XPC850SRZT80BU - 32-Bit 80MHz MPC8xx MPU | NXP | 256-PBGA
N.º da peça: XPC850SRZT80BU ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $43.2 | $432,00 |
| 100 | $38.5 | $3.850,00 |
| 500 | $33.8 | $16.900,00 |
| 1.000 | $29.95 | $29.950,00 |
XPC850SRZT80BU Visão geral
What is an MPU in the MPC8xx family? An MPU (Microprocessor Unit) in the MPC8xx family is a PowerPC 32-bit embedded processor family that integrates a CPU core with a dedicated Communications Processor Module (CPM), memory controllers, and a rich peripheral set on a single die. Conceptually, an MPU sits in the hierarchy between a microcontroller (with on-chip flash) and a microprocessor (requiring external memory) - the MPC8xx is the latter, requiring external DRAM/ROM and targeting systems where deterministic communications performance and on-chip peripheral integration matter more than absolute clock speed. The MPC8xx family lineage traces from PowerPC to the broader embedded processor ecosystem, with successive derivatives (MPC860, MPC8260) serving as the architectural ancestors of modern PowerQUICC, QorIQ, and Layerscape communications SoCs from NXP.
Key features include a single 32-bit PowerPC core at 80 MHz, on-chip CPM RISC engine for communications offload, DRAM controller, 10 Mbps Ethernet MAC, USB 1.x interface, and serial interfaces including UART, HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, and TDM ports. The device operates from a 3.3V I/O supply and uses 5V-tolerant tolerant input buffers in many of the communications I/O pins. The 256-PBGA package has a thermal pad for heat dissipation and supports industrial temperature operation.
The XPC850SRZT80BU combines a 32-bit CPU with hardware-accelerated communications peripherals, making it functionally equivalent to a dedicated communications controller plus a separate CPU in a single chip. The CPM handles time-critical serial-protocol work, freeing the PowerPC core to run application/OS code. Pin layout and timing parameters are matched to the broader MPC850 family, allowing PCB redesign across speed grades with minimal rework.
Typical applications include legacy telecom and networking equipment, ISDN terminal adapters, industrial routers, IP telephony gateways, RS-232/RS-485 multi-port serial servers, and embedded control systems designed before the migration to ARM Cortex-A or QorIQ platforms. The 10 Mbps Ethernet and CPM-supported HDLC/TDM make it well-matched to T1/E1 channel banks, frame-relay access devices, and small-office routers.
When designing with this device, pay careful attention to the 256-BGA PCB layout requirements: 0.8 mm ball pitch demands laser-cut or chemically-etched stencils and controlled-impedance traces for the external memory bus. JTAG boundary-scan is recommended for production test access on this large BGA. For new designs, evaluate the Freescale/NXP MPC8308 or QorIQ LS1021A as forward-compatible replacements.
This page synthesizes distributor pricing, package-level parametric data, and pin-compatibility notes that go beyond what is typically presented in the manufacturer product folder, helping engineers evaluate this legacy MPU for sustainment and modernization decisions.
Alternativas drop-in para XPC850SRZT80BU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC850SRVT80BU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC850SRCZQ66B
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC857TCVR66B
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC860SRVT80BU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC866SRVT100BU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XPC850SRZT80BU Classificações máximas e características elétricas
| Core Processor | MPC8xx (PowerPC 32-bit) |
| Number of Cores | 1 |
| Bus Width | 32-Bit |
| Core Speed | 80 MHz |
| Co-Processors / DSP | Communications; CPM (Communications Processor Module) |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | 10 Mbps (1 channel) |
| USB | USB 1.x (1 port) |
| I/O Voltage | 3.3 V |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
| Encapsulamento | 256-PBGA (23x23 mm) |
| Number of Terminals | 256 (BGA balls) |
| Terminal Form | Ball |
| Tipo de montagem | Surface Mount |
| Operating Temperature Grade | Other (see datasheet) |
| Part Status | Obsolete |
| Packaging | Tray |
Guia de Configuração de Pinos do XPC850SRZT80BU 256-pbga (23x23 mm)
Configuração de pinos para XPC850SRZT80BU (pacote 256-pbga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XPC850SRZT80BU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XPC850SRZT80BU é adequado para 6 aplicaçãos: Legacy ISDN Terminal Adapter, Small-Office Router / SOHO Gateway, Industrial Serial Server / RS-232/RS-485 Hub, T1/E1 Channel Bank, PCMCIA-Card-Form-Factor Network Adapter, Legacy Telecom Control Card.
Legacy ISDN Terminal Adapter
The XPC850SRZT80BU's integrated HDLC/SDLC controllers and TDM channel make it well-suited for legacy ISDN terminal adapters where deterministic synchronous serial handling is required. The CPM offloads HDLC framing from the PowerPC core, freeing CPU cycles for upper-layer protocol stacks. At 80 MHz the core can drive the protocol stack alongside the CPM with margin for AT-command processing. Compared to a discrete CPU plus external HDLC controller solution, the XPC850SRZT80BU reduces bill of materials and PCB area while delivering deterministic interrupt response for real-time bearer-channel work. The 3.3 V I/O simplifies interface to standard ISDN transceiver ICs (e.g., Motorola MC145574 family).
Recomendado
Small-Office Router / SOHO Gateway
For SOHO-class routers built around the 10 Mbps Ethernet and HDLC serial links, the XPC850SRZT80BU provides the right level of integration: single Ethernet MAC, dual UART, HDLC channels, and a PowerPC core for routing tables. The 80 MHz CPU sustains basic NAT/firewall throughput for tens of Mbps aggregated traffic. Compared to microcontrollers with software TCP/IP stacks, the XPC850SRZT80BU delivers hardware-assisted HDLC and synchronous serial, lowering CPU interrupt load. Designers targeting modern Gigabit designs should plan migration to QorIQ, but for legacy sustainment the part continues to serve in installed-base equipment for years.
Recomendado
Industrial Serial Server / RS-232/RS-485 Hub
For industrial multi-port serial servers (RS-232/RS-485 concentration in PLCs and SCADA gateways), the XPC850SRZT80BU's dual UART/USART channels and HDLC/SDLC synchronous serial allow flexible protocol aggregation. Each UART can be polled or interrupt-driven, with the PowerPC core handling packetization onto the Ethernet port. At 80 MHz, the device can sustain 4-8 serial ports at common baud rates while maintaining TCP/IP stack throughput. The wide operating temperature range and BGA package offer robust mechanical reliability for industrial cabinets. Compared to discrete UART expander solutions, the integrated MPU reduces board complexity significantly.
Recomendado
T1/E1 Channel Bank
The XPC850SRZT80BU's TDM interface and HDLC controllers directly match T1/E1 channel-bank requirements: TDM provides time-slotted access to DS0 channels, HDLC implements LAPD signaling for ISDN PRI. The CPM handles time-critical TDM framing without CPU intervention. At 80 MHz the PowerPC core can manage up to 4-8 DS0 channels of compressed voice (e.g., G.729) with adequate MIPS margin. Compared to DSP-plus-microcontroller alternatives, the integrated MPC8xx simplifies firmware partitioning because one toolchain covers both protocol and DSP-adjacent code paths. The 256-BGA package supports ruggedized chassis designs.
PCMCIA-Card-Form-Factor Network Adapter
The XPC850SRZT80BU integrates a PCMCIA-ATA host controller, which is ideal for compact PC-card form-factor network adapters (e.g., CompactFlash Ethernet or PCMCIA wireless cards). The HDLC and Ethernet peripherals implement the LAN or WAN side, while the PCMCIA host bridge connects to standard CardBus cards. At 80 MHz the device can sustain media-rate traffic for typical cards. Compared to external PCMCIA bridge chips plus a separate MPU, integrating the host controller into the MPC8xx saves significant board area and reduces power. The industrial temp grade and BGA package suit rugged mobile applications.
Legacy Telecom Control Card
For control cards in legacy telecom infrastructure (SS7 signaling controllers, A-bis interface controllers), the XPC850SRZT80BU provides a proven combination of synchronous serial (HDLC), TDM, and a capable 32-bit core running SS7 stack software. The PowerPC 80 MHz core sustains MTP-2/3 throughput for low-traffic nodes and E1/T1 link monitoring. The 3.3 V I/O and 256-PBGA package suit the multi-card chassis form factor. For new deployments, NXP's MPC8308 or QorIQ LS1021A are recommended; for sustainment of installed bases the XPC850SRZT80BU continues to provide reliable operation when sourced from authorized channels.
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC850SRZT80BU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC850SRVT80BU | MPC850SRCZQ66B | MPC857TCVR66B | MPC860SRVT80BU | MPC866SRVT100BU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA - same | 256-BGA ZQQ - same family | 256-PBGA - same family | 256-PBGA - same | 256-PBGA - same |
| Core Speed | 80 MHz | 80 MHz | 66 MHz | 66 MHz | 80 MHz | 100 MHz |
| Architecture | MPC8xx PowerPC 32-bit | MPC8xx | MPC8xx | MPC8xx | MPC8xx | MPC8xx |
| Ethernet | 10 Mbps (1 channel) | 10 Mbps (1) | 10 Mbps (1) | 10 Mbps (1) | 10/100 Mbps (2) + PCI | 10/100 Mbps (2) + PCI |
| USB | USB 1.x (1 port) | USB 1.x (1) | USB 1.x (1) | USB 1.x (1) | USB 1.x (1) | USB 1.x (1) |
| Core / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Same 256-PBGA footprint across alternatives simplifies board reuse (vs MPC850SRVT80BU)
- 80 MHz vs 66 MHz alternatives for higher performance headroom (vs MPC850SRCZQ66B)
- MPC8xx legacy architecture with multi-decade software ecosystem (vs MPC8308 / QorIQ LS1021A)
Notas de projeto
The 256-PBGA package at 1.0 mm ball pitch requires laser-cut or chemically-etched SMT stencils with 0.45-0.50 mm aperture for reliable paste deposition. Use NSMD (non-solder mask defined) pads with HASL or ENIG plating; OSP finish is also acceptable. Place 0.5 mm micro-vias in-pad (or staggered dog-bone fanout) for inner-layer escape routing. Route the 32-bit memory bus with characteristic impedance of 50-60 ohms and matched lengths within +/- 250 mil between data strobe groups. Reflow profile must follow JEDEC J-STD-020 with peak temperature under 245 C for the PBGA version (or 220 C for Pb-free).
Estimated: At 80 MHz full-core operation with typical 2.0 V core supply and 3.3 V I/O, internal power dissipation is approximately 0.8-1.2 W. The 23x23 mm PBGA with JEDEC-standard test-board conditions shows theta_JA of approximately 15-25 C/W depending on PCB copper count and airflow. Connection of the package thermal pad to an inner ground plane through 0.3 mm thermal vias (8-12 vias minimum, 1.0 mm pitch) is required to keep junction temperature under 105 C. For sustained industrial-temperature operation, add forced-air cooling or finned heat-spreader.
Critical signal traces (clock, reset, JTAG) must be guarded by ground on both sides. Place the 32 kHz to 4 MHz crystal/oscillator within 5 mm of the EXTCLK pin and route with controlled-impedance to minimize jitter. The JTAG TDI/TDO/TMS/TCK signals (10 kohm pullups required per MPC8xx reference manual) must be accessible at the board edge for boundary-scan test. The DRAM bus should use matched-pair routing with series termination; the SDRAM controller can be configured for 2-1-1-1 burst accesses at 80 MHz.
Informações de conformidade
Original MPC850 family parts have mixed lot compliance; verify RoHS/Pb-free status by date code and lot marking as of 2026-10-16. NXP product folder does not provide a consolidated compliance statement; contact your distributor or NXP sales representative with the device date code for per-lot confirmation.