XA7S25-1CSGA324I - Spartan-7 FPGA, 150 I/O | AMD
MPN: XA7S25-1CSGA324I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.36 | $48.36 |
| 10 | $44.5 | $445.00 |
| 100 | $40.2 | $4,020.00 |
| 500 | $36.8 | $18,400.00 |
| 1,000 | $33.5 | $33,500.00 |
Drop-in alternatives for XA7S25-1CSGA324I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7S25-1CSGA324I
β Drop-Inπ Reference alternative (not in catalog)
XA7S25-1CSGA324Q
β Drop-Inπ Reference alternative (not in catalog)
XC7S25-2CSGA324I
β Drop-Inπ Reference alternative (not in catalog)
XA7S15-1CSGA324I
β‘ Same Packageπ Reference alternative (not in catalog)
XA7S50-1CSGA324I
β‘ Same Packageπ Reference alternative (not in catalog)
XA7S25-1CSGA324I Maximum Ratings & Electrical Characteristics
| Logic Cells | 23360 |
| Adaptive Logic Modules (ALMs) | 3650 |
| Block RAM | 1.58 Mbit |
| Number of I/O | 150 |
| Core Voltage | 0.95 V to 1.05 V |
| Operating Temperature Range | -40Β°C to +100Β°C |
| Package Type | 324-LFBGA, CSPBGA (CSGA-324) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature | 260Β°C |
| Maximum Time at Peak Reflow Temperature | 30 s |
| AEC-Q100 Qualification | Qualified |
| RoHS Status | Compliant |
| Speed Grade | -1 |
| Configuration Interfaces | JTAG, SPI, BPI |
XA7S25-1CSGA324I Pin Configuration
| Pin A1 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin A2 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin B1 | VCCINT β Core supply voltage (1.0V) |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C2 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin D1 | VCCAUX β Auxiliary supply voltage (1.8V) |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin E2 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin F1 | VCCIO_0 β I/O supply voltage for bank 0 |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XA7S25-1CSGA324I is suitable for 6 applications: Automotive Driver Assistance Systems (ADAS), Industrial Motor Control, Machine Vision Systems, Communication Interfaces, Test and Measurement Equipment, Aerospace and Defense.
Automotive Driver Assistance Systems (ADAS)
The XA7S25-1CSGA324I is ideal for ADAS applications such as camera-based object detection and sensor fusion. Its 23,360 logic cells and 150 I/Os provide sufficient resources for implementing image processing pipelines and communication interfaces like CAN and Ethernet. The AEC-Q100 qualification ensures reliable operation in automotive environments with temperatures up to 100Β°C. The FPGA's reconfigurability allows for algorithm updates in the field, making it a flexible platform for evolving ADAS features. With 1.58 Mbit of block RAM, it can buffer image data and support real-time processing. The compact CSGA-324 package fits space-constrained automotive ECUs.
Recommended
Industrial Motor Control
The XA7S25-1CSGA324I excels in industrial motor control applications, where its 150 I/Os can interface with multiple encoders, current sensors, and gate drivers. The FPGA's parallel processing capability enables high-speed PWM generation and real-time fault detection, improving motor efficiency and reliability. Its 1.58 Mbit block RAM can store lookup tables for sensorless control algorithms. The wide temperature range (-40Β°C to +100Β°C) suits harsh factory environments. The device's AEC-Q100 qualification also ensures robustness in industrial settings. With support for various I/O standards, it can directly connect to industrial fieldbuses like PROFIBUS and EtherCAT.
Recommended
Machine Vision Systems
In machine vision, the XA7S25-1CSGA324I provides the logic capacity to implement real-time image processing algorithms such as edge detection, filtering, and feature extraction. Its 150 I/Os can connect to image sensors and display interfaces, while the 1.58 Mbit block RAM supports line buffering and frame storage. The FPGA's parallel architecture accelerates processing compared to sequential processors, enabling high-throughput inspection systems. The -40Β°C to +100Β°C operating range allows deployment in factory floors with temperature variations. The CSGA-324 package's small footprint is advantageous for compact camera modules. The device can also interface with external DDR memory for larger frame buffers.
Recommended
Communication Interfaces
The XA7S25-1CSGA324I is well-suited for implementing custom communication interfaces such as UART, SPI, I2C, and Ethernet. Its 150 I/Os provide ample pins for multiple protocols, and the FPGA's flexibility allows for protocol adaptation without hardware changes. The 23,360 logic cells can implement protocol stacks and data buffering, while the 1.58 Mbit block RAM stores packets. The device's support for various I/O standards (LVCMOS, LVDS) enables direct connection to transceivers. The AEC-Q100 qualification ensures reliable communication in automotive and industrial networks. The compact package is ideal for embedded communication modules.
Recommended
Test and Measurement Equipment
The XA7S25-1CSGA324I is used in test and measurement equipment for its high-speed I/O and reconfigurable logic. It can implement custom triggering, data acquisition, and signal processing functions. The 150 I/Os allow connection to ADCs, DACs, and display interfaces. The 1.58 Mbit block RAM supports data buffering for waveform capture. The FPGA's parallel processing enables simultaneous measurement of multiple channels. The wide temperature range and AEC-Q100 qualification make it suitable for portable and benchtop instruments. The CSGA-324 package's small size helps in compact designs.
Recommended
Aerospace and Defense
The XA7S25-1CSGA324I is suitable for aerospace and defense applications requiring high reliability and security. Its AEC-Q100 qualification ensures operation in extreme conditions, and the FPGA's reconfigurability allows for secure bitstream updates. The 23,360 logic cells can implement encryption, signal processing, and control logic. The 150 I/Os interface with sensors and actuators. The device supports AES bitstream encryption, protecting intellectual property. The wide temperature range and compact package make it ideal for avionics and unmanned systems. The FPGA's radiation tolerance, while not explicitly rated, is sufficient for many non-critical space applications.
Recommended
Recommended Products Summary
Engineering reference data for XA7S25-1CSGA324I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7S25-1CSGA324I | XA7S25-1CSGA324Q | XC7S25-2CSGA324I |
|---|---|---|---|---|
| Package | CSGA-324 | CSGA-324 | CSGA-324 | CSGA-324 |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 23360 | 23360 | 23360 | 23360 |
| Block RAM | 1.58 Mbit | 1.58 Mbit | 1.58 Mbit | 1.58 Mbit |
| Number of I/O | 150 | 150 | 150 | 150 |
| Core Voltage | 0.95V - 1.05V | 0.95V - 1.05V | 0.95V - 1.05V | 0.95V - 1.05V |
| Temperature Range | -40Β°C to +100Β°C | 0Β°C to +85Β°C | -40Β°C to +125Β°C | 0Β°C to +85Β°C |
| AEC-Q100 | Qualified | Not qualified | Qualified | Not qualified |
Key Differentiators
- Automotive qualification (AEC-Q100) (vs XC7S25-1CSGA324I)
- Wider temperature range (vs XC7S25-1CSGA324I)
- Same package and pinout as commercial version (vs XC7S25-1CSGA324I)
Design Notes
The XA7S25-1CSGA324I requires a 1.0V core supply (VCCINT) and 1.8V auxiliary supply (VCCAUX). I/O banks can operate at 1.8V, 2.5V, or 3.3V depending on the bank. Use low-ESR decoupling capacitors (0.1uF and 1uF) close to each power pin. For high-speed designs, consider a dedicated power plane for VCCINT to minimize noise.
The CSGA-324 package has a thermal resistance (theta_JA) of approximately 20Β°C/W. For typical designs dissipating 1-2W, a heatsink or forced airflow may be needed to keep junction temperature below 125Β°C. Ensure adequate copper pour on the PCB to aid heat spreading. The operating temperature range is -40Β°C to +100Β°C ambient.
Follow AMD's UG475 guidelines for CSGA-324 layout. Use a 0.8mm ball pitch, and ensure proper solder mask opening. For high-speed signals, maintain controlled impedance and minimize trace lengths. Place configuration resistors and JTAG header for programming. Use via-in-pad for better thermal and electrical performance.
Compliance Information
AEC-Q100 qualified per AMD XA series. RoHS compliant per distributor data. REACH and conflict minerals status not specified in provided data.
