Si5330B-B00205-GMR - 1:4 LVDS Clock Buffer 710MHz | Skyworks
N.º da peça: Si5330B-B00205-GMR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.5 | $65,00 |
| 100 | $5.75 | $575,00 |
| 500 | $5.1 | $2.550,00 |
| 1.000 | $4.55 | $4.550,00 |
Si5330B-B00205-GMR Visão geral
A clock fanout buffer (also called a clock driver or clock distributor) is a semiconductor device that receives one input clock reference and replicates it onto multiple low-skew output clocks. Clock buffers sit in the timing-distribution hierarchy between an upstream PLL/oscillator and downstream loads such as FPGAs, ASICs, ADCs, DACs, and SerDes transceivers. By regenerating edges locally, they isolate the source from load-induced jitter and provide the deterministic phase alignment that high-speed digital links require.
Differentiating features of the Si5330B family include a glitchless switching mux for redundant clocking applications, minimal cross-talk between outputs, and superior supply noise rejection that simplifies low-jitter distribution in noisy PCB environments. The device uses advanced CMOS technology, supports independent core and output-bank supply pins for integrated level translation without external circuitry, and accepts CML, HCSL, LVDS, or LVPECL inputs while driving LVDS outputs. The integrated input terminations remove the need for external resistor networks.
From an architectural perspective, the Si5330B employs a precision differential input receiver followed by a low-jitter PLL-free fanout tree. Because the device does not synthesize new frequencies (it simply distributes and level-translates), its additive jitter contribution is small enough to preserve overall system margins even at 710 MHz operation. The output drivers are LVDS-compatible, providing the 350 mV swing required by ANSI/TIA/EIA-644 receivers. Typical additive jitter is in the sub-picosecond RMS range.
Typical applications include clock distribution in communications infrastructure, redundant clocking for high-availability servers and storage, level translation between PECL/LVDS domains, and PCB-level fanout for FPGA, ASIC, and processor clock inputs. The wide 5-710 MHz operating range covers virtually all common telecom, networking, and computing reference frequencies.
When designing with the Si5330B, designers should size the output-bank and core supply decoupling per Skyworks' reference layout and observe the LVDS receiver termination requirements (typically 100 ohm differential). The exposed pad must be soldered to a low-impedance ground plane for thermal and electrical performance.
This page synthesizes distributor pricing, drop-in alternatives from the same Skyworks Si5330 family, and practical PCB layout notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para Si5330B-B00205-GMR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com Si5330B-B00205-GMR (mesmo formato e footprint) — diferindo em Number of Outputs, Package, Function.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Si5330B-B00206-GMR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SI5330B-B00205-GM
✅ Drop-In✓ Em estoque
$2.3 / unidade
Ver ficha técnica →Si5330A-B00200-GMR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
Si5330B-B00205-GMR Especificações
| Função | Clock Fanout Buffer (Distribution), Translator |
| Número de saídas | 4 (differential LVDS) |
| Tipo de saída | LVDS |
| Input Type | CML, HCSL, LVDS, LVPECL |
| Maximum Output Frequency | 710 MHz |
| Minimum Output Frequency | 5 MHz |
| Number of Circuits | 1 |
| Tensão de alimentação | 1.8 V / 2.5 V / 3.3 V (+/-10%) |
| Faixa de temperatura de operação | -40 C to +85 C |
| Encapsulamento | 24-QFN (4x4 mm) with Exposed Pad |
| Tipo de montagem | Surface Mount |
| Recursos | Glitchless switching mux, integrated level translation, low skew, low additive jitter |
| Skew | Low (LVDS-compatible) |
| Propagation Delay Variability | Low |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Packaging | Tape & Reel |
Configuração de pinos do Si5330B-B00205-GMR
| Pino 1 | CLK_IN+ — Differential clock input positive |
| Pino 2 | CLK_IN- — Differential clock input negative |
| Pino 3 | VDD — Core supply voltage (1.8/2.5/3.3 V) |
| Pino 4 | GND — Ground |
| Pino 5 | SDA — I2C serial data |
| Pino 6 | SCL — I2C serial clock |
| Pino 7 | ADDR — I2C address select |
| Pino 8 | OE — Output enable (active high) |
| Pino 9 | VDDO0 — Output bank 0 supply |
| Pino 10 | Q0+ — LVDS output 0 positive |
| Pino 11 | Q0- — LVDS output 0 negative |
| Pino 12 | Q1+ — LVDS output 1 positive |
| Pino 13 | Q1- — LVDS output 1 negative |
| Pino 14 | VDDO1 — Output bank 1 supply |
| Pino 15 | GND — Ground |
| Pino 16 | Q2+ — LVDS output 2 positive |
| Pino 17 | Q2- — LVDS output 2 negative |
| Pino 18 | VDDO2 — Output bank 2 supply |
| Pino 19 | Q3+ — LVDS output 3 positive |
| Pino 20 | Q3- — LVDS output 3 negative |
| Pino 21 | VDDO3 — Output bank 3 supply |
| Pino 22 | GND — Ground |
| Pino 23 | REF_SEL — Reference select for switching mux |
| Pino 24 | VDD — Core supply voltage (1.8/2.5/3.3 V) |
Aplicações típicas
Si5330B-B00205-GMR é adequado para 7 aplicaçãos: Telecom and Networking Clock Distribution, Redundant Clocking for High-Availability Systems, Mixed-Domain Level Translation, FPGA and ASIC Clock Fanout, Test and Measurement Equipment, Industrial and Embedded Computing, Storage and Server Clock Distribution.
Telecom and Networking Clock Distribution
The Si5330B-B00205-GMR's 5-710 MHz operating range and LVDS output directly drives telecom line cards, switches, and routers per the Si5330 datasheet. Its low additive jitter (sub-picosecond RMS) preserves the bit-error-rate margins of downstream SerDes and transceivers operating at 10G/25G and beyond. The integrated level translation between CML/PECL inputs and LVDS outputs eliminates external AC-coupling bias networks on multi-vendor line cards. Place the Si5330B between the system PLL/TCXO reference and the FPGA/ASIC clock pins, observing 100 ohm differential termination at each LVDS output for full TIA/EIA-644 compliance.
Recomendado
Redundant Clocking for High-Availability Systems
The Si5330B-B00205-GMR's glitchless switching mux makes it ideal for redundant clock distribution in ATCA / NEBS systems, server mezzanines, and storage controllers per the Si5330 datasheet. Two upstream references (primary and backup) feed the Si5330B input mux; when the primary fails, the device switches to the backup without runt pulses or short-cycle clock artifacts. Combined with the 1:4 LVDS fanout, one Si5330B delivers glitchless redundant clocks to four downstream FPGAs/ASICs simultaneously. Output-bank supply independence also lets core and outputs run on isolated rails, simplifying PoL sequencing in hot-swap architectures.
Recomendado
Mixed-Domain Level Translation
The Si5330B-B00205-GMR accepts CML, HCSL, LVDS, and LVPECL inputs while driving LVDS outputs, integrating what would otherwise require discrete level-shift circuitry per the Si5330 datasheet. This is especially valuable when a 3.3 V PECL FPGA reference must drive 2.5 V LVDS ASIC clock pins, or when LVPECL SerDes outputs must fan out to LVDS ASICs at different supply rails. Independent VDD and VDDO pins let core and output banks each rail at 1.8 V, 2.5 V, or 3.3 V, eliminating the AC-coupling and resistor divider networks typical of discrete translators.
Recomendado
FPGA and ASIC Clock Fanout
Routing multiple LVDS clock domains to FPGA GCLK inputs and ASIC reference pins from a single reference is a canonical Si5330B-B00205-GMR use case per the Si5330 datasheet. The 1:4 topology supplies four matched clocks with deterministic low skew to four devices on the same PCB, eliminating the trace-length matching and stub-routing pain of direct point-to-point distribution. The 710 MHz maximum supports modern FPGA transceiver reference clocks, ADC/DAC sampling clocks, and high-speed SERDES reference domains. Place 100 ohm differential terminations at the receiver end of each LVDS pair for optimal signal integrity.
Recomendado
Test and Measurement Equipment
Laboratory instruments such as oscilloscopes, logic analyzers, and protocol testers leverage the Si5330B-B00205-GMR's wide 5-710 MHz range and sub-picosecond jitter to fanout reference clocks to multiple ADC and DAC sampling domains per the Si5330 datasheet. The glitchless mux is especially useful in ATE systems where a DUT reference may be selected from multiple sources, allowing clean switching between calibration and production test clocks. The QFN-24-EP 4x4 mm footprint and industrial -40 to +85 C operating range support dense multi-board instruments where board space is at a premium.
Recomendado
Industrial and Embedded Computing
Factory automation controllers, industrial PCs, and ruggedized embedded boards require deterministic clock distribution across multiple SoCs, FPGAs, and I/O controllers per the Si5330B-B00205-GMR datasheet. The device's -40 C to +85 C operating range and CMOS-based 710 MHz fanout let a single upstream TCXO drive four downstream processor domains without per-domain crystals. The LVDS output provides excellent noise immunity in motor-drive and power-electronics environments. Pair the Si5330B with TVS protection and ferrite-bead supply filtering to meet IEC 61131-2 industrial EMC requirements.
Recomendado
Storage and Server Clock Distribution
Enterprise SSDs, RAID controllers, and server motherboards use the Si5330B-B00205-GMR to fanout a single PCIe reference clock to four endpoints per the Si5330 datasheet. The device's LVDS 100 ohm differential interface is electrically compatible with PCIe Gen3/Gen4 reference clock receivers. The glitchless input mux supports redundant boot-clock architectures where two system PLLs feed the Si5330B and automatic switchover maintains clock integrity if one PLL fails. Independent output-bank supply domains simplify multi-rail servers where PCIe runs at one voltage and storage controllers run at another.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para Si5330B-B00205-GMR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | Si5330B-B00206-GMR | Si5330B-B00205-GM | Si5330A-B00200-GMR |
|---|---|---|---|---|
| Brand | Skyworks | Skyworks | Skyworks | Skyworks |
| Package | 24-QFN-EP (4x4 mm) | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same | 24-QFN-EP (4x4 mm) - same |
| Maximum Output Frequency | 710 MHz | 710 MHz | 710 MHz | 710 MHz |
| Output Type | LVDS | LVDS | LVDS | LVDS |
| Number of Outputs | 4 | 4 | 4 | 4 |
| Glitchless Switching Mux | Yes (B revision) | Yes (B revision) | Yes (B revision) | No (A revision predecessor) |
| Configuration Register | B00205 (default) | B00206 (alternate) | B00205 (default) | A00200 (older revision) |
| Shipping Package Code | GMR (Tape & Reel, 1000 pcs) | GMR (Tape & Reel, 1000 pcs) | GM (Tray) | GMR (Tape & Reel, 1000 pcs) |
| Supply Voltage | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- B revision adds glitchless switching mux for redundant clocking (vs Si5330A-B00200-GMR (A revision))
- Same brand, same die, simplified supply chain with same-family parts (vs Si5330B-B00206-GMR (alternate register mapping))
- Integrated level translation without external bias networks (vs Discrete level-shift clock tree using bias resistors)
Notas de projeto
Solder the exposed pad (EP) of the 24-QFN package to a low-impedance ground plane using at least 4 thermal vias in a 0.3 mm-pitch array. Place 1 uF X7R ceramic decoupling capacitors within 2 mm of each VDD, VDDOx, and GND pin pair, with a parallel 0.1 uF capacitor for high-frequency noise. Route the 100 ohm differential LVDS output traces as tightly coupled pairs with differential impedance targeting 100 ohms +/-10%. Keep trace lengths matched within 5 mils across all four Q outputs to minimize output-to-output skew.
Terminate each LVDS output pair at the receiver with a 100 ohm differential resistor placed as close to the receiver pins as possible (within 4 mm). Do NOT place the termination at the Si5330B end - this causes reflections. For point-to-point LVDS routing, length-match the P and N traces of each pair within 0.5 mm to maintain differential balance. Maximum recommended stub length at any branch is 0.5 mm to suppress via stubs and discontinuities.
Do not leave any VDDOx output-bank supply pin floating even if that output is unused - floating VDDOx can cause high output jitter or logic glitches. Either power all four VDDOx pins at a valid supply voltage or disable the corresponding output via the OE control logic. Note that the Si5330A revision does NOT have the glitchless switching mux; if your design relies on redundant clocking with clean switchover, verify you are using the Si5330B 'B' revision silicon (e.g., 'B00205' or 'B00206' part numbers).
Estimated: The Si5330B's static core current draw is typically 30-40 mA at 3.3 V supply (estimated from datasheet). At 3.3 V * 40 mA = 132 mW core dissipation, and with each LVDS output driving 3.5 mA into 100 ohms adding approximately 12 mW per active output, total dissipation stays under 200 mW for typical configurations. The QFN-EP 4x4 mm provides adequate thermal headroom for industrial -40 to +85 C operation when EP is properly soldered as recommended in the PCB layout note.
Informações de conformidade
RoHS compliance confirmed by JLCPCB listing. REACH compliance inferred from Skyworks/Silicon Labs standard part numbering scheme. AEC-Q100 not applicable (not an automotive-grade part).
