10AS048E3F29I2SG - Arria 10 SX 480K SoC FPGA | Intel | 780-FBGA
MPN: 10AS048E3F29I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1550 | $387,500.00 |
| 500 | $1480 | $740,000.00 |
Drop-in alternatives for 10AS048E3F29I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048E3F29I2LG
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$1320 / Unit
View Datasheet →10AS048E3F29E2SG
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10AS048E3F29E2LG
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$7100 / Unit
View Datasheet →10AS048E2F29I2SG
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$1980 / Unit
View Datasheet →10AS048E2F29I2LG
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$2295 / Unit
View Datasheet →10AS048E2F29E2SG
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View Datasheet →10AS048E2F29E2LG
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$1995 / Unit
View Datasheet →10AS048E3F29I2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Device Subfamily | 10AS048 (480K logic elements) |
| Logic Elements | 480,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 1.5 GHz |
| Speed Grade | E3 |
| Package | 780-FBGA, FC (29x29 mm) |
| Package Designator | F29 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration | JTAG / Serial |
| Process Technology | 20 nm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
| Design Software | Intel Quartus Prime |
10AS048E3F29I2SG f29 Pin Configuration Guide
Complete pinout information for 10AS048E3F29I2SG (f29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E3F29I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E3F29I2SG is suitable for 6 applications: 5G Remote Radio Head (RRH), Radar Signal Processing, Industrial Machine Vision, Medical Imaging Accelerator, Test & Measurement Equipment, Video Broadcast Infrastructure.
5G Remote Radio Head (RRH)
The 10AS048E3F29I2SG is well matched to 5G RRH baseband because its dual Cortex-A9 HPS at 1.5 GHz runs the L2/L3 protocol stack and OAM while the 480K logic-element fabric implements the PHY-layer channel coding, FFT/iFFT, and crest-factor reduction in variable-precision DSP blocks. Up to 28.05 Gbps transceivers on Arria 10 SX variants interface directly with AD/DA converters and CPRI/eCPRI links to the baseband unit. Industrial temperature grade and 20 nm process node support outdoor tower-mount deployments. The HPS-to-FPGA AXI bridge provides coherent low-latency data movement between processor and FPGA pipeline, eliminating external chip-to-chip transfers.
Recommended
Radar Signal Processing
Military, automotive, and weather-radar systems use the 10AS048E3F29I2SG to implement pulse compression, MTI filtering, and CFAR detection in the FPGA fabric while the Cortex-A9 HPS handles target tracking and display rendering. The device's high DSP block count and 20 nm process enable real-time processing of multi-gigasample-per-second ADC streams. The 780-FBGA package's flip-chip thermal performance sustains full DSP utilization at industrial temperature. HPS peripherals (Gigabit Ethernet, USB) connect directly to radar data recorders and operator consoles without external bridge chips.
Recommended
Industrial Machine Vision
The 10AS048E3F29I2SG powers high-speed line-scan and area-scan camera systems used in semiconductor inspection, food sorting, and print inspection. The FPGA fabric preprocesses Bayer-pattern, GigE Vision, or CoaXPress image streams at multi-gigabit rates, while the dual Cortex-A9 runs the Linux-based inspection application, defect-classification CNN inference (if quantized), and industrial Ethernet (PROFINET, EtherNet/IP) stacks. Industrial temperature operation and the flip-chip BGA's robust mechanical properties suit factory-floor 24/7 duty cycles. DDR4 controller bandwidth and on-chip M20K memory buffers smooth bursty data rates.
Recommended
Medical Imaging Accelerator
Ultrasound, CT, and MRI reconstruction systems use the 10AS048E3F29I2SG to accelerate beamforming, back-projection, and FFT pipelines in hardware while the Cortex-A9 HPS manages the user interface, DICOM networking, and patient database. The Arria 10 SX family's medical-grade reliability, low-jitter transceivers, and deterministic latency are critical for diagnostic accuracy. Variable-precision DSP blocks allow runtime switching between integer and floating-point accumulation for image-quality vs throughput trade-offs. The 780-FBGA's compact footprint helps fit four or more SoC FPGAs into a single imaging board.
Recommended
Test & Measurement Equipment
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS048E3F29I2SG's FPGA fabric for real-time DSP (FFT, filtering, decimation) on multi-GSps ADC data while the HPS runs the touch-screen UI, Ethernet/SCPI remote control, and storage management. The integrated HPS eliminates the host processor that previously occupied a separate slot in the chassis, reducing BOM cost and shortening signal-trace paths between converter and DSP. Multiple high-speed transceivers feed PCIe Gen3 host interfaces or aggregated 10/25 GbE backhaul to the test rack.
Recommended
Video Broadcast Infrastructure
Broadcast video routers, multi-viewers, and IP-SDI gateways use the 10AS048E3F29I2SG to bridge 12G-SDI/Quad-Link 3G-SDI to SMPTE ST 2110 IP streams in a single device. The FPGA fabric handles uncompressed video multiplexing, genlock, and on-screen display overlay while the HPS runs control-plane software and SNMP/JSON management. Arria 10 SX's transceiver count and ST 2110 timing precision suit 4K/UHD production environments. Industrial temperature rating supports outdoor broadcast truck and OB-van deployments without active cooling redesign.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E3F29I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E3F29I2LG | 10AS048E3F29E2SG | 10AS048E3F29E2LG | 10AS048E2F29I2SG | 10AS048E2F29I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA, FC (29x29 mm) | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | E3 | E3 | E2 | E2 | E3 | E3 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore ~1.4 GHz | Dual ARM Cortex-A9 MPCore ~1.4 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz | Dual ARM Cortex-A9 MPCore 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Terminal Finish | Lead-free (SG suffix) | Leaded (LG suffix) | Lead-free (SG suffix) | Leaded (LG suffix) | Lead-free (SG suffix) | Leaded (LG suffix) |
| Approximate 1 pc Price (USD) | $1,850 | $1,850 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Single-chip FPGA + dual Cortex-A9 HPS integration eliminates external processor (vs Cyclone V SoC (e.g., 5CSEBA6U23I7))
- E3 speed grade offers highest Fmax in the 10AS048 F29 family (vs 10AS048E3F29E2SG (E2 speed grade variant))
- Pin-compatible leaded finish option for aerospace/defense assembly lines (vs 10AS048E3F29I2LG (LG suffix = leaded))
Design Notes
Estimated: The 780-FBGA flip-chip BGA package of the 10AS048E3F29I2SG benefits from a 12-layer or 14-layer PCB stack-up with a solid ground/thermal via array under the center balls. Quartus Prime Early Power Estimator (EPE) should be run with realistic toggle rates and DSP utilization (the device can draw 15-25 W at full DSP load); a heatsink with 1-2 C/W thermal resistance or a 200+ LFM airflow is typically required for sustained industrial-temperature operation. Junction-to-ambient thermal resistance depends strongly on PCB copper area, so allocate at least 25 sq cm of unbroken 1 oz copper on top and inner layers tied to the thermal pad balls.
The 780-ball FCBGA with 1.0 mm pitch requires microvia (laser-drilled) stack-up technology with 0.4-0.5 mm via pads and high-density interconnect (HDI) layer breaks. Maintain 100 ohm differential impedance for transceiver lanes (XCVR) and 85 ohm for HPS EMIF DDR4. Match HPS-to-FPGA bridge (AXI) trace lengths within 25 ps of skew to avoid hold-time violations. Place decoupling capacitors on the bottom side directly under the BGA's power/ground balls using 0201 or 0402 footprints, with via-in-pad preferred for the smallest capacitors to minimize loop inductance.
The 10AS048E3F29I2SG requires a minimum of four independent power rails: FPGA core (typically 0.9 V), HPS core (0.9-1.0 V), transceiver supply (1.0-1.1 V), and auxiliary I/O (1.8 V, 2.5 V, 3.3 V depending on bank). Use a multi-phase PWM controller for the FPGA/HPS core rails capable of 30-40 A peak, with remote sense lines tied to the BGA ball side. Power-on sequencing must follow the Intel Arria 10 SX POR (Power-On Reset) sequence - core rail first, then HPS, then I/O, then transceivers; failure to sequence correctly will latch-up or trigger brown-out reset.
Do not assume the 10AS048E3F29I2SG is drop-in compatible with larger Arria 10 SX variants (10AS066, 10AS115) in the same F29 package - those larger logic counts use bigger BGA packages (F34, F35, F40). Quartus Prime fitter must be re-run for every speed-grade change; the E3 vs E2 swap typically requires re-timing critical paths by ~10-15%. Configuration via JTAG and serial modes both require pull-ups on dedicated config pins per the pin connection guidelines - missing pull-ups result in intermittent configuration failure at production test.
For 10 Gbps+ transceiver channels, maintain 100 ohm differential impedance with intra-pair skew under 0.15 ps/mm and AC-coupling capacitors placed within 200 mil of the device balls. Use HSDIO-3D or HFSS field-solver models for via-stub optimization - back-drill transceiver vias to the 3rd or 4th layer to suppress stub resonances above 15 GHz. HPS DDR4 channels require matched fly-by topology with VTT termination; keep command/address traces within 50 ps of the longest DQS trace per the Arria 10 SX external memory interface guidelines.
Compliance Information
RoHS compliant per Intel/Altera product page. Lead-free terminal finish indicated by SG suffix; LG variants are leaded. Industrial temperature grade is not AEC-Q100 qualified.
