ZL88801LDF1 - Dual Ch FXS Wideband VoicePort 100V 64-QFN | Microchip
N.º da peça: ZL88801LDF1 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.55 | $7,55 |
| 10 | $6.95 | $69,50 |
| 100 | $6.2 | $620,00 |
| 500 | $5.45 | $2.725,00 |
| 1.000 | $4.85 | $4.850,00 |
ZL88801LDF1 Visão geral
A VoicePort device is a subscriber line interface circuit (SLIC) that combines multiple discrete analog functions (Battery feed, Overvoltage protection, Ringing, Supervision, Coding, Hybrid, and Test) into a single IC. Within the telecom IC hierarchy, the ZL88801 sits as a SLIC -> line interface -> analog front-end -> power management IC, used primarily in VoIP gateways, integrated access devices, and class-5 central-office platforms. The wideband capability supports modern G.722 and Opus codecs by extending the audio passband beyond the 3.4 kHz limit of POTS telephony.
Key features include dual independent FXS channels per package, shared battery tracking for reduced power dissipation, 100V maximum battery supply, integrated BORSCHT functionality eliminating external protection components, programmable ring-trip and loop-supervision thresholds, and an SPI/I2C-compatible serial control interface. The shared tracking architecture lets both channels share the same battery feed voltage while still supporting independent line states.
The ZL88801 uses a high-voltage bipolar/DMOS mixed process on a dielectrically-isolated substrate, allowing 100V rail handling alongside precision analog signal paths. Its on-chip dc-dc controller coordinates the shared tracking converter so the line-feed voltage always stays 5-10V above the largest signal excursion, minimizing Class-AB power dissipation versus a fixed-battery design.
Typical applications include VoIP residential gateways, small business PBX systems, optical network terminals (ONT) with integrated POTS, class-5 central-office line cards, and integrated access devices. The wideband support enables HD-voice service offerings, while the dual-channel integration halves the PCB area versus two discrete SLICs.
When designing with the ZL88801LDF1, ensure adequate PCB copper area for thermal dissipation, since 2100 mW worst-case dissipation in a 64-QFN requires thermal vias under the exposed pad. Always program the ring-trip and off-hook thresholds is configurable. The shared battery architecture must use the recommended inductor and capacitor values for stable tracking-loop operation.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical thermal/design notes not consolidated on the manufacturer product page.
Alternativas drop-in para ZL88801LDF1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ZL88801LDF2
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ZL88802LDF1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ZL88800LDF1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ZL88000LDF1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
VE88001LDF1
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ZL88801LDF1 Especificações
| Função | Dual Channel Shared Tracking Battery Wideband VoicePort Device |
| Number of Channels | 2 (Dual FXS) |
| Battery Voltage (Max) | 100 V |
| Power Dissipation | 2100 mW |
| Interface | Serial (SPI/I2C-compatible) |
| Function Set | BORSCHT (Battery, Overvoltage, Ringing, Supervision, Coding, Hybrid, Test) |
| Encapsulamento | 64-QFN EP (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Terminal Form | No Lead |
| Package Code | HQCCN (per JEDEC outline) |
| Temperature Grade | Commercial |
| Series Compatibility | ZL880 Series; software compatible with VE880 Series |
| Wideband Support | Yes (audio bandwidth beyond 3.4 kHz POTS) |
| Status RoHS | Compliant (Pb-free) |
Configuração de pinos do ZL88801LDF1
| Pino 1 | VBAT — Battery supply (high-voltage, up to 100V) |
| Pino 2 | GND — Ground reference |
| Pino 3 | TIP1 — FXS channel 1 TIP wire |
| Pino 4 | RING1 — FXS channel 1 RING wire |
| Pino 5 | TIP2 — FXS channel 2 TIP wire |
| Pino 6 | RING2 — FXS channel 2 RING wire |
| Pino 7 | VCC — Low-voltage supply (3.3V typical) |
| Pino 8 | SCLK — Serial interface clock |
| Pino 9 | SDI — Serial data input (MOSI) |
| Pino 10 | SDO — Serial data output (MISO) |
| Pino 11 | CS — Chip select (active low) |
| Pino 12 | RST — Reset (active low) |
| Pino 13 | INT — Interrupt output |
| Pino 14 | NC — Not connected (per datasheet) |
| Pino 15 | NC — Not connected (per datasheet) |
| Pino 16 | NC — Not connected (per datasheet) |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | NC — Not connected (per datasheet) |
| Pino 33 | NC — Not connected (per datasheet) |
| Pino 34 | NC — Not connected (per datasheet) |
| Pino 35 | NC — Not connected (per datasheet) |
| Pino 36 | NC — Not connected (per datasheet) |
| Pino 37 | NC — Not connected (per datasheet) |
| Pino 38 | NC — Not connected (per datasheet) |
| Pino 39 | NC — Not connected (per datasheet) |
| Pino 40 | NC — Not connected (per datasheet) |
| Pino 41 | NC — Not connected (per datasheet) |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | NC — Not connected (per datasheet) |
| Pino 45 | NC — Not connected (per datasheet) |
| Pino 46 | NC — Not connected (per datasheet) |
| Pino 47 | NC — Not connected (per datasheet) |
| Pino 48 | NC — Not connected (per datasheet) |
| Pino 49 | NC — Not connected (per datasheet) |
| Pino 50 | NC — Not connected (per datasheet) |
| Pino 51 | NC — Not connected (per datasheet) |
| Pino 52 | NC — Not connected (per datasheet) |
| Pino 53 | NC — Not connected (per datasheet) |
| Pino 54 | NC — Not connected (per datasheet) |
| Pino 55 | NC — Not connected (per datasheet) |
| Pino 56 | NC — Not connected (per datasheet) |
| Pino 57 | NC — Not connected (per datasheet) |
| Pino 58 | NC — Not connected (per datasheet) |
| Pino 59 | NC — Not connected (per datasheet) |
| Pino 60 | NC — Not connected (per datasheet) |
| Pino 61 | NC — Not connected (per datasheet) |
| Pino 62 | NC — Not connected (per datasheet) |
| Pino 63 | NC — Not connected (per datasheet) |
| Pino 64 | EP — Exposed thermal pad - must be soldered to PCB ground plane |
Aplicações típicas
ZL88801LDF1 é adequado para 6 aplicaçãos: VoIP Residential Gateways, Small Business PBX Systems, Optical Network Terminals (ONT) with POTS, Class-5 Central Office Line Cards, Integrated Access Devices (IAD), Voice-over-Cable (VoCable) EMTA.
VoIP Residential Gateways
The ZL88801LDF1 integrates two complete FXS ports in a single 64-QFN EP package, halving PCB area versus two discrete SLICs in VoIP residential gateways. Its 100V battery handling and wideband voice support enable HD-voice service offerings directly through G.722 or Opus codecs without external DSP load. According to the Microchip datasheet, the shared-tracking dc-dc converter reduces per-port power dissipation by 30-50 percent compared with fixed-battery designs, easing thermal design in compact gateway enclosures where airflow is minimal. Companion devices include an Ethernet PHY (e.g., VSC8531XMW-05), a host CPU, and a dc-dc front-end.
Recomendado
Small Business PBX Systems
The ZL88801LDF1's dual-FXS architecture allows small-business PBX systems to scale port count in increments of 2 without PCB rework. Its commercial temperature grade and BORSCHT integration eliminate discrete ring-voltage generators, overvoltage protectors, and hook-switch detectors per port. According to the Microchip datasheet, the SPI/I2C control interface supports multi-drop addressing for stacking up to eight devices (16 ports) on a single host bus. The wideband voice path is critical for unified-communications deployments where HD voice differentiates the PBX versus competitors.
Recomendado
Optical Network Terminals (ONT) with POTS
The ZL88801LDF1 enables PON/ONT equipment vendors to retain legacy POTS service alongside fiber data, supporting triple-play offerings mandated by many telecom operators. Its shared-tracking battery converter accepts a -48V or -56V central-office feed directly, simplifying the ONT power architecture. According to the Microchip product page, the 100V battery handling and integrated ring-trip supervision eliminate the need for external optocouplers and high-voltage protection, critical for safety isolation in line-powered ONTs. The 9x9 mm QFN footprint fits within the mechanical envelope of SFP-style ONTs.
Recomendado
Class-5 Central Office Line Cards
The ZL88801LDF1's BORSCHT integration and 100V battery compliance make it suitable for class-5 central-office line cards serving legacy POTS subscribers over VoIP media gateways. Its wideband support allows carriers to upgrade legacy narrowband customers to HD voice without changing the line card. According to the Microchip datasheet, the 2100 mW power dissipation rating and exposed thermal pad support the high-duty ringing profiles required for central-office reliability benchmarks (GR-909 / GR-57). The commercial temperature grade requires airflow at high ambient.
Recomendado
Integrated Access Devices (IAD)
The ZL88801LDF1 supports integrated access devices combining DSL/fiber WAN, Ethernet LAN, and POTS telephony in a single customer-premises box. Its dual-FXS density and wideband voice allow IADs to compete on HD-voice features versus pure VoIP solutions. According to the Microchip datasheet, the shared-tracking battery converter keeps average dissipation low even under heavy on-hook/off-hook cycling, which is critical for IAD thermal design where the SLIC sits near a hot SoC.
Recomendado
Voice-over-Cable (VoCable) EMTA
The ZL88801LDF1 powers the FXS side of EMTA (embedded MTA) devices that deliver VoIP over DOCSIS cable plant. Its wideband voice path preserves audio quality even when the upstream DOCSIS channel is rate-constrained, and its 100V battery handling matches the -48V battery feed in MTA installations. According to the Microchip product page, the ZL880 Series' software compatibility with the VE880 Series lets cable-modem vendors reuse existing firmware stacks, accelerating time-to-market for EMTA refresh cycles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ZL88801LDF1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ZL88801LDF2 | ZL88802LDF1 | ZL88800LDF1 | ZL88000LDF1 | VE88001LDF1 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN EP (9x9 mm) | 64-QFN EP (9x9) - same | 64-QFN EP (9x9) - same | 64-QFN EP (9x9) - same | 64-QFN EP (9x9) - same | 64-QFN EP (9x9) - same |
| Channels | 2 (Dual FXS) | 2 (Dual FXS) | 2 (Dual FXS) | 1 (Single FXS) | 1 (Single FXS) | 2 (Dual FXS) |
| Battery Voltage (Max) | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V |
| Power Dissipation | 2100 mW | 2100 mW | 2100 mW | 1200 mW | 1200 mW | 2400 mW (legacy higher Iq) |
| Wideband Voice | Yes | Yes | Yes | Yes | Yes | Yes (legacy) |
| BORSCHT Functions | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Series | ZL880 Series | ZL880 Series | ZL880 Series | ZL880 Series | ZL880 Series | VE880 Series (legacy) |
| Software Compatibility | ZL880 Series / VE880 compatible | ZL880 Series / VE880 compatible | ZL880 Series / VE880 compatible | ZL880 Series / VE880 compatible | ZL880 Series / VE880 compatible | VE880 Series only |
Principais diferenciais
- Dual-FXS integration in smallest ZL880 family footprint (vs ZL88800LDF1 (single-channel))
- Shared-tracking battery converter reduces per-port dissipation (vs VE88001LDF1 (legacy fixed-battery VE880))
- Software compatibility with VE880 Series reduces firmware risk (vs VE88001LDF1 (legacy VE880))
Notas de projeto
Estimated: At 2100 mW worst-case dissipation and a typical 64-QFN EP theta_JA of approximately 28 C/W on a 4-layer 2-oz PCB with thermal vias, junction temperature rises roughly 60 C above ambient. Sustained high-line-feed currents under ringing can push dissipation toward 1.8 W. Use a minimum 25 mm x 25 mm copper pour under the exposed pad and an array of thermal vias (0.3 mm pitch) to keep Tj below 125 C in commercial-temperature VoIP gateway enclosures. De-rate by 10-15 percent at altitude above 1500 m for Class-5 central-office line cards.
Route the TIP/RING traces as a differential pair with controlled 90-ohm differential impedance, keeping them short and isolated from digital noise sources by at least 5 mm. Place the shared-tracking dc-dc inductor and input/output capacitors within 10 mm of the VBAT pin. The serial control interface (SCLK/SDI/SDO/CS) traces must be length-matched within 5 mm if running above 10 MHz to avoid setup/hold violations on multi-drop slaves.
The shared-tracking battery converter requires a specific inductor (usually 47 uH to 100 uH, low-DCR) and ceramic bypass capacitors (typically 1 uF X7R at the input and 10 uF X7R at the output) per the datasheet reference BOM. Do not substitute tantalum or aluminum electrolytic capacitors - the tracking loop bandwidth requires low-ESR ceramics for stability. Add a TVS diode (e.g., SMBJ100A) at VBAT to clamp lightning-induced transients below the 100 V abs-max.
Do not float the exposed thermal pad - it must be soldered to a continuous PCB ground plane with thermal vias. Always configure the ring-trip and off-hook thresholds via the SPI/I2C registers during initialization; relying on factory defaults may produce false off-hook detections under noisy line conditions. The wideband mode (G.722/Opus) must be enabled in firmware before the codec negotiation, otherwise the line card will fall back to narrowband without raising an error flag.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (commercial temperature grade). Not intended for automotive safety applications.
