M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
Артикул: M1AFS250-1FGG256I ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
M1AFS250-1FGG256I Обзор
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital IC -> semiconductor - flash FPGAs occupy the single-chip, instant-on niche, because unlike SRAM FPGAs they retain their program when powered off and are Live at Power-Up (LAPU) without a boot sequence.
Key features of the M1AFS250-1FGG256I include the advanced 130-nm, 7-layer-metal flash-based CMOS process, nonvolatile configuration storage, a 128-bit flash-based security lock with industry-leading AES decryption for protecting programmed IP, and single-chip integration that removes the external boot flash required by SRAM FPGA architectures. The M1 prefix denotes Fusion devices with optional ARM support, integrating an ARM Cortex-M1 hard processor alongside configurable analog blocks, large flash memory blocks, and comprehensive clock generation and management circuitry in a monolithic device.
Technically, the Fusion fabric combines flash-based look-up-table logic with mixed-signal peripherals such as analog-to-digital conversion channels, comparators, and programmable system clocks, allowing sensing, control, and state-machine logic to reside on one die. As system power is applied and within normal operating specifications, Fusion devices are immediately working - a decisive advantage for industrial control, power supervision, and safety-interlock functions that cannot tolerate configuration latency.
Typical applications include industrial automation controllers, motor drive supervision, smart power management, portable instrumentation, and defense/aerospace subsystems where instant-on operation and IP security matter.
When designing with this device, verify I/O bank voltage assignments and analog block allocation early in the floorplan, since the 256-FBGA footprint fixes ball assignments across the Fusion family, enabling later speed-grade or density migrations on the same PCB.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для M1AFS250-1FGG256I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с M1AFS250-1FGG256I (тот же форм-фактор и посадочное место) — отличается по Package, Family, Configuration Memory, System Gates, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
M1AFS250-FGG256I
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$49.5 / шт.
Открыть даташит →M1AFS250-FGG256
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$88 / шт.
Открыть даташит →M1AFS250-2FGG256I
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$83.12 / шт.
Открыть даташит →M1AFS250-2FGG256
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$83.12 / шт.
Открыть даташит →M1AFS250-2FG256I
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →M1AFS250-FG256
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$112 / шт.
Открыть даташит →M1AFS250-1FGG256I Максимальные параметры и электрические характеристики
| Series | M1AFS250 (Fusion) |
| System Gates | 250,000 gates |
| Logic Cells | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 |
| Number of I/O | 114 |
| Maximum System Frequency | 350 MHz |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | 128-bit flash-based lock, AES decryption |
| Рабочее напряжение питания | 1.5 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Корпус / Типоразмер | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Способ монтажа | SMD/SMT |
| Packaging | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management |
Руководство по цоколевке M1AFS250-1FGG256I в корпусе 256-lbga (fbga), 1.00 mm ball pitch
Цоколевка для M1AFS250-1FGG256I (корпус 256-lbga (fbga), 1.00 mm ball pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для M1AFS250-1FGG256I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
M1AFS250-1FGG256I подходит для 6 применениеs: Industrial Automation Control, Smart Power Management, Portable and Battery-Powered Instrumentation, Motor Drive Supervision, Security and IP-Protected Systems, Aerospace and Defense Subsystems.
Industrial Automation Control
In factory automation nodes such as PLC I/O modules, sensor-hub controllers, and machine-interlock logic, the M1AFS250-1FGG256I's flash-based, Live-at-Power-Up fabric means control logic is functional the instant power is applied - critical for safety interlocks that must not wait for a configuration load. The 114 user I/O accommodate dense digital I/O expansion, while the integrated configurable analog blocks digitize sensor signals (temperature, current shunts) without an external ADC, cutting component count on the 256-FBGA board. The ARM Cortex-M1 handles protocol stacks while the fabric manages deterministic I/O timing up to 350 MHz system performance. Its industrial -40C to +85C rating and AES-protected flash configuration suit deployed equipment where firmware IP must be secured against cloning.
Рекомендуется
Smart Power Management
The Fusion architecture was explicitly designed to integrate configurable analog, flash memory, clock management, and programmable logic in one monolithic device, which makes the M1AFS250-1FGG256I a strong fit for power-supply supervision, sequencing, and monitoring boards. Its analog blocks can monitor voltage rails and currents on-chip, while fabric state machines enforce power-up sequencing - and because the device is nonvolatile and Live at Power-Up, sequencing logic is active before an SRAM FPGA or processor would even finish booting. Operation from a 1.5 V core with industrial temperature rating -40C to +85C supports embedded power shelves and 48 V distribution monitoring front-ends. Single-chip integration replaces discrete supervisor ICs, comparators, and a small CPLD, shrinking PCB area in dense power systems.
Рекомендуется
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250-1FGG256I's single-chip integration: flash configuration removes the external boot memory, the analog blocks replace a separate measurement ADC, and the ARM Cortex-M1 runs the user interface and communication firmware while fabric logic handles real-time acquisition. The 256-ball FBGA with 1.00 mm pitch conserves board area, and instant-on behavior gives users an immediately responsive instrument after power switch closure. The 128-bit flash lock with AES decryption protects calibration routines and proprietary algorithms stored in the nonvolatile configuration, an important concern for commercial handheld products. With 36864 listed memory bits and 6144 logic cells, the fabric buffers measurement samples and implements display and sensor interfaces without external glue logic.
Рекомендуется
Motor Drive Supervision
Motor-drive control boards use the M1AFS250-1FGG256I as a supervision and protection companion: fabric logic monitors gate-driver feedback and current-sense signals via the on-chip analog comparators and ADC channels, implementing fast fault latching within nanoseconds of a fault event. Because the device is Live at Power-Up, protection logic is armed before the main DSP or MCU boots, closing a dangerous window at power-on. The industrial -40C to +85C temperature range matches inverter cabinet environments, and the 114 I/O interface PWM, encoder, and communication signals without external buffers. The 350 MHz fabric capability supports high-resolution PWM counting and quadrature decoding concurrently with the supervision state machine on a single 1.5 V-core chip.
Рекомендуется
Security and IP-Protected Systems
Systems that must protect programmed intellectual property leverage the M1AFS250-1FGG256I's built-in security: a 128-bit flash-based lock and industry-leading AES decryption secure configuration data, so cloned or read-back attacks cannot recover the bitstream. Applications include encryption keys management, authentication daughtercards, anti-tamper front-ends, and license-controlled peripherals. Unlike SRAM FPGAs, whose bitstreams must be stored externally in the clear or encrypted at boot time, the Fusion flash configuration remains on-chip and nonvolatile, shrinking the attack surface and removing the boot-time plaintext window. Instant-on operation and the industrial temperature range further suit always-on security appliances deployed from -40C to +85C in uncontrolled environments.
Рекомендуется
Aerospace and Defense Subsystems
Flash-based, single-chip FPGAs have long been favored in defense and aerospace subsystems - satellite payload interfaces, telemetry encoders, and test-set controllers - because nonvolatile configuration tolerates radiation-induced configuration upsets better than SRAM fabrics and requires no boot PROM. The M1AFS250-1FGG256I contributes LAPU instant-on behavior for systems that must wake and operate immediately on power application, plus AES-encrypted configuration protecting mission IP. The 130-nm flash CMOS process with 7-layer metal provides a stable, qualified fabric, and the 256-FBGA footprint is shared across the Microchip RTAX and Fusion families available on XAIPART, giving procurement teams a path to rad-tolerant RTAX parts (e.g., RTAX2000S) when program requirements escalate.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для M1AFS250-1FGG256I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | M1AFS250-FGG256I | M1AFS250-FGG256 | M1AFS250-2FGG256I | M1AFS250-2FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA, 1.00 mm pitch) | 256-FBGA FGG256 - same footprint | 256-FBGA FGG256 - same footprint | 256-FBGA FGG256 - same footprint | 256-FBGA FG256 - same footprint, legacy finish |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Number of I/O | 114 | 114 | 114 | 114 | 114 |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | -40C to +85C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured | Nonvolatile flash, LAPU, AES-secured |
Ключевые отличия
- Instant-on nonvolatile operation (против SRAM FPGAs (e.g., Xilinx/Altera equivalents))
- Integrated mixed-signal fabric (против M1AFS250-2FGG256I)
- Industrial temperature rating with lead-free package (против M1AFS250-FGG256 (commercial grade))
Заметки по проектированию
The 256-ball FBGA uses a 1.00 mm ball pitch, requiring a fine-pitch PCB process: typical escape routing uses 0.10-0.13 mm traces with via-in-pad or dogbone escapes on the outer rows, while inner balls need microvia or buried-via stackups. Verify the exact land pattern against the Microchip Fusion datasheet mechanical drawing before fabrication. Since all M1AFS250 FGG256 speed grades share the same ball map, design the footprint once and qualify any family variant - this de-risks speed-grade or lead-finish (FG vs FGG) substitutions during shortages.
The core operates from 1.5 V; I/O banks and analog blocks use separate supplies that must be sequenced and decoupled per the Microchip Fusion power-supply guidelines. Provide dedicated ferrite-isolated rails or LDOs for the analog blocks so on-chip ADC/comparator accuracy is not degraded by core switching noise. Because Fusion devices are Live at Power-Up, ensure rail ramp monotonicity meets datasheet requirements - non-monotonic ramps can produce indeterminate I/O states during the instant-on window, which matters in sequencing/protection applications.
Do not assume the M1AFS250 can be replaced by SRAM FPGA families without redesign: the Fusion analog blocks and flash configuration architecture are proprietary, and Live-at-Power-Up behavior disappears in SRAM alternatives requiring boot devices. Also confirm temperature grade in the ordering code - 'I' suffix parts are -40C to +85C industrial, while commercial-grade variants (no 'I') are unsuitable for industrial deployments. Finally, when substituting speed grades, rerun static timing analysis in Libero; a design passing on grade -2 will pass on grade -1 only with timing margin.
Информация о соответствии
The FGG package suffix generally denotes lead-free (RoHS) ball finish per Microchip convention, but explicit RoHS/REACH declarations were not present in the provided verified data - confirm on the Microchip product page compliance section before purchase.
