XA7S25-1CSGA324I - Spartan-7 FPGA, 150 I/O | AMD
N.º da peça: XA7S25-1CSGA324I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.36 | $48,36 |
| 10 | $44.5 | $445,00 |
| 100 | $40.2 | $4.020,00 |
| 500 | $36.8 | $18.400,00 |
| 1.000 | $33.5 | $33.500,00 |
XA7S25-1CSGA324I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement any digital logic function. They are a subset of programmable logic devices (PLDs) and sit within the broader category of embedded processors and controllers. FPGAs are distinct from microcontrollers and ASICs because they offer reconfigurability, enabling rapid prototyping and in-field updates.
Key features of the XA7S25-1CSGA324I include 150 user I/Os, 1.58 Mbit of block RAM, and support for various I/O standards such as LVCMOS, LVDS, and SSTL. The device is AEC-Q100 qualified, making it suitable for automotive electronics. It also supports partial reconfiguration and has built-in security features like AES bitstream encryption. The CSGA-324 package offers a compact footprint with a 0.8mm ball pitch, ideal for space-constrained designs.
Technically, the Spartan-7 family is built on a 28nm process, balancing performance and power efficiency. The XA7S25 includes DSP slices for signal processing, clock management tiles (CMT) with PLLs and MMCMs, and high-speed transceivers (though this specific variant does not include GTP transceivers). The device supports configuration via JTAG, SPI, or BPI interfaces, and can be programmed using AMD's Vivado Design Suite.
Typical applications include automotive driver assistance systems (ADAS), industrial motor control, machine vision, and communication interfaces. The XA7S25's combination of logic density, I/O count, and automotive qualification makes it ideal for these environments.
When designing with this FPGA, ensure proper decoupling of the core and I/O supplies, and follow the layout guidelines in UG475 for the CSGA package. The device requires a 1.0V core supply and 1.8V/2.5V/3.3V I/O supplies, depending on the bank configuration.
Alternativas drop-in para XA7S25-1CSGA324I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XA7S25-1CSGA324I (mesmo formato e footprint) — diferindo em Logic Cells.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7S25-1CSGA324I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XA7S25-1CSGA324Q
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7S25-2CSGA324I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XA7S15-1CSGA324I
⚡ Mesmo encapsulamento ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XA7S50-1CSGA324I
⚡ Mesmo encapsulamento ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XA7S25-1CSGA324I Classificações máximas e características elétricas
| Logic Cells | 23360 |
| Adaptive Logic Modules (ALMs) | 3650 |
| Block RAM | 1.58 Mbit |
| Number of I/O | 150 |
| Core Voltage | 0.95 V to 1.05 V |
| Faixa de temperatura de operação | -40°C to +100°C |
| Package Type | 324-LFBGA, CSPBGA (CSGA-324) |
| Tipo de montagem | Surface Mount |
| Nível de sensibilidade à umidade (MSL) | 3 |
| Peak Reflow Temperature | 260°C |
| Maximum Time at Peak Reflow Temperature | 30 s |
| AEC-Q100 Qualification | Qualified |
| Status RoHS | Compliant |
| Speed Grade | -1 |
| Configuration Interfaces | JTAG, SPI, BPI |
Configuração de pinos do XA7S25-1CSGA324I
| Pino A1 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pino A2 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pino B1 | VCCINT — Core supply voltage (1.0V) |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pino C2 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pino D1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pino E2 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pino F1 | VCCIO_0 — I/O supply voltage for bank 0 |
| Pino F2 | GND — Ground |
Aplicações típicas
XA7S25-1CSGA324I é adequado para 6 aplicaçãos: Automotive Driver Assistance Systems (ADAS), Industrial Motor Control, Machine Vision Systems, Communication Interfaces, Test and Measurement Equipment, Aerospace and Defense.
Automotive Driver Assistance Systems (ADAS)
The XA7S25-1CSGA324I is ideal for ADAS applications such as camera-based object detection and sensor fusion. Its 23,360 logic cells and 150 I/Os provide sufficient resources for implementing image processing pipelines and communication interfaces like CAN and Ethernet. The AEC-Q100 qualification ensures reliable operation in automotive environments with temperatures up to 100°C. The FPGA's reconfigurability allows for algorithm updates in the field, making it a flexible platform for evolving ADAS features. With 1.58 Mbit of block RAM, it can buffer image data and support real-time processing. The compact CSGA-324 package fits space-constrained automotive ECUs.
Recomendado
Industrial Motor Control
The XA7S25-1CSGA324I excels in industrial motor control applications, where its 150 I/Os can interface with multiple encoders, current sensors, and gate drivers. The FPGA's parallel processing capability enables high-speed PWM generation and real-time fault detection, improving motor efficiency and reliability. Its 1.58 Mbit block RAM can store lookup tables for sensorless control algorithms. The wide temperature range (-40°C to +100°C) suits harsh factory environments. The device's AEC-Q100 qualification also ensures robustness in industrial settings. With support for various I/O standards, it can directly connect to industrial fieldbuses like PROFIBUS and EtherCAT.
Recomendado
Machine Vision Systems
In machine vision, the XA7S25-1CSGA324I provides the logic capacity to implement real-time image processing algorithms such as edge detection, filtering, and feature extraction. Its 150 I/Os can connect to image sensors and display interfaces, while the 1.58 Mbit block RAM supports line buffering and frame storage. The FPGA's parallel architecture accelerates processing compared to sequential processors, enabling high-throughput inspection systems. The -40°C to +100°C operating range allows deployment in factory floors with temperature variations. The CSGA-324 package's small footprint is advantageous for compact camera modules. The device can also interface with external DDR memory for larger frame buffers.
Recomendado
Communication Interfaces
The XA7S25-1CSGA324I is well-suited for implementing custom communication interfaces such as UART, SPI, I2C, and Ethernet. Its 150 I/Os provide ample pins for multiple protocols, and the FPGA's flexibility allows for protocol adaptation without hardware changes. The 23,360 logic cells can implement protocol stacks and data buffering, while the 1.58 Mbit block RAM stores packets. The device's support for various I/O standards (LVCMOS, LVDS) enables direct connection to transceivers. The AEC-Q100 qualification ensures reliable communication in automotive and industrial networks. The compact package is ideal for embedded communication modules.
Recomendado
Test and Measurement Equipment
The XA7S25-1CSGA324I is used in test and measurement equipment for its high-speed I/O and reconfigurable logic. It can implement custom triggering, data acquisition, and signal processing functions. The 150 I/Os allow connection to ADCs, DACs, and display interfaces. The 1.58 Mbit block RAM supports data buffering for waveform capture. The FPGA's parallel processing enables simultaneous measurement of multiple channels. The wide temperature range and AEC-Q100 qualification make it suitable for portable and benchtop instruments. The CSGA-324 package's small size helps in compact designs.
Recomendado
Aerospace and Defense
The XA7S25-1CSGA324I is suitable for aerospace and defense applications requiring high reliability and security. Its AEC-Q100 qualification ensures operation in extreme conditions, and the FPGA's reconfigurability allows for secure bitstream updates. The 23,360 logic cells can implement encryption, signal processing, and control logic. The 150 I/Os interface with sensors and actuators. The device supports AES bitstream encryption, protecting intellectual property. The wide temperature range and compact package make it ideal for avionics and unmanned systems. The FPGA's radiation tolerance, while not explicitly rated, is sufficient for many non-critical space applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XA7S25-1CSGA324I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7S25-1CSGA324I | XA7S25-1CSGA324Q | XC7S25-2CSGA324I |
|---|---|---|---|---|
| Package | CSGA-324 | CSGA-324 | CSGA-324 | CSGA-324 |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 23360 | 23360 | 23360 | 23360 |
| Block RAM | 1.58 Mbit | 1.58 Mbit | 1.58 Mbit | 1.58 Mbit |
| Number of I/O | 150 | 150 | 150 | 150 |
| Core Voltage | 0.95V - 1.05V | 0.95V - 1.05V | 0.95V - 1.05V | 0.95V - 1.05V |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | -40°C to +125°C | 0°C to +85°C |
| AEC-Q100 | Qualified | Not qualified | Qualified | Not qualified |
Principais diferenciais
- Automotive qualification (AEC-Q100) (vs XC7S25-1CSGA324I)
- Wider temperature range (vs XC7S25-1CSGA324I)
- Same package and pinout as commercial version (vs XC7S25-1CSGA324I)
Notas de projeto
The XA7S25-1CSGA324I requires a 1.0V core supply (VCCINT) and 1.8V auxiliary supply (VCCAUX). I/O banks can operate at 1.8V, 2.5V, or 3.3V depending on the bank. Use low-ESR decoupling capacitors (0.1uF and 1uF) close to each power pin. For high-speed designs, consider a dedicated power plane for VCCINT to minimize noise.
The CSGA-324 package has a thermal resistance (theta_JA) of approximately 20°C/W. For typical designs dissipating 1-2W, a heatsink or forced airflow may be needed to keep junction temperature below 125°C. Ensure adequate copper pour on the PCB to aid heat spreading. The operating temperature range is -40°C to +100°C ambient.
Follow AMD's UG475 guidelines for CSGA-324 layout. Use a 0.8mm ball pitch, and ensure proper solder mask opening. For high-speed signals, maintain controlled impedance and minimize trace lengths. Place configuration resistors and JTAG header for programming. Use via-in-pad for better thermal and electrical performance.
Informações de conformidade
AEC-Q100 qualified per AMD XA series. RoHS compliant per distributor data. REACH and conflict minerals status not specified in provided data.
