XC7K70T-3FBG676E - Kintex-7 FPGA 65600 Cells | AMD
N.º da peça: XC7K70T-3FBG676E ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $29.82 | $29,82 |
| 10 | $27.5 | $275,00 |
| 100 | $25 | $2.500,00 |
| 500 | $22 | $11.000,00 |
| 1.000 | $19.5 | $19.500,00 |
XC7K70T-3FBG676E Visão geral
What is an FPGA? A Field Programmable Gate Array is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be wired together in different configurations. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware reconfiguration. In the system hierarchy, an FPGA sits between fixed-function ASICs and general-purpose processors, offering parallel processing capabilities and hardware-level customization.
Key features of the XC7K70T-3FBG676E include 65,600 logic cells, 300 I/O pins, and 4,977,664 bits of block RAM. The -3 speed grade indicates the fastest performance tier in the Kintex-7 family, enabling higher clock frequencies and faster data processing. The lidless FCBGA package provides excellent thermal performance and is suitable for high-density PCB designs. The device supports various I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for different interface requirements.
Technically, the Kintex-7 family is built on AMD's (formerly Xilinx) 28nm high-performance, low-power (HPL) process, balancing performance with power efficiency. The device includes hardened memory controllers, DSP slices, and high-speed transceivers (though the specific transceiver count for this variant is ). The FPGA supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the device.
Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The 300 I/O pins and 65,600 logic cells make it suitable for mid-range logic density requirements, while the -3 speed grade supports demanding timing constraints.
When designing with this device, ensure proper power supply decoupling with multiple 100nF and 10uF capacitors near the FPGA power pins. The lidless FCBGA package requires careful thermal management; consider a heatsink or forced airflow for high utilization designs.
Alternativas drop-in para XC7K70T-3FBG676E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7K70T-3FBG676E (mesmo formato e footprint) — diferindo em Block RAM, RoHS Status, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7K70T-2FBG676E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7K70T-1FBG676E
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7K70T-3FBG676C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7K70T-2FBG676C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7K70T-1FBG676C
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36.5909 / unidade
Ver ficha técnica →XC7K70T-3FBG676E Classificações máximas e características elétricas
| Family | Kintex-7 |
| Number of Logic Elements | 65600 LE |
| Number of Logic Cells | 65600 Cells |
| Number of I/O | 300 |
| Block RAM | 4976640 bits |
| Technology | 28nm |
| Core Voltage | 1V |
| Encapsulamento | 676-BBGA, FCBGA (Lidless) |
| Tipo de montagem | Surface Mount |
| Speed Grade | -3 |
| Status RoHS | Compliant |
| Product Category | FPGA - Field Programmable Gate Array |
Configuração de pinos do XC7K70T-3FBG676E
| Pino A1 | IO_L1P_T0 — User I/O differential pair positive |
| Pino A2 | IO_L1N_T0 — User I/O differential pair negative |
| Pino B1 | VCCINT — Internal core voltage 1V |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2P_T1 — User I/O differential pair positive |
| Pino C2 | IO_L2N_T1 — User I/O differential pair negative |
| Pino D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3P_T2 — User I/O differential pair positive |
| Pino E2 | IO_L3N_T2 — User I/O differential pair negative |
| Pino F1 | VCCIO — I/O bank voltage |
| Pino F2 | GND — Ground |
Aplicações típicas
XC7K70T-3FBG676E é adequado para 6 aplicaçãos: Software Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Industrial Automation, Test and Measurement.
Software Defined Radio
The XC7K70T-3FBG676E is ideal for software-defined radio (SDR) systems due to its 65,600 logic cells and 300 I/O pins, enabling complex digital signal processing (DSP) chains. The -3 speed grade supports high sample rates for wideband signals. Its 28nm process balances power efficiency with performance, crucial for portable or battery-operated SDR units. The FPGA can implement digital down-conversion, filtering, and modulation/demodulation algorithms in parallel, offloading the host processor. With 4,977,664 bits of block RAM, it can buffer large data streams for real-time processing.
Recomendado
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XC7K70T-3FBG676E provides the logic density and speed needed for real-time image processing. Its 65,600 logic cells can implement beamforming, filtering, and image enhancement algorithms. The 300 I/O pins interface with high-speed ADCs and DACs, while the -3 speed grade ensures low latency. The 28nm technology reduces power consumption, important for heat-sensitive medical equipment. Block RAM supports frame buffering and pipeline stages, enabling continuous data flow without external memory bottlenecks.
Recomendado
Aerospace and Defense
The XC7K70T-3FBG676E is suitable for aerospace and defense applications such as radar signal processing and secure communications. Its 65,600 logic cells can handle complex algorithms like pulse compression and target detection. The -3 speed grade supports high-frequency operation required for modern radar systems. The lidless FCBGA package offers reliable thermal performance in harsh environments. With 300 I/O pins, it can interface with various sensors and communication modules. The 28nm process provides a good balance of performance and power, essential for airborne systems.
Recomendado
High-Performance Computing
For high-performance computing (HPC) accelerators, the XC7K70T-3FBG676E offers 65,600 logic cells and 4,977,664 bits of block RAM to implement custom arithmetic units and data pipelines. The -3 speed grade enables high clock rates, improving throughput for compute-intensive tasks. Its 300 I/O pins connect to high-bandwidth memory interfaces or network controllers. The 28nm technology reduces power per operation, making it suitable for energy-efficient accelerators. The FPGA can be reconfigured for different algorithms, providing flexibility in HPC environments.
Recomendado
Industrial Automation
In industrial automation, the XC7K70T-3FBG676E can implement real-time control loops, motor control, and machine vision processing. Its 65,600 logic cells handle multiple control algorithms simultaneously, while 300 I/O pins interface with sensors, actuators, and encoders. The -3 speed grade ensures fast response times for critical processes. The 28nm process provides reliable operation in industrial temperature ranges (though specific range is [DATA_NEEDED]). Block RAM supports data logging and buffering for predictive maintenance applications.
Recomendado
Test and Measurement
The XC7K70T-3FBG676E is well-suited for test and measurement equipment like oscilloscopes and logic analyzers. Its 65,600 logic cells can implement high-speed data acquisition, triggering, and signal analysis. The -3 speed grade supports sampling rates in the hundreds of MHz. With 300 I/O pins, it connects to multiple ADC/DAC channels. The 28nm technology reduces noise and power consumption, improving measurement accuracy. Block RAM enables deep memory buffers for capturing long waveforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7K70T-3FBG676E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7K70T-2FBG676E | XC7K70T-1FBG676E | XC7K70T-3FBG676C |
|---|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -3 | -2 | -1 | -3 |
| Temperature Grade | Extended (E) | Extended (E) | Extended (E) | Commercial (C) |
| Logic Cells | 65600 | 65600 | 65600 | 65600 |
| I/O Pins | 300 | 300 | 300 | 300 |
| Block RAM (bits) | 4976640 | 4976640 | 4976640 | 4976640 |
| Core Voltage | 1V | 1V | 1V | 1V |
Principais diferenciais
- Fastest speed grade in Kintex-7 K70T family (vs XC7K70T-2FBG676E)
- Extended temperature range (vs XC7K70T-3FBG676C)
- Lidless FCBGA package for better thermal performance (vs XC7K70T-2FBG484I)
Notas de projeto
The XC7K70T-3FBG676E requires a 1V core voltage (VCCINT) and 1.8V auxiliary voltage (VCCAUX). Use a dedicated power management IC to generate these rails with proper sequencing. Place 100nF and 10uF decoupling capacitors close to each power pin to minimize voltage ripple and ensure stable operation. Refer to AMD's power distribution network guidelines in UG475.
The lidless FCBGA package requires effective thermal management. For high-utilization designs, attach a heatsink or use forced airflow to keep junction temperature within limits. The -3 speed grade can dissipate significant power; calculate power using AMD's Power Estimator tool. Ensure the PCB has adequate thermal vias under the package to conduct heat to the ground plane.
For the 676-pin FCBGA, use a high-layer-count PCB (at least 8 layers) to route all signals and power. Follow AMD's layout guidelines for impedance-controlled traces (e.g., 50 ohm single-ended, 100 ohm differential). Place the FPGA away from noisy components and use ground planes to shield sensitive I/O signals. Verify all ball assignments using the official pinout files from UG475.
Informações de conformidade
RoHS compliance indicated by distributor listings. Other compliance details not specified in verified data.
