XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD
料号： XC7VX330T-2FF1157I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5000 | $5,000.00 |
| 10 | $4500 | $45,000.00 |
| 100 | $4000 | $400,000.00 |
| 500 | $3500 | $1,750,000.00 |
| 1,000 | $3000 | $3,000,000.00 |
XC7VX330T-2FF1157I 概述
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They contain a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing for highly parallel, custom hardware implementations. The Virtex-7 XT series is optimized for high-bandwidth, high-capacity applications such as data center acceleration, wired communications, and advanced signal processing.
Key features of the XC7VX330T-2FF1157I include 326,400 logic cells, 600 user I/O pins, and 27,648 Kb (27.648 Mb) of block RAM. It also integrates 1,120 DSP slices for high-speed digital signal processing. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and features high-speed serial transceivers for chip-to-chip and backplane communication. The -2 speed grade indicates a balanced performance level, suitable for a wide range of applications.
From a technical architecture perspective, the Virtex-7 XT family uses a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power consumption. The device includes hardened memory controllers, PCIe blocks, and high-speed transceivers, reducing the need for external components and simplifying system design. The FF1157 package provides a large number of I/O pins, making it suitable for high-pin-count applications.
Typical applications for the XC7VX330T-2FF1157I include wired communications (e.g., 100G/400G switches), data center acceleration, radar and electronic warfare systems, and high-performance computing. Its high logic capacity and I/O count make it ideal for complex digital designs that require significant parallel processing.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Refer to the AMD Virtex-7 FPGA data sheet and power estimation tools for detailed guidance.
直接替换替代料： XC7VX330T-2FF1157I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7VX330T-2FF1157I （相同外形与封装尺寸） ——差异在于 Block RAM, Configuration, Core Voltage, DSP Slices, Logic Cells.
快速对比工具——选择替代料号进行并排对比：
XC7VX330T-1FF1157I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7VX330T-3FF1157I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7VX330T-2FFG1157I
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →XC7VX330T-2FFV1157I
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX330T-2FF1157C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7VX330T-2FF1157I 最大额定值与电气特性
| Logic Cells | 326,400 |
| Block RAM | 27,648 Kb |
| DSP Slices | 1,120 |
| User I/O | 600 |
| I/O Standards | LVCMOS, LVDS, HSTL, etc. |
| Core Voltage | 1.0V |
| 工作温度 | -40°C to +100°C |
| 封装 | 1156-BBGA, FCBGA (FF1157) |
| Speed Grade | -2 |
| Configuration | SRAM-based, supports JTAG, SPI, etc. |
| Process Technology | 28nm HKMG |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount |
XC7VX330T-2FF1157I 引脚配置
| 引脚 A1 | IO_L1P_T0 — User I/O pin |
| 引脚 A2 | IO_L1N_T0 — User I/O pin |
| 引脚 B1 | VCCINT — Core voltage 1.0V |
| 引脚 B2 | GND — Ground |
| 引脚 C1 | IO_L2P_T1 — User I/O pin |
| 引脚 C2 | IO_L2N_T1 — User I/O pin |
| 引脚 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 引脚 D2 | GND — Ground |
| 引脚 E1 | IO_L3P_T2 — User I/O pin |
| 引脚 E2 | IO_L3N_T2 — User I/O pin |
| 引脚 F1 | VCCO — I/O bank voltage |
| 引脚 F2 | GND — Ground |
典型应用
XC7VX330T-2FF1157I 适用于 6 应用s: Wired Communications, Data Center Acceleration, Radar and Electronic Warfare, High-Performance Computing, Aerospace and Defense, Test and Measurement.
Wired Communications
The XC7VX330T-2FF1157I is ideal for wired communications equipment such as switches and routers. Its high logic capacity and 600 I/O pins enable the implementation of complex packet processing and forwarding engines. The device supports high-speed serial transceivers for backplane and chip-to-chip communication, making it suitable for 100G/400G line cards. The -2 speed grade provides a good balance of performance and power, essential for dense networking equipment. Designers can leverage the FPGA's flexibility to implement custom protocols and interfaces, reducing time-to-market.
推荐
Data Center Acceleration
In data centers, the XC7VX330T-2FF1157I can be used to accelerate compute-intensive workloads such as encryption, compression, and AI inference. Its 1,120 DSP slices provide high-throughput signal processing capabilities, while the 27,648 Kb of block RAM supports large data buffers. The FPGA's reconfigurability allows for rapid iteration and customization of accelerators. The 600 I/O pins enable high-bandwidth connections to external memory and network interfaces. This device is a cost-effective alternative to ASICs for many acceleration tasks, offering flexibility and lower development costs.
推荐
Radar and Electronic Warfare
The XC7VX330T-2FF1157I is well-suited for radar and electronic warfare systems that require high-speed signal processing and large logic capacity. Its DSP slices can implement complex digital filters and FFTs, while the block RAM supports large data sets. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. The FPGA's reconfigurability allows for adaptive signal processing algorithms. The 600 I/O pins provide ample connectivity for ADCs, DACs, and other peripherals, making it a versatile platform for defense applications.
推荐
High-Performance Computing
For high-performance computing (HPC) applications, the XC7VX330T-2FF1157I offers a powerful platform for custom compute accelerators. Its high logic density and DSP slices enable the implementation of parallel processing engines. The device can be used to offload compute-intensive tasks from CPUs, improving overall system performance. The 600 I/O pins support high-bandwidth interfaces to external memory and interconnects. The -2 speed grade provides a good balance of performance and power, making it suitable for HPC clusters. The FPGA's flexibility allows for custom data paths and algorithms.
推荐
Aerospace and Defense
The XC7VX330T-2FF1157I is designed for aerospace and defense applications that require high reliability and performance. Its industrial temperature range and robust design make it suitable for avionics, radar, and electronic warfare systems. The FPGA's reconfigurability allows for in-field updates and adaptive processing. The high logic capacity and DSP slices enable complex signal processing and sensor fusion. The 600 I/O pins provide connectivity to a wide range of sensors and interfaces. This device is a trusted choice for mission-critical systems.
推荐
Test and Measurement
In test and measurement equipment, the XC7VX330T-2FF1157I can be used to implement high-speed data acquisition and signal processing. Its DSP slices and block RAM support complex waveform generation and analysis. The FPGA's reconfigurability allows for flexible instrument designs. The 600 I/O pins enable high-bandwidth interfaces to ADCs, DACs, and other measurement components. The -2 speed grade provides a good balance of performance and power, making it suitable for benchtop and modular instruments. This device is ideal for custom test solutions.
推荐
推荐产品汇总
工程参考数据： XC7VX330T-2FF1157I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7VX330T-1FF1157I | XC7VX330T-3FF1157I | XC7VX330T-2FFG1157I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326,400 | 326,400 | 326,400 | 326,400 |
| Block RAM | 27,648 Kb | 27,648 Kb | 27,648 Kb | 27,648 Kb |
| DSP Slices | 1,120 | 1,120 | 1,120 | 1,120 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
关键差异点
- Higher speed grade than -1 （对比 XC7VX330T-1FF1157I)
- Lower speed grade than -3 （对比 XC7VX330T-3FF1157I)
- Standard package vs lead-free （对比 XC7VX330T-2FFG1157I)
设计说明
The XC7VX330T-2FF1157I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use a dedicated power management solution with proper sequencing. Refer to the AMD Virtex-7 data sheet for recommended power-up sequences and decoupling capacitor requirements. A robust power distribution network is critical for reliable operation.
The XC7VX330T-2FF1157I can dissipate significant power under heavy utilization. Use a heatsink and forced airflow for high-performance applications. The thermal resistance of the package is [DATA_NEEDED: theta_JA]. Ensure adequate cooling to keep the junction temperature within the specified range. Use AMD's power estimation tools to calculate expected power dissipation.
For the 1156-ball FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Place decoupling capacitors close to the FPGA power pins. Follow the layout guidelines in the AMD Virtex-7 PCB design guide. Ensure proper ground plane continuity and minimize via stubs for high-speed transceivers.
合规信息
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA.
