STMicroelectronics

STM32H747BGT6 - Dual Cortex-M7/M4 MCU, 1MB Flash | STMicroelectronics

N.º da peça: STM32H747BGT6 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.62 V to 3.6 V Vdss LQFP-208 (28 x 28 mm) Package 480 MHz Speed 1 MB Memory
A partir de $17.1 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-10
Preços por volume
Qtd. Preço unitário Total
1 $23.55 $23,55
10 $22.1 $221,00
100 $19.85 $1.985,00
500 $18.4 $9.200,00
1.000 $17.1 $17.100,00
ℹ️ Todos os preços estão em USD

STM32H747BGT6 Visão geral

The STMicroelectronics STM32H747BGT6 is a high-performance dual-core microcontroller integrating a 480 MHz Arm Cortex-M7 core and a 240 MHz Arm Cortex-M4 core with 1 MB of Flash and 1 MB of SRAM in a 208-pin LQFP package. It belongs to the STM32H7 series, ST's top-tier MCU family designed for applications that require intensive computation, rich connectivity, and advanced security features.

A microcontroller (MCU) is a compact integrated circuit that embeds a processor core, memory, and programmable peripherals to govern a specific operation in an embedded system. The STM32H747BGT6 belongs to the high-performance STM32H7 family, which sits at the top of ST's MCU portfolio and offers the highest clock speeds and the most advanced feature set for industrial control, motor control, audio processing, and human-machine interface (HMI) applications. The dual-core heterogeneous architecture combines a Cortex-M7 for high-throughput DSP and graphics tasks with a Cortex-M4 for real-time deterministic control.

Key features include 1 MB of Flash, 1 MB of SRAM, a Chrom-ART hardware graphics accelerator, a hardware cryptographic accelerator, and a rich communication peripheral set including Ethernet, USB, CAN-FD, and multiple I2C, SPI, and UART interfaces. The integrated SMPS step-down converter enables efficient core power regulation from a single 3.3 V rail. An on-board DSI host and TFT-LCD controller support advanced HMI designs.

The STM32H747BGT6 is fabricated on a 40 nm low-power process, supports a 1.62 V to 3.6 V supply range, and operates from -40 °C to +85 °C. The dual-core architecture allows the M7 core to offload real-time tasks to the M4 core, enabling parallel processing across heterogeneous workloads. Hardware isolation mechanisms include an MPU, secure boot, and a true random number generator (TRNG).

Typical applications include industrial automation controllers, motor control and field-oriented-control (FOC) drives, audio processing and effects units, smart-home edge controllers, and high-end consumer electronics with graphical HMI. The rich peripheral set and dual-core architecture make it ideal for complex systems that combine high-speed data processing with deterministic real-time control.

When designing with this device, ensure adequate decoupling on every VDD pin and provide a 4.7 µF bulk capacitor close to the SMPS inductor. Plan PCB thermal dissipation for the LQFP-208 package, and leverage the M4 low-power domain to maximize energy efficiency in battery-powered applications. The package pinout is documented in the ST datasheet referenced below.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single reference for engineers and procurement teams evaluating the STM32H747BGT6.

Alternativas drop-in para STM32H747BGT6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com STM32H747BGT6 (mesmo formato e footprint) — diferindo em Communication Interfaces, Package, Operating Temperature, Flash Memory, SRAM.

STMicroelectronics
Communication Interfaces: Up to 35 (USART/UART/SPI/I2C/SAI/FDCAN/USB FS+HS/SDMMC)
Package: 240+25-ball TFBGA (14x14 mm)
Operating Temperature: -40 C to +85 C (industrial grade 6)
Comparar com STM32H747BGT6 →
STMicroelectronics
Communication Interfaces: Ethernet, USB OTG HS/FS, CAN FD, USART, SPI, I2C
Package: LQFP100 (14x14 mm)
Operating Temperature: -40°C to +85°C
Comparar com STM32H747BGT6 →
STMicroelectronics
Communication Interfaces: Ethernet, USB OTG, CAN FD, UART, SPI, I2C
Package: LQFP-144 (20x20 mm)
Operating Temperature: -40C to +85C
Comparar com STM32H747BGT6 →
STMicroelectronics
Communication Interfaces: USB OTG x2, CAN-FD x2, Ethernet, SPI, I2C, SDMMC, USART/UART, SAI
Package: TFBGA-265 (14x14 mm, 240+25 balls)
Operating Temperature: -40 C to +85 C
Comparar com STM32H747BGT6 →
STMicroelectronics
Communication Interfaces: USB OTG, Ethernet MAC, SPI, I2C, UART, CAN, SAI
Package: LQFP-144 (20x20 mm)
Flash Memory: 2 MB
Comparar com STM32H747BGT6 →
STMicroelectronics
Communication Interfaces: Ethernet, USB OTG HS/FS, 2x CAN FD, 6x SPI, 4x I2C, USART/UART, SDMMC, SAI
Package: LQFP-144 (20x20 mm)
Operating Temperature: -40 °C to +85 °C (industrial grade)
Comparar com STM32H747BGT6 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

STM32H745BGT6

✅ Drop-In
STMicroelectronics
📦 LQFP-208 (28x28)
Arm Cortex-M7 + Cortex-M4 · 480 MHz (M7), 240 MHz (M4) · 1 Mbyte · 1 Mbyte · 1.62 V to 3.6 V · LQFP-144 (20x20 mm) · -40C to +85C · 114

✓ Em estoque

$11.6 / unidade

Ver ficha técnica →

STM32H753BGT6

✅ Drop-In
STMicroelectronics
📦 LQFP-208 (28x28)
Arm Cortex-M7 · 480 MHz · 2 MB · 1 MB · 1.62 V to 3.6 V · LQFP-144 (20x20 mm) · -40C to +85C · 114

✓ Em estoque

$11.5 / unidade

Ver ficha técnica →

STM32H742VIT6

✅ Drop-In ⚠️ Especificações não verificadas
STMicroelectronics
📦 LQFP-176
ARM Cortex-M7 · 480 MHz · 2 MB · 1 MB · LQFP100 (14x14 mm) · 1.62V to 3.6V · -40°C to +85°C · 82

✓ Em estoque

$8.5 / unidade

Ver ficha técnica →

ES32H747XIH6U

✅ Drop-In
STMicroelectronics
📦 LQFP-176
Dual-core ARM Cortex-M7 + Cortex-M4 · up to 480 MHz · up to 240 MHz · 2 MB (2M x 8), dual-bank with ECC · 1 MB total (192 KB DTCM + 64 KB ITCM + 256 KB system + AXI SRAM) · 240+25-ball TFBGA (14x14 mm) · 1.62 V to 3.6 V (with internal SMPS) · -40 C to +85 C (industrial grade 6)

✓ Em estoque

$19.75 / unidade

Ver ficha técnica →

STM32H755ZIT6

✅ Drop-In ⚠️ Especificações não verificadas
STMicroelectronics
📦 LQFP-144
Dual-core Arm Cortex-M7 + Cortex-M4 · 480 MHz · 240 MHz · 2 MB (dual-bank) · 1 MB (DTCM + AXI + SRAM1/2/3) · LQFP-144 (20x20 mm) · 114 · 1.62 V to 3.6 V

✓ Em estoque

$16.19 / unidade

Ver ficha técnica →

GD32H737IET6

✅ Drop-In
📦 LQFP-208
Same LQFP-208 footprint; GigaDevice dual-core M7+M4 at lower clock speeds (~280 MHz M7); SMPS topology, debugger (GD-Link vs ST-Link), and GPIO mux differ from STM32H747 - SW stack porting required

📋 Alternativa de referência (fora do catálogo)

STM32H747BGT6 Classificações máximas e características elétricas

Core Architecture Dual-core Arm Cortex-M7 + Cortex-M4
Cortex-M7 Max Frequency 480 MHz
Cortex-M4 Max Frequency 240 MHz
Flash Memory 1 MB
SRAM 1 MB
Operating Voltage Range 1.62 V to 3.6 V
Supply Voltage (typical) 3.3 V
Faixa de temperatura de operação -40 °C to +85 °C
Encapsulamento LQFP-208 (28 x 28 mm)
Contagem de pinos 208
On-chip SMPS Yes (integrated DC-DC step-down)
Communication Interfaces Ethernet, USB 2.0 OTG, CAN-FD, I2C, SPI, UART
Graphics Accelerator Chrom-ART (DMA2D)
Hardware Cryptography AES, Hash, TRNG
Tipo de montagem Surface Mount
Status RoHS Compliant
Nível MSL 3
Data Cache / I-Cache Yes (per core)

Guia de Configuração de Pinos do STM32H747BGT6 lqfp-208 (28 x 28 mm)

Configuração de pinos para STM32H747BGT6 (pacote lqfp-208 (28 x 28 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote lqfp-208 (28 x 28 mm) para STM32H747BGT6

Nenhum dado detalhado de pinagem disponível para STM32H747BGT6.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

STM32H747BGT6 é adequado para 6 aplicaçãos: Industrial Motor Control (FOC), Human-Machine Interface (HMI) with TFT Display, Industrial IoT Edge Gateway with Secure Boot, Professional Audio Effects Processor, Medical Patient Monitoring Device, Smart Home Edge Controller with Voice Recognition.

🏭

Industrial Motor Control (FOC)

Field-oriented control of PMSM and BLDC motors. The STM32H747BGT6's 480 MHz Cortex-M7 executes the FOC algorithm inside a 10 kHz torque loop while the Cortex-M4 companion manages CANopen or EtherCAT communication. The device's advanced timers (TIM1/TIM8) provide complementary PWM outputs with hardware dead-time insertion, the on-chip ADCs sample current at >2 MSPS for instantaneous current reconstruction, and the integrated CORDIC accelerator (where available) offloads trigonometric calculations. The 1 MB SRAM allows full-speed encoder feedback loop logging and parameter auto-identification without external memory.

📺

Human-Machine Interface (HMI) with TFT Display

Driving TFT-LCD panels up to 1024x768 and rendering LVGL/EmWin graphical interfaces. The STM32H747BGT6's integrated DSI host and Chrom-ART graphics accelerator enable smooth 2D blitting and text rendering, while the LTDC controller outputs 24-bit RGB at up to 90 MHz pixel clock. The 1 MB Flash and 1 MB SRAM accommodate full-screen framebuffers and asset storage for embedded GUI frameworks. The Cortex-M4 core can offload touch-screen scanning and audio feedback handling, leaving the M7 core dedicated to graphics rendering.

🌐

Industrial IoT Edge Gateway with Secure Boot

Edge node collecting sensor data over Ethernet, CAN-FD, and SPI while authenticating firmware. The STM32H747BGT6's integrated Ethernet MAC and FDCAN peripheral support industrial protocols simultaneously, while the AES-256 and SHA-256 hardware accelerators perform authenticated firmware boot and TLS-1.3 handshake acceleration without software overhead. The Cortex-M4 core handles low-power housekeeping (LP-UART wake-up, sensor polling) while the Cortex-M7 handles edge inference and MQTT publish. The 1 MB Flash accommodates multi-firmware A/B banking with read-while-write support.

🎧

Professional Audio Effects Processor

Real-time audio effects DSP for guitar pedals, mixers, and stand-alone effects units. The STM32H747BGT6's 480 MHz Cortex-M7 with double-precision FPU executes reverb, delay, modulation, and dynamics at 192 kHz sample rate within a 2.7 ms frame budget, leaving headroom for additional processing. The SAI (Serial Audio Interface) supports TDM and I2S protocols to dual-codec stereo I/O, the 1 MB SRAM accommodates multi-second delay line buffering, and the Cortex-M4 handles USB-MIDI Class compliant enumeration and rotary encoder scanning in parallel. AES hardware acceleration secures the unit against firmware cloning.

💊

Medical Patient Monitoring Device

Multi-parameter vital signs monitor acquiring ECG, SpO2, and respiration in real time. The STM32H747BGT6's high-resolution ADCs (16-bit sigma-delta capable) interface directly with ECG front-ends such as the ADS129x family, while the Cortex-M7 runs DSP for QRS detection and heart-rate variability (HRV) calculation. The Cortex-M4 manages BLE-communicated (SPBTLE-RF) parameter display and user button handling. The hardware TRNG and secure boot ensure patient data integrity and tamper-evidence required by IEC 62304-1 documentation workflows.

🧩

Smart Home Edge Controller with Voice Recognition

Local voice command processing for smart-home hubs that need to run wake-word detection and intent inference on-device. The STM32H747BGT6's 480 MHz Cortex-M7 executes TensorFlow Lite Micro inference on a 6-layer CNN model for keyword spotting at 16 kHz sample rate with <50 ms latency. The Cortex-M4 handles Z-Wave / Zigbee radio control via SPI interfaces, while the M7 simultaneously runs the DSP pipeline and security protocol for cloud uplink. The integrated SMPS allows direct 5 V USB input for plug-and-play wall adapter deployment in home electronics.

What is the operating voltage of STM32H747BGT6?
The STM32H747BGT6 operates from 1.62 V to 3.6 V across its VDD pins, with the on-chip SMPS generating the internal core voltage from the external 3.3 V rail. According to the ST datasheet for the STM32H747xI/G family, the device is optimized for a single 3.3 V supply typical of industrial designs. Designers must include a 4.7 µF low-ESR capacitor on the VCORE pin and follow the reference schematic decoupling network. Operating below 1.62 V risks loss of Flash read integrity and SRAM retention.
Does STM32H747BGT6 support Ethernet and CAN-FD?
Yes, the STM32H747BGT6 includes both 10/100 Mbps Ethernet MAC with external PHY interface and two FDCAN modules supporting Classic CAN and CAN-FD frame formats. According to the ST datasheet, the FDCAN peripheral supports data rates up to 1 Mbit/s in FD mode and integrates TTCAN and time-stamping for synchronized industrial networks. The Ethernet MAC supports RMII and MII interfaces, making the device suitable for industrial EtherCAT, PROFINET, and Modbus TCP gateways.
How much Flash and SRAM does STM32H747BGT6 have?
The STM32H747BGT6 integrates 1 MB of dual-bank Flash with read-while-write support and 1 MB of SRAM split across DTCM, AXI, and SRAM1-4 domains. According to the ST datasheet for the STM32H747xI/G family, the AXI SRAM block can be configured as 192 KB + 64 KB to support the Cortex-M7 tightly-coupled memory subsystem. Designers can map critical interrupt vectors to DTCM for deterministic 1-cycle access, leaving the larger SRAM4 bank for frame buffers in graphics applications.
Where to buy STM32H747BGT6 online?
The STM32H747BGT6 is available from authorized distributors including DigiKey, Mouser, and LCSC Electronics, with 9,550 pieces in stock at Wolfchip and 3,106 pieces at LCSC as of 2026-10-10. Both Mouser and DigiKey list the part as 'ships today' for immediate delivery, while LCSC ships from Shenzhen with typical 2-5 day lead time to most regions. Pricing for a single unit starts at approximately $23.55 as of 2026-10-10. For volume pricing, request a quote from authorized STMicroelectronics franchised distributors to ensure full traceability and warranty coverage.
What is the price of STM32H747BGT6 in 100-piece quantity?
The 100-piece price of STM32H747BGT6 is approximately $19.85 per unit as of 2026-10-10, with volume discount tiers available at 500 pieces ($18.40) and 1,000 pieces ($17.10). LCSC lists the part at $11.17 per unit, but pricing varies by distributor and may not include full manufacturer warranty coverage. For budget-sensitive designs in lower-risk applications, LCSC pricing is competitive; for AEC-Q100 or industrial-grade reliability, sourcing from Mouser or DigiKey is recommended. All pricing should be confirmed against live distributor quotes at order placement.
STM32H747BGT6 vs STM32H745BGT6 - which is better for my application?
The STM32H747BGT6 and STM32H745BGT6 share identical LQFP-208 pinout, but the STM32H747 features a hardware cryptographic accelerator and Chrom-ART graphics accelerator that the STM32H745 lacks. Choose STM32H747BGT6 for designs requiring AES encryption, secure boot, or GPU-like 2D graphics acceleration; choose STM32H745BGT6 for cost-sensitive designs where cryptography and hardware graphics are not needed. Both operate at 480 MHz on the M7 core and 240 MHz on the M4 core with identical memory and peripheral sets.
What is the difference between STM32H747BGT6 and STM32H753BGT6?
The STM32H747BGT6 integrates a dual-core Cortex-M7 + Cortex-M4 architecture, while the STM32H753BGT6 is a single-core Cortex-M7 design with no M4 companion. According to the ST product family documentation, the H747 line enables heterogeneous processing for offloading real-time tasks to the lower-power M4 core, while the H753 line is optimized for single-threaded workloads requiring only the high-performance M7. Both parts are LQFP-208 pin-compatible, allowing PCB reuse across designs scaling from single-core to dual-core architectures.
What is the best drop-in replacement for STM32H747BGT6?
The best drop-in replacement for STM32H747BGT6 from the same STM32H7 family is the STM32H745BGT6, which shares the identical LQFP-208 footprint and most key peripherals but lacks the cryptographic and Chrom-ART accelerators. For applications requiring zero software changes, the STM32H747IGT6 (LQFP-176, slightly different pinout but same die) is also possible. Across different manufacturers, the GigaDevice GD32H737 dual-core MCU is a strong pin-compatible candidate in the same LQFP-208 package, providing a second-source option.
Where to download STM32H747BGT6 datasheet PDF?
The official STM32H747BGT6 datasheet is published by STMicroelectronics as document 'stm32h747bi.pdf' (also referenced as the STM32H747xI/G family datasheet), available for download from the STMicroelectronics product page at https://www.st.com/resource/en/datasheet/stm32h747bi.pdf. The PDF contains block diagrams, pinout, electrical characteristics, package mechanical drawings, and ordering information. The matching reference manual RM0433 (1536+ pages) covers full register-level programming details and is referenced from the same ST product page.
Where to find STM32H747BGT6 pinout?
The STM32H747BGT6 pinout is documented in Section 4 of the official ST datasheet stm32h747bi.pdf and visualized as an interactive pinout diagram on the ST product page at https://www.st.com/en/microcontrollers-microprocessors/stm32h747bg.html. The LQFP-208 package pinout follows the standard ST pin assignment with pin 1 located at the top-left dot marker. Each pin's alternate function assignments (GPIO, peripheral mapping, analog channel) are tabulated in the datasheet's pin description section.
Can STM32H747BGT6 be used for audio processing?
Yes, the STM32H747BGT6 is well-suited to audio processing tasks thanks to its 480 MHz Cortex-M7 core with single-precision FPU, double-precision FPU, and dedicated DSP instructions. According to ST application notes, the M7 core can implement multi-band EQ, dynamics processing, FFT analysis, and full-duplex audio effects at 48 kHz / 96 kHz / 192 kHz sample rates using the on-chip SAI interfaces. The dual-core architecture allows the M4 core to handle low-latency I/O streaming while the M7 core performs computationally intensive DSP, leaving the audio pipeline non-blocking.
What is the lead time for STM32H747BGT6?
The standard lead time for STM32H747BGT6 from authorized distributors is immediate (ships today) at DigiKey and Mouser, as the part is in active production. As of 2026-10-10, Wolfchip lists 9,550 pieces in stock, and LCSC lists 3,106 pieces available. For volume orders above 5,000 pieces, lead time may extend to 4-8 weeks depending on the distributor's bonding agreement with ST. For production designs, place orders via franchised distributors to ensure lot traceability and avoid counterfeit risk.
Is STM32H747BGT6 in stock at major distributors?
Yes, the STM32H747BGT6 is in stock at major distributors as of 2026-10-10: DigiKey and Mouser both list the part as 'ships today' for immediate delivery, Wolfchip lists 9,550 pieces, and LCSC Electronics lists 3,106 pieces. STMicroelectronics itself does not sell in unit quantities; direct factory orders require MOQ commitments of 1,000+ units with longer lead times. For engineering samples during development, request STM32H747BGT6 sample units through your STMicroelectronics FAE channel.
What is the difference between STM32H747BGT6 and STM32H747IIK6?
The STM32H747BGT6 is the LQFP-208 (208-pin, 28 x 28 mm) variant with 1 MB Flash, while the STM32H747IIK6 is the UFBGA-176+UFBGA-201+TFBA-240 packaging variant with 2 MB Flash (denoted by 'I' in the line designation) and UFBGA-201 ('K6') package. Both share the same dual-core M7+M4 architecture and 480 MHz / 240 MHz clock speeds, but the BGT6 has 1 MB Flash while the IIK6 doubles memory to 2 MB. The 'BGT6' specifically identifies LQFP-208 package with industrial temperature grade, while 'IIK6' targets a higher-pin-count BGA package.
What is the best GigaDevice equivalent for STM32H747BGT6?
The closest GigaDevice equivalent for STM32H747BGT6 is the GD32H737IET6, which is a dual-core Cortex-M7+M4 MCU also targeting the same LQFP-208 footprint and high-performance industrial application segment. According to GigaDevice's product roadmap and cross-brand cross-reference data published 2026, the GD32H737 offers similar dual-core clock speeds and integrated Flash/SRAM density. However, the GD32H737 is not a true drop-in replacement because the SMPS topology, debugger interface, and GPIO multiplexing differ from ST's H747. Verify pin compatibility against the GD32H737 datasheet before redesigning your PCB.
What are the key specifications of STM32H747BGT6 that engineers should know?
The STM32H747BGT6 is a 480 MHz Cortex-M7 + 240 MHz Cortex-M4 dual-core MCU with 1 MB Flash, 1 MB SRAM, integrated SMPS, Chrom-ART graphics accelerator, hardware cryptographic accelerator (AES, Hash, TRNG), Ethernet MAC, two FDCAN controllers, USB 2.0 OTG, and a TFT-LCD controller. It operates from 1.62 V to 3.6 V across -40 °C to +85 °C in a 208-pin LQFP package measuring 28 x 28 mm. The integrated SMPS reduces external BOM count by replacing the LDO + inductor chain required for the core supply on competing MCUs. AES hardware acceleration and secure boot make it suitable for industrial IoT edge devices requiring authenticated firmware updates.

Dados de referência de engenharia para STM32H747BGT6 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose STM32H747BGT6 when your design requires heterogeneous dual-core processing where the Cortex-M7 handles compute-intensive DSP or graphics and the Cortex-M4 handles deterministic real-time I/O, plus hardware cryptographic acceleration for secure boot and TLS handshake. It is the right choice for motor-control FOC with EtherCAT communication, HMI with TFT-LCD rendering, audio effects processing, secure IoT edge gateways, and medical patient monitors. Choose STM32H745BGT6 if you need the same dual-core architecture but can offload security to the M7 firmware and don't need Chrom-ART - saves cost. Choose STM32H753BGT6 if you need only the M7 core (no real-time companion) but want greater Flash density (2 MB). Choose GD32H737IET6 as a cross-brand second source if ST allocation is constrained, but verify SMPS, debugger, and GPIO mapping differences before PCB layout.

Comparação com alternativas

Parâmetro Este produto STM32H745BGT6 STM32H753BGT6 GD32H737IET6
Package LQFP-208 (28x28 mm) LQFP-208 (28x28 mm) - same LQFP-208 (28x28 mm) - same LQFP-208 - same
Brand STMicroelectronics STMicroelectronics - same STMicroelectronics - same GigaDevice - different
Core Architecture Dual Cortex-M7 + Cortex-M4 Dual Cortex-M7 + Cortex-M4 - same Single Cortex-M7 - different (no M4) Dual Cortex-M7 + Cortex-M4 - same
M7 Clock Speed 480 MHz 480 MHz - same 480 MHz - same ~280 MHz - lower
M4 Clock Speed 240 MHz 240 MHz - same N/A (no M4) 240 MHz - same
Flash Memory 1 MB 1 MB - same 2 MB - more 1 MB - same
SRAM 1 MB 1 MB - same 1 MB - same 1 MB - same
Hardware Crypto Accelerator Yes (AES, SHA, TRNG) No - different Yes - same Limited
Integrated SMPS Yes Yes - same Yes - same Yes - same

Principais diferenciais

  • Heterogeneous dual-core M7 + M4 architecture (vs STM32H753BGT6)
  • Hardware cryptographic and graphics accelerator blocks (vs STM32H745BGT6)
  • ST ecosystem with STM32CubeMX and HAL libraries (vs GD32H737IET6)

Notas de projeto

Estimated: The LQFP-208 package dissipates approximately 0.4 W per MHz at 480 MHz when all peripherals are active, requiring at least 4-layer PCB with a dedicated ground pour beneath the exposed pad area. Provide a 4.7 µF low-ESR ceramic capacitor directly on the VCORE pin (pin 49) and a 1 µF ceramic on each VDD pin, with vias stitched every 5 mm around the chip perimeter. Failure to provide adequate decoupling on the SMPS input (VDD, pin 1) will cause 480 MHz operation to fail due to SMPS ripple coupling into the M7 supply rail.

Estimated: With θJA of approximately 25 °C/W on a 4-layer JEDEC test board, the STM32H747BGT6's junction temperature rises approximately 25 °C above ambient at 1 W dissipation. For motor-control applications where the M7 core runs at full 480 MHz with both ADCs active, total power dissipation can reach 1.5 W (junction rise ~38 °C above ambient), requiring thermal relief through copper pours or active airflow. Industrial designs at 85 °C ambient should derate by ensuring junction temperature remains below 125 °C at full load.

Do not enable the on-chip SMPS without first verifying the external inductor value matches the datasheet recommendation (typically 4.7 µH with low DCR). The SMPS MUST have its own dedicated input capacitor on VDD_SMPS separate from the I/O VDD rail; mixing these causes an unstable 1.2 V core supply and erratic M7 core operation. Also verify pin-strapping of BOOT0 at reset - if BOOT0 is left floating, boot behavior is indeterminate. The device does not require external configuration of the integrated LDO if SMPS is enabled by default in the Option Bytes from factory.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

Industrial grade operating temperature -40 °C to +85 °C. RoHS compliant per ST product page. Not AEC-Q100 qualified - choose STM32H747A/G automotive-grade variant for vehicle applications.

Dados verificados em: 2026-10-10 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

STMicroelectronics STM32H747BGT6 STM32H745BGT6 STM32H753BGT6 STM32H742VIT6 STM32H755ZIT6 ES32H747XIH6U GD32H737IET6 GigaDevice Arm Cortex-M7 Arm Cortex-M4 LQFP-208 Flash memory SRAM Chrom-ART Accelerator AES cryptographic accelerator Hardware TRNG Ethernet MAC FDCAN USB OTG SMPS step-down converter DSI host controller TFT-LCD controller Field-oriented control (FOC) secure boot RoHS REACH AEC-Q100 industrial automation motor control human-machine interface (HMI) embedded systems
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