XPC850DSLCZT50BU - MPC8xx PowerQUICC MPU 50MHz | NXP | 256-PBGA
N.º da peça: XPC850DSLCZT50BU ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.9 | $1.990,00 |
| 500 | $16.4 | $8.200,00 |
| 1.000 | $13.85 | $13.850,00 |
XPC850DSLCZT50BU Visão geral
What is a PowerQUICC microprocessor? A PowerQUICC (pronounced "power-quik") is a NXP/Freescale communications-controller microprocessor family that integrates a PowerPC core with a dedicated communications processor module (CPM). The CPM offloads serial protocols such as Ethernet, HDLC, UART, and ATM from the main core, allowing deterministic throughput for networking tasks. Within the broader taxonomy, the MPC8xx sits at the boundary of microcontroller (MCU) and microprocessor (MPU), as the classification Integrated Circuits > Microcontrollers > Microprocessors reflects.
Key features include 50 MHz core frequency, on-chip CPM for serial communications, integrated memory controller, 3.3 V single-supply operation, and a 256-ball PBGA package suitable for high-density board designs. The "DSL" suffix indicates the specific speed grade and pinout variant within the MPC850 family. Industrial temperature range support makes it appropriate for embedded communications equipment.
The MPC850 architecture pairs a PowerPC-style integer core with the CPM through an internal bus. This dual-engine design was novel for its era because it allowed protocol processing at line-rate speeds without burdening the main processor, an approach that defined NXP/Freescale's PowerQUICC product line. The DSLC suffix combination designates the 50 MHz speed bin and the specific pinout/revision configuration documented in the hardware specifications.
Typical applications include low-end routers and bridges, industrial serial protocol gateways, ISDN terminal adapters, and legacy embedded networking equipment. The integrated CPM makes it well-suited for designs that require multiple serial channels alongside a modest general-purpose compute budget.
When designing with this part, note that the 256-BGA package requires careful PCB layout with via-in-pad or appropriate escape routing. The 3.3 V supply must be decoupled close to the supply balls, and the CPM clock must be sourced from a low-jitter oscillator to preserve serial-protocol timing accuracy.
This page synthesizes distributor pricing, drop-in alternatives drawn from the MPC850 family cross-reference, and practical design considerations drawn from NXP's hardware specifications. The information above is curated for engineers maintaining or replicating legacy embedded communications hardware.
Alternativas drop-in para XPC850DSLCZT50BU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC850DSLCVR50BU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC850DSLCZQ50BU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC850DSLZT50BU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC850DSLVR50BU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC850DSLCZT50BU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860DTZQ80D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC850DSLCZT50BU Classificações máximas e características elétricas
| Processor Type | MPC8xx PowerQUICC, 32-Bit RISC |
| Core Count | 1 |
| Core Architecture | PowerPC integer core |
| Core Frequency | 50 MHz |
| Tensão de alimentação de operação | 3.3 V |
| Encapsulamento | 256-PBGA (23x23 mm) |
| Package Code | BGA, 256-ball |
| Terminal Form | Ball |
| Number of Terminals | 256 |
| Package Shape | Square |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Industrial |
| Communications Processor Module (CPM) | Integrated (Ethernet, HDLC, UART, etc.) |
| Livre de halogênio | Not Compliant |
| ECCN | 5A991 |
| Introduction Date | August 30, 2001 |
| Estimated EOL Date | Obsolete / End of life |
Guia de Configuração de Pinos do XPC850DSLCZT50BU square
Configuração de pinos para XPC850DSLCZT50BU (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XPC850DSLCZT50BU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XPC850DSLCZT50BU é adequado para 6 aplicaçãos: Low-End Router/Bridge, ISDN Terminal Adapter, Industrial Serial Protocol Gateway, Legacy Embedded Networking Appliance, DSL/Cable Modem (Legacy Reference Design), Multi-Serial Industrial Controller.
Low-End Router/Bridge
The XPC850DSLCZT50BU's integrated Communications Processor Module (CPM) provides dedicated Ethernet MAC and HDLC controllers, making it well-suited for low-end router and bridge designs. In a typical 10/100 Mbps Ethernet bridge, the CPM handles line-rate frame processing while the 50 MHz PowerPC core runs the routing/bridging protocol stack. The 256-PBGA 23x23 mm package delivers high-density I/O for the multiple serial channels required by small-form-factor networking hardware. Designers benefit from deterministic protocol throughput, but should budget CPM clock-tree jitter to within the limits specified in the NXP hardware specifications.
Recomendado
ISDN Terminal Adapter
The XPC850DSLCZT50BU's CPM includes an HDLC/SDLC controller and time-slot assigner (TSA) that match the requirements of ISDN terminal adapters. The 50 MHz core is sufficient for U-interface signalling and call-control state machines, while the CPM absorbs the bit-level D-channel processing. Operating from a single 3.3 V rail, the part simplifies the analog/digital interface design typical of ISDN customer-premises equipment. Designers should pair the part with a low-jitter PCM-clock source and an external codec for the S/T interface.
Recomendado
Industrial Serial Protocol Gateway
Industrial gateways commonly aggregate multiple UART-based fieldbuses (Modbus, Profibus, etc.) and present them on Ethernet. The XPC850DSLCZT50BU's combination of UART channels and an integrated Ethernet MAC makes it a single-chip solution for protocol-conversion gateways. The industrial temperature grade enables operation in factory-floor environments, while the 256-PBGA package supports the high I/O count needed for multi-channel serial aggregation. For each UART channel running at 115.2 kbps, CPM bandwidth is trivial; designers can also use spare channels for diagnostics or local HMI.
Recomendado
Legacy Embedded Networking Appliance
Long-lifecycle embedded appliances such as industrial printers, point-of-sale terminals, and legacy SCADA nodes often use the MPC850 family because of its deterministic communications throughput and stable firmware ecosystem. The XPC850DSLCZT50BU's 50 MHz speed grade and 3.3 V supply fit the existing board designs of these mature products. The 256-PBGA footprint matches earlier PowerQUICC layouts, simplifying board re-spins. Designers maintaining such products should track the part's obsolete status and qualify a drop-in alternative for last-time-buy transitions.
Recomendado
DSL/Cable Modem (Legacy Reference Design)
Early-generation DSL and cable modems used the MPC850 family to integrate the host processor, ATM segmentation-and-reassembly logic, and Ethernet MAC into a single chip. The XPC850DSLCZT50BU's CPM supports ATM AAL-1/AAL-2/AAL-5 bearers alongside the Ethernet port, matching the data-path requirements of legacy residential gateways. While newer designs have moved to dedicated SoCs, repair and refurbishment channels continue to specify this part for warranty service on deployed units. Designers should verify transceiver compatibility when integrating the modem PHY.
Recomendado
Multi-Serial Industrial Controller
Industrial machinery controllers often require 4-8 UART channels for sensor aggregation plus a higher-speed fieldbus (EtherCAT, Profinet) for the main control loop. The XPC850DSLCZT50BU's CPM provides multiple SCC/SMC serial channels and a 10 Mbps Ethernet MAC, sufficient for non-real-time supervisory layers in such systems. While not a hard-real-time EtherCAT master, the part excels at serial-bridge and protocol-translation duties in distributed control architectures. Industrial temperature grade operation supports cabinet-mounted deployment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC850DSLCZT50BU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC850DSLCVR50BU | MPC850DSLCZQ50BU | XPC850DSLZT50BU | MPC860DTZQ80D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) | 256-PBGA (23x23) | 256-PBGA (23x23) | 256-PBGA (23x23) |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 80 MHz |
| Core Count | 1 | 1 | 1 | 1 | 1 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Communications Processor Module (CPM) | Integrated | Integrated | Integrated | Integrated | Integrated (enhanced CPM) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
Principais diferenciais
- Tray packaging format tailored for engineering builds (vs MPC850DSLCVR50BU)
- Stable supply through authorised distributor channels (vs Generic MPC850 listings on independent brokers)
- Lower-tier speed grade reduces system cost (vs MPC860DTZQ80D4)
Notas de projeto
The 256-PBGA package at 23x23 mm has a fine ball pitch (typically 1.27 mm). PCB layout must use via-in-pad or dog-bone fanout escape on at least four routing layers. Assign continuous ground and power planes on the layers directly beneath the package, and follow NXP's BGA escape guidelines in the hardware specifications to maintain signal integrity for the high-speed memory and CPM buses.
The 3.3 V main supply must be decoupled with bulk, mid-frequency, and high-frequency capacitors placed within 5 mm of the supply balls. The internal core voltage is generated by an on-chip regulator and requires additional bulk capacitance on the internal-voltage pins. Sequence the 3.3 V supply with respect to any external PHY supplies to avoid latch-up during power-up and power-down transients.
Because the XPC850DSLCZT50BU is obsolete, counterfeit risk is elevated. The GlobalSpec entry reports a 63% fake-threat figure for this part on the open market. Always source from authorised distributors or verified independent brokers with lot traceability. Insist on a factory test certificate and visual/lot-code verification before integrating into production builds.
The CPM clock must be sourced from a low-jitter oscillator (typically below 50 ps RMS jitter). Higher jitter degrades serial-protocol timing margins and can cause intermittent link failures on Ethernet and HDLC channels. Place the clock source as close as possible to the CLK pins and isolate it from switching-power and CPM data lines.
Informações de conformidade
Per GlobalSpec: Halogen Free: Not Compliant. ECCN 5A991. Introduction Date August 30, 2001. RoHS status not explicitly documented; lead-bearing variant most likely given 2001 introduction date.