EPF10K30ETC144-2 vs EPF10K30ETC144-3N Сравнение
Подробное сравнение бок о бок EPF10K30ETC144-2 от Intel и EPF10K30ETC144-3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPF10K30ETC144-2 | EPF10K30ETC144-3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $37,80 | $26,75 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1,728 | — |
| Typical Gates | 30,000 | 30,000 |
| Maximum User I/Os | 102 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | 24,576 |
| Embedded Array Blocks (EABs) | 6 | — |
| Корпус | 144-LQFP (TQFP, 20x20 mm) | — |
| Speed Grade | -2 | — |
| Рабочая температура | 0C to +70C (Commercial) | 0 °C to 70 °C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Internal Frequency | up to 80 MHz | [DATA_NEEDED: internal frequency max] |
| Propagation Delay (typ.) | 0.6 ns | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Process Technology | CMOS, SRAM-based | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Статус RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Logic Family | — | CMOS |
| Logic Elements / Cells | — | 1,728 |
| User I/Os | — | 102 |
| Количество выводов | — | 144 |
| Package Type | — | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Package Code | — | LFQFP |
| Terminal Form | — | Gull Wing |
| Technology | — | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| Propagation Delay | — | 0.6 ns (typical) |
| Programming Method | — | JTAG (IEEE 1149.1), in-system SRAM configuration |
| Configuration Memory | — | Volatile SRAM (requires external configuration device) |