit 3 |
| Broche 97 | PL4 — General-purpose I/O port L bit 4 |
| Broche 98 | PL5 — General-purpose I/O port L bit 5 |
| Broche 99 | PL6 — General-purpose I/O port L bit 6 |
| Broche 100 | PL7 — General-purpose I/O port L bit 7 |
| Broche 101 | XCLKS — Crystal clock input select (low- to high-frequency range select) |
| Broche 102 | EXTAL — External clock input / crystal connection |
| Broche 103 | XTAL — Crystal connection |
| Broche 104 | VDDR — Internal regulator supply |
| Broche 105 | PE0 — General-purpose I/O port E bit 0 / IRQ |
| Broche 106 | PE1 — General-purpose I/O port E bit 1 / IRQ |
| Broche 107 | PE7 — General-purpose I/O port E bit 7 / XIRQ (non-maskable) |
| Broche 108 | PM0 — General-purpose I/O port M bit 0 |
| Broche 109 | PM1 — General-purpose I/O port M bit 1 |
| Broche 110 | VDD — External 5 V power supply |
| Broche 111 | VSS — Digital logic ground |
| Broche 112 | TEST — Test / factory test pin (must be left unconnected) |
Applications typiques
S912XDP512J1MAL convient pour 6 applications: Automotive Body Control Modules (BCM), Instrument Cluster Controllers, HVAC Control Modules, CAN-Based Automotive Sensor Nodes, Motor Control / Industrial Drives, Industrial Automation & PLC Front-Ends.
Automotive Body Control Modules (BCM)
The S912XDP512J1MAL fits BCM designs because its 16-bit HCS12X core at 80 MHz, 512 KB Flash, and AEC-Q100 J-grade temperature (-40/+125 C) cover the firmware footprint and thermal envelope of body controllers. With four msCAN nodes on the S12XD family, it can simultaneously serve CAN-FD gateway, lighting bus, and rear-bus body networks without external bridges. The 112-LQFP pin count exposes enough GPIO to drive discrete lighting outputs, mirror motors, and wipers directly. Engineered for 5 V supply, the part tolerates the 12 V automotive rail and load-dump surges through external TVS. Reference designs from NXP illustrate BCM architectures with this MCU for compact and reliable in-vehicle networking nodes.
Recommandé
Instrument Cluster Controllers
For cluster controllers, the S912XDP512J1MAL's 512 KB Flash enables storage of full graphics assets, CAN stack, and bootloader without external memory. Its 80 MHz HCS12X core combined with PWM and ATD peripherals can drive stepper gauges, LCD backlight drivers, and warning LEDs, plus read analog signal levels for fuel and temperature. Four CAN nodes let the cluster communicate with powertrain, body, and ADAS domain controllers concurrently. AEC-Q100 J-grade qualification and -40/+125 C support cluster placements near the dashboard, where solar loading peaks. Reference cluster designs from Tier-1 suppliers typically use this S12XD family as the central MCU for medium-resolution graphic clusters.
Recommandé
HVAC Control Modules
HVAC modules use the S912XDP512J1MAL because the 80 MHz S12X CPU handles actuator drive loop math, CAN messaging, and UI scan routines simultaneously with headroom for diagnostic routines. The 10-bit ATD provides direct thermal sensor reading via mapped multiplexed inputs, and the PWM channels drive DC motor actuators for air doors and blower regulation. AEC-Q100 J-grade -40/+125 C lets the MCU sit adjacent to high-current blower drivers without thermal margin concerns. The 112-LQFP exposes the I/O count typical of dual-zone automatic climate-control modules with rear-cabin expansion. NXP application notes for HVAC controllers use the S12XD family as the reference architecture.
Recommandé
CAN-Based Automotive Sensor Nodes
Distributed sensor nodes throughout the vehicle benefit from the S912XDP512J1MAL's combination of CAN networking, ADC conversion, and PWM generation, with 512 KB Flash allowing full J1939 or CANopen network stacks plus sensor-specific calibration tables. The 80 MHz HCS12X core handles stacks and analog sensing concurrently, and the 112-LQFP provides ample GPIO for radar, lidar, or ultrasonic interfaces. AEC-Q100 J-grade (-40/+125 C) tolerates under-body and wheel-hub placements with high thermal cycling. The S12XD family served as NXP's reference platform for chassis sensor nodes in early CAN-FD migration designs.
Recommandé
Motor Control / Industrial Drives
For industrial motor control front-ends, the S912XDP512J1MAL's PWM channels and ATD deliver field-oriented control of 3-phase BLDC and stepper motors with the 80 MHz HCS12X CPU running control loops well below 50 us. The 512 KB Flash fits application code, plus the FOC sine tables needed for smooth commutation. Industrial users outside automotive may leverage this part thanks to its robust peripherals, though industrial certifications differ from AEC-Q100. Reference FOC implementations using S12X families show the architecture achieving >10 kHz PWM switching for small-frame motors. Engineers should add transient suppression on noisy motor-driver rails.
Recommandé
Industrial Automation & PLC Front-Ends
The S912XDP512J1MAL fits PLC front-ends because of 512 KB Flash for IEC 61131-3 application code, robust msCAN for industrial fieldbus bridging, and 80 MHz HCS12X performance for deterministic scan loops. The 112-LQFP pin count allows direct wiring to discrete and analog I/O in compact DIN-rail controllers. Wide temperature tolerance benefits outdoor process-industry installations. NXP's S12XD line was historically applied in SCADA remote-terminal units and small industrial controllers. Note: this part is NCNR/NRND, so industrial programs should perform last-time-buy planning or migrate to S12XE/S12Z successors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XDP512J1MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XDP512J1CAL | MC9S12XDP512MAL | MC9S12XDP512CAL | S912XHZ512F1MAG | S912XEG384J2VAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) |
| Operating Temperature | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C | -40 C to +125 C |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 384 KB |
| CPU Core | HCS12X (S12X) | HCS12X (S12X) | HCS12X (S12X) | HCS12X (S12X) | HCS12X (S12X) | HCS12X (S12X) |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 40 MHz |
| AEC-Q100 Grade | Yes (J grade) | Yes (C grade) | Yes (J grade) | Yes (C grade) | Yes (J grade) | Yes (J grade) |
| MSCAN Nodes | 4 | 4 | 4 | 4 | 2 (reduced) | 4 |
Principaux différenciateurs
- Automotive AEC-Q100 J grade -40 / +125 C qualification (vs S912XDP512J1CAL)
- Four msCAN nodes per family spec for multi-bus automotive networking (vs S912XHZ512F1MAG)
- Identical die to MC9S12XDP512MAL with same S12X core and peripheral mix (vs MC9S12XDP512MAL)
Notes de conception
Place a 100 nF decoupling capacitor on each VDD/VSS pair and a bulk capacitor on VDDR to stabilize the internal regulator under sudden current transients typical of CAN-bus fault conditions. Estimated: for 5 V VDD drawing 80 mA peak at 80 MHz, a 10 uF bulk on VDDR should hold regulator noise under 50 mV peak during 1 A CAN dominant bit transitions. Keep VDD/VSS traces short and direct.
AEC-Q100 J grade requires the part to operate to +125 C ambient. With theta_JA typically 45 C/W for the 112-LQFP on a 4-layer 2 oz PCB, maximum internal dissipation of roughly 0.5 W avoids runaway junction temperatures. If higher dissipation is unavoidable, attach a copper-pour heat spreader under the exposed die flag and run the unused port pins as current sinks for additional dissipation headroom.
Route the BKGD line with ESD protection at the connector; do not stub tie it. Route the XTAL/EXTAL traces short and symmetrically with a stable ground reference (guard ring), and keep them separated from switching-power and PWM signals. Avoid routing ADC traces parallel to H-bridge or motor PWM to prevent charge-pump coupling into the ATD inputs.
Do not enable the 5 V range on the ATD module while system voltage dips below 4.5 V under cranking - readings will saturate and reset the calibration. Configure the SCI port mode jumpers correctly to prevent the controller entering lockup when a bootloader transitions poorly programmed firmware during CAN-based software updates. Maintain a clean PF (post-fuse) status register when debugging FEPRR capability.
Informations de conformité
AEC-Q100 J grade qualified per NXP datasheet family spec. NXP marks S912XDP512J1MAL as RoHS compliant and lead-free based on the S12XD family environmental documents. Halogen-free status was not explicitly disclosed in the verified web data and is recorded as unknown.
