EP3C25F256I7N vs EP3C25F256C8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F256I7N sa pamamagitan ng Intel at EP3C25F256C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3C25F256C8 EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial

EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial

EP3C25F256C8 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP3C25F256I7N EP3C25F256C8
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Type FPGA Cyclone III FPGA
Family Cyclone III —
Logic Elements 24,624 —
Embedded Memory 608,256 bits 608,256 bits
Embedded Multipliers 66 (18x18) —
Maximum User I/O 156 —
Core Supply Voltage 1.2 V 1.2 V
Packhaging 256-FBGA (FineLine BGA) —
Temperature na Operasyon -40C to +125C -40 °C to +125 °C
Speed Grade 7 —
Process Technology 65 nm low-power —
PLLs 4 general-purpose PLLs —
External Memory Support DDR/DDR2/QDRII/QDRII+ —
Uri ng Pagpapasok Surface Mount Surface mount
Tindminan RoHS Compliant (lead-free) [DATA_NEEDED: RoHS compliance status]
Hot Socketing Supported —
Configuration SRAM-based, in-system programmable —
Logic Cells — 24,624 cells
Maximum Frequency — 402 MHz
Fabrication Technology — 65 nm
User I/O Count — 156 I/Os
Logic Blocks — 1,539 LABs
Package Type — 256-pin FBGA
Package Pin Count — 256 pins
Package Standard — MS-034 FBGA-256
Lead-Free Status — Lead-free package
Programmable Logic Type — SRAM-configured FPGA
FPGA Family — Cyclone III
Product Category — Field programmable gate arrays
REACH Status — [DATA_NEEDED: REACH compliance status]
Configuration Method — [DATA_NEEDED: supported configuration methods]
Differential I/O Standards — [DATA_NEEDED: supported differential I/O standards]

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