P1012NSE2HFB vs P1012NSN2HFB Сравнение
Подробное сравнение бок о бок P1012NSE2HFB от NXP Semiconductors и P1012NSN2HFB от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Последняя закупкаNXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ Последняя закупкаСравнение характеристик
| Параметр | P1012NSE2HFB | P1012NSN2HFB |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Последняя закупка | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $52,75 | $49,85 |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-Bit Power Architecture | 32-bit |
| Maximum Core Frequency | 800 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (multiple MACs) | GbE (10/100/1000 Mbps) |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | USB 2.0 (dual port) |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Корпус | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Operating Temperature (Tj) | 0C to +125C | — |
| Статус RoHS | RoHS Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free |
| Packaging | Tray | Tray |
| Manufacturer | — | NXP Semiconductors |
| Series | — | QorIQ P1 |
| Core Processor | — | PowerPC e500v2 |
| Speed | — | 800 MHz |
| Co-processors / DSP | — | QUICC Engine (QE) |
| Connectivity | — | Ethernet, PCIe, USB, TDM, UART, I2C, SPI |
| PCIe | — | PCIe Gen1 (x1/x2) |
| Корпус / Типоразмер | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Рабочая температура | — | 0 C to 125 C |
| Die Revision | — | 1.1 |
| Security | — | Hardware-accelerated cryptography |