XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD
MPN: XC7VX330T-2FF1157I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5000 | $5,000.00 |
| 10 | $4500 | $45,000.00 |
| 100 | $4000 | $400,000.00 |
| 500 | $3500 | $1,750,000.00 |
| 1,000 | $3000 | $3,000,000.00 |
Drop-in alternatives for XC7VX330T-2FF1157I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX330T-1FF1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-3FF1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157I
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βXC7VX330T-2FFV1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FF1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FF1157I Maximum Ratings & Electrical Characteristics
| Logic Cells | 326,400 |
| Block RAM | 27,648 Kb |
| DSP Slices | 1,120 |
| User I/O | 600 |
| I/O Standards | LVCMOS, LVDS, HSTL, etc. |
| Core Voltage | 1.0V |
| Operating Temperature | -40Β°C to +100Β°C |
| Package | 1156-BBGA, FCBGA (FF1157) |
| Speed Grade | -2 |
| Transceivers | [DATA_NEEDED: number of GTX transceivers] |
| PCIe Blocks | [DATA_NEEDED: number of integrated PCIe blocks] |
| Configuration | SRAM-based, supports JTAG, SPI, etc. |
| Process Technology | 28nm HKMG |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
XC7VX330T-2FF1157I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O pin |
| Pin A2 | IO_L1N_T0 β User I/O pin |
| Pin B1 | VCCINT β Core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T1 β User I/O pin |
| Pin C2 | IO_L2N_T1 β User I/O pin |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T2 β User I/O pin |
| Pin E2 | IO_L3N_T2 β User I/O pin |
| Pin F1 | VCCO β I/O bank voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX330T-2FF1157I is suitable for 6 applications: Wired Communications, Data Center Acceleration, Radar and Electronic Warfare, High-Performance Computing, Aerospace and Defense, Test and Measurement.
Wired Communications
The XC7VX330T-2FF1157I is ideal for wired communications equipment such as switches and routers. Its high logic capacity and 600 I/O pins enable the implementation of complex packet processing and forwarding engines. The device supports high-speed serial transceivers for backplane and chip-to-chip communication, making it suitable for 100G/400G line cards. The -2 speed grade provides a good balance of performance and power, essential for dense networking equipment. Designers can leverage the FPGA's flexibility to implement custom protocols and interfaces, reducing time-to-market.
Recommended
Data Center Acceleration
In data centers, the XC7VX330T-2FF1157I can be used to accelerate compute-intensive workloads such as encryption, compression, and AI inference. Its 1,120 DSP slices provide high-throughput signal processing capabilities, while the 27,648 Kb of block RAM supports large data buffers. The FPGA's reconfigurability allows for rapid iteration and customization of accelerators. The 600 I/O pins enable high-bandwidth connections to external memory and network interfaces. This device is a cost-effective alternative to ASICs for many acceleration tasks, offering flexibility and lower development costs.
Recommended
Radar and Electronic Warfare
The XC7VX330T-2FF1157I is well-suited for radar and electronic warfare systems that require high-speed signal processing and large logic capacity. Its DSP slices can implement complex digital filters and FFTs, while the block RAM supports large data sets. The industrial temperature range (-40Β°C to +100Β°C) ensures reliable operation in harsh environments. The FPGA's reconfigurability allows for adaptive signal processing algorithms. The 600 I/O pins provide ample connectivity for ADCs, DACs, and other peripherals, making it a versatile platform for defense applications.
Recommended
High-Performance Computing
For high-performance computing (HPC) applications, the XC7VX330T-2FF1157I offers a powerful platform for custom compute accelerators. Its high logic density and DSP slices enable the implementation of parallel processing engines. The device can be used to offload compute-intensive tasks from CPUs, improving overall system performance. The 600 I/O pins support high-bandwidth interfaces to external memory and interconnects. The -2 speed grade provides a good balance of performance and power, making it suitable for HPC clusters. The FPGA's flexibility allows for custom data paths and algorithms.
Recommended
Aerospace and Defense
The XC7VX330T-2FF1157I is designed for aerospace and defense applications that require high reliability and performance. Its industrial temperature range and robust design make it suitable for avionics, radar, and electronic warfare systems. The FPGA's reconfigurability allows for in-field updates and adaptive processing. The high logic capacity and DSP slices enable complex signal processing and sensor fusion. The 600 I/O pins provide connectivity to a wide range of sensors and interfaces. This device is a trusted choice for mission-critical systems.
Recommended
Test and Measurement
In test and measurement equipment, the XC7VX330T-2FF1157I can be used to implement high-speed data acquisition and signal processing. Its DSP slices and block RAM support complex waveform generation and analysis. The FPGA's reconfigurability allows for flexible instrument designs. The 600 I/O pins enable high-bandwidth interfaces to ADCs, DACs, and other measurement components. The -2 speed grade provides a good balance of performance and power, making it suitable for benchtop and modular instruments. This device is ideal for custom test solutions.
Recommended
Engineering reference data for XC7VX330T-2FF1157I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX330T-1FF1157I | XC7VX330T-3FF1157I | XC7VX330T-2FFG1157I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326,400 | 326,400 | 326,400 | 326,400 |
| Block RAM | 27,648 Kb | 27,648 Kb | 27,648 Kb | 27,648 Kb |
| DSP Slices | 1,120 | 1,120 | 1,120 | 1,120 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Operating Temperature | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C |
Key Differentiators
- Higher speed grade than -1 (vs XC7VX330T-1FF1157I)
- Lower speed grade than -3 (vs XC7VX330T-3FF1157I)
- Standard package vs lead-free (vs XC7VX330T-2FFG1157I)
Design Notes
The XC7VX330T-2FF1157I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use a dedicated power management solution with proper sequencing. Refer to the AMD Virtex-7 data sheet for recommended power-up sequences and decoupling capacitor requirements. A robust power distribution network is critical for reliable operation.
The XC7VX330T-2FF1157I can dissipate significant power under heavy utilization. Use a heatsink and forced airflow for high-performance applications. The thermal resistance of the package is [DATA_NEEDED: theta_JA]. Ensure adequate cooling to keep the junction temperature within the specified range. Use AMD's power estimation tools to calculate expected power dissipation.
For the 1156-ball FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Place decoupling capacitors close to the FPGA power pins. Follow the layout guidelines in the AMD Virtex-7 PCB design guide. Ensure proper ground plane continuity and minimize via stubs for high-speed transceivers.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA.
