XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD
N.º da peça: XC7VX330T-2FF1157I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5000 | $5.000,00 |
| 10 | $4500 | $45.000,00 |
| 100 | $4000 | $400.000,00 |
| 500 | $3500 | $1.750.000,00 |
| 1.000 | $3000 | $3.000.000,00 |
XC7VX330T-2FF1157I Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They contain a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing for highly parallel, custom hardware implementations. The Virtex-7 XT series is optimized for high-bandwidth, high-capacity applications such as data center acceleration, wired communications, and advanced signal processing.
Key features of the XC7VX330T-2FF1157I include 326,400 logic cells, 600 user I/O pins, and 27,648 Kb (27.648 Mb) of block RAM. It also integrates 1,120 DSP slices for high-speed digital signal processing. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and features high-speed serial transceivers for chip-to-chip and backplane communication. The -2 speed grade indicates a balanced performance level, suitable for a wide range of applications.
From a technical architecture perspective, the Virtex-7 XT family uses a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power consumption. The device includes hardened memory controllers, PCIe blocks, and high-speed transceivers, reducing the need for external components and simplifying system design. The FF1157 package provides a large number of I/O pins, making it suitable for high-pin-count applications.
Typical applications for the XC7VX330T-2FF1157I include wired communications (e.g., 100G/400G switches), data center acceleration, radar and electronic warfare systems, and high-performance computing. Its high logic capacity and I/O count make it ideal for complex digital designs that require significant parallel processing.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Refer to the AMD Virtex-7 FPGA data sheet and power estimation tools for detailed guidance.
Alternativas drop-in para XC7VX330T-2FF1157I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7VX330T-2FF1157I (mesmo formato e footprint) — diferindo em Block RAM, Configuration, Core Voltage, DSP Slices, Logic Cells.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7VX330T-1FF1157I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7VX330T-3FF1157I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7VX330T-2FFG1157I
✅ Drop-In✓ Em estoque
$1380 / unidade
Ver ficha técnica →XC7VX330T-2FFV1157I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7VX330T-2FF1157C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7VX330T-2FF1157I Classificações máximas e características elétricas
| Logic Cells | 326,400 |
| Block RAM | 27,648 Kb |
| DSP Slices | 1,120 |
| User I/O | 600 |
| I/O Standards | LVCMOS, LVDS, HSTL, etc. |
| Core Voltage | 1.0V |
| Temperatura de operação | -40°C to +100°C |
| Encapsulamento | 1156-BBGA, FCBGA (FF1157) |
| Speed Grade | -2 |
| Configuration | SRAM-based, supports JTAG, SPI, etc. |
| Process Technology | 28nm HKMG |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Configuração de pinos do XC7VX330T-2FF1157I
| Pino A1 | IO_L1P_T0 — User I/O pin |
| Pino A2 | IO_L1N_T0 — User I/O pin |
| Pino B1 | VCCINT — Core voltage 1.0V |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2P_T1 — User I/O pin |
| Pino C2 | IO_L2N_T1 — User I/O pin |
| Pino D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3P_T2 — User I/O pin |
| Pino E2 | IO_L3N_T2 — User I/O pin |
| Pino F1 | VCCO — I/O bank voltage |
| Pino F2 | GND — Ground |
Aplicações típicas
XC7VX330T-2FF1157I é adequado para 6 aplicaçãos: Wired Communications, Data Center Acceleration, Radar and Electronic Warfare, High-Performance Computing, Aerospace and Defense, Test and Measurement.
Wired Communications
The XC7VX330T-2FF1157I is ideal for wired communications equipment such as switches and routers. Its high logic capacity and 600 I/O pins enable the implementation of complex packet processing and forwarding engines. The device supports high-speed serial transceivers for backplane and chip-to-chip communication, making it suitable for 100G/400G line cards. The -2 speed grade provides a good balance of performance and power, essential for dense networking equipment. Designers can leverage the FPGA's flexibility to implement custom protocols and interfaces, reducing time-to-market.
Recomendado
Data Center Acceleration
In data centers, the XC7VX330T-2FF1157I can be used to accelerate compute-intensive workloads such as encryption, compression, and AI inference. Its 1,120 DSP slices provide high-throughput signal processing capabilities, while the 27,648 Kb of block RAM supports large data buffers. The FPGA's reconfigurability allows for rapid iteration and customization of accelerators. The 600 I/O pins enable high-bandwidth connections to external memory and network interfaces. This device is a cost-effective alternative to ASICs for many acceleration tasks, offering flexibility and lower development costs.
Recomendado
Radar and Electronic Warfare
The XC7VX330T-2FF1157I is well-suited for radar and electronic warfare systems that require high-speed signal processing and large logic capacity. Its DSP slices can implement complex digital filters and FFTs, while the block RAM supports large data sets. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. The FPGA's reconfigurability allows for adaptive signal processing algorithms. The 600 I/O pins provide ample connectivity for ADCs, DACs, and other peripherals, making it a versatile platform for defense applications.
Recomendado
High-Performance Computing
For high-performance computing (HPC) applications, the XC7VX330T-2FF1157I offers a powerful platform for custom compute accelerators. Its high logic density and DSP slices enable the implementation of parallel processing engines. The device can be used to offload compute-intensive tasks from CPUs, improving overall system performance. The 600 I/O pins support high-bandwidth interfaces to external memory and interconnects. The -2 speed grade provides a good balance of performance and power, making it suitable for HPC clusters. The FPGA's flexibility allows for custom data paths and algorithms.
Recomendado
Aerospace and Defense
The XC7VX330T-2FF1157I is designed for aerospace and defense applications that require high reliability and performance. Its industrial temperature range and robust design make it suitable for avionics, radar, and electronic warfare systems. The FPGA's reconfigurability allows for in-field updates and adaptive processing. The high logic capacity and DSP slices enable complex signal processing and sensor fusion. The 600 I/O pins provide connectivity to a wide range of sensors and interfaces. This device is a trusted choice for mission-critical systems.
Recomendado
Test and Measurement
In test and measurement equipment, the XC7VX330T-2FF1157I can be used to implement high-speed data acquisition and signal processing. Its DSP slices and block RAM support complex waveform generation and analysis. The FPGA's reconfigurability allows for flexible instrument designs. The 600 I/O pins enable high-bandwidth interfaces to ADCs, DACs, and other measurement components. The -2 speed grade provides a good balance of performance and power, making it suitable for benchtop and modular instruments. This device is ideal for custom test solutions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7VX330T-2FF1157I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7VX330T-1FF1157I | XC7VX330T-3FF1157I | XC7VX330T-2FFG1157I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326,400 | 326,400 | 326,400 | 326,400 |
| Block RAM | 27,648 Kb | 27,648 Kb | 27,648 Kb | 27,648 Kb |
| DSP Slices | 1,120 | 1,120 | 1,120 | 1,120 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
Principais diferenciais
- Higher speed grade than -1 (vs XC7VX330T-1FF1157I)
- Lower speed grade than -3 (vs XC7VX330T-3FF1157I)
- Standard package vs lead-free (vs XC7VX330T-2FFG1157I)
Notas de projeto
The XC7VX330T-2FF1157I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use a dedicated power management solution with proper sequencing. Refer to the AMD Virtex-7 data sheet for recommended power-up sequences and decoupling capacitor requirements. A robust power distribution network is critical for reliable operation.
The XC7VX330T-2FF1157I can dissipate significant power under heavy utilization. Use a heatsink and forced airflow for high-performance applications. The thermal resistance of the package is [DATA_NEEDED: theta_JA]. Ensure adequate cooling to keep the junction temperature within the specified range. Use AMD's power estimation tools to calculate expected power dissipation.
For the 1156-ball FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Place decoupling capacitors close to the FPGA power pins. Follow the layout guidelines in the AMD Virtex-7 PCB design guide. Ensure proper ground plane continuity and minimize via stubs for high-speed transceivers.
Informações de conformidade
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA.
