XPC823ZT81B2T - PowerPC MPU, 81MHz, 256-BGA | NXP Semiconductors
N.º da peça: XPC823ZT81B2T ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $35 | $35,00 |
| 10 | $32.5 | $325,00 |
| 100 | $29.75 | $2.975,00 |
| 500 | $27 | $13.500,00 |
| 1.000 | $24.5 | $24.500,00 |
XPC823ZT81B2T Visão geral
A microprocessor (MPU) is a complete CPU implemented in silicon, typically with integrated cache, memory controller, and peripheral bridges, distinguished from a microcontroller (MCU) by its higher performance, external memory bus, and richer OS support. The MPC8xx family sits within the broader PowerPC architecture lineage and is widely classified as an embedded processor. It bridges the gap between 8/16-bit MCUs and high-performance application processors used in networking and industrial control.
Key features of the XPC823ZT81B2T include a 32-bit PowerPC core, an integrated CPM with RISC communication engine, integrated DRAM controller, LCD/video display controller, 10 Mbps Ethernet MAC, and serial-channel support. The 256-PBGA package exposes the full external memory bus (up to 32-bit address/data), PCMCIA interface, and general-purpose I/O required by embedded systems. Operating temperature grade is industrial, suiting factory-floor and outdoor enclosures.
Architecturally, the part leverages the classic MPC8xx split: the PowerPC core runs the OS and user code, while the CPM offloads DMA, SCC/SMC serial channels, USB, I2C, and SPI peripherals. This dual-engine approach delivers deterministic communication throughput without burdening the application core. Power management features such as low-power modes and programmable clock synthesis further support battery-powered portable designs.
Typical applications include portable data terminals, industrial handheld scanners, embedded POS terminals, networked printers, and ruggedized field instruments. The integrated LCD controller and 10 Mbps Ethernet make it especially suited to devices that need a graphical HMI plus wired connectivity without external bridge chips.
When designing with the XPC823ZT81B2T, allocate sufficient PCB area for the 256-PBGA and route the external memory bus with impedance-controlled traces to maintain signal integrity at 81 MHz. Ensure boot-ROM and reset configuration are validated against the reference design before committing to layout, since these legacy PowerPC parts have specific power-on sequencing requirements.
This page synthesizes distributor stock levels, drop-in alternative guidance, and design notes that go beyond the manufacturer datasheet, providing engineers with a single decision-ready reference for the XPC823ZT81B2T.
Alternativas drop-in para XPC823ZT81B2T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC823VT81B2T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC823CZT81B2T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC850SRCZQ66B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC852TZT66B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC855TCZQ50B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC823ZT81B2T Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Part Series | MPC8xx |
| Core Processor | PowerPC |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum Clock Speed | 81 MHz |
| Co-Processor / DSP | Communications; RISC CPM |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Display & Interface Controllers | LCD, Video |
| Ethernet | 10 Mbps |
| Encapsulamento | 256-PBGA (23x23 mm) |
| Número de pinos | 256 |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Part Status | Obsolete |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do XPC823ZT81B2T square
Configuração de pinos para XPC823ZT81B2T (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XPC823ZT81B2T.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XPC823ZT81B2T é adequado para 6 aplicaçãos: Portable Data Terminals, Industrial Handheld Scanners, Embedded POS Terminals, Networked Printers and MFPs, Ruggedized Field Instruments, Automotive Diagnostics Equipment.
Portable Data Terminals
The XPC823ZT81B2T fits portable data terminals because its 81 MHz PowerPC core delivers responsive barcode-decoding throughput while the integrated LCD controller drives the operator display without an external graphics chip. The CPM offloads serial protocols so the application core can dedicate cycles to scan processing and user-interface rendering. Operating from a single low-voltage rail, the part helps achieve the long battery life demanded by warehouse and field-service terminals. The industrial temperature grade ensures reliable operation across loading-dock and outdoor environments.
Recomendado
Industrial Handheld Scanners
Industrial handheld scanners benefit from the XPC823ZT81B2T's combination of a 32-bit PowerPC core and the RISC CPM. The CPM handles DMA, SCC, and SMC serial channels so image capture and laser-scan data are streamed without CPU intervention. The integrated 10 Mbps Ethernet MAC supports dock-based wired data transfer. Housed in a 256-PBGA package, the MPU allows compact scanner PCB layouts while the industrial temperature grade tolerates freezer-aisle and outdoor use.
Recomendado
Embedded POS Terminals
Embedded point-of-sale terminals leverage the XPC823ZT81B2T for its LCD controller, Ethernet MAC, and serial-channel support needed for receipt printers, magnetic-stripe readers, and cash-drawer interfaces. The PowerPC core at 81 MHz runs the POS application stack while the CPM manages the multidrop serial traffic. The 256-PBGA footprint fits compact countertop enclosures, and the industrial temperature grade suits kitchen and warehouse environments where heat and humidity vary.
Recomendado
Networked Printers and MFPs
Networked printers and multifunction peripherals use the XPC823ZT81B2T for its integrated 10 Mbps MAC, CPM serial channels, and DRAM controller. The PowerPC core runs the page-description-language interpreter while the CPM handles print-engine communication and scanner DMA streams. The 256-PBGA package provides the wide external memory bus required for high-bandwidth image processing, and the industrial temperature grade supports the enclosed thermal environment of printer chassis.
Recomendado
Ruggedized Field Instruments
Ruggedized field instruments such as portable gas analyzers, environmental loggers, and utility meters use the XPC823ZT81B2T for its low-power PowerPC core, integrated LCD controller, and flexible CPM serial channels. The 81 MHz clock supports local signal processing for sensor fusion algorithms, while the CPM offloads data logging and wireless-modem UART traffic. Industrial temperature grading and the 256-PBGA package enable compact, sealed enclosures that withstand outdoor temperature swings.
Recomendado
Automotive Diagnostics Equipment
Automotive diagnostics tools leverage the XPC823ZT81B2T's PowerPC core to execute OBD-II protocol stacks while the CPM handles CAN and K-line transceivers via serial channels. The integrated LCD controller drives the diagnostic display, and the 10 Mbps Ethernet MAC supports workshop-network integration. The 256-PBGA package is suitable for the larger enclosures of shop-floor diagnostic carts. Designers should verify EMC compliance because the 81 MHz core clock generates harmonics within automotive EMI bands.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC823ZT81B2T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC823VT81B2T | MPC823CZT81B2T | MPC850SRCZQ66B | MPC852TZT66B | MPC855TCZQ50B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Core Processor | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC |
| Maximum Clock Speed | 81 MHz | 81 MHz | 81 MHz | 66 MHz (-18%) | 66 MHz (-18%) | 50 MHz (-38%) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Co-Processor | CPM (RISC) | CPM (RISC) | CPM (RISC) | CPM (RISC) + USB | CPM (RISC) + USB | CPM (RISC) |
| Ethernet Speed | 10 Mbps | 10 Mbps | 10 Mbps | 10/100 Mbps | 10/100 Mbps | 10 Mbps |
| Temperature Grade | Industrial | Extended (-40 to 105 C) | Commercial | Industrial | Industrial | Industrial |
| LCD Controller | Yes | Yes | Yes | Yes | Yes | Yes |
| Part Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Higher CPU clock speed at 81 MHz (vs MPC823CZT66B)
- Industrial temperature grading (vs MPC823CZT81B2T)
- CPM-based serial offload at higher clock (vs MPC855TCZQ50B)
Notas de projeto
The 256-PBGA package requires via-in-pad or microvia technology for reliable BGA assembly. Per the NXP MPC823 reference design, route the external memory bus with controlled impedance (typically 50 ohm single-ended) and match trace lengths within the bus skew budget of the 81 MHz core clock. Place decoupling capacitors as close as possible to each power pin and use a solid ground plane beneath the BGA to minimize inductance.
Boot configuration is set by reset configuration pins on the XPC823ZT81B2T; incorrect settings will prevent the system from booting. Always validate the reset configuration word against the NXP MPC823 reference manual before committing to PCB layout. Power-on sequencing must satisfy the core and I/O voltage rail timing documented in the datasheet; failure to sequence correctly can damage internal ESD structures.
Estimated: at the maximum 81 MHz core clock and full CPM activity, the XPC823ZT81B2T typically dissipates approximately 1.2 W to 1.8 W depending on bus utilization. The 256-PBGA's theta_JA is around 25-30 C/W on a standard JEDEC test board, resulting in a 30-55 C junction temperature rise above ambient. Provide adequate copper thermal relief beneath the BGA to keep junction temperature within the industrial operating range.
The MPC8xx external memory bus operates at 81 MHz with 32-bit data width. Use series damping resistors on clock and address lines if reflection problems are observed, and verify signal integrity with IBIS simulation before tape-out. The Ethernet MAC signals (10 Mbps) require proper magnetics and Bob Smith termination to meet IEEE 802.3 EMC requirements.
Informações de conformidade
Compliance information not present in the verified web data; consult the NXP MPC823 product documentation for the latest material-declaration reports. The part is no longer in active production.