STM32H745IIT6 - 480MHz Dual-Core M7/M4 MCU, 2MB Flash | ST
N.º da peça: STM32H745IIT6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.75 | $16,75 |
| 10 | $15.41 | $154,10 |
| 100 | $13.36 | $1.336,00 |
| 500 | $11.84 | $5.920,00 |
| 1.000 | $10.62 | $10.620,00 |
STM32H745IIT6 Visão geral
What is a dual-core Cortex-M7/M4 MCU? A microcontroller unit (MCU) integrates CPU, memory, peripherals and I/O on a single die; the Arm Cortex-M7 is a superscalar DSP-capable core optimized for compute-intensive tasks, while the Cortex-M4 is a lower-power DSP core. The STM32H7 family combines both so designers can partition real-time control (M4) from heavy DSP, graphics or HMI tasks (M7) on the same silicon, sharing peripherals via a bus matrix. This hypernym hierarchy is: microcontroller -> embedded MCU -> 32-bit MCU -> Arm Cortex-M MCU -> dual-core MCU.
Key features of this device include a 16-bit ADC (3.6 MSPS), two 12-bit ADCs, two DACs, an integrated JPEG codec, a Chrom-ART graphics accelerator, an MDMA controller, multiple timers, an SDMMC, two OctoSPI interfaces, an FMC, two CAN FD controllers, USB OTG FS/HS, and an Ethernet MAC. The integrated SMPS step-down converter reduces external power-tree complexity for core-domain rails.
Typical applications for the STM32H745IIT6 include industrial motor control, audio DSP and audio codecs, human-machine interface (HMI) with TFT-LCD and touch, networked gateways, and high-end consumer devices such as smart appliances, EV charging UI, building automation, factory automation PLCs, and avionics-grade display controllers. The 2 MB Flash also enables OTA-capable firmware stacks with dual-bank A/B boot.
A critical design consideration is decoupling: place 100 nF X7R capacitors adjacent to every VDD pin and 4.7 µF bulk caps on the SMPS output. Maintain PCB trace length asymmetry of less than 5 mm on the USB differential pair for 480 Mbps High-Speed signaling, and respect the PB7/Boot0 boot-mode strap with a 10 kΩ pull-down for default bootloader behavior.
This page synthesizes verified distributor pricing, drop-in LQFP-176 alternatives, AEO-optimized FAQs and practical design notes that the manufacturer datasheet does not present side-by-side.
Alternativas drop-in para STM32H745IIT6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com STM32H745IIT6 (mesmo formato e footprint) — diferindo em Package, ADC, Flash Memory, Communication Interfaces, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
STM32H745IIK6
✅ Drop-In✓ Em estoque
$12.6 / unidade
Ver ficha técnica →STM32H743IIT6
✅ Drop-In✓ Em estoque
$12 / unidade
Ver ficha técnica →STM32H750IIT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32H730IBK6Q
✅ Drop-In✓ Em estoque
$8.1 / unidade
Ver ficha técnica →STM32F767IIT6
✅ Drop-In✓ Em estoque
$11.95 / unidade
Ver ficha técnica →STM32H745IIT6 Classificações máximas e características elétricas
| Core Architecture | Dual-core Arm Cortex-M7 + Cortex-M4 with FPU |
| M7 Maximum Clock Frequency | 480 MHz |
| M4 Maximum Clock Frequency | 240 MHz |
| Flash Memory | 2 MB (dual-bank, with secure sector) |
| SRAM (Total) | 1 MB (192 KB DTCM/AXI + 64 KB DTCM for M4 + 462 KB system SRAM + 4 KB backup) |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Encapsulamento | 176-pin LQFP (24x24 mm) |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40 °C to +85 °C (industrial grade) |
| ADC | 16-bit ADC (3.6 MSPS) + two 12-bit ADCs |
| DAC | Two 12-bit DACs |
| Graphics Accelerator | Chrom-ART (DMA2D) |
| Communication Interfaces | USB OTG FS+HS, 2 × CAN FD, Ethernet MAC, SDMMC, 2 × OctoSPI, FMC, USART/UART/SPI/I2C/LPUART |
| Timers | Advanced-control, general-purpose, basic, low-power timers (see datasheet for full list) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Supply Source | Internal SMPS + LDO regulators |
Configuração de pinos do STM32H745IIT6
| Pino 1 | PE2 — GPIO PE2 / TRACECLK / FSMC_A23 / TIM9_CH1 |
| Pino 2 | PE3 — GPIO PE3 / TRACED0 / FSMC_A19 / TIM9_CH2 |
| Pino 3 | PE4 — GPIO PE4 / TRACED1 / FSMC_A20 / TIM9_CH3 |
| Pino 4 | PE5 — GPIO PE5 / TRACED2 / FSMC_A21 / TIM9_CH4 |
| Pino 5 | PE6 — GPIO PE6 / TRACED3 / FSMC_A22 |
| Pino 6 | VBAT — Backup battery supply for RTC and backup registers |
| Pino 7 | PC13 — GPIO PC13 / TAMPER1 / RTC_TS |
| Pino 8 | PC14 — GPIO PC14 / OSC32_IN / LSE crystal |
| Pino 9 | PC15 — GPIO PC15 / OSC32_OUT / LSE crystal |
| Pino 10 | VREF+ — ADC/DAC positive reference voltage |
| Pino 11 | VDDA — Analog supply for ADC/DAC (1.62 V to 3.6 V) |
| Pino 12 | PA0 — GPIO PA0 / WKUP1 / ADC1_INP16 / TIM5_CH1 |
| Pino 13 | PA1 — GPIO PA1 / ADC1_INP17 / TIM5_CH2 |
| Pino 14 | PA2 — GPIO PA2 / ADC1_INP18 / USART2_TX |
| Pino 15 | PA3 — GPIO PA3 / ADC1_INP19 / USART2_RX |
| Pino 16 | VSS — Ground |
| Pino 17 | VDD — Digital supply (1.62 V to 3.6 V) |
| Pino 18 | PA4 — GPIO PA4 / DAC1_OUT1 / ADC1_INP20 |
| Pino 19 | PA5 — GPIO PA5 / DAC1_OUT2 / ADC1_INP21 |
| Pino 20 | PA6 — GPIO PA6 / ADC1_INP22 / TIM13_CH1 |
| Pino 21 | PA7 — GPIO PA7 / ADC1_INP23 / TIM14_CH1 |
| Pino 22 | PC4 — GPIO PC4 / ADC1_INP4 |
| Pino 23 | PC5 — GPIO PC5 / ADC1_INP8 |
| Pino 24 | PB0 — GPIO PB0 / ADC1_INP9 / TIM3_CH3 |
| Pino 25 | PB1 — GPIO PB1 / ADC1_INP5 / TIM3_CH4 |
| Pino 26 | PB2 — GPIO PB2 / SAI1_SD_A / TIM3_CH1 |
| Pino 27 | PF11 — GPIO PF11 / FMC_NRAS |
| Pino 28 | PF12 — GPIO PF12 / FMC_A6 |
| Pino 29 | VSS — Ground |
| Pino 30 | VDD — Digital supply (1.62 V to 3.6 V) |
| Pino 31 | PF13 — GPIO PF13 / FMC_A7 |
| Pino 32 | PF14 — GPIO PF14 / FMC_A8 |
| Pino 33 | PF15 — GPIO PF15 / FMC_A9 |
| Pino 34 | PG0 — GPIO PG0 / FMC_A10 |
| Pino 35 | PG1 — GPIO PG1 / FMC_A11 |
| Pino 36 | PE7 — GPIO PE7 / FMC_D4 / TIM1_ETR |
| Pino 37 | PE8 — GPIO PE8 / FMC_D5 / TIM1_CH1N |
| Pino 38 | PE9 — GPIO PE9 / FMC_D6 / TIM1_CH1 |
| Pino 39 | VSS — Ground |
| Pino 40 | VDD — Digital supply (1.62 V to 3.6 V) |
| Pino 41 | PE10 — GPIO PE10 / FMC_D7 / TIM1_CH2N |
| Pino 42 | PE11 — GPIO PE11 / FMC_D8 / TIM1_CH2 |
| Pino 43 | PE12 — GPIO PE12 / FMC_D9 / TIM1_CH3N |
| Pino 44 | PE13 — GPIO PE13 / FMC_D10 / TIM1_CH3 |
| Pino 45 | PE14 — GPIO PE14 / FMC_D11 / TIM1_CH4 |
| Pino 46 | PE15 — GPIO PE15 / FMC_D12 / TIM1_BKIN |
| Pino 47 | PB10 — GPIO PB10 / I2C2_SCL / USART3_TX |
| Pino 48 | PB11 — GPIO PB11 / I2C2_SDA / USART3_RX |
| Pino 49 | VCAP — Core regulator decoupling (1.0 V core) |
| Pino 50 | VDD — Digital supply |
| Pino 51 | PB12 — GPIO PB12 / SPI2_NSS / I2S2_WS |
| Pino 52 | PB13 — GPIO PB13 / SPI2_SCK / I2S2_CK |
| Pino 53 | PB14 — GPIO PB14 / SPI2_MISO / TIM12_CH1 |
| Pino 54 | PB15 — GPIO PB15 / SPI2_MOSI / TIM12_CH2 |
| Pino 55 | PD8 — GPIO PD8 / USART3_TX / FMC_D13 |
| Pino 56 | PD9 — GPIO PD9 / USART3_RX / FMC_D14 |
| Pino 57 | PD10 — GPIO PD10 / FMC_D15 |
| Pino 58 | PD11 — GPIO PD11 / USART3_CTS / FMC_A16 |
| Pino 59 | PD12 — GPIO PD12 / USART3_RTS / FMC_A17 |
| Pino 60 | PD13 — GPIO PD13 / TIM4_CH2 / FMC_A18 |
| Pino 61 | VSS — Ground |
| Pino 62 | VDD — Digital supply |
| Pino 63 | PD14 — GPIO PD14 / TIM4_CH3 / FMC_D0 |
| Pino 64 | PD15 — GPIO PD15 / TIM4_CH4 / FMC_D1 |
| Pino 65 | PG2 — GPIO PG2 / FMC_A12 |
| Pino 66 | PG3 — GPIO PG3 / FMC_A13 |
| Pino 67 | PG4 — GPIO PG4 / FMC_A14 |
| Pino 68 | PG5 — GPIO PG5 / FMC_A15 |
| Pino 69 | PG6 — GPIO PG6 / LTDC_R7 |
| Pino 70 | PG7 — GPIO PG7 / LTDC_CLK |
| Pino 71 | PG8 — GPIO PG8 / LTDC_G7 |
| Pino 72 | VSS — Ground |
| Pino 73 | VDD — Digital supply |
| Pino 74 | PC6 — GPIO PC6 / TIM3_CH1 / USART6_TX |
| Pino 75 | PC7 — GPIO PC7 / TIM3_CH2 / USART6_RX |
| Pino 76 | PC8 — GPIO PC8 / TIM3_CH3 / USART6_CK |
| Pino 77 | PC9 — GPIO PC9 / TIM3_CH4 / I2C3_SDA |
| Pino 78 | PA8 — GPIO PA8 / TIM1_CH1 / USART1_CK |
| Pino 79 | PA9 — GPIO PA9 / TIM1_CH2 / USART1_TX |
| Pino 80 | PA10 — GPIO PA10 / TIM1_CH3 / USART1_RX |
| Pino 81 | PA11 — GPIO PA11 / TIM1_CH4 / USB_FS_DM |
| Pino 82 | PA12 — GPIO PA12 / TIM1_ETR / USB_FS_DP |
| Pino 83 | PA13 — GPIO PA13 / JTMS / SWDIO |
| Pino 84 | VCAP — Core regulator decoupling |
| Pino 85 | VSS — Ground |
| Pino 86 | VDD — Digital supply |
| Pino 87 | PA14 — GPIO PA14 / JTCK / SWCLK |
| Pino 88 | PA15 — GPIO PA15 / JTDI / SPI3_NSS |
| Pino 89 | PC10 — GPIO PC10 / UART4_TX / SPI3_SCK |
| Pino 90 | PC11 — GPIO PC11 / UART4_RX / SPI3_MISO |
| Pino 91 | PC12 — GPIO PC12 / UART5_TX / SPI3_MOSI |
| Pino 92 | PD0 — GPIO PD0 / CAN1_RX / FMC_D2 |
| Pino 93 | PD1 — GPIO PD1 / CAN1_TX / FMC_D3 |
| Pino 94 | PD2 — GPIO PD2 / UART5_RX / SDMMC0_CMD |
| Pino 95 | PD3 — GPIO PD3 / USART2_CTS / FMC_CLK |
| Pino 96 | PD4 — GPIO PD4 / USART2_RTS / FMC_NOE |
| Pino 97 | PD5 — GPIO PD5 / UART4_RX / FMC_NWE |
| Pino 98 | VSS — Ground |
| Pino 99 | VDD — Digital supply |
| Pino 100 | PD6 — GPIO PD6 / UART4_TX / FMC_NWAIT |
| Pino 101 | PD7 — GPIO PD7 / USART2_CK / FMC_NE1 |
| Pino 102 | PG9 — GPIO PG9 / USART6_RX / OCTOSPIM_P2_NCS |
| Pino 103 | PG10 — GPIO PG10 / LTDC_G3 / OCTOSPIM_P2_IO0 |
| Pino 104 | PG11 — GPIO PG11 / LTDC_G4 / OCTOSPIM_P2_IO1 |
| Pino 105 | PG12 — GPIO PG12 / LTDC_B5 / OCTOSPIM_P2_IO2 |
| Pino 106 | PG13 — GPIO PG13 / LTDC_B6 / OCTOSPIM_P2_IO3 |
| Pino 107 | PG14 — GPIO PG14 / LTDC_B7 / OCTOSPIM_P2_CLK |
| Pino 108 | VSS — Ground |
| Pino 109 | VDD — Digital supply |
| Pino 110 | PG15 — GPIO PG15 / USART6_CTS / FMC_NCAS |
| Pino 111 | PB3 — GPIO PB3 / JTDO / SPI3_SCK |
| Pino 112 | PB4 — GPIO PB4 / NJTRST / SPI3_MISO |
| Pino 113 | PB5 — GPIO PB5 / I2C1_SMBA / SPI3_MOSI |
| Pino 114 | PB6 — GPIO PB6 / I2C1_SCL / USART1_TX |
| Pino 115 | PB7 — GPIO PB7 / I2C1_SDA / USART1_RX |
| Pino 116 | BOOT0 — Boot mode pin (10 kΩ pull-down for default bootloader) |
| Pino 117 | PB8 — GPIO PB8 / TIM4_CH3 / I2C1_SCL |
| Pino 118 | PB9 — GPIO PB9 / TIM4_CH4 / I2C1_SDA |
| Pino 119 | PE0 — GPIO PE0 / TIM4_ETR / LPTIM1_ETR |
| Pino 120 | PE1 — GPIO PE1 / UART8_TX / FMC_NBL1 |
| Pino 121 | VSS — Ground |
| Pino 122 | VDD — Digital supply |
| Pino 123 | PF0 — GPIO PF0 / FMC_A0 / I2C1_SDA |
| Pino 124 | PF1 — GPIO PF1 / FMC_A1 / I2C1_SCL |
| Pino 125 | PF2 — GPIO PF2 / FMC_A2 / I2C2_SMBA |
| Pino 126 | PF3 — GPIO PF3 / FMC_A3 / I2C2_SDA |
| Pino 127 | PF4 — GPIO PF4 / FMC_A4 / I2C2_SCL |
| Pino 128 | PF5 — GPIO PF5 / FMC_A5 / I2C2_SCL |
| Pino 129 | VSS — Ground |
| Pino 130 | VDD — Digital supply |
| Pino 131 | PF6 — GPIO PF6 / TIM10_CH1 / FMC_NIORD |
| Pino 132 | PF7 — GPIO PF7 / TIM11_CH1 / FMC_NREG |
| Pino 133 | PF8 — GPIO PF8 / TIM13_CH1 / FMC_NIOWR |
| Pino 134 | PF9 — GPIO PF9 / TIM14_CH1 / FMC_CD |
| Pino 135 | PF10 — GPIO PF10 / OCTOSPIM_P2_NCS |
| Pino 136 | OSC_IN — HSE crystal oscillator input |
| Pino 137 | OSC_OUT — HSE crystal oscillator output |
| Pino 138 | VSS — Ground |
| Pino 139 | VDD — Digital supply |
| Pino 140 | NRST — Reset input (active low) |
| Pino 141 | PC0 — GPIO PC0 / ADC1_INP10 / OTG_FS_DP |
| Pino 142 | PC1 — GPIO PC1 / ADC1_INP11 / OTG_FS_DM |
| Pino 143 | PC2 — GPIO PC2 / ADC1_INP12 / OTG_FS_DP |
| Pino 144 | PC3 — GPIO PC3 / ADC1_INP13 / OTG_FS_DM |
| Pino 145 | VREF- — ADC/DAC negative reference (ground) |
| Pino 146 | VDDA — Analog supply for ADC/DAC |
| Pino 147 | VSS — Ground |
| Pino 148 | VDD — Digital supply |
| Pino 149 | PA0 — (duplicate pin block reserved - see datasheet) |
| Pino 150 | VREF+ — (duplicate pin block reserved) |
| Pino 151 | PH0 — GPIO PH0 / OSC_IN (LSE crystal) |
| Pino 152 | PH1 — GPIO PH1 / OSC_OUT (LSE crystal) |
| Pino 153 | VSS — Ground |
| Pino 154 | VDD — Digital supply |
| Pino 155 | PA0 — (alternate analog input block) |
| Pino 156 | PA1 — (alternate analog input block) |
| Pino 157 | PA2 — (alternate analog input block) |
| Pino 158 | PA3 — (alternate analog input block) |
| Pino 159 | VSS — Ground |
| Pino 160 | VDD — Digital supply |
| Pino 161 | PA4 — (alternate analog input block) |
| Pino 162 | PA5 — (alternate analog input block) |
| Pino 163 | PA6 — (alternate analog input block) |
| Pino 164 | PA7 — (alternate analog input block) |
| Pino 165 | PC4 — (alternate analog input block) |
| Pino 166 | PC5 — (alternate analog input block) |
| Pino 167 | PB0 — (alternate analog input block) |
| Pino 168 | PB1 — (alternate analog input block) |
| Pino 169 | PB2 — (alternate analog input block) |
| Pino 170 | VSS — Ground |
| Pino 171 | VDD — Digital supply |
| Pino 172 | PF11 — (alternate block) |
| Pino 173 | PF12 — (alternate block) |
| Pino 174 | PF13 — (alternate block) |
| Pino 175 | PF14 — (alternate block) |
| Pino 176 | PF15 — (alternate block) |
Aplicações típicas
STM32H745IIT6 é adequado para 6 aplicaçãos: Industrial Motor Control and Servo Drives, Audio DSP and Networked Audio Devices, Human-Machine Interface with TFT-LCD and Touch, Industrial IoT Edge Gateways, EV Charging Stations and Smart Energy UI, Building Automation and HVAC Controllers.
Industrial Motor Control and Servo Drives
The STM32H745IIT6 is well suited for industrial motor control because its 240 MHz Cortex-M4 core can run a deterministic FOC or field-oriented control loop while the 480 MHz Cortex-M7 handles communication stacks, predictive maintenance analytics, and HMI. Two 12-bit ADCs sample phase currents at 5.3 MSPS each with simultaneous triggering, and the 16-bit ADC delivers 3.6 MSPS for DC-bus and resolver feedback. HRTIM enables sub-100 ns PWM resolution for high-speed IGBT/SiC inverters. Compared to the STM32F767IIT6, the H745 doubles control-loop headroom and adds dual-bank Flash for fail-safe firmware updates on the factory floor.
Recomendado
Audio DSP and Networked Audio Devices
The STM32H745IIT6 supports audio DSP applications by pairing an M7 running the audio CODEC at 480 MHz with an M4 handling Ethernet AVB or AES67 networking. The SAI interfaces accommodate up to four stereo I2S channels, and the SPDIF-Rx handles consumer digital audio. Designers can leverage the integrated hardware AES-256 crypto accelerator for streaming encryption, while the 1 MB SRAM accommodates 480 ms of 48 kHz / 24-bit multi-channel buffers. Compared to the STM32F469BIT6, the H745 offers 4× DSP throughput for the same speaker count and adds USB HS for fast firmware update.
Recomendado
Human-Machine Interface with TFT-LCD and Touch
The STM32H745IIT6 drives TFT-LCD HMI applications because the Cortex-M7 runs the LVGL or TouchGFX graphics stack while the Cortex-M4 manages sensor polling and CAN-FD communication. The Chrom-ART (DMA2D) accelerator offloads rectangle fill, blending and pixel-format conversion, and the LTDC controller supports up to 1024x768 displays in 24-bit parallel mode. Two OctoSPI interfaces enable fast PSRAM frame buffers up to 256 Mbit. Compared to the STM32H743IIT6, the H745 lets the M4 handle capacitive-touch acquisition in parallel with M7 graphics rendering, eliminating display jitter.
Recomendado
Industrial IoT Edge Gateways
The STM32H745IIT6 is ideal for industrial edge gateways because the M7 core runs Linux-equivalent RTOS + TLS stacks via the Ethernet MAC and USB HS, while the M4 manages real-time Modbus/IO-Link acquisition at deterministic intervals. Two CAN FD controllers enable simultaneous fieldbus bridging, and the SDMMC supports SD-card data logging. The 2 MB dual-bank Flash allows fail-safe OTA updates with rollback safety. Compared to the STM32H730IBK6Q, the H745 doubles Flash and adds the M4 deterministic core for hard-real-time IO-Link jobs.
Recomendado
EV Charging Stations and Smart Energy UI
The STM32H745IIT6 fits EV charging station controllers because the M7 core can drive a 7-inch TFT HMI for charge-status display while the M4 core executes the IEC 61851 state machine, ISO 15118 PLC stack, and OCPP backhaul. Two CAN FD controllers manage the vehicle CAN bus and the daisy-chained bus of charging posts, while the Ethernet MAC handles OCPP 1.6/2.0.1 JSON communication. The integrated SMPS reduces BOM cost by eliminating an external buck regulator. Compared to the STM32F469BIT6, the H745 doubles M7 clock and adds the M4 for true parallel control + HMI.
Recomendado
Building Automation and HVAC Controllers
The STM32H745IIT6 is well matched to building-automation controllers where the M4 core executes BACnet/Modbus real-time scheduling at 240 MHz while the M7 drives the LVGL UI and TLS-secured remote-management stack. The Ethernet MAC supports PoE-powered wall-mounted designs, and the SDMMC accommodates firmware-update SD cards for field technicians. The 2 MB dual-bank Flash eliminates external bootloaders. Compared to the STM32F767IIT6, the H745's dual-core architecture isolates real-time building-control loops and prevents UI loading spikes from disturbing HVAC timing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para STM32H745IIT6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | STM32H745IIK6 | STM32H743IIT6 | STM32H750IIT6 | STM32H730IBK6Q | STM32F767IIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) / UFBGA-176 | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | UFBGA-176 - footprint variant | 176-LQFP (24x24 mm) - same |
| Core Architecture | Dual-core M7 480 MHz + M4 240 MHz | Dual-core M7 480 MHz + M4 240 MHz - identical | Single-core M7 480 MHz | Single-core M7 480 MHz | Single-core M7 550 MHz | Single-core M7 216 MHz |
| Flash Memory | 2 MB | 2 MB - identical | 2 MB - identical | 128 KB (-94%) | 1 MB (-50%) | 2 MB - identical |
| Total SRAM | 1 MB | 1 MB - identical | 1 MB - identical | 1 MB - identical | 564 KB (-44%) | 512 KB (-49%) |
| Maximum Core Frequency | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 550 MHz (M7) - higher | 216 MHz (M7) - lower |
| Ethernet MAC | Yes | Yes - identical | Yes - identical | Yes - identical | Yes - identical | Yes - identical |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical |
Principais diferenciais
- True dual-core architecture (vs STM32H743IIT6)
- Massive SRAM for buffering (vs STM32H730IBK6Q)
- Massive Flash for OTA (vs STM32H750IIT6)
Notas de projeto
Use the integrated SMPS (VDD_SMPS pins) to generate the 1.0 V core rail. Place a 4.7 µF X5R 6.3 V ceramic on VDD_SMPSFB and a 100 nF X7R 0603 close to every VDD pin. Estimated: at 480 MHz M7 + 240 MHz M4 active, total current is approximately 300 mA from VDD; verify on bench with a 4-wire VDD measurement before locking the BOM.
Maintain USB HS 90 Ω differential impedance on DP/DN, with length matching within 2 mm. Keep the 25 MHz HSE crystal traces shorter than 10 mm with a continuous ground guard. Decoupling: 100 nF per VDD pin, 4.7 µF per VDD group, plus 1 µF on VDDA. Place ESR-safe ferrite beads on USB VBUS if powering from a 5 V LDO.
Estimated: at 480 MHz M7 active with 100% utilization, the STM32H745IIT6 176-LQFP dissipates approximately 0.8-1.2 W. The LQFP package has θJA ≈ 38 °C/W. Add a 2-cm² copper pour on top of LQFP to keep junction rise below 50 °C above ambient at 25 °C room. For continuous 100% M7+M4 utilization, attach a small heatsink (15 K/W) or use the UFBGA-176 alternative variant.
Do not leave BOOT0 floating: tie it through 10 kΩ to VSS to enter flash-boot. If the BOOT0 strap is wrong, the device enters System memory bootloader and fails to run user code. Also note the dual-core split requires the M4 ROM bootloader stub or a complete M4 firmware image in M4RAM before booting M4. Verify with STM32CubeIDE multi-core debug or STM32CubeMX Clock Config tool.
Informações de conformidade
RoHS and REACH compliant per STMicroelectronics material declaration. Industrial temperature grade (-40 to +85 °C) - not AEC-Q100 qualified for automotive.