EP3C25F256I7N vs EP3C25F256C8 Сравнение
Подробное сравнение бок о бок EP3C25F256I7N от Intel и EP3C25F256C8 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP3C25F256I7N | EP3C25F256C8 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Device Type | FPGA | Cyclone III FPGA |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Корпус | 256-FBGA (FineLine BGA) | — |
| Рабочая температура | -40C to +125C | -40 °C to +125 °C |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | — |
| PLLs | 4 general-purpose PLLs | — |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Тип монтажа | Surface Mount | Surface mount |
| Статус RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS compliance status] |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Logic Cells | — | 24,624 cells |
| Maximum Frequency | — | 402 MHz |
| Fabrication Technology | — | 65 nm |
| User I/O Count | — | 156 I/Os |
| Logic Blocks | — | 1,539 LABs |
| Package Type | — | 256-pin FBGA |
| Package Pin Count | — | 256 pins |
| Package Standard | — | MS-034 FBGA-256 |
| Lead-Free Status | — | Lead-free package |
| Programmable Logic Type | — | SRAM-configured FPGA |
| FPGA Family | — | Cyclone III |
| Product Category | — | Field programmable gate arrays |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| Configuration Method | — | [DATA_NEEDED: supported configuration methods] |
| Differential I/O Standards | — | [DATA_NEEDED: supported differential I/O standards] |