AMD

XC7K70T-3FBG676E - Kintex-7 FPGA 65600 Cells | AMD

Name: XC7K70T-3FBG676E
Brand: AMD
Price: 19.5 USD
Availability: InStock

MPN: XC7K70T-3FBG676E ✓ Active

In Stock Ships in 1-3 business days

1V Vdss 676-BBGA, FCBGA (Lidless) Package -3 Speed

From $19.5 USD / Unit

MOQ: 1 |

Price updated: 2026-08-19

Volume Pricing

Qty	Unit Price	Extended
1	$29.82	$29.82
10	$27.5	$275.00
100	$25	$2,500.00
500	$22	$11,000.00
1,000	$19.5	$19,500.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K70T-3FBG676E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K70T-2FBG676E

✅ Drop-In

📦 676-BBGA, FCBGA

Same package and pinout, -2 speed grade instead of -3

📋 Reference alternative (not in catalog)

XC7K70T-1FBG676E

✅ Drop-In

📦 676-BBGA, FCBGA

Same package and pinout, -1 speed grade (slower)

📋 Reference alternative (not in catalog)

XC7K70T-3FBG676C

✅ Drop-In

📦 676-BBGA, FCBGA

Same package and pinout, commercial temperature grade

📋 Reference alternative (not in catalog)

XC7K70T-2FBG676C

✅ Drop-In

📦 676-BBGA, FCBGA

Same package and pinout, -2 speed grade, commercial temperature

📋 Reference alternative (not in catalog)

XC7K70T-1FBG676C

✅ Drop-In

AMD

📦 676-BBGA, FCBGA

Kintex-7 · 65,600 · 4,976,640 bits · 300 · 28nm · 1V · 676-BBGA, FCBGA (lidless) · 676

✓ In Stock

$26.2 / Unit

View Datasheet →

XC7K70T-3FBG676E Maximum Ratings & Electrical Characteristics

Family	Kintex-7
Number of Logic Elements	65600 LE
Number of Logic Cells	65600 Cells
Number of I/O	300
Block RAM	4976640 bits
Technology	28nm
Core Voltage	1V
Package	676-BBGA, FCBGA (Lidless)
Mounting Type	Surface Mount
Speed Grade	-3
Operating Temperature	[DATA_NEEDED: Operating Temperature]
Number of Transceivers	[DATA_NEEDED: Number of Transceivers]
Number of DSP Slices	[DATA_NEEDED: Number of DSP Slices]
RoHS Status	Compliant
Product Category	FPGA - Field Programmable Gate Array

XC7K70T-3FBG676E Pin Configuration

Pin A1	IO_L1P_T0 — User I/O differential pair positive
Pin A2	IO_L1N_T0 — User I/O differential pair negative
Pin B1	VCCINT — Internal core voltage 1V
Pin B2	GND — Ground
Pin C1	IO_L2P_T1 — User I/O differential pair positive
Pin C2	IO_L2N_T1 — User I/O differential pair negative
Pin D1	VCCAUX — Auxiliary voltage 1.8V
Pin D2	GND — Ground
Pin E1	IO_L3P_T2 — User I/O differential pair positive
Pin E2	IO_L3N_T2 — User I/O differential pair negative
Pin F1	VCCIO — I/O bank voltage
Pin F2	GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K70T-3FBG676E is suitable for 6 applications: Software Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Industrial Automation, Test and Measurement.

📡

Software Defined Radio

The XC7K70T-3FBG676E is ideal for software-defined radio (SDR) systems due to its 65,600 logic cells and 300 I/O pins, enabling complex digital signal processing (DSP) chains. The -3 speed grade supports high sample rates for wideband signals. Its 28nm process balances power efficiency with performance, crucial for portable or battery-operated SDR units. The FPGA can implement digital down-conversion, filtering, and modulation/demodulation algorithms in parallel, offloading the host processor. With 4,977,664 bits of block RAM, it can buffer large data streams for real-time processing.

Recommended

XC7Z020 · AMD

💊

Medical Imaging

In medical imaging systems like ultrasound and CT scanners, the XC7K70T-3FBG676E provides the logic density and speed needed for real-time image processing. Its 65,600 logic cells can implement beamforming, filtering, and image enhancement algorithms. The 300 I/O pins interface with high-speed ADCs and DACs, while the -3 speed grade ensures low latency. The 28nm technology reduces power consumption, important for heat-sensitive medical equipment. Block RAM supports frame buffering and pipeline stages, enabling continuous data flow without external memory bottlenecks.

Recommended

MT40A512M16JY-075E · Micron Technology

✈️

Aerospace and Defense

The XC7K70T-3FBG676E is suitable for aerospace and defense applications such as radar signal processing and secure communications. Its 65,600 logic cells can handle complex algorithms like pulse compression and target detection. The -3 speed grade supports high-frequency operation required for modern radar systems. The lidless FCBGA package offers reliable thermal performance in harsh environments. With 300 I/O pins, it can interface with various sensors and communication modules. The 28nm process provides a good balance of performance and power, essential for airborne systems.

Recommended

XC7A100T · AMD

🖥️

High-Performance Computing

For high-performance computing (HPC) accelerators, the XC7K70T-3FBG676E offers 65,600 logic cells and 4,977,664 bits of block RAM to implement custom arithmetic units and data pipelines. The -3 speed grade enables high clock rates, improving throughput for compute-intensive tasks. Its 300 I/O pins connect to high-bandwidth memory interfaces or network controllers. The 28nm technology reduces power per operation, making it suitable for energy-efficient accelerators. The FPGA can be reconfigured for different algorithms, providing flexibility in HPC environments.

Recommended

MT40A512M16TB-062E · Micron Technology

🏭

Industrial Automation

In industrial automation, the XC7K70T-3FBG676E can implement real-time control loops, motor control, and machine vision processing. Its 65,600 logic cells handle multiple control algorithms simultaneously, while 300 I/O pins interface with sensors, actuators, and encoders. The -3 speed grade ensures fast response times for critical processes. The 28nm process provides reliable operation in industrial temperature ranges (though specific range is [DATA_NEEDED]). Block RAM supports data logging and buffering for predictive maintenance applications.

Recommended

STM32F446VCT6 · STMicroelectronics

🔧

Test and Measurement

The XC7K70T-3FBG676E is well-suited for test and measurement equipment like oscilloscopes and logic analyzers. Its 65,600 logic cells can implement high-speed data acquisition, triggering, and signal analysis. The -3 speed grade supports sampling rates in the hundreds of MHz. With 300 I/O pins, it connects to multiple ADC/DAC channels. The 28nm technology reduces noise and power consumption, improving measurement accuracy. Block RAM enables deep memory buffers for capturing long waveforms.

Recommended

XC7A100T · AMD

Recommended Products Summary

XC7Z020 AMD Used in: Software Defined Radio MT40A512M16JY-075E Micron Technology Used in: Medical Imaging XC7A100T AMD Used in: Aerospace and Defense, Test and Measurement MT40A512M16TB-062E Micron Technology Used in: High-Performance Computing STM32F446VCT6 STMicroelectronics Used in: Industrial Automation

What is the XC7K70T-3FBG676E?

The XC7K70T-3FBG676E is a Kintex-7 FPGA from AMD (formerly Xilinx) with 65,600 logic cells, 300 I/O pins, and 4,977,664 bits of block RAM. It operates at 1V core voltage and comes in a 676-pin lidless FCBGA package. According to the AMD Kintex-7 product page, it is designed for high-performance applications requiring a balance of logic density and cost.

What is the price of XC7K70T-3FBG676E?

As of 2026-08-20, the XC7K70T-3FBG676E is priced at approximately $29.82 per unit at LCSC Electronics. Prices vary by distributor and quantity; DigiKey and Mouser also list this part. For volume pricing, contact distributors directly as bulk discounts may apply.

Where can I buy XC7K70T-3FBG676E online?

The XC7K70T-3FBG676E is available from multiple distributors including DigiKey, Mouser, LCSC, and Xecor. DigiKey lists it as 'ships today' with stock available. LCSC offers it at $29.8161. Check current inventory and pricing on these platforms as of 2026-08-20.

What is the lead time for XC7K70T-3FBG676E?

The lead time for XC7K70T-3FBG676E varies by distributor and stock levels. DigiKey indicates it ships today, suggesting immediate availability. For larger quantities, lead times may extend to 4-8 weeks depending on AMD's production schedule. Contact your preferred distributor for accurate lead time information as of 2026-08-20.

Is XC7K70T-3FBG676E in stock?

Yes, the XC7K70T-3FBG676E is in stock at several distributors as of 2026-08-20. DigiKey shows it as available and ships today. LCSC also lists it as in-stock. However, inventory levels fluctuate, so verify current stock status on distributor websites before ordering.

What is the difference between XC7K70T-3FBG676E and XC7K70T-2FBG484I?

The XC7K70T-3FBG676E and XC7K70T-2FBG484I differ in package and speed grade. The -3FBG676E uses a 676-pin FCBGA package with a -3 speed grade (fastest), while the -2FBG484I uses a 484-pin FCBGA package with a -2 speed grade. Both have 65,600 logic cells, but the 676-pin package offers more I/O (300 vs fewer) and better thermal performance.

When should I choose XC7K70T-3FBG676E over XC7K325T-3FBG676E?

Choose the XC7K70T-3FBG676E when your design requires 65,600 logic cells or less and you need the -3 speed grade for high performance. The XC7K325T-3FBG676E offers significantly more logic resources (326,080 cells) but at a higher cost. If your design fits within the K70T's capacity, it provides a more cost-effective solution.

What is the best drop-in replacement for XC7K70T-3FBG676E?

The best drop-in replacement for XC7K70T-3FBG676E is the XC7K70T-2FBG676E, which shares the same 676-pin FCBGA package and pinout but has a -2 speed grade instead of -3. This allows direct PCB replacement with only a potential timing performance difference. Verify timing closure when using the -2 grade.

Can XC7K70T-2FBG676E replace XC7K70T-3FBG676E?

Yes, the XC7K70T-2FBG676E can replace the XC7K70T-3FBG676E as it is pin-compatible and shares the same package and logic resources. The -2 speed grade is slower than -3, so designs must meet timing requirements with the reduced performance. This is a valid drop-in replacement for most applications.

Where can I download the XC7K70T-3FBG676E datasheet PDF?

The XC7K70T-3FBG676E datasheet can be downloaded from AMD's official website under the Kintex-7 FPGA product page. Additionally, datasheets.com, Octopart, and DigiKey provide PDF downloads. The AMD Kintex-7 product page at https://www.amd.com/en/products/adaptive-socs-and-fpgas/fpga/kintex-7.html is the authoritative source.

Where can I find the XC7K70T-3FBG676E pinout?

The XC7K70T-3FBG676E pinout is available in AMD's package pinout files for Kintex-7 FPGAs. AMD provides ASCII package files in TXT and CSV formats on their website, described in document UG475. These files list all pin assignments for the 676-pin FCBGA package.

What are the key specifications of XC7K70T-3FBG676E that engineers should know?

The XC7K70T-3FBG676E features 65,600 logic cells, 300 I/O pins, 4,977,664 bits of block RAM, and operates at 1V core voltage. It uses 28nm technology and comes in a 676-pin lidless FCBGA package. The -3 speed grade is the fastest in the Kintex-7 family, enabling high clock frequencies for demanding applications.

Hey Google, what can replace XC7K70T-3FBG676E?

The XC7K70T-3FBG676E can be replaced by the XC7K70T-2FBG676E, which is pin-compatible with the same 676-pin FCBGA package but a slower -2 speed grade. Other options include the XC7K70T-1FBG676E (even slower) or the XC7K70T-3FBG676C (commercial temperature grade). All share the same footprint.

Is XC7K70T-3FBG676E the same as XC7K70T-2FBG676E?

No, the XC7K70T-3FBG676E and XC7K70T-2FBG676E are not the same. They share the same package (676-FCBGA) and logic resources (65,600 cells), but differ in speed grade: -3 is faster than -2. The -3 grade supports higher clock frequencies, while -2 may be more cost-effective for designs with relaxed timing requirements.

What is the best AMD equivalent for XC7K70T-3FBG676E?

The best AMD equivalent for XC7K70T-3FBG676E is the XC7K70T-2FBG676E, offering the same package and pinout with a -2 speed grade. For higher performance, consider the XC7K160T-3FBG676E, which has more logic cells (162,240) but is not pin-compatible. The XC7K70T-2FBG676E is the closest drop-in replacement.

Engineering reference data for XC7K70T-3FBG676E — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K70T-3FBG676E when you need the highest performance from the Kintex-7 K70T family with 65,600 logic cells and 300 I/O pins. The -3 speed grade is ideal for timing-critical applications like high-speed signal processing and software-defined radio. If your design can tolerate a slower speed grade, the XC7K70T-2FBG676E offers cost savings with the same package and pinout. For commercial temperature environments only, the XC7K70T-3FBG676C is a lower-cost option. The XC7K70T-1FBG676E is suitable for designs with relaxed timing requirements. All alternatives share the same 676-pin FCBGA footprint, enabling PCB layout reuse. For higher logic density, consider the XC7K160T-3FBG676E, but note it is not pin-compatible.

Comparison with Alternatives

Parameter	This Product	XC7K70T-2FBG676E	XC7K70T-1FBG676E	XC7K70T-3FBG676C
Package	676-BBGA, FCBGA	676-BBGA, FCBGA - same	676-BBGA, FCBGA - same	676-BBGA, FCBGA - same
Brand	AMD	AMD	AMD	AMD
Speed Grade	-3	-2	-1	-3
Temperature Grade	Extended (E)	Extended (E)	Extended (E)	Commercial (C)
Logic Cells	65600	65600	65600	65600
I/O Pins	300	300	300	300
Block RAM (bits)	4976640	4976640	4976640	4976640
Core Voltage	1V	1V	1V	1V

Key Differentiators

Fastest speed grade in Kintex-7 K70T family (vs XC7K70T-2FBG676E)
Extended temperature range (vs XC7K70T-3FBG676C)
Lidless FCBGA package for better thermal performance (vs XC7K70T-2FBG484I)

Design Notes

The XC7K70T-3FBG676E requires a 1V core voltage (VCCINT) and 1.8V auxiliary voltage (VCCAUX). Use a dedicated power management IC to generate these rails with proper sequencing. Place 100nF and 10uF decoupling capacitors close to each power pin to minimize voltage ripple and ensure stable operation. Refer to AMD's power distribution network guidelines in UG475.

The lidless FCBGA package requires effective thermal management. For high-utilization designs, attach a heatsink or use forced airflow to keep junction temperature within limits. The -3 speed grade can dissipate significant power; calculate power using AMD's Power Estimator tool. Ensure the PCB has adequate thermal vias under the package to conduct heat to the ground plane.

For the 676-pin FCBGA, use a high-layer-count PCB (at least 8 layers) to route all signals and power. Follow AMD's layout guidelines for impedance-controlled traces (e.g., 50 ohm single-ended, 100 ohm differential). Place the FPGA away from noisy components and use ground planes to shield sensitive I/O signals. Verify all ball assignments using the official pinout files from UG475.