S9S08AW32E5MFUE - 8-bit S08 MCU, 32KB Flash, 40MHz, 64-QFP | NXP
N.º da peça: S9S08AW32E5MFUE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.45 | $64,50 |
| 100 | $5.55 | $555,00 |
| 500 | $4.8 | $2.400,00 |
| 1.000 | $4.15 | $4.150,00 |
S9S08AW32E5MFUE Visão geral
An 8-bit microcontroller (MCU) is a compact embedded processor that integrates a CPU core, memory (Flash/RAM), and peripheral interfaces onto a single silicon die. The HCS08 core belongs to the broader category of 8-bit CISC microcontrollers, which sit hierarchically below 32-bit ARM Cortex-M devices in performance but above simple state machines in capability. Within NXP's portfolio, the S08AW family targets cost-sensitive, real-time control applications where deterministic interrupt response and low power matter more than raw compute throughput.
The S9S08AW32E5MFUE integrates 32KB of Flash program memory, 2KB of RAM, and a rich peripheral set including timers, ADC, SCI/SPI/I2C communication modules, and an on-chip CAN controller suited for automotive networks. Its 40MHz bus clock delivers 20MHz instruction rate with the HCS08's enhanced 8-bit pipeline, providing predictable deterministic execution for motor control loops. Internal clock generation, watchdog timer, and low-voltage detection enhance robustness in safety-critical systems.
The device is fabricated on an automotive-qualified process and is specified across the full -40C to +125C automotive temperature range. The 64-pin QFP (14x14) package offers generous I/O count with surface-mount manufacturability, while the HCS08 core's CISC instruction set keeps code density high and compiler overhead low. On-chip debug and Flash programming support simplify field updates and production testing.
Typical applications include automotive body controllers, HVAC actuators, instrument clusters, CAN node endpoints, industrial sensor hubs, and small motor drives. The combination of CAN, ADC, and PWM-rich timers makes the S9S08AW32 particularly well suited to distributed in-vehicle networks. Compact embedded systems in industrial automation, such as valve controllers or remote sensor nodes, also benefit from the part's rugged temperature range and peripheral integration.
When designing with the S9S08AW32E5MFUE, ensure decoupling capacitors are placed close to the supply pins and that the CAN bus termination and ESD protection follow IEC 62228 guidelines for automotive network reliability. Always program the Flash configuration section to lock unused pins and configure the watchdog for fail-safe operation in safety-relevant applications.
This page synthesizes distributor pricing, drop-in alternatives from the S9S08AW family, and practical design notes not found in the manufacturer datasheet, providing engineers with the information needed to specify, source, and qualify this automotive MCU.
Alternativas drop-in para S9S08AW32E5MFUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S08AW32E5MFUE (mesmo formato e footprint) — diferindo em Operating Temperature Range, Package, ADC, Core, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S08AW32E5CFUE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08AW32E5MPUE
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →MC9S08AW32CFUER
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08AW60E5MFGE
✅ Drop-In✓ Em estoque
$6.05 / unidade
Ver ficha técnica →MC9S08AW32MFGE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.15 / unidade
Ver ficha técnica →S9S08AW32E5MFUE Classificações máximas e características elétricas
| Core Architecture | HCS08 (8-bit CISC) |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB |
| Maximum CPU Frequency | 40 MHz |
| Supply Voltage Range | 3.3 V / 5 V (2.7 V to 5.5 V) |
| Faixa de temperatura de operação | -40 C to +125 C (automotive grade) |
| Encapsulamento | 64-QFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Automotive Qualification | Yes (AEC-Q100) |
| Communication Interfaces | CAN, SCI (UART), SPI, I2C |
| On-chip Debug | Background Debug Mode (BDM) |
| Watchdog Timer | Yes (COP) |
| Low-Voltage Detect | Yes |
| Status RoHS | Compliant |
Configuração de pinos do S9S08AW32E5MFUE
| Pino 1 | PTD7/KBI3P7 — Port D bit 7 / Keyboard interrupt |
| Pino 2 | PTD6/KBI3P6 — Port D bit 6 / Keyboard interrupt |
| Pino 3 | PTD5/KBI3P5 — Port D bit 5 / Keyboard interrupt |
| Pino 4 | PTD4/KBI3P4 — Port D bit 4 / Keyboard interrupt |
| Pino 5 | VDD — Power supply (3.3V/5V) |
| Pino 6 | VSS — Ground |
| Pino 7 | PTD3/KBI3P3 — Port D bit 3 / Keyboard interrupt |
| Pino 8 | PTD2/KBI3P2 — Port D bit 2 / Keyboard interrupt |
| Pino 9 | PTD1/KBI3P1 — Port D bit 1 / Keyboard interrupt |
| Pino 10 | PTD0/KBI3P0 — Port D bit 0 / Keyboard interrupt |
| Pino 11 | PTC7 — Port C bit 7 |
| Pino 12 | PTC6 — Port C bit 6 |
| Pino 13 | PTC5 — Port C bit 5 |
| Pino 14 | PTC4 — Port C bit 4 |
| Pino 15 | PTC3 — Port C bit 3 |
| Pino 16 | PTC2 — Port C bit 2 |
| Pino 17 | PTC1 — Port C bit 1 |
| Pino 18 | PTC0 — Port C bit 0 |
| Pino 19 | PTB7 — Port B bit 7 |
| Pino 20 | PTB6 — Port B bit 6 |
| Pino 21 | PTB5 — Port B bit 5 |
| Pino 22 | PTB4 — Port B bit 4 |
| Pino 23 | PTB3 — Port B bit 3 |
| Pino 24 | PTB2 — Port B bit 2 |
| Pino 25 | PTB1 — Port B bit 1 |
| Pino 26 | PTB0 — Port B bit 0 |
| Pino 27 | PTA7 — Port A bit 7 |
| Pino 28 | PTA6 — Port A bit 6 |
| Pino 29 | PTA5 — Port A bit 5 |
| Pino 30 | PTA4 — Port A bit 4 |
| Pino 31 | PTA3 — Port A bit 3 |
| Pino 32 | PTA2 — Port A bit 2 |
| Pino 33 | PTA1 — Port A bit 1 |
| Pino 34 | PTA0 — Port A bit 0 |
| Pino 35 | VDD — Power supply (3.3V/5V) |
| Pino 36 | VSS — Ground |
| Pino 37 | BKGD — Background Debug Mode pin |
| Pino 38 | RESET — External reset input (active low) |
| Pino 39 | TCLK/PTE7 — Timer clock / Port E bit 7 |
| Pino 40 | PTE6 — Port E bit 6 |
| Pino 41 | PTE5 — Port E bit 5 |
| Pino 42 | PTE4 — Port E bit 4 |
| Pino 43 | PTE3 — Port E bit 3 |
| Pino 44 | PTE2 — Port E bit 2 |
| Pino 45 | PTE1 — Port E bit 1 |
| Pino 46 | PTE0 — Port E bit 0 |
| Pino 47 | CAN_TX — CAN transmit output |
| Pino 48 | CAN_RX — CAN receive input |
| Pino 49 | TXD1 — SCI1 transmit |
| Pino 50 | RXD1 — SCI1 receive |
| Pino 51 | SPSCK1 — SPI1 clock |
| Pino 52 | MOSI1 — SPI1 master-out/slave-in |
| Pino 53 | MISO1 — SPI1 master-in/slave-out |
| Pino 54 | SS1 — SPI1 slave select |
| Pino 55 | SCL — I2C clock |
| Pino 56 | SDA — I2C data |
| Pino 57 | ADC0 — ADC channel 0 input |
| Pino 58 | ADC1 — ADC channel 1 input |
| Pino 59 | ADC2 — ADC channel 2 input |
| Pino 60 | ADC3 — ADC channel 3 input |
| Pino 61 | ADC4 — ADC channel 4 input |
| Pino 62 | ADC5 — ADC channel 5 input |
| Pino 63 | ADC6 — ADC channel 6 input |
| Pino 64 | ADC7 — ADC channel 7 input |
Aplicações típicas
S9S08AW32E5MFUE é adequado para 6 aplicaçãos: Automotive Body Control Modules, HVAC Actuator Controllers, Instrument Cluster Sub-Processors, Industrial Sensor Hubs, CAN Node Endpoints in Vehicle Networks, Small Motor Control Drivers.
Automotive Body Control Modules
The S9S08AW32E5MFUE is purpose-built for automotive body control modules where deterministic CAN communication and PWM-rich timers are essential. Its integrated CAN 2.0B controller connects directly to the vehicle body network for lighting, door lock, and mirror control functions, while the HCS08 core's fast interrupt response handles real-time actuator feedback loops. The AEC-Q100 qualification and 32 KB Flash comfortably fit body control firmware including LIN slave communication stacks.
Recomendado
HVAC Actuator Controllers
Automotive HVAC actuators require reliable brushless DC motor control with multiple temperature sensor inputs and CAN network integration. The S9S08AW32E5MFUE delivers up to 40 MHz of HCS08 processing power for PID control loops, while its ADC channels interface directly with NTC temperature and pressure sensors. The -40C to +125C automotive temperature range ensures operation in under-hood and dashboard environments, and the 32 KB Flash accommodates calibration tables for different vehicle platforms.
Recomendado
Instrument Cluster Sub-Processors
In distributed instrument cluster architectures, the S9S08AW32E5MFUE serves as a CAN-connected sub-processor that drives gauge stepper motors and reads fuel/temperature sensors. Its timer modules generate precise PWM signals for bipolar stepper motor microstepping, while the HCS08 core manages CAN message filtering for cluster data broadcast. The 64-QFP package provides ample GPIO for direct connection to multiple sensor inputs without external logic.
Recomendado
Industrial Sensor Hubs
For industrial sensor aggregation nodes, the S9S08AW32E5MFUE offers an automotive-grade platform with extended temperature tolerance suitable for factory floor deployment. Its CAN interface connects to industrial CANopen or DeviceNet networks, while the ADC and I2C peripherals read multiple sensor types including temperature, pressure, and flow. The 32 KB Flash supports protocol stacks and sensor calibration data, with BDM enabling field firmware updates over the same debug interface.
Recomendado
CAN Node Endpoints in Vehicle Networks
The S9S08AW32E5MFUE excels as a low-cost CAN endpoint in modern automotive networks, where it handles local sensor/actuator interfaces while communicating with central body or chassis domain controllers. Its integrated CAN module, ADC, and PWM timers replace several discrete components, reducing BOM cost in seat controllers, mirror modules, and lighting nodes. The AEC-Q100 grade and 40 MHz HCS08 performance ensure compliance with automotive EMC and functional safety requirements.
Recomendado
Small Motor Control Drivers
Small DC and stepper motor control in automotive and industrial environments is a sweet spot for the S9S08AW32E5MFUE. Its HCS08 core runs commutation algorithms while the on-chip timers generate center-aligned PWM with dead-time insertion, and the ADC samples back-EMF or current feedback. The 64-QFP package allows direct mounting to motor driver PCBs without intermediate interconnect, and the AEC-Q100 grade supports deployment in seat adjusters, mirror actuators, and throttle-by-wire subsystems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S08AW32E5MFUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S08AW32E5CFUE | S9S08AW32E5MPUE | MC9S08AW32CFUER | S9S08AW60E5MFGE | MC9S08AW32MFGE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFP (14x14) | 64-QFP (14x14) - same | 64-LQFP - compatible | 64-QFP (14x14) - same | 64-LQFP - compatible | 64-LQFP - compatible |
| Core | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 60 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 4 KB | 2 KB |
| Maximum Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
Principais diferenciais
- Higher Flash density within same 64-QFP footprint (vs MC9S08AW32CFUER)
- Optimized 32 KB Flash for cost-sensitive body controllers (vs S9S08AW60E5MFGE)
- Standard QFP-14x14 tray packaging (vs S9S08AW32E5MPUE)
Notas de projeto
Place 100 nF decoupling capacitors as close as possible to each VDD/VSS pin pair on the 64-QFP package, with additional 10 uF bulk capacitors at the board's power entry point. The S9S08AW32E5MFUE operates from 2.7 V to 5.5 V, but automotive 12 V battery systems require a linear regulator (such as NXP's TJA1027 family) to step down the rail. Include reverse-battery and load-dump protection per ISO 7637-2 for automotive deployment.
Estimated: At maximum operating temperature of 125 C with typical automotive body controller duty cycles (5-15% CPU load), the S9S08AW32E5MFUE's junction temperature rise is approximately 8-15 C above ambient due to its low-power HCS08 core design. The 64-QFP 14x14 mm package provides adequate thermal dissipation for the 50 mA active current draw. Forced airflow is not required for normal operation, but PCB thermal relief via copper pours improves margin in sealed enclosures.
The 64-QFP 14x14 mm package has 0.8 mm lead pitch, which is compatible with standard 4-layer SMT assembly lines and JEDEC-compliant solder paste stencil designs. Route the CAN_TX and CAN_RX differential pair to the transceiver with matched 50-ohm impedance and keep them isolated from switching signals like PWM outputs. Use a star-ground topology with the MCU's VSS pin serving as the central reference. Keep the BKGD and RESET traces short and protected from coupling to high-current motor traces.
Do not confuse the 'E5' temperature grade suffix with 'C5' - the E5 grade denotes -40 C to +125 C automotive qualification, while C5 may refer to different temperature or revision parameters. Always verify the Flash security bytes are properly configured to prevent unintended read-back of proprietary firmware via the BDM interface in production units. The on-chip CAN module requires an external transceiver (such as TJA1050 or TJA1042) for bus-level compliance - the on-chip module is protocol-only, not physical-layer.
Informações de conformidade
AEC-Q100 qualified per automotive part number suffix. RoHS and REACH compliance per NXP product page. Halogen-free status not explicitly stated in available data.