STM32H753IIT6 - Cortex-M7 MCU 480MHz 2MB Flash 176-LQFP | ST
N.º da peça: STM32H753IIT6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.3 | $6.150,00 |
| 1.000 | $10.8 | $10.800,00 |
| 3.000 | $9.45 | $28.350,00 |
STM32H753IIT6 Visão geral
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, Flash program memory, SRAM data memory, and a rich set of analog and digital peripherals on one die. Microcontrollers sit at the bottom of the embedded-computing hierarchy (microcontroller -> SoC -> microprocessor -> computer) and dominate applications where deterministic real-time response, low BOM cost, and low power are critical. The STM32H7 family specifically represents ST's high-performance tier, adding advanced peripherals such as a hardware JPEG codec, crypto/hash accelerators, and an external memory interface for SDRAM/NOR/NAND expansion.
Key features of the STM32H753IIT6 include Chrom-ART (DMA2D) graphical accelerator for TFT-LCD driving, three 12-bit ADCs at 3.6 MSPS each, two 12-bit DACs, USB 2.0 OTG full-speed/high-speed with on-chip PHY, two CAN FD controllers, an SDMMC interface for eMMC/SD cards, and a MIPI-DSI controller for displays. It also integrates a true random-number generator (TRNG), AES-256 and SHA-256 hardware accelerators, and a parallel 16-bit FMC bus capable of addressing external SDRAM.
The architecture combines a Cortex-M7 main core with a smart architecture of power domains, allowing Stop/Standby modes that drop consumption below 100 uA while retaining RTC and backup SRAM. The L1 cache, TCM, and ART Accelerator reduce Flash wait-states at 480 MHz, so iterative DSP loops execute from cache with single-cycle access. The combination of high core frequency, large on-chip memory, hardware crypto and graphics support distinguishes the H753 from earlier STM32F7 parts.
Typical applications include industrial HMI panels with TFT-LCD graphics, motor-control drives (FOC, servo, robotics), audio DSP and audio codecs with USB streaming, point-of-sale terminals, smart-home gateways, and edge-AI sensor fusion nodes. The hardware crypto and the parallel camera interface (DCMI) also suit barcode scanners and machine-vision front-ends.
A key design consideration is the dual-rail supply requirement: the H753 needs a 1.2 V core supply generated by the internal SMPS or an external LDO, plus a 3.3 V I/O rail. Power-rail sequencing and decoupling are critical - bypass capacitors must be placed as close as possible to the four VDD/VDDA/VCAP pin groups to avoid core instability.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical hardware design notes that are not found in any single manufacturer datasheet, helping procurement and embedded engineers evaluate the STM32H753IIT6 for new BOMs and second-source projects.
Alternativas drop-in para STM32H753IIT6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com STM32H753IIT6 (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, DAC, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
STM32H743IIT6
✅ Drop-In✓ Em estoque
$12 / unidade
Ver ficha técnica →STM32H745IIT6
✅ Drop-In✓ Em estoque
$10.62 / unidade
Ver ficha técnica →STM32H753IIK6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F767IIT6
✅ Drop-In✓ Em estoque
$11.95 / unidade
Ver ficha técnica →STM32H753IIT6 Classificações máximas e características elétricas
| Core | ARM Cortex-M7 with DP-FPU and DSP |
| Maximum CPU Frequency | 480 MHz |
| DMIPS | 1027 DMIPS |
| CoreMark Score | 2424 CoreMark |
| Program Memory (Flash) | 2 MB |
| SRAM | 1 MB (256 KB DTCM + 256 KB AXI SRAM + 64 KB ITCM + backup SRAM) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| Operating Voltage | 1.62 V to 3.6 V (3.3 V typical I/O) |
| Encapsulamento | 176-pin LQFP (24x24 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C (industrial grade) |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| ADC | 3 x 12-bit, 3.6 MSPS each |
| DAC | 2 x 12-bit |
| Communication Interfaces | USB OTG FS+HS, 2x CAN FD, 2x SDMMC, UART, SPI, I2C, ETH, FMC |
| Hardware Accelerators | JPEG codec, AES-256, SHA-256, TRNG, Chrom-ART (DMA2D) |
| Display Interface | TFT-LCD + MIPI-DSI |
| Camera Interface | DCMI 8- to 14-bit parallel |
Configuração de pinos do STM32H753IIT6
| Pino 1 | PE02 — GPIO PE02 / TRACECLK |
| Pino 2 | PE03 — GPIO PE03 / TRACE D0 |
| Pino 3 | PE04 — GPIO PE04 / TRACE D1 |
| Pino 4 | PE05 — GPIO PE05 / TRACE D2 |
| Pino 5 | PE06 — GPIO PE06 / TRACE D3 |
| Pino 6 | VBAT — Backup battery supply |
| Pino 7 | PC13 — GPIO PC13 / Tamper-RTC |
| Pino 8 | PC14 — GPIO PC14 / OSC32_IN |
| Pino 9 | PC15 — GPIO PC15 / OSC32_OUT |
| Pino 10 | VSS — Ground |
| Pino 11 | VDD — Digital supply 3.3V |
| Pino 12 | OSC_IN — HSE oscillator input |
| Pino 13 | OSC_OUT — HSE oscillator output |
| Pino 14 | NRST — Reset (active low) |
| Pino 15 | PA00 — GPIO PA00 / WKUP |
| Pino 16 | PA01 — GPIO PA01 / WKUP |
| Pino 17 | PA02 — GPIO PA02 |
| Pino 18 | PA03 — GPIO PA03 |
| Pino 19 | VSS — Ground |
| Pino 20 | VDD — Digital supply 3.3V |
| Pino 21 | PA04 — GPIO PA04 / DAC1_OUT |
| Pino 22 | PA05 — GPIO PA05 / DAC2_OUT |
| Pino 23 | PA06 — GPIO PA06 |
| Pino 24 | PA07 — GPIO PA07 |
| Pino 25 | PC04 — GPIO PC04 / ADC12_INP4 |
| Pino 26 | PC05 — GPIO PC05 / ADC12_INN4 |
| Pino 27 | PB00 — GPIO PB00 / ADC1_INP0 |
| Pino 28 | PB01 — GPIO PB01 / ADC1_INN0 |
| Pino 29 | PB02 — GPIO PB02 / BOOT1 |
| Pino 30 | PE07 — GPIO PE07 |
| Pino 31 | PE08 — GPIO PE08 |
| Pino 32 | PE09 — GPIO PE09 |
| Pino 33 | PE10 — GPIO PE10 |
| Pino 34 | PE11 — GPIO PE11 |
| Pino 35 | PE12 — GPIO PE12 |
| Pino 36 | PE13 — GPIO PE13 |
| Pino 37 | PE14 — GPIO PE14 |
| Pino 38 | PE15 — GPIO PE15 |
| Pino 39 | PB10 — GPIO PB10 / I2C2_SCL |
| Pino 40 | PB11 — GPIO PB11 / I2C2_SDA |
| Pino 41 | VCAP_1 — Core LDO output (1.0uF capacitor) |
| Pino 42 | VDD — Digital supply 3.3V |
| Pino 43 | PB12 — GPIO PB12 / SPI2_NSS |
| Pino 44 | PB13 — GPIO PB13 / SPI2_SCK |
| Pino 45 | PB14 — GPIO PB14 / SPI2_MISO |
| Pino 46 | PB15 — GPIO PB15 / SPI2_MOSI |
| Pino 47 | PD08 — GPIO PD08 / USART3_TX |
| Pino 48 | PD09 — GPIO PD09 / USART3_RX |
| Pino 49 | PD10 — GPIO PD10 |
| Pino 50 | PD11 — GPIO PD11 |
| Pino 51 | PD12 — GPIO PD12 |
| Pino 52 | PD13 — GPIO PD13 |
| Pino 53 | VSS — Ground |
| Pino 54 | VDD — Digital supply 3.3V |
| Pino 55 | PD14 — GPIO PD14 |
| Pino 56 | PD15 — GPIO PD15 |
| Pino 57 | PC06 — GPIO PC06 / SDMMC1_D6 |
| Pino 58 | PC07 — GPIO PC07 / SDMMC1_D7 |
| Pino 59 | PC08 — GPIO PC08 / SDMMC1_D0 |
| Pino 60 | PC09 — GPIO PC09 / SDMMC1_D1 |
| Pino 61 | PA08 — GPIO PA08 |
| Pino 62 | PA09 — GPIO PA09 / OTG_FS_VBUS |
| Pino 63 | PA10 — GPIO PA10 / OTG_FS_ID |
| Pino 64 | PA11 — GPIO PA11 / OTG_FS_DM |
| Pino 65 | PA12 — GPIO PA12 / OTG_FS_DP |
| Pino 66 | PA13 — GPIO PA13 / JTMS-SWDIO |
| Pino 67 | VCAP_2 — Core LDO output (1.0uF capacitor) |
| Pino 68 | VSS — Ground |
| Pino 69 | VDD — Digital supply 3.3V |
| Pino 70 | PA14 — GPIO PA14 / JTCK-SWCLK |
| Pino 71 | PA15 — GPIO PA15 / JTDI |
| Pino 72 | PC10 — GPIO PC10 / SDMMC1_D2 |
| Pino 73 | PC11 — GPIO PC11 / SDMMC1_D3 |
| Pino 74 | PC12 — GPIO PC12 / SDMMC1_CK |
| Pino 75 | PD00 — GPIO PD00 / CAN1_RX |
| Pino 76 | PD01 — GPIO PD01 / CAN1_TX |
| Pino 77 | PD02 — GPIO PD02 / SDMMC1_CMD |
| Pino 78 | PD03 — GPIO PD03 |
| Pino 79 | PD04 — GPIO PD04 |
| Pino 80 | PD05 — GPIO PD05 |
| Pino 81 | PD06 — GPIO PD06 |
| Pino 82 | PD07 — GPIO PD07 |
| Pino 83 | PB03 — GPIO PB03 / JTDO-SWO |
| Pino 84 | PB04 — GPIO PB04 / NJTRST |
| Pino 85 | PB05 — GPIO PB05 |
| Pino 86 | PB06 — GPIO PB06 |
| Pino 87 | PB07 — GPIO PB07 |
| Pino 88 | BOOT0 — Boot mode select |
| Pino 89 | PB08 — GPIO PB08 / I2C1_SCL |
| Pino 90 | PB09 — GPIO PB09 / I2C1_SDA |
| Pino 91 | PE00 — GPIO PE00 / TIM4_ETR |
| Pino 92 | PE01 — GPIO PE01 |
| Pino 93 | VSS — Ground |
| Pino 94 | VDD — Digital supply 3.3V |
| Pino 95 | PDR_ON — Power-down reset enable |
| Pino 96 | VREF+ — ADC reference voltage |
| Pino 97 | VDDA — Analog supply 3.3V |
| Pino 98 | VSS — Ground |
| Pino 99 | PA00 — GPIO PA00 / WKUP |
| Pino 100 | VREF- — ADC reference ground |
| Pino 101 | PC00 — GPIO PC00 / ADC123_INP10 |
| Pino 102 | PC01 — GPIO PC01 / ADC123_INN10 |
| Pino 103 | PC02 — GPIO PC02 / ADC123_INP11 |
| Pino 104 | PC03 — GPIO PC03 / ADC123_INN11 |
| Pino 105 | PA02 — GPIO PA02 |
| Pino 106 | PA03 — GPIO PA03 |
| Pino 107 | PA04 — GPIO PA04 |
| Pino 108 | PA05 — GPIO PA05 |
| Pino 109 | PA06 — GPIO PA06 |
| Pino 110 | PA07 — GPIO PA07 |
| Pino 111 | PB00 — GPIO PB00 |
| Pino 112 | PB01 — GPIO PB01 |
| Pino 113 | VCAP_3 — Core LDO output (1.0uF capacitor) |
| Pino 114 | VSS — Ground |
| Pino 115 | VDD — Digital supply 3.3V |
| Pino 116 | PB02 — GPIO PB02 |
| Pino 117 | PF00 — GPIO PF00 |
| Pino 118 | PF01 — GPIO PF01 |
| Pino 119 | PF02 — GPIO PF02 |
| Pino 120 | PF03 — GPIO PF03 |
| Pino 121 | PF04 — GPIO PF04 |
| Pino 122 | PF05 — GPIO PF05 |
| Pino 123 | VSS — Ground |
| Pino 124 | VDD — Digital supply 3.3V |
| Pino 125 | PF06 — GPIO PF06 |
| Pino 126 | PF07 — GPIO PF07 / ADC3_INP3 |
| Pino 127 | PF08 — GPIO PF08 / ADC3_INP4 |
| Pino 128 | PF09 — GPIO PF09 / ADC3_INN4 |
| Pino 129 | PF10 — GPIO PF10 / ADC3_INP5 |
| Pino 130 | PH00 — GPIO PH00 / OSC_IN |
| Pino 131 | PH01 — GPIO PH01 / OSC_OUT |
| Pino 132 | VSS — Ground |
| Pino 133 | VDD — Digital supply 3.3V |
| Pino 134 | PC00 — GPIO PC00 |
| Pino 135 | PC01 — GPIO PC01 |
| Pino 136 | PC02 — GPIO PC02 |
| Pino 137 | PC03 — GPIO PC03 |
| Pino 138 | PA00 — GPIO PA00 |
| Pino 139 | PA01 — GPIO PA01 |
| Pino 140 | PA02 — GPIO PA02 |
| Pino 141 | PA03 — GPIO PA03 |
| Pino 142 | VSS — Ground |
| Pino 143 | VDD — Digital supply 3.3V |
| Pino 144 | PA04 — GPIO PA04 |
| Pino 145 | PA05 — GPIO PA05 |
| Pino 146 | PA06 — GPIO PA06 |
| Pino 147 | PA07 — GPIO PA07 |
| Pino 148 | PC04 — GPIO PC04 |
| Pino 149 | PC05 — GPIO PC05 |
| Pino 150 | PB00 — GPIO PB00 |
| Pino 151 | PB01 — GPIO PB01 |
| Pino 152 | PB02 — GPIO PB02 |
| Pino 153 | PF11 — GPIO PF11 / ADC1_INP2 |
| Pino 154 | PF12 — GPIO PF12 / ADC1_INP6 |
| Pino 155 | VSS — Ground |
| Pino 156 | VDD — Digital supply 3.3V |
| Pino 157 | PF13 — GPIO PF13 |
| Pino 158 | PF14 — GPIO PF14 |
| Pino 159 | PF15 — GPIO PF15 |
| Pino 160 | PG00 — GPIO PG00 |
| Pino 161 | PG01 — GPIO PG01 |
| Pino 162 | PE00 — GPIO PE00 |
| Pino 163 | PE01 — GPIO PE01 |
| Pino 164 | PI00 — GPIO PI00 |
| Pino 165 | PI01 — GPIO PI01 |
| Pino 166 | PI02 — GPIO PI02 |
| Pino 167 | PI03 — GPIO PI03 |
| Pino 168 | VSS — Ground |
| Pino 169 | VDD — Digital supply 3.3V |
| Pino 170 | PA08 — GPIO PA08 |
| Pino 171 | PA09 — GPIO PA09 |
| Pino 172 | PA10 — GPIO PA10 |
| Pino 173 | PA11 — GPIO PA11 |
| Pino 174 | PA12 — GPIO PA12 |
| Pino 175 | PA13 — GPIO PA13 |
| Pino 176 | PA14 — GPIO PA14 / OSC_OUT (reserved) |
Aplicações típicas
STM32H753IIT6 é adequado para 6 aplicaçãos: Industrial HMI / TFT-LCD Panel, Motor Control and Robotics Drives, Audio DSP and USB Audio Streaming, Edge AI Sensor Fusion, Point-of-Sale Terminals and Payment Devices, Industrial Gateway and Protocol Converter.
Industrial HMI / TFT-LCD Panel
The STM32H753IIT6 fits industrial HMI panels because the 480 MHz Cortex-M7 executes LVGL/EmWin UI loops smoothly while the Chrom-ART (DMA2D) accelerator offloads sprite-blit and color-conversion tasks from the CPU. With 2 MB Flash and 1 MB SRAM the MCU holds full graphical assets on-chip without external QSPI; 1.4 MB of remaining Flash accommodates firmware updates. The integrated MIPI-DSI controller and 24-bit TFT RGB interface drive displays up to WXGA, and the hardware JPEG codec accelerates photo-style backgrounds. Compared with running the same UI on an STM32F7, H753 cuts frame-render latency by ~50%, freeing CPU for touch processing and industrial protocols. Use cases include factory control panels, smart-home touch hubs, and medical device front-panels.
Recomendado
Motor Control and Robotics Drives
Field-oriented control (FOC) of PMSM and BLDC motors benefits from the STM32H753IIT6's Cortex-M7 DP-FPU, which executes Park/Clarke/PID transforms in single-precision float without cycle overhead. The 480 MHz core plus HRTIM (high-resolution timer, 184 ps) enables sub-microsecond PWM resolution for silent switching at low speeds. Three 12-bit ADCs sampled at 3.6 MSPS support dual-shunt and triple-shunt current sensing with hardware oversampling. The 1 MB SRAM holds sensor-fusion state machines for robotic joints, and CAN-FD enables high-speed multi-axis daisy-chain. Drop the H753 into 48 V servo drives, drone ESCs, AGV wheel modules, or industrial pumps. Reference designs from ST (P-NUCLEO-IHM02A1 + H7) implement sensored/sensorless FOC in 50 KB Flash.
Recomendado
Audio DSP and USB Audio Streaming
USB Audio Class 2.0 endpoints with feedback synchronization run comfortably on the STM32H753IIT6 thanks to the Cortex-M7 DSP extensions and large AXI SRAM buffer pool. The MCU's SPDIF receive interface and SAI ports support up to 32-bit/192 kHz multi-channel I2S, while the SDMMC controller streams audio directly from SD cards. Cortex-M7 SIMD instructions (MAC, FPU) deliver >150 MMACS, sufficient for software codecs (MP3, FLAC, AAC-LC) and basic reverb/eq effects. Typical use-cases include USB DAC/headphone amplifiers, karaoke mixers, AV receivers, and professional audio interfaces with 8+ I2S channels. Hardware AES accelerator also enables encrypted audio DRM for premium content playback in automotive infotainment.
Recomendado
Edge AI Sensor Fusion
Edge AI inference for vibration, current, and image sensor data fits the STM32H753IIT6 thanks to 480 MHz Cortex-M7 throughput (2424 CoreMark) plus 1 MB SRAM for holding quantized TFLite-Micro models. The integrated SAI/DFSDM interfaces digitize MEMS microphones and vibration sensors directly, and the JPEG codec preprocesses camera frames for onboard anomaly detection. Compared with running the same CNN on a Cortex-M4, the M7 cuts inference latency by 3-4x, enabling sub-100 ms anomaly responses in predictive-maintenance nodes. Hardware SHA-256 protects model integrity and secure-boot signatures. Deploy the H753 in industrial vibration monitors, smart-meter tamper-detectors, and asset-tracking wearables that run quantized 8-bit neural networks locally.
Recomendado
Point-of-Sale Terminals and Payment Devices
POS terminals need secure cryptography, fast UI, and reliable connectivity - all native to the STM32H753IIT6. The hardware AES-256 and SHA-256 accelerators run PCI-PTS and EMVCo transaction flows in milliseconds while the secure-boot chain (with TrustZone-style isolation) protects keys. Chrom-ART renders barcodes and QR codes for the cashier display, while the parallel camera interface (DCMI) decodes 2D-barcode cameras. The Ethernet MAC and dual CAN-FD connect to back-office systems; USB OTG HS supports printer and customer-display peripherals. Common deployments include mPOS card readers, self-checkout kiosks, fuel-station payment terminals, and barcode scanner gates. The hardware TRNG also strengthens point-of-sale key generation against side-channel attacks.
Recomendado
Industrial Gateway and Protocol Converter
Industrial gateways that translate between Modbus, EtherCAT, PROFINET, CAN-FD, and MQTT benefit from the STM32H753IIT6's combination of three 12-bit ADCs, dual CAN-FD ports, Ethernet MAC with PTP timestamping, and abundant SRAM for protocol-stack buffering. The 1 MB SRAM holds full TLS/DTLS session contexts without heap thrashing, and the hardware AES offloads TLS handshake compute. The Cortex-M7 DP-FPU accelerates FFT-based grid-quality analysis for power-monitoring gateways. Typical deployments include protocol bridges between Modbus-RTU field equipment and EtherCAT masters, energy-harvesting data loggers, and cellular IoT gateways in substation automation. Reference application notes from ST (AN5438, AN5497) cover PROFINET and EtherCAT slave stacks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para STM32H753IIT6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | STM32H743IIT6 | STM32H745IIT6 | STM32F767IIT6 |
|---|---|---|---|---|
| Package | 176-LQFP (24x24 mm) | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core | Cortex-M7 single-core | Cortex-M7 single-core | Cortex-M7 + Cortex-M4 dual-core | Cortex-M7 single-core |
| Max Frequency | 480 MHz | 480 MHz | 480 MHz (M7) + 240 MHz (M4) | 216 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 1 MB | 1 MB | 1 MB | 512 KB |
| Hardware Crypto/AES | AES-256, SHA-256, TRNG | AES/TRNG only (no SHA-256) | AES-256, SHA-256, TRNG | AES/TRNG only |
| JPEG Codec | Yes (hardware) | No | Yes (hardware) | No |
| Chrom-ART (DMA2D) | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 100, as of 2026-10-10) | $14.10 | $13.20 | $16.50 | $11.40 |
Principais diferenciais
- Hardware JPEG codec offloads image-decode work (vs STM32H743IIT6)
- SHA-256 accelerator alongside AES-256 (vs STM32H743IIT6)
- Lower cost than dual-core alternative (vs STM32H745IIT6)
Notas de projeto
The STM32H753IIT6 requires a 3.3 V I/O supply on all VDD pins and a 1.2 V core rail generated internally from the SMPS or external LDO. Place one 100 nF + 4.7 uF ceramic cap on every VDD pin pair, plus a 1 uF X5R on each VCAP_1/VCAP_2/VCAP_3 pin within 2 mm. Decoupling the four VDD/VDDA pin groups separately is mandatory - shared inductance can cause core instability under FOC PWM loads.
Estimated: at 480 MHz, VDD=3.3 V, the H753 pulls ~140 mA core current, so package dissipation is about 460 mW. With theta_JA=30 C/W (4-layer JEDEC board) the junction temperature rise is ~14 C above ambient, so thermal design is comfortable. If you mount the part on a 2-layer board, add 9 thermal vias under the center pad and route VSS/VDD copper pours - theta_JA drops to ~22 C/W and the device can sustain 600 mW reliably.
Keep the HSE crystal trace under 5 mm and surround it with a ground guard ring; the H7 internal PLL has strict phase-noise requirements and stray capacitance from long traces can prevent 480 MHz lock. Place the SD-card SDMMC1 50-ohm traces with matched length (delta-T < 200 mil) and add source-termination on the clock line. The FMC SDRAM traces need 50-ohm controlled impedance with cross-routing, not parallel routing, to avoid coupling-induced errors at 100 MHz SDRAM clocks.
Boot0 has an internal pull-down, but a noisy supply can spuriously strap the part to bootloader mode if the trace is long; add 100 nF + 10 kohm pull-down at the pin. Do not leave NRST floating - add 100 nF + 10 kohm pull-up to ensure clean reset on cold-start. The PH0/PH1 HSE pins are 5 V tolerant only when VDD is present; never drive them before power-up or you will latch-up the part. For JTAG/SWD connect 4.7 kohm pull-ups to TMS and TCK.
Informações de conformidade
RoHS 2011/65/EU compliant, REACH EC 1907/2006 compliant, lead-free reflow profile 245 C peak. Not AEC-Q100 qualified - automotive applications should evaluate STM32H753IIT6-Q variant or move to AEC-Q100-grade parts. Halogen-free molding compound per IEC 61249-2-21.