XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD
N.º da peça: XC6SLX25-3FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45.32 | $45,32 |
| 10 | $41.87 | $418,70 |
| 100 | $36.54 | $3.654,00 |
| 500 | $32.1 | $16.050,00 |
| 1.000 | $28.75 | $28.750,00 |
XC6SLX25-3FGG484I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in terms of flexibility and performance. The Spartan-6 series is optimized for low power and cost-sensitive applications, making it a popular choice for industrial, automotive, and telecommunications systems.
Key features of the XC6SLX25-3FGG484I include a speed grade of -3, which is the highest performance grade available for Spartan-6 LX devices, enabling faster clock frequencies and improved timing margins. The device operates from a 1.2V core supply (1.14V to 1.26V range) and supports multiple I/O standards, including LVCMOS, LVDS, and HSTL. It also includes dedicated DSP48A1 slices and block RAM for efficient implementation of arithmetic and memory-intensive functions.
From a technical perspective, the Spartan-6 architecture incorporates a 6-input look-up table (LUT) fabric, advanced clock management tiles (CMTs) with PLLs and DCMs, and high-speed serial transceivers (in LXT variants). The -3 speed grade provides a maximum internal frequency of 500 MHz, as noted in the datasheet, enabling high-throughput designs. The device is RoHS compliant and lead-free, meeting modern environmental standards.
Typical applications for the XC6SLX25-3FGG484I include industrial automation, telecommunications infrastructure, automotive electronics, and video/image processing. Its combination of logic density, I/O count, and low power consumption makes it suitable for bridging, protocol conversion, and real-time control tasks.
When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high speeds. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and proper sequencing during power-up. Refer to the Spartan-6 FPGA datasheet and PCB design guidelines for detailed recommendations.
Alternativas drop-in para XC6SLX25-3FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX25-3FGG484I (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX25-3FGG484C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25-2FGG484I
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →XC6SLX25-N3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX45-3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XA6SLX25-3FGG484Q
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE5U-25F-6BG256C
⚡ Mesmo encapsulamento ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX25-3FGG484I Classificações máximas e características elétricas
| Family | Spartan-6 LX |
| Logic Cells | 24051 |
| Configurable Logic Blocks (CLBs) | 1879 |
| Total RAM Bits | 958464 |
| Number of I/O | 266 |
| Encapsulamento | 484-BBGA (23x23 mm) |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação de operação | 1.14 V ~ 1.26 V |
| Faixa de temperatura de operação | -40°C ~ 100°C (TJ) |
| Speed Grade | -3 (highest performance) |
| Internal Frequency | 500 MHz |
| Process Technology | 45nm CMOS |
| Status RoHS | Compliant |
| Lead Free | Yes |
| Number of LABs/CLBs | 1879 |
Configuração de pinos do XC6SLX25-3FGG484I
| Pino A1 | IO_L0P_0 — User I/O bank 0, differential pair P |
| Pino A2 | IO_L0N_0 — User I/O bank 0, differential pair N |
| Pino B1 | VCCINT — Core logic supply voltage (1.2V) |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L1P_0 — User I/O bank 0, differential pair P |
| Pino C2 | IO_L1N_0 — User I/O bank 0, differential pair N |
| Pino D1 | VCCAUX — Auxiliary supply voltage (2.5V) |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L2P_0 — User I/O bank 0, differential pair P |
| Pino E2 | IO_L2N_0 — User I/O bank 0, differential pair N |
| Pino F1 | VCCO_0 — I/O supply voltage for bank 0 |
| Pino F2 | GND — Ground |
Aplicações típicas
XC6SLX25-3FGG484I é adequado para 6 aplicaçãos: Industrial Automation, Telecommunications, Automotive Electronics, Video and Image Processing, Aerospace and Defense, IoT and Edge Computing.
Industrial Automation
The XC6SLX25-3FGG484I is ideal for industrial automation due to its 266 I/O pins and 24,051 logic cells, enabling implementation of motor control, PLC interfaces, and real-time monitoring. Its industrial temperature range (-40°C to 100°C) ensures reliable operation in harsh factory environments. The FPGA's low power consumption and high-speed performance support deterministic control loops and sensor fusion, making it a cost-effective solution for distributed control systems.
Recomendado
Telecommunications
In telecommunications, the XC6SLX25-3FGG484I excels in protocol bridging, packet processing, and signal aggregation. With 958,464 RAM bits and 500 MHz internal frequency, it can handle high-throughput data paths and implement complex state machines. The 266 I/O pins support multiple high-speed interfaces like LVDS and HSTL, enabling seamless connection to PHYs and switches. Its low power footprint is critical for line cards and remote radio heads.
Recomendado
Automotive Electronics
The XC6SLX25-3FGG484I is suitable for automotive applications such as infotainment, ADAS, and body control modules. Its industrial temperature range and robust I/O support automotive-grade interfaces like CAN and LIN. The FPGA's reconfigurability allows for over-the-air updates and adaptation to evolving standards. With 24,051 logic cells, it can implement vision processing algorithms and sensor fusion, while the -3 speed grade ensures real-time performance.
Recomendado
Video and Image Processing
The XC6SLX25-3FGG484I is well-suited for video and image processing applications, including frame grabbers, video converters, and machine vision systems. Its 958,464 RAM bits can store multiple lines of video data, and the DSP48A1 slices accelerate filtering and transformation algorithms. The 266 I/O pins support parallel video buses and serial interfaces like LVDS, enabling high-bandwidth data transfer. The -3 speed grade ensures real-time processing at high resolutions.
Recomendado
Aerospace and Defense
In aerospace and defense, the XC6SLX25-3FGG484I is used in radar processing, secure communications, and flight control systems. Its industrial temperature range and proven reliability make it suitable for harsh environments. The FPGA's reconfigurability allows for mission-specific logic updates, while the 24,051 logic cells provide ample resources for signal processing and encryption. The -3 speed grade supports high-speed data acquisition and real-time control.
Recomendado
IoT and Edge Computing
The XC6SLX25-3FGG484I is a powerful choice for IoT gateways and edge computing nodes, where low power and flexibility are key. Its 24,051 logic cells can implement protocol conversion, data aggregation, and local AI inference. The 266 I/O pins connect to various sensors and communication modules, while the 958,464 RAM bits buffer data for efficient processing. The industrial temperature range ensures reliable operation in outdoor or remote installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX25-3FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX25-3FGG484C | XC6SLX25-2FGG484I | XC6SLX25-N3FGG484I | XC6SLX45-3FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 24051 | 24051 | 24051 | 24051 | 43661 |
| Number of I/O | 266 | 266 | 266 | 266 | 316 |
| Total RAM Bits | 958464 | 958464 | 958464 | 958464 | 2080768 |
| Speed Grade | -3 | -3 | -2 | -3 | -3 |
| Operating Temperature Range | -40°C to 100°C | 0°C to 85°C | -40°C to 100°C | -40°C to 100°C | -40°C to 100°C |
| Core Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
Principais diferenciais
- Highest speed grade (-3) in Spartan-6 LX family (vs XC6SLX25-2FGG484I)
- Industrial temperature range (vs XC6SLX25-3FGG484C)
- Pin-compatible with larger Spartan-6 devices (vs XC6SLX45-3FGG484I)
Notas de projeto
The XC6SLX25-3FGG484I requires multiple supply rails: VCCINT (1.2V), VCCAUX (2.5V), and VCCO (depending on I/O bank). Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin to minimize noise. Follow the recommended power sequencing: VCCINT, then VCCAUX, then VCCO. Refer to the Spartan-6 FPGA datasheet for detailed decoupling guidelines.
For high-speed designs, maintain controlled impedance for I/O traces (e.g., 50 ohm single-ended, 100 ohm differential). Use ground planes under the FPGA and minimize via stubs. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines for the FGG484 package to ensure signal integrity.
The XC6SLX25-3FGG484I can dissipate significant power at high utilization. Ensure adequate airflow or a heatsink if the junction temperature approaches the maximum rating of 100°C. Use thermal vias under the exposed pad (if present) to conduct heat to the PCB ground plane. Monitor junction temperature in your design to avoid reliability issues.
Informações de conformidade
RoHS compliant and lead-free per distributor listings. AEC-Q100 not applicable for standard FPGA; automotive variant XA6SLX25-3FGG484Q is available.
