XC6SLX100T-3FGG484C - Spartan-6 FPGA 101K Logic Cells | AMD
MPN: XC6SLX100T-3FGG484C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $60.96 | $60.96 |
| 10 | $58 | $580.00 |
| 100 | $55 | $5,500.00 |
| 500 | $52 | $26,000.00 |
| 1,000 | $49 | $49,000.00 |
Drop-in alternatives for XC6SLX100T-3FGG484C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC6SLX100T-4FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX100T-2FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX100T-3FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX150T-3FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX100T-3FG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX100T-3FGG484C Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LXT |
| Logic Cells | 101261 |
| Number of I/O | 296 |
| Block RAM | 4939776 bits |
| Package | 484-BBGA (FBGA) |
| Core Voltage | 1.2 V |
| Speed Grade | -3 |
| Process Technology | 45 nm low-power copper |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Number of Pins | 484 |
| RoHS Status | Compliant |
| Configuration Interfaces | JTAG, SPI, BPI |
| DSP Slices | [DATA_NEEDED: DSP48A1 slice count] |
| Transceivers | Up to 3.125 Gbps (LXT) |
XC6SLX100T-3FGG484C Pin Configuration
| Pin A1 | IO_L0P_0 β User I/O bank 0 differential pair P |
| Pin A2 | IO_L0N_0 β User I/O bank 0 differential pair N |
| Pin B1 | IO_L1P_0 β User I/O bank 0 differential pair P |
| Pin B2 | IO_L1N_0 β User I/O bank 0 differential pair N |
| Pin C1 | VCCINT β Core voltage 1.2V |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_0 β User I/O bank 0 differential pair P |
| Pin D2 | IO_L2N_0 β User I/O bank 0 differential pair N |
| Pin E1 | IO_L3P_0 β User I/O bank 0 differential pair P |
| Pin E2 | IO_L3N_0 β User I/O bank 0 differential pair N |
| Pin F1 | VCCAUX β Auxiliary voltage 2.5V |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC6SLX100T-3FGG484C is suitable for 6 applications: Software-Defined Radio (SDR), Industrial Motor Control, Medical Imaging, High-Performance Computing Acceleration, Aerospace and Defense, Communications Infrastructure.
Software-Defined Radio (SDR)
The XC6SLX100T-3FGG484C is ideal for SDR baseband processing due to its 101,261 logic cells and high-speed transceivers. It can handle digital up/down conversion, filtering, and modulation/demodulation in real time. The 296 I/O pins allow interfacing with multiple ADCs and DACs, while the 4.9 Mb block RAM supports buffering and FFT operations. Its low power consumption (half of previous Spartan families) is critical for portable and battery-operated SDR platforms.
Recommended
Industrial Motor Control
In industrial motor control, the XC6SLX100T-3FGG484C provides the logic density for implementing field-oriented control (FOC) algorithms, PWM generation, and safety interlocks. Its DSP48A1 slices accelerate math-intensive operations like Clarke/Park transforms. The 296 I/O pins interface with position encoders, current sensors, and gate drivers. The -3 speed grade ensures fast loop closure, and the 45 nm process keeps power dissipation low for enclosed cabinets. The device's reliability and long-term supply make it suitable for factory automation.
Recommended
Medical Imaging
The XC6SLX100T-3FGG484C is well-suited for medical imaging systems such as ultrasound and CT scanners, where high-speed data acquisition and real-time processing are required. Its 101,261 logic cells can implement beamforming, image filtering, and enhancement algorithms. The high-speed transceivers enable fast data transfer from sensor arrays. The device's low power consumption reduces heat in sensitive medical equipment. The 296 I/O pins connect to multiple ADCs and memory devices, and the block RAM supports frame buffering. Its commercial temperature range is adequate for controlled clinical environments.
Recommended
High-Performance Computing Acceleration
The XC6SLX100T-3FGG484C can accelerate compute-intensive workloads in HPC systems, such as financial modeling, genomics, and data analytics. Its DSP48A1 slices and logic cells enable custom arithmetic pipelines that outperform general-purpose CPUs for specific tasks. The high-speed transceivers provide low-latency interconnect to host processors or other FPGAs. The 296 I/O pins allow wide parallel interfaces to memory and peripherals. The -3 speed grade maximizes throughput, while the 45 nm process balances performance and power. This FPGA is a cost-effective alternative to ASICs for prototyping and low-volume production.
Recommended
Aerospace and Defense
The XC6SLX100T-3FGG484C is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. Its 101,261 logic cells and high-speed transceivers support complex signal processing and encryption. The device's mature 45 nm process and long-term supply availability are critical for defense programs. The 296 I/O pins interface with sensors, memory, and communication links. The commercial temperature range is suitable for many avionics environments, but for extreme conditions, the industrial-grade variant (XC6SLX100T-3FGG484I) is recommended. FPGAX specializes in sourcing this part for defense with traceability.
Recommended
Communications Infrastructure
The XC6SLX100T-3FGG484C is ideal for communications infrastructure like base stations, routers, and switches. Its high-speed transceivers support protocols such as Gigabit Ethernet and CPRI. The 101,261 logic cells can implement packet processing, protocol conversion, and error correction. The 296 I/O pins connect to PHYs, memory, and control planes. The device's low power consumption reduces operating costs in 24/7 operation. The -3 speed grade ensures high throughput, and the 45 nm process provides a good balance of performance and power. This FPGA is a proven choice for telecom equipment.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX100T-3FGG484C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX100T-4FGG484C | XC6SLX100T-2FGG484C | XC6SLX100T-3FGG484I | XC6SLX150T-3FGG484C |
|---|---|---|---|---|---|
| Package | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) | 484-BBGA (FBGA) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 101261 | 101261 | 101261 | 101261 | 147443 |
| Number of I/O | 296 | 296 | 296 | 296 | 296 |
| Block RAM | 4939776 bits | 4939776 bits | 4939776 bits | 4939776 bits | 5308416 bits |
| Speed Grade | -3 | -4 | -2 | -3 | -3 |
| Temperature Range | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Higher speed grade (-3) for faster performance (vs XC6SLX100T-2FGG484C)
- Commercial temperature range for cost savings (vs XC6SLX100T-3FGG484I)
- Balanced logic density and cost (vs XC6SLX150T-3FGG484C)
Design Notes
The XC6SLX100T-3FGG484C requires a 1.2V core supply (VCCINT) and a 2.5V auxiliary supply (VCCAUX). Use low-noise LDOs or switching regulators with proper decoupling. Place 100 nF ceramic capacitors close to each power pin and a 10 uF bulk capacitor per power rail. Ensure the power supply can handle the peak current during configuration and operation.
For the 484-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Route high-speed differential pairs with controlled impedance (e.g., 100 ohm for LVDS). Keep trace lengths matched for clock and data signals. Follow AMD's layout guidelines for the Spartan-6 family to minimize signal integrity issues.
Ensure the configuration bitstream is stored in a compatible SPI flash or programmed via JTAG. Do not leave unused I/O pins floating; set them to a defined state in the bitstream. Verify that the core voltage is within 1.14V to 1.26V to avoid malfunction. Also, check that the device is not subjected to voltages above the absolute maximum ratings.
Compliance Information
RoHS compliant per package code 'GG'. Other compliance data not specified in provided sources.
