ES32H747XIH6U - Dual-Core ARM Cortex-M7/M4 MCU 480MHz | STMicroelectronics
MPN: ES32H747XIH6U ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.9 | $289.00 |
| 100 | $25.4 | $2,540.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $19.75 | $19,750.00 |
ES32H747XIH6U Overview
An MCU (microcontroller unit) is a single-chip computer that combines a CPU core, non-volatile program memory, working RAM, and a rich set of on-chip peripherals. The STM32H7 family sits at the top of the Cortex-M performance hierarchy: Cortex-M7 -> 32-bit MCU -> microcontroller -> embedded computing platform. Within that family the dual-core STM32H747 series adds heterogeneous processing, where code can run concurrently on both cores with deterministic inter-core messaging.
Key features include 2 MB dual-bank Flash with ECC, 1 MB SRAM (including 192 KB DTCM + 64 KB ITCM for the M7 and 256 KB system SRAM shared between the cores), Chrom-ART graphics accelerator, JPEG codec, a built-in SMPS for direct 2.7 V–3.6 V single-rail operation, MIPI-DSI host interface, and a parallel 16-bit RGB LCD-TFT controller. Peripherals include up to 35 communication interfaces (USART, UART, SPI, I2C, SAI, FDCAN, USB 2.0 FS+HS, SDMMC), three 12-bit ADCs (3.6 MSPS), two 12-bit DACs, and crypto/hash accelerators.
Typical applications include industrial HMI panels with TFT/DSI displays, motor-control and inverter platforms, medical patient monitors, audio DSP front-ends, and IoT edge gateways. The TFBGA-240+25 package exposes the parallel camera interface, DSI lanes, Ethernet MAC, and SDMMC, enabling direct connection of high-bandwidth peripherals without external bridge ICs.
When designing with this part, ensure the PCB has at least 4 copper layers to fan out the 240-ball grid with proper ground stitching, and follow ST's reference manual for SMPS inductor selection. Decoupling must include 100 nF capacitors within 1 mm of every supply pin plus bulk 4.7 µF on each supply rail.
Drop-in alternatives for ES32H747XIH6U — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ES32H747XIH6U (same form factor and footprint) — differing in Package, SRAM, Communication Interfaces, Flash Memory, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32H747XIH6
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →STM32H747XIH6U3
✅ Drop-In📋 Reference alternative (not in catalog)
STM32H757XIH6
✅ Drop-In✓ In Stock
$12.18 / Unit
View Datasheet →STM32H747IIT6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
STM32H745XIH6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ES32H747XIH6U Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core ARM Cortex-M7 + Cortex-M4 |
| M7 Core Frequency | up to 480 MHz |
| M4 Core Frequency | up to 240 MHz |
| Program Memory (Flash) | 2 MB (2M x 8), dual-bank with ECC |
| SRAM | 1 MB total (192 KB DTCM + 64 KB ITCM + 256 KB system + AXI SRAM) |
| Package | 240+25-ball TFBGA (14x14 mm) |
| Supply Voltage | 1.62 V to 3.6 V (with internal SMPS) |
| Operating Temperature | -40 C to +85 C (industrial grade 6) |
| Display Interface | MIPI-DSI host + 16-bit RGB LCD-TFT controller |
| Graphics Acceleration | Chrom-ART Accelerator (DMA2D), JPEG codec |
| ADC | 3x 12-bit, up to 3.6 MSPS |
| DAC | 2x 12-bit |
| Communication Interfaces | Up to 35 (USART/UART/SPI/I2C/SAI/FDCAN/USB FS+HS/SDMMC) |
| Ethernet | 10/100 Mbps MAC (external PHY required) |
| Crypto / Hash | AES, Hash (SHA-256), True Random Number Generator |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
ES32H747XIH6U 240+25-ball tfbga (14x14 mm) Pin Configuration Guide
Pin configuration for ES32H747XIH6U (240+25-ball tfbga (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ES32H747XIH6U.
Refer to the datasheet for full pin configuration.
Typical Applications
ES32H747XIH6U is suitable for 7 applications: Industrial HMI with DSI Display, Medical Patient Monitor, Audio DSP and Effects Processor, Motor Control and Inverter Platform, IoT Edge Gateway with TLS Security, Automotive Infotainment / Cluster, Smart Appliance / Home Appliance Control.
Industrial HMI with DSI Display
The ES32H747XIH6U drives industrial HMI panels through its integrated MIPI-DSI 2-lane host controller, supporting up to WUXGA (1920x1200) resolution at 60 fps. The 480 MHz Cortex-M7 runs the LVGL graphics stack while the 240 MHz Cortex-M4 handles Modbus, CAN, and EtherCAT fieldbus traffic in parallel. Its 2 MB Flash and 1 MB SRAM accommodate full framebuffers without external memory, and the Chrom-ART DMA2D accelerator offloads block-copy/composition from the CPU. Designers should reserve 4-layer PCB with 50-ohm DSI lanes and place the SMPS inductor within 5 mm of the VCAP pins.
Recommended
Medical Patient Monitor
In medical patient monitors the ES32H747XIH6U's dual-core architecture isolates safety-critical signal acquisition on the Cortex-M4 from the M7-driven display and DSP processing of ECG/SpO2 waveforms. The three 12-bit 3.6 MSPS ADCs simultaneously sample multiple biosignal channels with hardware oversampling for noise reduction. The hardware AES/SHA (via STM32H757 upgrade) secures patient data on TLS 1.3 connections. Operating temperature of -40 C to +85 C supports clinical and laboratory environments.
Recommended
Audio DSP and Effects Processor
The 480 MHz Cortex-M7 with single-precision FPU and DSP extensions makes the ES32H747XIH6U well-suited for multi-channel audio processing - parametric EQ, reverb, dynamics, and beamforming - at 96 kHz / 24-bit sample rates. The SAI (Serial Audio Interface) ports connect directly to professional audio DACs and ADCs. The dual-core split places effects processing on the M7 and user-interface/MIDI control on the M4, avoiding audio glitches during UI updates. The internal SMPS provides a clean 1.0 V core rail without external switching noise coupling into the analog path.
Recommended
Motor Control and Inverter Platform
The ES32H747XIH6U drives 3-phase FOC motor control loops with deterministic timing on the Cortex-M4 while the M7 handles higher-level communications (EtherCAT, CAN FD) and user-facing diagnostics. The advanced timer peripherals (TIM1/TIM8/TIM15/TIM16/TIM17 with complementary PWM and deadband insertion) and three 3.6 MSPS ADCs provide simultaneous current/voltage sampling at 20 kHz PWM. The SMPS and low-dropout regulators on-chip simplify the auxiliary supply chain in compact inverter modules.
Recommended
IoT Edge Gateway with TLS Security
As an IoT edge gateway, the ES32H747XIH6U runs an HTTPS/MQTT client on the Cortex-M7 with the M4 dedicated to local sensor aggregation over UART/RS-485 and BLE. Up to 35 communication interfaces including two USB 2.0 (FS+HS), two SDMMC, FDCAN, and multiple SPI/I2C/UART allow direct connection to cellular modems, Wi-Fi modules, and secure-element companions. Designers preferring hardware crypto should upgrade to the pin-compatible STM32H757XIH6 for AES-256, SHA-256, and TRNG on-chip, accelerating TLS handshakes by 3-5x versus software crypto.
Recommended
Automotive Infotainment / Cluster
For automotive digital instrument clusters and infotainment head units, the ES32H747XIH6U drives two displays simultaneously via the MIPI-DSI host and the parallel 16-bit RGB LCD-TFT controller, supporting 1080p cluster plus 720p center-stack. The dual-core split allows cluster graphics on M7 while the M4 handles CAN-FD body-network and vehicle-signaling tasks. For AEC-Q100 qualified deployments, designers should consider the drop-in STM32H747XIH6U3 automotive variant. The 14x14 mm TFBGA footprint fits within the tight thermal envelope behind the dashboard.
Recommended
Smart Appliance / Home Appliance Control
In high-end home appliances such as robotic vacuum cleaners, washing machines, and induction cooktops, the ES32H747XIH6U's dual-core architecture handles motor FOC algorithms on the M4 while the M7 runs the touch-screen UI and Wi-Fi cloud connectivity. The integrated JPEG codec accelerates QR-code scanning and camera-based navigation. Hardware cryptographic support (via STM32H757 migration path) secures OTA firmware updates against tampering. The wide operating temperature range of -40 C to +85 C covers both kitchen and laundry environments.
Recommended
Recommended Products Summary
Engineering reference data for ES32H747XIH6U — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32H747XIH6 | STM32H747XIH6U3 | STM32H757XIH6 | STM32H745XIH6 | STM32H747IIT6 |
|---|---|---|---|---|---|---|
| Package | TFBGA-240+25 (14x14 mm) | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-240+25 (14x14 mm) - same | TFBGA-176 (10x10 mm) - different footprint |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Cores | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz + crypto | Cortex-M7 480 MHz + Cortex-M4 240 MHz (lower flash) | Cortex-M7 480 MHz + Cortex-M4 240 MHz (TFBGA-176) |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 2 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| MIPI-DSI Host | Yes (2-lane, up to WUXGA) | Yes | Yes | Yes | Yes | Yes |
| Hardware Crypto | No (AES via software library) | No | No | Yes (AES, SHA, TRNG) | No | No |
| Automotive Grade | Industrial (-40 to +85 C) | Industrial | AEC-Q100 Grade 3 | Industrial | Industrial | Industrial |
| Approx. Unit Price (1 pc, USD) | 32.50 | 32.50 | 36.00 (est.) | 38.00 (est.) | 27.50 (est.) | 28.00 (est.) |
Key Differentiators
- Pin-compatible upgrade path to AEC-Q100 automotive grade (vs STM32H747XIH6U3)
- Drop-in upgrade to hardware crypto accelerator (vs STM32H757XIH6)
- 2 MB Flash vs 1 MB Flash drop-in downgrade (vs STM32H745XIH6)
Design Notes
The TFBGA-240+25 package has a 0.8 mm ball pitch and requires at least a 4-layer PCB with 0.5 oz copper on outer layers and 1 oz on inner planes. Use via-in-pad with filled-and-plated-over vias under each thermal/ground ball to maximize heat extraction. Per IPC-2222 design rules, fan-out should reserve at least a 6-mil trace-and-space for signal escape. ST's STM32H747 reference layouts (Altium and Cadence Allegro) are available on st.com.
Estimated: at full M7+M4 dual-core load (480 MHz + 240 MHz with all peripherals enabled) the core current draw is approximately 290 mA at 1.0 V internal rail. Add a 4.7 µF X7R ceramic plus 100 nF decoupling within 1 mm of every VCAP pin. The internal SMPS requires a 4.7 µH to 10 µH shielded inductor with saturation current >= 700 mA on the SMPS_V1/L1 pins; refer to STM32H747 hardware design guide section 5.
Do not route DSI clock and data lanes over a discontinuous reference plane - DSI is a current-mode differential interface sensitive to impedance breaks. Place the DSI connector within 50 mm of the BGA and use 100-ohm differential impedance with length matching within 150 µm. Also note that the SDMMC and DSI share some internal bus bandwidth; concurrent use may require DMA bandwidth budgeting. Boot pins (BOOT0) must be left floating or pulled low for normal Flash boot.
Estimated: at maximum dual-core load with peripherals enabled, package dissipation is approximately 0.8 W. The 14x14 mm TFBGA with 25 thermal balls reaches a junction-to-ambient thermal resistance (theta_JA) of approximately 28 C/W on a 4-layer JEDEC EIA/JESD51 test board. Sustained 85 C ambient operation requires verifying with a thermal-coup test in your actual enclosure - consider the -40 C to +85 C industrial limit as the worst-case envelope.
Compliance Information
Industrial grade -40C to +85C. RoHS/REACH compliant per STMicroelectronics product page. AEC-Q100 Grade 3 qualified variant available as STM32H747XIH6U3.
