EP3C25F256I7N vs EP3C25F256C8 Vergleich
Detaillierter Direktvergleich von EP3C25F256I7N von Intel und EP3C25F256C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F256I7N | EP3C25F256C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | FPGA | Cyclone III FPGA |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Gehäuse | 256-FBGA (FineLine BGA) | — |
| Betriebstemperatur | -40C to +125C | -40 °C to +125 °C |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | — |
| PLLs | 4 general-purpose PLLs | — |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Montageart | Surface Mount | Surface mount |
| RoHS-Status | Compliant (lead-free) | [DATA_NEEDED: RoHS compliance status] |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Logic Cells | — | 24,624 cells |
| Maximum Frequency | — | 402 MHz |
| Fabrication Technology | — | 65 nm |
| User I/O Count | — | 156 I/Os |
| Logic Blocks | — | 1,539 LABs |
| Package Type | — | 256-pin FBGA |
| Package Pin Count | — | 256 pins |
| Package Standard | — | MS-034 FBGA-256 |
| Lead-Free Status | — | Lead-free package |
| Programmable Logic Type | — | SRAM-configured FPGA |
| FPGA Family | — | Cyclone III |
| Product Category | — | Field programmable gate arrays |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| Configuration Method | — | [DATA_NEEDED: supported configuration methods] |
| Differential I/O Standards | — | [DATA_NEEDED: supported differential I/O standards] |