UJA1169ATK/F - Mini HS-CAN SBC, 5V LDO | NXP Semiconductors
N.º da peça: UJA1169ATK/F ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.64 | $5,64 |
| 10 | $5.21 | $52,10 |
| 100 | $4.62 | $462,00 |
| 500 | $4.05 | $2.025,00 |
| 1.000 | $3.58 | $3.580,00 |
| 3.000 | $3.12 | $9.360,00 |
UJA1169ATK/F Visão geral
A System Basis Chip (SBC) is a multi-functional automotive-grade IC that combines a bus transceiver with one or more voltage regulators, watchdog logic, and a host interface such as SPI. SBCs sit one level above plain transceivers in the in-vehicle networking hierarchy: CAN transceiver -> CAN SBC -> power management IC -> automotive ECU. By colocating the supply rails and bus interface in one die, an SBC reduces PCB area, simplifies wiring harness design, and improves electromagnetic compatibility versus a discrete implementation.
Key features of the UJA1169ATK/F include a 5 V V1 LDO delivering up to 250 mA to the host MCU, an additional second onboard 5 V LDO (V2) that powers the internal CAN transceiver and may also be used for additional onboard hardware, ISO 11898-2:201x HS-CAN physical-layer compliance with CAN FD frame support, integrated SPI control interface for mode and diagnostics, a hardware watchdog, and very low quiescent current with several low-power operating modes to meet automotive deep-sleep requirements.
The device targets 12 V automotive battery rails with full load-dump and jump-start resilience. Its architecture implements selective wake-up capability so the rest of the ECU can stay powered down until a valid CAN wake frame is received, dramatically reducing quiescent drain on the battery. The /F suffix designates a specific firmware/configuration variant within the UJA1169ATK family.
Typical applications include automotive body control modules, gateway ECUs, HVAC and lighting controllers, instrument clusters, powertrain peripherals, and any CAN-FD node that benefits from a single-chip supply-and-transceiver solution.
When designing with the UJA1169ATK/F, ensure the HVSON exposed pad is soldered to a sufficiently large copper pour to meet the package thermal resistance. Decoupling must follow the manufacturer's recommended capacitor network, and the CAN bus termination (typically 120 ohm between CANH and CANL) must be located close to the bus pins. This page synthesizes distributor pricing, family variants, and design guidance not aggregated in the manufacturer datasheet.
Alternativas drop-in para UJA1169ATK/F — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com UJA1169ATK/F (mesmo formato e footprint) — diferindo em Package, Watchdog, CAN FD Support, CAN Standard, Low-Power Modes.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
UJA1169ATK
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
UJA1169ATK/F/3
✅ Drop-In✓ Em estoque
$3.48 / unidade
Ver ficha técnica →UJA1169ATK/X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
UJA1169ATK/X/F
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
UJA1169ATK/FZ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
UJA1169ATK/F Classificações máximas e características elétricas
| Product Type | System Basis Chip (SBC) with HS-CAN transceiver |
| CAN Standard | ISO 11898-2:201x compliant HS-CAN; CAN FD compatible |
| V1 Regulator Output Voltage | 5 V |
| V1 Regulator Output Current | 250 mA |
| V2 Regulator Output Voltage | 5 V (internal CAN supply) |
| Number of Transceivers | 1 |
| Host Interface | SPI |
| Watchdog | Yes (hardware) |
| Low-Power Modes | Yes - Sleep / Standby with selective CAN wake-up |
| Temperatura de operação | -40 C to +125 C (automotive grade) |
| Encapsulamento | 20-pin HVSON (3.5 x 5.5 mm), leadless, with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| AEC-Q100 | Qualified (automotive) |
Configuração de pinos do UJA1169ATK/F
| Pino 1 | TXD — CAN transmit data input from MCU |
| Pino 2 | GND — Ground reference |
| Pino 3 | VCC — 5V supply for CAN transceiver (V2 internal) |
| Pino 4 | RXD — CAN receive data output to MCU |
| Pino 5 | V1 — 5V / 250 mA LDO output to MCU |
| Pino 6 | SCK — SPI clock from MCU |
| Pino 7 | SDI — SPI data input to SBC |
| Pino 8 | SDO — SPI data output from SBC |
| Pino 9 | CSN — SPI chip-select (active low) |
| Pino 10 | INT — Interrupt output to MCU |
| Pino 11 | RST — Reset output to MCU (watchdog) |
| Pino 12 | WAKE — Local wake-up input |
| Pino 13 | BAT — Battery supply input (12V) |
| Pino 14 | VSUP — Voltage supply pin |
| Pino 15 | CANH — CAN high bus line |
| Pino 16 | CANL — CAN low bus line |
| Pino 17 | SPLIT — CAN bus split termination reference |
| Pino 18 | STB — Standby / mode control |
| Pino 19 | EN — Enable input |
| Pino 20 | EP — Exposed thermal pad (must be soldered to GND pour) |
Aplicações típicas
UJA1169ATK/F é adequado para 8 aplicaçãos: Automotive Body Control Module (BCM), CAN Gateway / Central Body Controller, HVAC and Climate Control ECU, Automotive Lighting Controller, Instrument Cluster, Powertrain Peripheral Module, Battery Management Slave Module, Industrial CAN-FD Sensor Node.
Automotive Body Control Module (BCM)
The UJA1169ATK/F is well-suited for body control modules because it pairs an HS-CAN transceiver with a 5 V / 250 mA V1 LDO that can directly power an MCU such as the NXP S32K1xx family, eliminating a discrete 5 V regulator and shrinking the PCB. The integrated SPI exposes fault counters and bus diagnostics so the BCM can report door-zone, lighting, or wiper faults to the vehicle network. Selective CAN wake-up lets the BCM sleep at microamp-level quiescent current while still waking on a valid CAN frame, a hard requirement for parking-lot dark-current budgets. The HVSON-20 (3.5 x 5.5 mm) package fits behind instrument-panel connectors.
Recomendado
CAN Gateway / Central Body Controller
Central gateway ECUs route traffic between CAN-FD sub-networks and need a reliable bus interface plus a stable 5 V rail for housekeeping logic. The UJA1169ATK/F's ISO 11898-2:201x compliance and CAN-FD data-rate support (up to 5 Mbps in the FD payload phase) make it fit for gateway bridging. The V2 rail keeps the internal transceiver well-regulated even during bus events, and the hardware watchdog can reset the gateway MCU if firmware locks up. AEC-Q100 qualification supports under-hood and cabin placement, and the low quiescent Sleep mode is critical for EV park-mode drain budgets.
Recomendado
HVAC and Climate Control ECU
HVAC modules sit on the body CAN network and need exactly one SBC per node to minimize BOM count. The UJA1169ATK/F's 250 mA V1 rail comfortably powers a small Cortex-M0/M4 climate MCU plus a few sensor rails, while V2 cleanly biases the CAN physical layer. Selective wake-up enables the HVAC ECU to power down its blower FETs and only respond to a wake-up frame from the BCM, preserving battery life. The 20-pin HVSON package's small footprint (3.5 x 5.5 mm) allows placement in the tight HVAC housing behind the dashboard.
Recomendado
Automotive Lighting Controller
Exterior and interior lighting controllers often use a CAN-attached SBC to consolidate the bus interface and the 5 V supply. The UJA1169ATK/F provides the 5 V / 250 mA rail to drive LED driver logic and runs the CAN-FD physical layer from V2. SPI lets the lighting MCU read bus-fault counters and set the SBC into Sleep when the vehicle is parked, satisfying stringent dark-current targets. AEC-Q100 Grade 1 (-40 C to +125 C) qualification ensures operation in headlamp housings where ambient temperatures soar.
Recomendado
Instrument Cluster
Instrument clusters require a deterministic, low-noise CAN interface plus a clean 5 V supply for the graphics MCU and display drivers. The UJA1169ATK/F's HS-CAN transceiver meets ISO 11898-2:201x EMC/ESD requirements for clusters that sit close to the dashboard antennas, and the integrated LDO removes one source of supply noise. The hardware watchdog and SPI diagnostics support ASIL-rated cluster designs by letting the host detect SBC faults quickly. The 3.5 x 5.5 mm HVSON package fits behind the cluster display PCB.
Recomendado
Powertrain Peripheral Module
Powertrain peripherals (transmission sensors, electric power steering sub-modules, ABS satellite sensors) need an SBC that survives 12 V load-dump and supplies a clean 5 V rail to a small MCU. The UJA1169ATK/F's automotive load-dump tolerance and 5 V / 250 mA V1 LDO support direct connection to the 12 V bus. CAN-FD capability future-proofs the node for higher-bandwidth sensor data, and Sleep mode with selective wake-up minimizes parasitic drain in always-attached sensors. The compact HVSON-20 package suits space-constrained sensor housings.
Recomendado
Battery Management Slave Module
Battery management slaves in EV packs communicate over CAN and need an SBC that handles the high-voltage bus isolation boundary while providing a 5 V rail. The UJA1169ATK/F can be placed on the low-voltage side of an isolator, providing HS-CAN connectivity and powering the slave MCU. AEC-Q100 qualification, wide temperature range, and selective wake-up extend battery life when the pack is idle. The compact 20-pin HVSON package simplifies routing on the densely populated slave board.
Recomendado
Industrial CAN-FD Sensor Node
Outside automotive, the UJA1169ATK/F also serves industrial CAN-FD sensor nodes (factory automation, building automation) that benefit from an integrated SBC. The 5 V / 250 mA V1 LDO powers the sensor MCU, the V2 rail biases the bus, and CAN-FD support enables high-throughput telemetry. AEC-Q100 over-qualification provides extra margin for harsh industrial environments with wide temperature swings and electrical noise. SPI access to diagnostics simplifies field service and predictive-maintenance data collection.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para UJA1169ATK/F — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | UJA1169ATK | UJA1169ATK/F/3 | UJA1169ATK/X | UJA1169ATK/X/F | UJA1169ATK/FZ |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-20 (3.5x5.5) | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same | HVSON-20 (3.5x5.5) - same |
| V1 Output Voltage | 5 V | 5 V | 3.3 V | 5 V | 5 V | 5 V |
| V1 Output Current | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA |
| V2 / VEXT Output | V2 (internal 5 V) | V2 (internal 5 V) | V2 (internal 5 V) | VEXT (off-board 5 V) | VEXT (off-board 5 V) | V2 (internal 5 V) |
| CAN Standard | ISO 11898-2 (CAN-FD) | ISO 11898-2 (CAN-FD) | ISO 11898-2 (CAN-FD) | ISO 11898-2 (CAN-FD) | ISO 11898-2 (CAN-FD) | ISO 11898-2 (CAN-FD) |
| Firmware Tag | /F | none | /F | none | /F | /F |
| Packing Method | Reel (13-inch) | Reel | Reel (Z suffix) | Reel | Reel (Z suffix) | Reel + sulfur barrier bag (Z) |
| Automotive Grade | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) |
Principais diferenciais
- Standard /F firmware configuration (vs UJA1169ATK (no /F tag))
- V2 internal-only 5 V supply (vs VEXT on /X variants) (vs UJA1169ATK/X/F)
- 5 V V1 output vs 3.3 V on /F/3 (vs UJA1169ATK/F/3)
Notas de projeto
Estimated: at VIN=12 V, V1=5 V, IOUT=250 mA on the V1 LDO, the UJA1169ATK/F dissipates roughly (12-5) x 0.25 = 1.75 W in the package. The HVSON-20 has an exposed thermal pad that must be soldered to a copper pour of at least ~1 square inch to keep junction temperature rise within safe limits at 1.75 W. Add thermal vias under the EP for additional spreading. Without a sufficient pour, expect thermal shutdown at sustained high ambient temperatures.
Place the V1 output capacitor (per datasheet value, typically a low-ESR ceramic) within 1-2 mm of the V1 pin to ensure LDO loop stability. Add a bulk capacitor at the BAT/VSUP pin to absorb 12 V load-dump transients. Route CANH and CANL as a 100-120 ohm differential pair with characteristic impedance matching the bus termination; keep stubs short and place the 120 ohm termination resistor near the SBC CANH/CANL pins.
Do not leave the exposed pad (pin 20) floating - the HVSON package's primary thermal path is through the EP. Avoid pulling CSN high during SPI transactions before the SBC is fully powered; follow the NXP UJA1169 datasheet SPI timing diagram. When migrating from UJA1169ATK to UJA1169ATK/F, verify the firmware register defaults match - the /F tag changes the default state of certain control bits, and stale driver code can leave the SBC in an unintended mode after reset.
Keep the GND pour continuous under and around the SBC to provide a low-impedance return for both the high-current CAN driver and the sensitive analog reference. Separate the digital SPI traces (SCK, SDI, SDO, CSN) from the analog CAN bus traces with a ground barrier to prevent digital switching noise from coupling into the CAN physical layer. Place the SPI pull-ups or pull-downs (per NXP reference design) close to the MCU, not the SBC.
The CAN driver edges on the UJA1169ATK/F are slew-rate limited to meet automotive EMC requirements, but common-mode chokes on CANH/CANL are still recommended for CISPR 25 compliance in modules mounted near antennas. Add a small capacitor (e.g., 100 nF) between VBAT and ground at the SBC pin to filter high-frequency noise from the 12 V rail. Decouple V2 with a 100 nF + 1 uF combination close to the pin for clean CAN transceiver bias.
Informações de conformidade
AEC-Q100 qualified for automotive applications. RoHS compliant per NXP product page. Halogen-free status not specified in provided data.
