P1012NSE2HFB vs P1012NSN2HFB 对比

详细并排对比 P1012NSE2HFB 出自 NXP Semiconductors 和 P1012NSN2HFB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
P1012NSE2HFB P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB ⚠ 最后一次采购
NXP Semiconductors
P1012NSN2HFB P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking

P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking

P1012NSN2HFB ⚠ 最后一次采购

规格对比

参数 P1012NSE2HFB P1012NSN2HFB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $52.75 $49.85
Processor Series QorIQ P1 —
Processor Core PowerPC e500v2 —
Number of Cores 1 1
Core Architecture 32-Bit Power Architecture 32-bit
Maximum Core Frequency 800 MHz —
Process Technology 45 nm CMOS 45 nm
Memory Controller DDR2/DDR3 with ECC DDR2/DDR3 with ECC
Ethernet Integrated GbE (multiple MACs) GbE (10/100/1000 Mbps)
PCIe Controllers PCIe Gen 2 (x1/x2/x4) —
USB USB 2.0 (host + device) USB 2.0 (dual port)
TDM Interfaces 4 (T1/E1) —
QUICC Engine (QE) Yes (protocol offload) —
SEC Security Accelerator SEC 4.0 —
封装 689-TEPBGA II (31x31 mm) with exposed thermal pad —
安装类型 Surface Mount Surface Mount
Operating Temperature (Tj) 0C to +125C —
RoHS 状态 RoHS Compliant RoHS Compliant
Lead Free Status Lead Free Lead Free
Packaging Tray Tray
Manufacturer — NXP Semiconductors
Series — QorIQ P1
Core Processor — PowerPC e500v2
Speed — 800 MHz
Co-processors / DSP — QUICC Engine (QE)
Connectivity — Ethernet, PCIe, USB, TDM, UART, I2C, SPI
PCIe — PCIe Gen1 (x1/x2)
封装 / 外壳 — 689-TEPBGA II (31x31 mm) with exposed thermal pad
工作温度 — 0 C to 125 C
Die Revision — 1.1
Security — Hardware-accelerated cryptography

数据手册与资源

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