10AS048E3F29I2SG - Arria 10 SX 480K SoC FPGA | Intel | 780-FBGA
Артикул: 10AS048E3F29I2SG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 250 | $1550 | $387.500,00 |
| 500 | $1480 | $740.000,00 |
10AS048E3F29I2SG Обзор
What is a System-on-Chip (SoC) FPGA? An SoC FPGA is a hybrid device that integrates a hard processor subsystem (HPS) - typically one or more ARM Cortex-A cores with peripherals, memory controllers, and interconnect - alongside a programmable FPGA fabric on a single die. This integration reduces board footprint, lowers power versus separate chip implementations, and provides high-bandwidth HPS-to-FPGA bridges (in Arria 10 SX, an AXI-coherent fabric interconnect runs at hundreds of MHz). The Arria 10 SX family sits in the mid-to-high-performance tier of Intel's (formerly Altera's) FPGA portfolio, between the lower-power Cyclone series and the high-end Stratix 10 line, and is widely used in 5G wireless, radar, medical imaging, and industrial vision.
Key specifications for 10AS048E3F29I2SG include 480K logic elements, a Cortex-A9 dual-core hard processor system up to 1.5 GHz with CoreSight debug, integrated DDR3/DDR4 memory controllers in the HPS, and 28.05 Gbps-capable transceivers on certain package variants. The E3 speed grade and F29 (780-ball FCBGA 29x29 mm) package designation also signal industrial-grade temperature and a thermally-enhanced flip-chip BGA, suitable for sustained high-utilization workloads. The device is configured via JTAG or serial configuration, supports partial reconfiguration, and ships with Quartus Prime design software support.
Architecturally, the 10AS048E3F29I2SG leverages Intel's 20 nm process for the SoC die, pairing a fixed HPS block (Cortex-A9 dual-core, NEON SIMD, L1/L2 caches, SDRAM controller, USB, Ethernet MAC, NAND/NOR flash controllers) with adaptive logic modules (ALMs), embedded M20K memory blocks, and variable-precision DSP blocks. Memory bandwidth and DSP throughput make this part particularly competitive in baseband processing, motor control loops, and image pre-processing pipelines.
Typical applications include 5G remote radio heads (RRH), radar signal processing boards, industrial machine vision, medical imaging accelerators, and high-end test & measurement equipment. Designers often pair this SoC FPGA with external DDR4, high-speed ADC/DAC, and SFP+ or QSFP+ cages to build complete signal-processing subsystems.
When designing with the 10AS048E3F29I2SG, pay close attention to PCB layout of the 780-ball FCBGA - use microvia stack-ups, matched-length HPS-to-FPGA bridge traces, and a multi-rail power solution that meets the FPGA core, HPS core, transceiver, and auxiliary voltage requirements. Quartus Prime power estimates are mandatory before committing to the PCB thermal design.
Аналоги без доработки для 10AS048E3F29I2SG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AS048E3F29I2SG (тот же форм-фактор и посадочное место) — отличается по Package, Mounting Type, Process Technology, RoHS Status, Package Code.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AS048E3F29I2LG
✅ Прямая замена✓ В наличии
$1320 / шт.
Открыть даташит →10AS048E3F29E2SG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
10AS048E3F29E2LG
✅ Прямая замена✓ В наличии
$7100 / шт.
Открыть даташит →10AS048E2F29I2SG
✅ Прямая замена✓ В наличии
$1980 / шт.
Открыть даташит →10AS048E2F29I2LG
✅ Прямая замена✓ В наличии
$2295 / шт.
Открыть даташит →10AS048E2F29E2SG
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →10AS048E2F29E2LG
✅ Прямая замена✓ В наличии
$1995 / шт.
Открыть даташит →10AS048E3F29I2SG Максимальные параметры и электрические характеристики
| Series | Arria 10 SX |
| Device Subfamily | 10AS048 (480K logic elements) |
| Logic Elements | 480,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 1.5 GHz |
| Speed Grade | E3 |
| Корпус | 780-FBGA, FC (29x29 mm) |
| Package Designator | F29 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration | JTAG / Serial |
| Process Technology | 20 nm |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
| Design Software | Intel Quartus Prime |
Руководство по цоколевке 10AS048E3F29I2SG в корпусе f29
Цоколевка для 10AS048E3F29I2SG (корпус f29). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AS048E3F29I2SG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AS048E3F29I2SG подходит для 6 применениеs: 5G Remote Radio Head (RRH), Radar Signal Processing, Industrial Machine Vision, Medical Imaging Accelerator, Test & Measurement Equipment, Video Broadcast Infrastructure.
5G Remote Radio Head (RRH)
The 10AS048E3F29I2SG is well matched to 5G RRH baseband because its dual Cortex-A9 HPS at 1.5 GHz runs the L2/L3 protocol stack and OAM while the 480K logic-element fabric implements the PHY-layer channel coding, FFT/iFFT, and crest-factor reduction in variable-precision DSP blocks. Up to 28.05 Gbps transceivers on Arria 10 SX variants interface directly with AD/DA converters and CPRI/eCPRI links to the baseband unit. Industrial temperature grade and 20 nm process node support outdoor tower-mount deployments. The HPS-to-FPGA AXI bridge provides coherent low-latency data movement between processor and FPGA pipeline, eliminating external chip-to-chip transfers.
Рекомендуется
Radar Signal Processing
Military, automotive, and weather-radar systems use the 10AS048E3F29I2SG to implement pulse compression, MTI filtering, and CFAR detection in the FPGA fabric while the Cortex-A9 HPS handles target tracking and display rendering. The device's high DSP block count and 20 nm process enable real-time processing of multi-gigasample-per-second ADC streams. The 780-FBGA package's flip-chip thermal performance sustains full DSP utilization at industrial temperature. HPS peripherals (Gigabit Ethernet, USB) connect directly to radar data recorders and operator consoles without external bridge chips.
Рекомендуется
Industrial Machine Vision
The 10AS048E3F29I2SG powers high-speed line-scan and area-scan camera systems used in semiconductor inspection, food sorting, and print inspection. The FPGA fabric preprocesses Bayer-pattern, GigE Vision, or CoaXPress image streams at multi-gigabit rates, while the dual Cortex-A9 runs the Linux-based inspection application, defect-classification CNN inference (if quantized), and industrial Ethernet (PROFINET, EtherNet/IP) stacks. Industrial temperature operation and the flip-chip BGA's robust mechanical properties suit factory-floor 24/7 duty cycles. DDR4 controller bandwidth and on-chip M20K memory buffers smooth bursty data rates.
Рекомендуется
Medical Imaging Accelerator
Ultrasound, CT, and MRI reconstruction systems use the 10AS048E3F29I2SG to accelerate beamforming, back-projection, and FFT pipelines in hardware while the Cortex-A9 HPS manages the user interface, DICOM networking, and patient database. The Arria 10 SX family's medical-grade reliability, low-jitter transceivers, and deterministic latency are critical for diagnostic accuracy. Variable-precision DSP blocks allow runtime switching between integer and floating-point accumulation for image-quality vs throughput trade-offs. The 780-FBGA's compact footprint helps fit four or more SoC FPGAs into a single imaging board.
Рекомендуется
Test & Measurement Equipment
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS048E3F29I2SG's FPGA fabric for real-time DSP (FFT, filtering, decimation) on multi-GSps ADC data while the HPS runs the touch-screen UI, Ethernet/SCPI remote control, and storage management. The integrated HPS eliminates the host processor that previously occupied a separate slot in the chassis, reducing BOM cost and shortening signal-trace paths between converter and DSP. Multiple high-speed transceivers feed PCIe Gen3 host interfaces or aggregated 10/25 GbE backhaul to the test rack.
Рекомендуется
Video Broadcast Infrastructure
Broadcast video routers, multi-viewers, and IP-SDI gateways use the 10AS048E3F29I2SG to bridge 12G-SDI/Quad-Link 3G-SDI to SMPTE ST 2110 IP streams in a single device. The FPGA fabric handles uncompressed video multiplexing, genlock, and on-screen display overlay while the HPS runs control-plane software and SNMP/JSON management. Arria 10 SX's transceiver count and ST 2110 timing precision suit 4K/UHD production environments. Industrial temperature rating supports outdoor broadcast truck and OB-van deployments without active cooling redesign.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AS048E3F29I2SG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AS048E3F29I2LG | 10AS048E3F29E2SG | 10AS048E3F29E2LG | 10AS048E2F29I2SG | 10AS048E2F29I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA, FC (29x29 mm) | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | E3 | E3 | E2 | E2 | E3 | E3 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore ~1.4 GHz | Dual ARM Cortex-A9 MPCore ~1.4 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Terminal Finish | Lead-free (SG suffix) | Leaded (LG suffix) | Lead-free (SG suffix) | Leaded (LG suffix) | Lead-free (SG suffix) | Leaded (LG suffix) |
Ключевые отличия
- Single-chip FPGA + dual Cortex-A9 HPS integration eliminates external processor (против Cyclone V SoC (e.g., 5CSEBA6U23I7))
- E3 speed grade offers highest Fmax in the 10AS048 F29 family (против 10AS048E3F29E2SG (E2 speed grade variant))
- Pin-compatible leaded finish option for aerospace/defense assembly lines (против 10AS048E3F29I2LG (LG suffix = leaded))
Заметки по проектированию
Estimated: The 780-FBGA flip-chip BGA package of the 10AS048E3F29I2SG benefits from a 12-layer or 14-layer PCB stack-up with a solid ground/thermal via array under the center balls. Quartus Prime Early Power Estimator (EPE) should be run with realistic toggle rates and DSP utilization (the device can draw 15-25 W at full DSP load); a heatsink with 1-2 C/W thermal resistance or a 200+ LFM airflow is typically required for sustained industrial-temperature operation. Junction-to-ambient thermal resistance depends strongly on PCB copper area, so allocate at least 25 sq cm of unbroken 1 oz copper on top and inner layers tied to the thermal pad balls.
The 780-ball FCBGA with 1.0 mm pitch requires microvia (laser-drilled) stack-up technology with 0.4-0.5 mm via pads and high-density interconnect (HDI) layer breaks. Maintain 100 ohm differential impedance for transceiver lanes (XCVR) and 85 ohm for HPS EMIF DDR4. Match HPS-to-FPGA bridge (AXI) trace lengths within 25 ps of skew to avoid hold-time violations. Place decoupling capacitors on the bottom side directly under the BGA's power/ground balls using 0201 or 0402 footprints, with via-in-pad preferred for the smallest capacitors to minimize loop inductance.
The 10AS048E3F29I2SG requires a minimum of four independent power rails: FPGA core (typically 0.9 V), HPS core (0.9-1.0 V), transceiver supply (1.0-1.1 V), and auxiliary I/O (1.8 V, 2.5 V, 3.3 V depending on bank). Use a multi-phase PWM controller for the FPGA/HPS core rails capable of 30-40 A peak, with remote sense lines tied to the BGA ball side. Power-on sequencing must follow the Intel Arria 10 SX POR (Power-On Reset) sequence - core rail first, then HPS, then I/O, then transceivers; failure to sequence correctly will latch-up or trigger brown-out reset.
Do not assume the 10AS048E3F29I2SG is drop-in compatible with larger Arria 10 SX variants (10AS066, 10AS115) in the same F29 package - those larger logic counts use bigger BGA packages (F34, F35, F40). Quartus Prime fitter must be re-run for every speed-grade change; the E3 vs E2 swap typically requires re-timing critical paths by ~10-15%. Configuration via JTAG and serial modes both require pull-ups on dedicated config pins per the pin connection guidelines - missing pull-ups result in intermittent configuration failure at production test.
For 10 Gbps+ transceiver channels, maintain 100 ohm differential impedance with intra-pair skew under 0.15 ps/mm and AC-coupling capacitors placed within 200 mil of the device balls. Use HSDIO-3D or HFSS field-solver models for via-stub optimization - back-drill transceiver vias to the 3rd or 4th layer to suppress stub resonances above 15 GHz. HPS DDR4 channels require matched fly-by topology with VTT termination; keep command/address traces within 50 ps of the longest DQS trace per the Arria 10 SX external memory interface guidelines.
Информация о соответствии
RoHS compliant per Intel/Altera product page. Lead-free terminal finish indicated by SG suffix; LG variants are leaded. Industrial temperature grade is not AEC-Q100 qualified.