FPGA и CPLD
Товары (6536)
XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU19EG-1FFVC1760E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with UltraScale+ programmable logic. It is housed in a 1760-FCBGA package (42.5x42.5 mm) and operates over a 0°C to 100°C junction temperature range. A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric. Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces. Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features. Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control. When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.
XCZU19EG-2FFVB1517I - Zynq UltraScale+ MPSoC | AMD
The AMD XCZU19EG-2FFVB1517I is a Zynq UltraScale+ MPSoC EG system-on-chip (SoC) in a 1517-FCBGA (40x40 mm) package. It integrates quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, an ARM Mali-400 MP2 graphics processor, and 1,143K+ FPGA logic cells. Its processing subsystem supports clock frequencies of 533 MHz, 600 MHz, and 1.3 GHz, enabling compute-intensive embedded applications in a single device. An MPSoC is a multi-processor system-on-chip that combines a processor system (PS) with programmable logic (PL) fabric, allowing designers to integrate software-based control and hardware-accelerated datapaths on one die. Within the programmable-logic hierarchy, the Zynq UltraScale+ MPSoC sits above traditional FPGAs by adding hardened ARM cores, memory controllers, and high-speed transceivers. This class of device is commonly used in 5G wireless, aerospace, defense, medical imaging, and data center acceleration. Key features of the XCZU19EG-2FFVB1517I include high logic density with 1,143K+ logic cells, a -2 speed grade for balanced performance, and industrial temperature grade (I suffix) for extended environmental operation. The 1517-FCBGA package exposes 16 accessible GTH transceivers; the device contains 72 total transceivers, but the D1760 package is required to access all GTY channels. The quad A53 cluster can run Linux, while the dual R5 cores handle deterministic real-time control. From a technical depth perspective, the Zynq UltraScale+ architecture uses 16nm FinFET process technology. The programmable logic can implement complex DSP pipelines, AI inference engines, and custom protocol bridges. The hardened PS includes DDR4 memory controllers, but the exact DDR4 PHY configuration and I/O bank assignments must be verified in the AMD package pinout file. The Mali-400 MP2 GPU accelerates lightweight graphics or compute-display tasks. Typical applications include 5G/6G radio and fronthaul processing, radar and electronic warfare subsystems, medical imaging and ultrasound beamforming, industrial machine vision, SmartNIC acceleration, and multi-channel video surveillance. The combination of hardened processors and scalable logic gives designers flexibility to partition functions between software and hardware. When designing with this device, plan a proper multi-rail power sequence and a robust thermal solution. Because exact VCCINT/VCCAUX voltage levels and thermal data are not included in the verified web snippets, refer to the official AMD Zynq UltraScale+ MPSoC data sheets and package pinout files before final board design.
XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU19EG-2FFVC1760E is a high-performance Zynq UltraScale+ MPSoC EG family system-on-chip (SoC) that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a large programmable logic (FPGA) fabric. This device is housed in a 1760-ball FCBGA package measuring 42.5x42.5 mm and is designed for demanding embedded applications requiring both high-level operating system support and real-time, low-latency processing. A Zynq UltraScale+ MPSoC is a heterogeneous multi-processor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single die. The PS typically includes application processors (Cortex-A53), real-time processors (Cortex-R5), and a graphics processor (Mali-400), while the PL is an FPGA fabric that can be configured to implement custom hardware accelerators, high-speed I/O interfaces, and complex digital logic. This architecture allows designers to optimize their systems by partitioning tasks between software running on the processors and hardware implemented in the FPGA. Key features of the XCZU19EG-2FFVC1760E include 1,143K+ logic cells in the programmable logic, providing substantial capacity for complex digital designs. The processing system operates at speeds of 533 MHz for the real-time processors, 600 MHz for the graphics processor, and 1.3 GHz for the application processors. The device supports 512 user I/O pins, enabling high-bandwidth connectivity to external memory, peripherals, and high-speed transceivers. From a technical perspective, the XCZU19EG-2FFVC1760E leverages AMD's UltraScale+ architecture, which is built on a 16nm FinFET process. This advanced process technology enables high performance and low power consumption compared to previous generations. The device includes a comprehensive set of hard intellectual property (IP) blocks, such as PCIe, USB, DisplayPort, and Gigabit Ethernet, which offload these functions from the programmable logic, freeing up resources for custom logic. Typical applications for the XCZU19EG-2FFVC1760E include high-end embedded computing, software-defined radio, medical imaging, aerospace and defense systems, and data center acceleration. Its combination of powerful processors and large FPGA fabric makes it suitable for applications that require both complex software algorithms and high-throughput, low-latency hardware processing. When designing with this device, careful attention must be paid to power supply sequencing, thermal management, and high-speed PCB layout. The device requires multiple power rails with specific voltage levels and sequencing requirements. Adequate decoupling and a robust power delivery network are essential for reliable operation at high clock speeds.
XCZU1CG-2SFVA625E - Zynq UltraScale+ SoC FPGA | AMD
The AMD XCZU1CG-2SFVA625E is a Zynq® UltraScale+™ MPSoC (Multi-Processor System-on-Chip) that integrates a dual-core ARM® Cortex®-A53 application processor and a dual-core ARM® Cortex®-R5 real-time processor with programmable logic fabric in a single 625-ball FCBGA package. This device is part of the Zynq UltraScale+ family, offering a balance of processing performance and FPGA flexibility for a wide range of embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a processing system (PS) with programmable logic (PL) on a single chip. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O interfaces, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware. Key features of the XCZU1CG-2SFVA625E include a maximum clock frequency of 1.333GHz for the Cortex-A53 cores and 533MHz for the Cortex-R5 cores, providing substantial processing power for demanding applications. The device is housed in a 625-FCBGA package with a 21x21mm footprint, offering a compact solution for space-constrained designs. The -2 speed grade indicates a mid-range performance level, balancing speed and power consumption. The XCZU1CG-2SFVA625E is built on TSMC's 16nm FinFET process technology, enabling high performance with low power consumption. The programmable logic fabric provides a rich set of resources including configurable logic blocks, block RAM, DSP slices, and high-speed transceivers, allowing for flexible hardware acceleration and custom I/O implementations. The device also includes a comprehensive set of hard IP blocks, such as PCIe, USB, and DisplayPort controllers, reducing the need for external components. Typical applications for this device include industrial automation, automotive driver assistance systems, medical imaging, and aerospace and defense systems. The combination of ARM processing and FPGA flexibility makes it ideal for applications requiring real-time processing, high-speed data acquisition, and custom I/O interfaces. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to ensure reliable operation, and the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.
XCZU28DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen3 | AMD
The AMD XCZU28DR-1FSVE1156E is a Zynq UltraScale+ RFSoC Gen3 adaptive SoC, integrating a multi-core ARM Cortex-A53 processing system with UltraScale+ programmable logic and high-performance RF data converters in a single device. This part is specifically designed for demanding RF and wireless applications, offering a comprehensive system-on-chip solution that reduces board space and power consumption compared to discrete implementations. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that combines a processing system (PS) with programmable logic (PL) and dedicated RF analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This integration eliminates the need for separate data converter ICs and high-speed digital interfaces, simplifying system design and improving signal integrity. The RFSoC family sits within the broader adaptive SoC hierarchy, which includes the Zynq-7000 and Zynq UltraScale+ families, and is positioned for applications requiring direct RF sampling. The XCZU28DR-1FSVE1156E features a powerful processing system with quad-core ARM Cortex-A53 application processors and dual-core Cortex-R5 real-time processors, providing both high-level operating system support and deterministic real-time control. The programmable logic is based on the UltraScale+ architecture, offering high-density logic, DSP slices, and block RAM. The device is packaged in a 1156-ball BGA (FSVE1156) package, which provides excellent thermal and electrical performance for high-speed signals. This RFSoC integrates eight 14-bit 5.0 GSPS ADCs and eight 14-bit 9.85 GSPS DACs, enabling direct RF sampling in the sub-6 GHz range. The RF data converters feature digital up-conversion (DUC) and digital down-conversion (DDC) blocks, supporting flexible frequency planning. The device also includes a comprehensive set of hard IP blocks, including PCIe Gen3, 100G Ethernet, and Interlaken, reducing the need for soft logic implementation. Typical applications for the XCZU28DR-1FSVE1156E include 5G NR base stations, phased array radar, electronic warfare, and test and measurement equipment. The device's high-speed data converters and processing capabilities make it ideal for software-defined radio (SDR) platforms. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management to ensure reliable operation.
XCZU28DR-2FSVE1156I - Zynq UltraScale+ RFSoC Gen 3 | AMD
The AMD XCZU28DR-2FSVE1156I is a Zynq UltraScale+ RFSoC Gen 3 device that integrates a powerful processing system (PS) and programmable logic (PL) with high-performance RF data converters on a single chip. It is housed in a 1156-ball FCBGA package (35x35 mm) and operates over the industrial temperature grade. The device combines a quad-core Arm Cortex-A53 application processor and a dual-core Arm Cortex-R5 real-time processor with extensive programmable logic resources, making it suitable for a wide range of signal processing and control applications. A Zynq UltraScale+ RFSoC is a System-on-Chip (SoC) that merges an FPGA fabric with a multi-core processor subsystem and integrated RF analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This integration eliminates the need for separate discrete converters, reducing board space, power consumption, and design complexity. The RFSoC family is part of the broader adaptive SoC category, which includes FPGAs and other programmable devices, and is designed for applications requiring high-speed data conversion and flexible digital processing. Key features of the XCZU28DR-2FSVE1156I include the Zynq UltraScale+ RFSoC Gen 3 architecture, which provides enhanced RF performance and higher bandwidth compared to previous generations. The device supports a maximum logic cell count of 930K+ and operates at a maximum clock frequency of 1.333 GHz for the PS and 533 MHz for the PL. The integrated RF data converters support direct RF sampling, enabling software-defined radio and radar systems. The device also includes a rich set of I/O options, including high-speed transceivers and general-purpose I/O. From a technical perspective, the XCZU28DR-2FSVE1156I leverages AMD's UltraScale+ architecture, which offers advanced power management, security features, and high-speed connectivity. The device supports a wide range of interfaces, including PCIe, Ethernet, and USB, making it suitable for diverse applications. The RFSoC Gen 3 devices are designed to meet the demands of 5G wireless infrastructure, aerospace and defense, and test and measurement equipment. Typical applications for the XCZU28DR-2FSVE1156I include 5G massive MIMO base stations, radar and electronic warfare systems, and high-speed data acquisition systems. The device's integrated RF converters and powerful processing capabilities make it ideal for these applications, where high bandwidth and low latency are critical. When designing with this device, it is important to consider the power supply requirements and thermal management. The device requires multiple power rails with specific sequencing, and adequate cooling is necessary to maintain reliable operation at high performance levels. Refer to the AMD Zynq UltraScale+ RFSoC data sheet and design guides for detailed recommendations.
XCZU2CG-1SBVA484E - Zynq UltraScale+ MPSoC, 103K+ LC, 484-FCBGA | AMD
The AMD (Xilinx) XCZU2CG-1SBVA484E is a Zynq UltraScale+ MPSoC from the CG (Cost-Optimized) sub-family, integrating a Dual-core ARM Cortex-A53 application processor (up to 1.2 GHz), Dual-core ARM Cortex-R5 real-time processors (up to 500 MHz), and 103K+ system logic cells in a 19x19 mm 484-ball FCBGA (SBVA484) package. The device ships in -1 speed grade and the E (extended) temperature grade, and supports programmable logic densities and DSP counts typical of mid-range UltraScale+ MPSoC devices used in embedded vision, industrial control, and 5G baseband applications. A multiprocessor system-on-chip (MPSoC) is a class of integrated device that combines hardened CPU subsystems with programmable FPGA fabric on a single die, allowing software code and hardware datapaths to share I/O, memory, and on-chip interconnect. Zynq UltraScale+ devices in particular expose the ARM cores through a coherent multiprocessor fabric (Cortex-A53 application processor and Cortex-R5 real-time processor) alongside a wide I/O portfolio including PS-side GPIO, gigabit transceivers (GT), high-speed serial, and DDR controllers. Designers typically boot Linux on the A53 MPCore while running deterministic real-time tasks on the R5 cores, and accelerate throughput-critical signal processing with FPGA fabric. Key features of the XCZU2CG-1SBVA484E include 103K+ system logic cells, ARM Mali-400MP2 GPU subsystem, integrated video codec (VCU) absent on this CG variant, low-power LPDDR4/DDR4 memory controller with ECC, and the AMD hardened platform management controller (PMC). The ZU2CG is the cost-optimized member of the UltraScale+ MPSoC family, positioned below the EV (enhanced video) and EG (embedded graphics) sub-families for applications that need ARM cores plus FPGA but not on-chip video codec hardware. Designers typically pair the XCZU2CG-1SBVA484E with LPDDR4 memory (32-bit with ECC), gigabit Ethernet PHYs, USB 3.0 controllers, and high-speed ADCs. Power sequencing is handled by a dedicated AMD power management IC such as the MAX20812 or similar PMBus-compatible regulators. The SBVA484 package's small 19x19 mm footprint supports space-constrained embedded modules such as the Ultra96-V2 and ZUBoard 1CG. Typical applications include industrial machine vision, 5G small-cell baseband processing, ADAS sensor fusion, medical imaging, robotic motion controllers, and aerial drone platforms. The CG sub-family is the right choice when full UltraScale+ FPGA fabric is needed but the GPU/VCU hardware of EG-class devices is not required, balancing cost with full-feature software ecosystem support (PetaLinux, Yocto, FreeRTOS, Vitis AI). When designing with this device, ensure that the chosen carrier board's 484-ball FCBGA footprint matches the SBVA484 mechanical outline in UG1075; a board designed for SBVA484 can host both -1 and -2 speed grade members, but cannot accept the larger SBVA625 or SBVA900 packages without rework. This page synthesizes distributor pricing, drop-in alternative ordering, and practical Vivado/Vitis design notes not found in the manufacturer datasheet alone.
XCZU2EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU2EG-1SFVA625E is a Zynq UltraScale+ MPSoC EG family device that integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with programmable logic fabric. It is housed in a 625-ball FCBGA package (21x21 mm) and operates at a maximum frequency of 1.5 GHz for the Cortex-A53 cores. The device features 103,320 logic cells and is fabricated using a 20nm process technology, supporting a core voltage of 0.95V. A Zynq UltraScale+ MPSoC is a heterogeneous multiprocessor system-on-chip that combines a processing system (PS) with programmable logic (PL) on a single device. The PS includes ARM application and real-time processors, while the PL provides FPGA fabric for custom hardware acceleration. This architecture enables designers to implement complex systems that require both software flexibility and hardware performance, making it ideal for applications such as embedded vision, industrial automation, and software-defined radio. Key features of the XCZU2EG-1SFVA625E include the quad-core ARM Cortex-A53 MPCore with CoreSight debug, dual-core ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 GPU. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The programmable logic provides 103,320 logic cells, enabling substantial custom logic implementation. The device is designed for industrial temperature ranges and is RoHS compliant. From a technical perspective, the XCZU2EG-1SFVA625E leverages the UltraScale+ architecture, which offers advanced clocking, routing, and DSP capabilities. The 20nm process technology provides improved power efficiency and performance compared to older generations. The device includes integrated memory controllers, PCIe blocks, and security features, making it a comprehensive solution for high-performance embedded systems. Typical applications include embedded vision systems, industrial motor control, automotive driver assistance, and data center acceleration. The combination of ARM processing and FPGA fabric allows for real-time processing and hardware acceleration, making it suitable for edge computing and AI inference. When designing with this device, consider the power supply requirements, including the 0.95V core voltage and multiple I/O banks. Proper decoupling and power sequencing are essential for reliable operation. The device requires a configuration source, such as QSPI flash or SD card, for booting.
XCZU2EG-L1SBVA484I - Zynq UltraScale+ MPSoC SoC FPGA | AMD
The AMD Xilinx XCZU2EG-L1SBVA484I is a Zynq UltraScale+ MPSoC EG family System-on-Chip (SoC) that combines a quad-core Arm Cortex-A53 application processor, a dual-core Arm Cortex-R5 real-time processor, an Arm Mali-400 MP2 graphics processor, and UltraScale+ programmable logic in a 484-pin FCBGA (19x19) package. This device targets embedded vision, edge AI, industrial automation, and software-defined systems where heterogeneous processing in one package reduces system cost and board area. A System-on-Chip FPGA (SoC FPGA) integrates a processor subsystem and programmable fabric on a single die, enabling hardware acceleration, custom peripherals, and deterministic low-latency I/O alongside general-purpose operating systems. In the power management hierarchy, this SoC replaces multiple discrete components—MCU, DSP, FPGA, and GPU—with one programmable architecture that can adapt to evolving standards. Key features include 103K+ FPGA logic cells, maximum operating frequencies of 500 MHz for the real-time processors, 600 MHz for the graphics/real-time complex, and 1.2 GHz for the application cores, plus CoreSight debug technology for full multicore trace and profiling. The L1 speed grade optimizes power efficiency, while the industrial temperature suffix (-I) supports -40°C operation. Built on TSMC 16nm UltraScale+ technology, this SoC provides over 85K LUT equivalents in programmable logic plus high-bandwidth connectivity between ARM processors and fabric. The FCBGA package offers up to 396 user I/O and 4 multi-gigabit transceivers, enabling 10GbE, PCIe, and high-speed ADC interfaces. Typical applications include advanced driver assistance (ADAS), machine vision cameras, 5G small cells, industrial controllers, and medical imaging. The 103K logic cells allow implementing vision pipelines, FFT engines, and custom motor-control loops. For edge AI, the Mali GPU and DSP engine accelerate typical neural-network kernels. Designers should plan a power budget for VCCINT, VCCAUX, VCCO, and PS rails; use PMIC sequencing and adequate decoupling. The large BGA footprint requires multi-layer PCB routing and thermal vias to maintain junction temperature within limits.
XCZU3EG-1SFVA625E - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU3EG-1SFVA625E is a Zynq UltraScale+ MPSoC EG family System-on-Chip (SoC) that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a 154K+ logic cell FPGA fabric. This device is housed in a 625-ball FCBGA (21x21 mm) package and operates with a core voltage of 0.85V, fabricated on TSMC's 20nm process technology. A Zynq UltraScale+ MPSoC is a heterogeneous multiprocessor system-on-chip that combines a hardened processing system (PS) with programmable logic (PL) on a single die. The PS provides the software-defined processing capability with ARM cores, while the PL offers the hardware flexibility of an FPGA. This architecture sits at the top of the embedded processing hierarchy, bridging the gap between traditional microprocessors and FPGAs, enabling designers to optimize for both software flexibility and hardware acceleration. Key features of the XCZU3EG-1SFVA625E include the quad-core ARM Cortex-A53 MPCore with CoreSight running at up to 1.2GHz, the dual-core ARM Cortex-R5 with CoreSight at up to 600MHz, and the ARM Mali-400 MP2 GPU. The FPGA fabric contains 154,350 logic cells, providing substantial programmable logic resources. The device supports a maximum operating temperature of 100°C and is available in a tray packaging format. The XCZU3EG-1SFVA625E leverages the UltraScale+ architecture, which delivers high-performance serial I/O, advanced clocking, and robust power management. The integration of the ARM processing system with the FPGA fabric enables low-latency, high-bandwidth communication between software and hardware, making it ideal for applications requiring both complex algorithms and real-time processing. Typical applications include software-defined radio, industrial motor control, medical imaging, and automotive driver assistance systems. The combination of the A53 application cores, R5 real-time cores, and FPGA fabric allows for a flexible partitioning of tasks between software and hardware. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The 0.85V core voltage requires a clean, well-regulated supply, and the multiple power rails must be sequenced according to the guidelines in the Zynq UltraScale+ device technical reference manual.
XCZU3EG-1UBVA530E - Zynq UltraScale+ SoC FPGA | AMD
The AMD XCZU3EG-1UBVA530E is a Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) that integrates a quad-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ programmable logic fabric. This device is housed in a 530-ball FCBGA package (16x9.5 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for high throughput and low latency while running operating systems and control software on the ARM cores. The PS and PL are connected via high-bandwidth AXI interfaces, enabling efficient data movement between software and hardware. Key features of the XCZU3EG-1UBVA530E include 154K+ logic cells, a 500 MHz maximum PL clock frequency, and a 1.2 GHz maximum PS clock frequency. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The UltraScale+ architecture provides advanced power management and security features, making it suitable for a variety of applications. The XCZU3EG-1UBVA530E is part of the Zynq UltraScale+ family, which offers scalability from the ZU2 to ZU19 devices. This specific variant, the EG (embedded graphics) class, includes a Mali-400 GPU for graphics and video processing. The device is manufactured using a 16nm process, providing a balance of performance and power efficiency. Typical applications for the XCZU3EG-1UBVA530E include software-defined radio, machine vision, industrial automation, and aerospace and defense systems. The combination of ARM cores and FPGA fabric makes it ideal for applications that require real-time processing, high-speed data acquisition, and flexible I/O. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) must be powered up in the correct order to prevent damage. Use the AMD power management reference design and follow the guidelines in the Zynq UltraScale+ Technical Reference Manual (UG1085) for reliable operation.
XCZU3EG-2SFVA625I - Zynq UltraScale+ MPSoC EG | AMD
The AMD XCZU3EG-2SFVA625I is a Zynq UltraScale+ MPSoC EG family device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with programmable logic based on the UltraScale+ architecture. This System-on-Chip (SoC) is housed in a 625-ball FCBGA package measuring 21x21 mm and operates with a maximum clock frequency of 1.3 GHz for the application processor, 600 MHz for the real-time processor, and 533 MHz for the programmable logic. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processing with FPGA fabric on a single die. This architecture enables designers to implement complex systems that require both high-level software control and hardware-accelerated data processing. The EG variant is optimized for embedded applications that need a balance of processing power, programmable logic capacity, and I/O flexibility, making it suitable for a wide range of industrial, aerospace, and defense applications. Key features of the XCZU3EG-2SFVA625I include 154K+ logic cells, 360 DSP slices, and 7.6 Mb of block RAM, providing substantial programmable logic resources for custom hardware acceleration. The device supports a wide range of high-speed serial transceivers and general-purpose I/O, enabling flexible system integration. The processing system includes a memory management unit, cache coherency, and a rich set of peripherals, including USB 3.0, DisplayPort, SATA, and PCIe, which are essential for modern embedded systems. The device is built on TSMC's 16nm FinFET process technology, which delivers high performance with low power consumption. The UltraScale+ architecture includes advanced clocking resources, high-bandwidth memory interfaces, and integrated blocks for PCIe and Ethernet, reducing the need for external components. The processing system and programmable logic are connected through a high-bandwidth AXI interconnect, enabling efficient data movement between software and hardware domains. Typical applications for the XCZU3EG-2SFVA625I include software-defined radio, industrial motor control, machine vision, and aerospace avionics. The device's combination of real-time processing, application processing, and programmable logic makes it ideal for systems that require both deterministic control and complex signal processing. The device operates over a junction temperature range of -40°C to 100°C, making it suitable for harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require a well-designed power distribution network to ensure reliable operation at high clock frequencies. The device also requires a configuration source, such as QSPI flash or SD card, to load the bitstream at power-up.
XCZU42DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen 1 | AMD
The AMD XCZU42DR-1FSVE1156E is a Zynq UltraScale+ RFSoC Gen 1 device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and a large FPGA fabric with 489K+ logic cells. This System-on-Chip (SoC) is housed in a 1156-FCBGA (35x35 mm) package and operates with a maximum clock frequency of 500 MHz for the programmable logic and 1.2 GHz for the application processor. A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in the RFSoC family, integrated RF data converters. This device class sits at the top of the adaptive SoC hierarchy, enabling software-defined radio, radar, and 5G NR baseband processing in a single chip. The RFSoC architecture eliminates the need for separate data converter ICs, reducing board area and power while improving signal integrity. Key features of the XCZU42DR-1FSVE1156E include the 489K+ logic cells, which provide substantial programmable fabric for custom DSP and control logic. The quad-core Cortex-A53 cluster runs at up to 1.2 GHz, suitable for Linux-based application processing, while the dual-core Cortex-R5 handles real-time tasks. The device supports a wide range of high-speed transceivers and memory interfaces, making it suitable for demanding compute and I/O workloads. Technically, the RFSoC Gen 1 integrates RF data converters (ADCs and DACs) that operate at multi-GSPS sample rates, enabling direct RF sampling in transceiver designs. The programmable logic is built on the UltraScale+ 16nm FinFET process, offering high logic density and low power. The 1156-FCBGA package provides excellent thermal and electrical performance for high-speed signals. Typical applications include 5G NR remote radio units (RRUs), phased-array radar, software-defined radio (SDR), and test and measurement equipment. The combination of ARM processing and dense programmable logic makes it ideal for signal processing chains that require both flexibility and performance. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The device requires multiple power rails with specific ramp-up sequences, and a high-quality reference clock is essential for the RF converters. Adequate decoupling and a low-impedance power distribution network are critical for reliable operation.
XCZU42DR-2FSVE1156I - RFSoC, 489K Logic Cells | AMD
The AMD XCZU42DR-2FSVE1156I is a Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip) that integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and a large FPGA fabric with 489K+ logic cells. It operates at processor speeds of 533MHz (Cortex-A53) and 1.333GHz (Cortex-R5), and is housed in a 1156-FCBGA (35x35mm) package. This device is designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, uniquely, integrated RF data converters (RF-ADC and RF-DAC). This integration eliminates the need for separate discrete converters, reducing board space, power, and latency. The RFSoC family sits within the broader adaptive SoC category, bridging FPGA flexibility with processor-based software programmability. Key features include the 489K logic cells, 533MHz/1.333GHz processor clocks, and the 1156-FCBGA package. The 'I' suffix indicates an industrial temperature grade (-40C to +100C), making it suitable for demanding environments. The '2' speed grade offers a balance of performance and power. The integrated RF converters support direct RF sampling, simplifying transceiver designs. Technically, the device leverages AMD's UltraScale+ 16nm FinFET process, providing high logic density and low power. The RFSoC architecture includes dedicated DSP slices, block RAM, and high-speed transceivers, enabling complex digital signal processing. The programmable logic can be configured for custom algorithms, while the ARM cores handle control and protocol processing. Typical applications include 5G NR base stations, phased array radar, test and measurement equipment, and satellite communications. The integrated RF data converters and high-speed processing make it ideal for software-defined radio (SDR) systems. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 1156-FCBGA package requires a multi-layer PCB with adequate decoupling and a thermal solution to dissipate heat from the high-performance cores and RF converters.
XCZU47DR-1FFVE1156E - RFSoC, 930K Logic Cells | AMD
The AMD XCZU47DR-1FFVE1156E is a Zynq® UltraScale+™ RFSoC, a heterogeneous System-on-Chip (SoC) that integrates a Quad-core ARM® Cortex®-A53 MPCore™ application processor and a Dual-core ARM® Cortex™-R5 real-time processor with a substantial FPGA fabric. This device is housed in a 1156-FCBGA (35x35) package and is part of the Zynq UltraScale+ RFSoC family, designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in this 'DR' variant, integrated RF data converters. This integration eliminates the need for separate discrete data converters, reducing board space, power, and latency in RF systems. The architecture allows for a single-chip solution that can handle digital signal processing, control, and RF front-end tasks. Key features of the XCZU47DR-1FFVE1156E include 930K+ logic cells, a 500MHz maximum frequency for the FPGA fabric, and a 1.2GHz maximum frequency for the ARM Cortex-A53 processor. The device supports a wide range of I/O standards and includes features such as DMA and WDT. The operating temperature range is 0°C to 100°C (Tj), making it suitable for commercial and industrial environments. The RFSoC architecture integrates high-speed analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) directly into the device, enabling direct RF sampling and synthesis. This reduces the complexity of the analog front-end and improves system performance by eliminating the need for multiple intermediate frequency (IF) stages. The device also includes a comprehensive set of peripherals and interfaces for system integration. Typical applications for the XCZU47DR-1FFVE1156E include 5G wireless base stations, phased array radar, test and measurement equipment, and software-defined radio (SDR) systems. Its high logic density and integrated RF converters make it ideal for applications requiring high bandwidth and low latency. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to ensure reliable operation at high power levels.
XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD
The AMD XCZU47DR-2FFVE1156I is a Zynq UltraScale+ RFSoC, a heterogeneous System-on-Chip (SoC) that integrates a Quad-core ARM Cortex-A53 application processor, a Dual-core ARM Cortex-R5 real-time processor, and a large programmable logic (FPGA) fabric with over 930,000 logic cells. This device is housed in a 1156-pin FCBGA package (35x35 mm) and is designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that monolithically integrates data converters (ADCs and DACs) alongside the programmable logic and processing system, eliminating the need for separate converter chips in radio systems. This integration reduces board space, power, and latency, making it ideal for applications like 5G base stations, radar, and test equipment. Key features include the ARM Cortex-A53 application processor running at up to 1.333 GHz, the ARM Cortex-R5 real-time processor at up to 533 MHz, and the 930K+ logic cells for custom hardware acceleration. The device also supports high-speed transceivers and DDR4 memory interfaces, enabling high-throughput data movement. The -2 speed grade indicates a high-performance variant, and the I suffix denotes an industrial temperature grade (-40C to +100C). The RFSoC architecture combines the flexibility of FPGA fabric with the performance of dedicated converters, allowing designers to implement complex DSP chains in hardware while maintaining software programmability. The integrated converters support direct RF sampling, reducing analog front-end complexity. The device is supported by AMD's Vivado design suite and Vitis unified software platform. Typical applications include 5G NR base stations, phased array radar, software-defined radio, and medical imaging systems. The high logic cell count and processing power make it suitable for beamforming, channel estimation, and real-time signal analysis. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling, as the RFSoC has multiple power rails with specific requirements. The package pinout files from AMD (UG1075) should be consulted for accurate pin assignments.
XCZU4CG-1FBVB900E - Zynq UltraScale+ MPSoC CG | AMD
The AMD XCZU4CG-1FBVB900E is a Zynq UltraScale+ MPSoC CG device that integrates a dual-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ FPGA fabric. It comes in a 900-ball FCBGA package (31x31 mm) and is designed for high-performance embedded applications requiring both processing and programmable logic. A System-on-Chip (SoC) combines multiple components of a computer or electronic system into a single chip. The Zynq UltraScale+ MPSoC family specifically merges a multi-core ARM processing system (PS) with programmable logic (PL), enabling hardware-software co-design. This architecture allows designers to implement custom accelerators, high-speed I/O, and real-time control in the PL while running operating systems like Linux on the PS. Key features include 192K+ logic cells, 500 MHz PS clock, 1.2 GHz application processor clock, and support for DDR4, LPDDR4, and 32-bit/64-bit memory interfaces. The device also includes UltraScale+ programmable logic with 461K system logic cells, 21.1 Mb block RAM, and 1,152 DSP slices. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The architecture combines the ARM Cortex-A53 application processor for high-level operating systems, the Cortex-R5 for real-time deterministic processing, and the FPGA fabric for custom logic. This heterogeneous computing platform enables efficient task partitioning, with the PS handling control and communication while the PL accelerates data-intensive algorithms. The device also features advanced security, power management, and system monitoring capabilities. Typical applications include software-defined radio, industrial automation, medical imaging, aerospace and defense systems, and data center acceleration. The combination of high-performance processing, programmable logic, and rich I/O makes it suitable for edge computing and embedded vision systems. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 900-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides reference designs and power management solutions to simplify the design process.
XCZU4EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD
The AMD XCZU4EV-1SFVC784E is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 MPCore™ application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit into a single System-on-Chip (SoC). This device is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and programmable logic. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) fabric on a single die. This architecture enables designers to implement custom hardware accelerators, high-speed I/O interfaces, and complex signal processing chains in the PL while running operating systems and application software on the PS. The EV variant specifically adds a video codec unit (VCU) for hardware-accelerated video encoding and decoding. The XCZU4EV-1SFVC784E features 192K+ logic cells in the programmable logic fabric, providing substantial capacity for custom logic designs. The processing system operates at speeds up to 1.2 GHz for the Cortex-A53 cores, 600 MHz for the Cortex-R5 cores, and 500 MHz for the Mali-400 GPU. This combination of processing power and programmable logic makes it suitable for a wide range of applications. Key features include support for DDR4 memory interfaces, high-speed transceivers, and a comprehensive set of I/O standards. The device supports multiple boot modes including Quad-SPI flash, SD card, and JTAG. The 784-pin FCBGA package provides excellent thermal and electrical performance for high-speed designs. Typical applications include video processing systems, software-defined radio, industrial automation, medical imaging, and aerospace/defense systems. The device's ability to handle both real-time processing and complex algorithms makes it ideal for edge computing and embedded vision applications. When designing with this device, careful attention must be paid to power supply sequencing, clocking architecture, and thermal management. The device requires multiple power rails with specific voltage levels and sequencing requirements as detailed in the power management documentation.
XCZU4EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD
The AMD XCZU4EV-2SFVC784I is a Zynq UltraScale+ MPSoC EV device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) combines the flexibility of an FPGA with the performance of a multi-core processing system, making it suitable for a wide range of embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that merges a processing system (PS) with programmable logic (PL) on a single die. The PS contains the ARM cores, memory interfaces, and peripheral controllers, while the PL provides reconfigurable hardware acceleration. This architecture allows designers to implement complex algorithms in hardware for high performance and low latency, while the software-defined PS handles system-level tasks and connectivity. Key features of the XCZU4EV-2SFVC784I include 192K+ logic cells, 533MHz for the Cortex-R5, 600MHz for the Mali-400 MP2, and 1.3GHz for the Cortex-A53. The device is housed in a 784-FCBGA package measuring 23x23 mm, offering 252 user I/O pins. This combination of processing power and programmable logic makes it ideal for applications requiring both high-level operating systems and real-time, low-latency control. The XCZU4EV-2SFVC784I is built on a 16nm process technology, providing a balance of performance and power efficiency. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The integrated memory controllers support DDR4, LPDDR4, and other memory types, enabling high-bandwidth data processing. Typical applications include software-defined radio, video processing, industrial automation, and aerospace and defense systems. The combination of ARM cores and FPGA fabric allows for flexible, high-performance solutions that can be adapted to changing requirements. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 784-FCBGA package requires a multi-layer PCB with adequate decoupling and thermal vias to ensure reliable operation at high clock speeds.
XCZU5CG-1SFVC784E - Zynq UltraScale+ MPSoC, 256K Logic Cells | AMD
The AMD (Xilinx) XCZU5CG-1SFVC784E is a Zynq UltraScale+ MPSoC integrating a programmable logic fabric with a heterogeneous multiprocessing system on a single die, housed in a 784-ball FCBGA package measuring 23x23 mm. The CG (Cost-Grade) variant supplies 256K+ system logic cells with the dual-core ARM Cortex-R5 real-time processor, dual-core ARM Cortex-A53 application processor subsystem with CoreSight debug, and the Mali-400 MP2 GPU. The part operates across 500 MHz fabric / 1.2 GHz PS clock domains and supports a 0.85 V core supply built on a 20 nm process node. A Multi-Processor System-on-Chip (MPSoC) merges hardened ARM cores with programmable FPGA logic, enabling designers to partition deterministic control tasks to the Cortex-R5, high-level application code to the Cortex-A53 running Linux, and custom accelerators into the FPGA fabric. Within the broader taxonomy, the Zynq UltraScale+ MPSoC sits above single-core Cortex-M microcontrollers and below discrete CPU+FPGA board-level designs, providing hardware/software co-design in one silicon device. Architecturally the CG family omits the video codec unit (VCU) and the high-end Programmable Logic density of the EG/EV variants, but retains the same Memory Protection Unit (XMPU) and DDR4 controller infrastructure. Designers benefit from the integrated GTH/GTY transceivers, AXI4 high-performance interconnects, and tight PS-PL coupling without external bridges. Typical applications include industrial machine vision, motor control drives, edge AI inference gateways, software-defined radio front-ends, and automotive driver-assistance ECUs where deterministic response and Linux-class processing coexist on one die. Designers should validate DDR4 routing against the Zynq UltraScale+ PCB guidelines (UG1075) and ensure the heat spreader/FCLGA lid is properly attached with a thermal interface material, since the 784-FCBGA package relies on top-side cooling for sustained workloads.
XCZU5EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD
The AMD XCZU5EV-1SFVC784E is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for performance and power efficiency while maintaining the flexibility of software-defined control. The EV family specifically adds video codec units, making it ideal for multimedia and vision applications. Key features of the XCZU5EV-1SFVC784E include 256K+ logic cells, a 500MHz Cortex-A53 processor, a 600MHz Cortex-R5 processor, and a 1.2GHz Mali-400 MP2 GPU. The device supports high-speed transceivers and a wide range of I/O standards, enabling high-bandwidth data movement. The programmable logic is based on the UltraScale+ architecture, offering advanced clocking, DSP slices, and block RAM resources. Technically, the XCZU5EV-1SFVC784E is fabricated on a 16nm process, providing a balance of performance and power. The PS and PL are connected via a high-bandwidth AXI interconnect, allowing low-latency communication. The device includes security features such as AES and RSA for secure boot, and supports a comprehensive set of peripherals including USB, PCIe, and Ethernet. Typical applications include software-defined radio, machine vision, medical imaging, and aerospace/defense systems. The combination of ARM cores and FPGA fabric makes it suitable for edge computing where low latency and high throughput are critical. The Mali-400 GPU enables graphical user interfaces and video processing. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable operation. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals.
XCZU5EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD
The AMD XCZU5EV-2SFVC784I is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 MPCore™ application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM-based processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for high throughput and low latency, while the PS handles operating systems and control tasks. The EV family specifically adds video codec units, making it ideal for multimedia and vision applications. Key features of the XCZU5EV-2SFVC784I include 256K+ logic cells, a maximum operating frequency of 1.3 GHz for the Cortex-A53 cores, 600 MHz for the Cortex-R5 cores, and 533 MHz for the Mali-400 GPU. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The -2 speed grade indicates a balanced performance-power profile. The device is built on TSMC's 16nm FinFET process technology, offering a good balance of performance and power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring 6-input look-up tables (LUTs), block RAM, and DSP slices. The integrated video codec supports H.264/H.265 encoding and decoding, offloading these tasks from the CPU. Typical applications include video surveillance systems, medical imaging equipment, automotive driver assistance systems, and software-defined radio. The combination of ARM processing, FPGA flexibility, and video codec support makes it a versatile platform for edge computing and vision-based AI. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) require proper filtering and sequencing to ensure reliable operation. The FCBGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals.
XCZU6CG-1FFVC900E - Zynq UltraScale+ MPSoC CG, Dual A53/R5, 900-FCBGA | AMD
The AMD (formerly Xilinx) XCZU6CG-1FFVC900E is a heterogeneous Zynq UltraScale+ MPSoC CG device integrating a dual-core ARM Cortex-A53 application processor (up to 1.2 GHz) with a dual-core ARM Cortex-R5 real-time processor (up to 500 MHz), CoreSight debug, and approximately 469K+ programmable logic cells, all housed in a 900-ball FCBGA (31x31 mm) package. The CG subfamily is the cost-optimized dual-core variant without the integrated H.264/H.265 video codec, which AMD explicitly targets at industrial motor control and sensor-fusion workloads. The -1 speed grade and E (0C to +100C) extended temperature grade make this part well suited for industrial and edge deployments where power-constrained enclosures and harsh environments are common. A heterogeneous MPSoC (Multiprocessor System-on-Chip) is a class of integrated device that tightly couples deterministic real-time microcontrollers, application-class CPUs, graphics/video engines, and hardware-programmable FPGA fabric on a single die. The Zynq UltraScale+ family sits at the top of AMD's SoC taxonomy: heterogeneous MPSoC > Zynq UltraScale+ > Zynq-7000 > earlier Zynq devices, and competes directly with Microchip PolarFire SoC, NXP Layerscape, and TI Jacinto in the embedded edge AI and industrial control segment. Key features include dual ARM Cortex-A53 cores with NEON/SIMD and ARMv8-A 64-bit support, dual ARM Cortex-R5 cores with lock-step capability, ARM Mali-400MP2 GPU, integrated memory controller supporting DDR4/LPDDR4 with ECC, high-speed transceivers (GTH/GTX), common-use peripherals such as USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, UART, and 256-bit AES/RSA hardware root of trust for secure boot. The 900-FCBGA package exposes approximately 256 user I/O pins grouped into high-range, high-performance, and high-density banks. The programmable logic portion contains roughly 469K system logic cells plus DSP slices, block RAM, and UltraRAM, all accessible through the ARM PS-PL AXI interconnect. Designers can implement custom peripherals, hardware accelerators, and vision pipelines in the PL fabric, while the hardened PS handles real-time and application tasks. The Vivado and Vitis toolchains from AMD provide C/C++, RTL, and high-level synthesis flows. Typical applications include industrial motor drives, robotics, sensor fusion gateways, machine-vision controllers, 5G edge radio units, automotive ADAS prototyping, and medical imaging. The CG subfamily is optimal when video encode/decode is not needed but deterministic real-time control, Linux application processing, and FPGA acceleration are all required. When designing with this device, allocate PCB power-delivery for the multi-rail requirement (typically 0.85 V VCCINT, 1.8 V VCCAUX, 0.9 V DDR4 VTT, plus 3.3 V I/O). Proper decoupling, ground plane stitching under the BGA, and length-matched DDR4 address/command traces are critical; AMD UG583 and UG1075 are the primary hardware-design references. This page synthesizes distributor pricing, validated drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
XCZU7CG-L2FFVF1517E - Zynq UltraScale+ MPSoC CG | AMD
The AMD XCZU7CG-L2FFVF1517E is a Zynq UltraScale+ MPSoC CG device that integrates a dual-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ programmable logic fabric. This System-on-Chip (SoC) is housed in a 1517-ball FCBGA package (40x40 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die. The CG variant is the cost-optimized family, offering a balanced mix of processing system (PS) and programmable logic (PL) resources. The device supports a wide range of operating systems including Linux, VxWorks, and bare-metal applications, making it a versatile choice for edge computing, industrial automation, and aerospace systems. Key features of the XCZU7CG-L2FFVF1517E include 504K+ logic cells, 533 MHz maximum frequency for the Cortex-A53 cores, and 1.3 GHz for the Cortex-R5 cores. The device also includes 256 KB of on-chip memory, high-speed transceivers, and a comprehensive set of I/O interfaces. The 'L2' speed grade indicates a high-performance variant, and the 'E' suffix denotes an extended temperature range (-40°C to +100°C). From an architectural perspective, the XCZU7CG integrates a quad-core ARM Cortex-A53 MPCore with CoreSight debug, a dual-core ARM Cortex-R5 with CoreSight, and a Mali-400 MP2 GPU. The programmable logic is based on the UltraScale+ architecture, featuring 6-input LUTs, block RAM, and DSP slices. The device supports PCIe Gen3, USB 3.0, DisplayPort, and Gigabit Ethernet, providing extensive connectivity options. Typical applications include software-defined radio, machine vision, autonomous driving, and data center acceleration. The combination of high-performance processing and reconfigurable logic allows designers to implement complex algorithms with low latency and high throughput. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides comprehensive reference designs and documentation to facilitate development.