XC7K70T-1FBG676C - Kintex-7 FPGA 65,600 Cells | AMD
N.º da peça: XC7K70T-1FBG676C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $62.7273 | $62,73 |
| 10 | $45.303 | $453,03 |
| 100 | $40.0758 | $4.007,58 |
| 500 | $38.3333 | $19.166,65 |
| 1.000 | $36.5909 | $36.590,90 |
XC7K70T-1FBG676C Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the programmable logic device (PLD) hierarchy, above CPLDs, and are used for parallel processing, high-speed interfacing, and rapid prototyping. The Kintex-7 family balances cost, performance, and power for mid-range applications.
Key features include 300 user I/Os supporting various I/O standards, 4,976,640 bits of block RAM for data buffering, and 65,600 logic cells for implementing complex digital designs. The 28nm process enables high performance with reasonable power consumption. The lidless FCBGA package provides excellent thermal performance for high-density designs.
Technically, the XC7K70T-1FBG676C includes MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks for clock generation and management, supporting a wide range of clock frequencies. The device supports configuration via JTAG, SPI, and BPI interfaces, allowing flexible programming options. The 1V core voltage reduces dynamic power compared to older families.
Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace/defense systems where high-speed signal processing and reconfigurability are required. The 300 I/Os enable interfacing with high-speed ADCs, DACs, and memory devices.
When designing with this FPGA, ensure adequate decoupling capacitors on all power pins and follow AMD's power-on sequencing guidelines. The lidless package requires careful thermal management; use a heatsink or forced airflow for high utilization designs.
Alternativas drop-in para XC7K70T-1FBG676C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7K70T-1FBG676C (mesmo formato e footprint) — diferindo em Block RAM, RoHS Status, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7K70T-2FBG676I
✓ Em estoque
$19 / unidade
Ver ficha técnica →XC7K325T-1FBG676C
✓ Em estoque
$108 / unidade
Ver ficha técnica →XC7K70T-2FBG676C
📋 Alternativa de referência (fora do catálogo)
XC7K70T-1FBG676I
📋 Alternativa de referência (fora do catálogo)
XC7K160T-1FBG676C
📋 Alternativa de referência (fora do catálogo)
XC7K70T-1FBG676C Classificações máximas e características elétricas
| Family | Kintex-7 |
| Logic Cells | 65,600 |
| Block RAM | 4,976,640 bits |
| User I/Os | 300 |
| Process Technology | 28nm |
| Core Voltage | 1V |
| Encapsulamento | 676-BBGA, FCBGA (lidless) |
| Número de pinos | 676 |
| Tipo de montagem | Surface Mount |
| Clock Management | MMCM, PLL |
| Configuration Interfaces | JTAG, SPI, BPI |
| Speed Grade | -1 |
| Status RoHS | Compliant (Pb-free) |
Configuração de pinos do XC7K70T-1FBG676C
| Pino A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pino A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pino B1 | VCCINT — Internal core voltage 1V |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pino C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pino D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pino E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pino F1 | VCCINT — Internal core voltage 1V |
| Pino F2 | GND — Ground |
Aplicações típicas
XC7K70T-1FBG676C é adequado para 6 aplicaçãos: Software-Defined Radio, Medical Imaging, Industrial Automation, Aerospace and Defense, High-Performance Computing, Test and Measurement.
Software-Defined Radio
The XC7K70T-1FBG676C is ideal for software-defined radio (SDR) systems due to its 300 user I/Os and 65,600 logic cells, enabling high-speed digital signal processing. It can interface with high-speed ADCs and DACs, supporting wideband signal processing. The MMCM and PLL blocks provide flexible clock generation for various frequency bands. Its 28nm process ensures low power consumption, critical for portable SDR units. The lidless FCBGA package allows efficient heat dissipation in compact enclosures.
Recomendado
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XC7K70T-1FBG676C provides the logic capacity for real-time image processing. Its 4,976,640 bits of block RAM enable efficient data buffering for image frames. The 300 I/Os connect to image sensors and display interfaces. The device's reliability and long-term availability make it suitable for medical equipment. The commercial temperature grade covers typical operating environments in hospitals.
Recomendado
Industrial Automation
The XC7K70T-1FBG676C excels in industrial automation for motor control and machine vision. Its 65,600 logic cells can implement multiple control loops and vision algorithms. The 300 I/Os interface with encoders, sensors, and actuators. The 28nm process provides a balance of performance and power for 24/7 operation. The lidless FCBGA package supports reliable operation in industrial environments with proper cooling.
Recomendado
Aerospace and Defense
For aerospace and defense applications, the XC7K70T-1FBG676C offers the reconfigurability needed for radar and communication systems. Its 65,600 logic cells can implement complex signal processing chains. The device supports secure configuration via JTAG and SPI. The commercial temperature grade is suitable for ground-based systems, while the industrial variant is available for harsher environments. AMD's long-term supply commitment supports defense program lifecycles.
Recomendado
High-Performance Computing
In high-performance computing (HPC) accelerators, the XC7K70T-1FBG676C provides parallel processing capabilities for data-intensive tasks. Its 65,600 logic cells can implement custom arithmetic units and data paths. The 300 I/Os enable high-bandwidth connections to host processors and memory. The 28nm process offers competitive performance-per-watt. The lidless FCBGA package allows efficient thermal management in server environments.
Recomendado
Test and Measurement
The XC7K70T-1FBG676C is well-suited for test and measurement equipment like oscilloscopes and logic analyzers. Its 300 I/Os can capture high-speed digital signals, while the 65,600 logic cells implement trigger and analysis logic. The MMCM and PLL blocks generate precise sampling clocks. The device's reconfigurability allows firmware updates to add new measurement features. The commercial temperature grade covers typical lab environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7K70T-1FBG676C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7K70T-2FBG676C | XC7K70T-1FBG676I | XC7K70T-2FBG676I |
|---|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 65,600 | 65,600 | 65,600 | 65,600 |
| Block RAM | 4,976,640 bits | 4,976,640 bits | 4,976,640 bits | 4,976,640 bits |
| User I/Os | 300 | 300 | 300 | 300 |
| Speed Grade | -1 | -2 | -1 | -2 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Industrial (I) |
| Core Voltage | 1V | 1V | 1V | 1V |
Principais diferenciais
- Cost-effective logic density (vs XC7K325T-1FBG676C)
- Lower power consumption (vs XC7K325T-1FBG676C)
- Pin-compatible speed grade upgrade (vs XC7K70T-2FBG676C)
Notas de projeto
The XC7K70T-1FBG676C requires a 1V core voltage (VCCINT) and 1.8V auxiliary voltage (VCCAUX). Use low-dropout regulators or switching converters with tight voltage tolerance. Place decoupling capacitors (100nF and 10uF) close to each power pin to minimize noise. Follow AMD's power-on sequencing guidelines to avoid latch-up.
The lidless FCBGA package exposes the die for direct thermal contact. Use a heatsink or thermal pad to dissipate heat effectively. For high-utilization designs, calculate power dissipation using AMD's Power Estimator tool. Ensure adequate airflow in the enclosure to keep junction temperature within limits.
For the 676-ball FCBGA, use a high-layer-count PCB (8-12 layers) with controlled impedance for high-speed I/Os. Follow AMD's PCB design guidelines in UG475 for via placement and routing. Use microvias for dense BGA fanout. Ensure proper ground plane continuity under the device.
Informações de conformidade
Pb-free package per datasheet. RoHS compliant. Not AEC-Q100 qualified.
