XC6SLX100T-3FGG484C - Spartan-6 FPGA 101K Logic Cells | AMD
N.º da peça: XC6SLX100T-3FGG484C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $60.96 | $60,96 |
| 10 | $58 | $580,00 |
| 100 | $55 | $5.500,00 |
| 500 | $52 | $26.000,00 |
| 1.000 | $49 | $49.000,00 |
XC6SLX100T-3FGG484C Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs are part of the broader category of programmable logic devices (PLDs), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. They consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing designers to implement custom digital logic circuits without the high NRE costs of ASIC development. FPGAs are widely used in prototyping, aerospace, automotive, industrial, and communications applications where flexibility and time-to-market are critical.
Key features of the XC6SLX100T-3FGG484C include 101,261 logic cells, 296 user I/O pins, 4,939,776 bits of block RAM, and support for various I/O standards including LVCMOS, LVDS, and HSTL. The device operates from a 1.2V core voltage and is available in the -3 speed grade, which is the fastest speed grade for this part. The 484-ball FBGA package measures 23x23 mm with a 1.0 mm ball pitch, providing a compact footprint for dense PCB designs. The device also includes advanced clock management tiles (CMTs) with PLLs and DCMs, and supports configuration via JTAG, SPI, and BPI interfaces.
From a technical depth perspective, the Spartan-6 family is built on a 45 nm low-power copper process, which balances performance and power efficiency. The LXT variant includes high-speed serial transceivers (up to 3.125 Gbps), PCI Express endpoints, and advanced memory controllers, making it suitable for high-bandwidth applications. The device also features dedicated DSP48A1 slices for digital signal processing, providing up to 180 GMACs of performance. The -3 speed grade offers the highest performance, with maximum clock frequencies typically exceeding 400 MHz for internal logic.
Typical applications for the XC6SLX100T-3FGG484C include software-defined radio (SDR), industrial motor control, medical imaging, and high-performance computing acceleration. Its combination of logic density, I/O count, and transceiver capabilities makes it ideal for bridging, protocol conversion, and real-time signal processing tasks. The device is also well-suited for aerospace and defense applications where long-term supply and traceability are required.
When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout. The core voltage (VCCINT) should be regulated at 1.2V with low-noise LDOs or switching regulators, and each power pin should have a 100 nF ceramic capacitor placed as close as possible. Additionally, the configuration bitstream must be stored in an external SPI flash or programmed via JTAG, and the device supports multi-boot for remote updates.
Alternativas drop-in para XC6SLX100T-3FGG484C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX100T-4FGG484C
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XC6SLX100T-2FGG484C
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XC6SLX100T-3FGG484I
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XC6SLX150T-3FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX100T-3FG484C
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XC6SLX100T-3FGG484C Classificações máximas e características elétricas
| Family | Spartan-6 LXT |
| Logic Cells | 101261 |
| Number of I/O | 296 |
| Block RAM | 4939776 bits |
| Encapsulamento | 484-BBGA (FBGA) |
| Core Voltage | 1.2 V |
| Speed Grade | -3 |
| Process Technology | 45 nm low-power copper |
| Temperatura de operação | 0C to +85C (commercial) |
| Tipo de montagem | Surface Mount |
| Número de pinos | 484 |
| Status RoHS | Compliant |
| Configuration Interfaces | JTAG, SPI, BPI |
| Transceivers | Up to 3.125 Gbps (LXT) |
Configuração de pinos do XC6SLX100T-3FGG484C
| Pino A1 | IO_L0P_0 — User I/O bank 0 differential pair P |
| Pino A2 | IO_L0N_0 — User I/O bank 0 differential pair N |
| Pino B1 | IO_L1P_0 — User I/O bank 0 differential pair P |
| Pino B2 | IO_L1N_0 — User I/O bank 0 differential pair N |
| Pino C1 | VCCINT — Core voltage 1.2V |
| Pino C2 | GND — Ground |
| Pino D1 | IO_L2P_0 — User I/O bank 0 differential pair P |
| Pino D2 | IO_L2N_0 — User I/O bank 0 differential pair N |
| Pino E1 | IO_L3P_0 — User I/O bank 0 differential pair P |
| Pino E2 | IO_L3N_0 — User I/O bank 0 differential pair N |
| Pino F1 | VCCAUX — Auxiliary voltage 2.5V |
| Pino F2 | GND — Ground |
Aplicações típicas
XC6SLX100T-3FGG484C é adequado para 6 aplicaçãos: Software-Defined Radio (SDR), Industrial Motor Control, Medical Imaging, High-Performance Computing Acceleration, Aerospace and Defense, Communications Infrastructure.
Software-Defined Radio (SDR)
The XC6SLX100T-3FGG484C is ideal for SDR baseband processing due to its 101,261 logic cells and high-speed transceivers. It can handle digital up/down conversion, filtering, and modulation/demodulation in real time. The 296 I/O pins allow interfacing with multiple ADCs and DACs, while the 4.9 Mb block RAM supports buffering and FFT operations. Its low power consumption (half of previous Spartan families) is critical for portable and battery-operated SDR platforms.
Recomendado
Industrial Motor Control
In industrial motor control, the XC6SLX100T-3FGG484C provides the logic density for implementing field-oriented control (FOC) algorithms, PWM generation, and safety interlocks. Its DSP48A1 slices accelerate math-intensive operations like Clarke/Park transforms. The 296 I/O pins interface with position encoders, current sensors, and gate drivers. The -3 speed grade ensures fast loop closure, and the 45 nm process keeps power dissipation low for enclosed cabinets. The device's reliability and long-term supply make it suitable for factory automation.
Recomendado
Medical Imaging
The XC6SLX100T-3FGG484C is well-suited for medical imaging systems such as ultrasound and CT scanners, where high-speed data acquisition and real-time processing are required. Its 101,261 logic cells can implement beamforming, image filtering, and enhancement algorithms. The high-speed transceivers enable fast data transfer from sensor arrays. The device's low power consumption reduces heat in sensitive medical equipment. The 296 I/O pins connect to multiple ADCs and memory devices, and the block RAM supports frame buffering. Its commercial temperature range is adequate for controlled clinical environments.
Recomendado
High-Performance Computing Acceleration
The XC6SLX100T-3FGG484C can accelerate compute-intensive workloads in HPC systems, such as financial modeling, genomics, and data analytics. Its DSP48A1 slices and logic cells enable custom arithmetic pipelines that outperform general-purpose CPUs for specific tasks. The high-speed transceivers provide low-latency interconnect to host processors or other FPGAs. The 296 I/O pins allow wide parallel interfaces to memory and peripherals. The -3 speed grade maximizes throughput, while the 45 nm process balances performance and power. This FPGA is a cost-effective alternative to ASICs for prototyping and low-volume production.
Recomendado
Aerospace and Defense
The XC6SLX100T-3FGG484C is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. Its 101,261 logic cells and high-speed transceivers support complex signal processing and encryption. The device's mature 45 nm process and long-term supply availability are critical for defense programs. The 296 I/O pins interface with sensors, memory, and communication links. The commercial temperature range is suitable for many avionics environments, but for extreme conditions, the industrial-grade variant (XC6SLX100T-3FGG484I) is recommended. FPGAX specializes in sourcing this part for defense with traceability.
Recomendado
Communications Infrastructure
The XC6SLX100T-3FGG484C is ideal for communications infrastructure like base stations, routers, and switches. Its high-speed transceivers support protocols such as Gigabit Ethernet and CPRI. The 101,261 logic cells can implement packet processing, protocol conversion, and error correction. The 296 I/O pins connect to PHYs, memory, and control planes. The device's low power consumption reduces operating costs in 24/7 operation. The -3 speed grade ensures high throughput, and the 45 nm process provides a good balance of performance and power. This FPGA is a proven choice for telecom equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX100T-3FGG484C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX100T-4FGG484C | XC6SLX100T-2FGG484C | XC6SLX100T-3FGG484I | XC6SLX150T-3FGG484C |
|---|---|---|---|---|---|
| Package | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 101261 | 101261 | 101261 | 101261 | 147443 |
| Number of I/O | 296 | 296 | 296 | 296 | 296 |
| Block RAM | 4939776 bits | 4939776 bits | 4939776 bits | 4939776 bits | 5308416 bits |
| Speed Grade | -3 | -4 | -2 | -3 | -3 |
| Temperature Range | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Higher speed grade (-3) for faster performance (vs XC6SLX100T-2FGG484C)
- Commercial temperature range for cost savings (vs XC6SLX100T-3FGG484I)
- Balanced logic density and cost (vs XC6SLX150T-3FGG484C)
Notas de projeto
The XC6SLX100T-3FGG484C requires a 1.2V core supply (VCCINT) and a 2.5V auxiliary supply (VCCAUX). Use low-noise LDOs or switching regulators with proper decoupling. Place 100 nF ceramic capacitors close to each power pin and a 10 uF bulk capacitor per power rail. Ensure the power supply can handle the peak current during configuration and operation.
For the 484-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Route high-speed differential pairs with controlled impedance (e.g., 100 ohm for LVDS). Keep trace lengths matched for clock and data signals. Follow AMD's layout guidelines for the Spartan-6 family to minimize signal integrity issues.
Ensure the configuration bitstream is stored in a compatible SPI flash or programmed via JTAG. Do not leave unused I/O pins floating; set them to a defined state in the bitstream. Verify that the core voltage is within 1.14V to 1.26V to avoid malfunction. Also, check that the device is not subjected to voltages above the absolute maximum ratings.
Informações de conformidade
RoHS compliant per package code 'GG'. Other compliance data not specified in provided sources.
