10AS048E3F29I2LG - Arria 10 SX SoC FPGA, 480K LE, Dual A9, 780-FBGA | Intel
MPN: 10AS048E3F29I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
Drop-in alternatives for 10AS048E3F29I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048E3F29E2LG
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View Datasheet →10AS048E3F29I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480000 |
| Process Technology | 20 nm (TSMC) |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS CPU Frequency | 1.5 GHz |
| Package | 780-FBGA, FC (29x29 mm) |
| Package Code | F29 |
| Speed Grade | 3 |
| Temperature Grade | Industrial (-40C to +100C TJ) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Range | -40C to +100C |
10AS048E3F29I2LG f29 Pin Configuration Guide
Complete pinout information for 10AS048E3F29I2LG (f29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E3F29I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E3F29I2LG is suitable for 6 applications: Industrial Motor Drive & Motion Control, Software-Defined Radio & Wireless Baseband, Medical Imaging & Diagnostic Equipment, Broadcast Video Processing & Studio Equipment, Military & Aerospace Signal Processing, High-Performance Embedded Computing Platforms.
Industrial Motor Drive & Motion Control
The 10AS048E3F29I2LG fits industrial motor drives because the Arria 10 SX SoC combines a hard dual-core ARM Cortex-A9 HPS for control-loop software (PID, commutation, field-oriented control) with 480K logic elements that can implement multi-axis PWM generation, encoder decoding, and field-weakening algorithms in custom logic. The industrial temperature grade supports factory-floor deployment, while the integrated DDR3/DDR4 controllers feed the deterministic data paths needed for real-time torque control. The 1.5 GHz Cortex-A9 pair handles Linux or RTOS supervisory stacks alongside the FPGA fabric's hardware-accelerated current/voltage loops, reducing bill-of-materials cost versus a discrete MCU+FPGA architecture.
Recommended
Software-Defined Radio & Wireless Baseband
For software-defined radio and wireless baseband, the 10AS048E3F29I2LG delivers up to 28.05 Gbps transceivers alongside 480K logic elements and dedicated DSP blocks with single/double-precision floating point. The hard dual Cortex-A9 HPS runs the MAC layer and protocol stacks under Linux while the FPGA fabric implements channelization, FFT/iFFT, modulation/demodulation, and crest-factor reduction. The 20 nm process and integrated PCIe Gen3 x8 enable high-throughput data offload to a host CPU or DSP co-processor, which is essential for multi-antenna MIMO and small-cell 4G/5G baseband cards.
Recommended
Medical Imaging & Diagnostic Equipment
The 10AS048E3F29I2LG suits medical imaging systems such as ultrasound beamformers, CT reconstruction pipelines, and MRI receivers because the 480K logic elements implement parallel beamforming and back-projection kernels while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and image post-processing. Hardware floating-point DSP blocks accelerate tomographic reconstruction algorithms in real time, and the industrial temperature range supports the controlled thermal environment of medical carts and stationary imaging suites. The integrated PCIe Gen3 endpoint interfaces directly to host workstations or storage arrays for raw image data ingest.
Recommended
Broadcast Video Processing & Studio Equipment
In broadcast video processing, the 10AS048E3F29I2LG handles 4K/UHD HEVC encoding assist, multi-stream SDI interfacing, and real-time color-space conversion using its 480K logic elements and DSP blocks. The hard ARM Cortex-A9 HPS runs control-plane software such as SMPTE 2110 IP stacks, while the FPGA fabric implements low-latency video pipelines. Transceiver rates up to 28.05 Gbps support 12G-SDI and 25G Ethernet for studio backbone connectivity, and the 20 nm process provides the throughput-per-watt required for in-rack broadcast appliances.
Recommended
Military & Aerospace Signal Processing
For military and aerospace signal processing - including radar, electronic warfare, and avionics - the 10AS048E3F29I2LG provides high DSP throughput with floating-point support for FFT-based algorithms, plus hardened memory controllers and SERDES for secure sensor data links. The industrial temperature grade supports ruggedized enclosures. The hard ARM cores run secure boot, RTOS, and mission software while the FPGA fabric implements signal detection and tracking pipelines. For full MIL-PRF-grade screened variants, customers should consult Intel's military/aerospace part-number families separately.
Recommended
High-Performance Embedded Computing Platforms
The 10AS048E3F29I2LG serves as the compute heart of high-performance embedded systems such as test and measurement instruments, industrial PCs, and edge AI acceleration cards, where the dual Cortex-A9 HPS runs a Linux or RTOS supervisory stack and the FPGA fabric implements custom data acquisition, protocol bridging, or ML inference pipelines. The integrated PCIe Gen3 x8 endpoint allows direct insertion into host systems as a co-processor card. With 480K logic elements, ample DSP, and 20 nm performance, the device delivers a compelling compute density for space- and power-constrained embedded deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E3F29I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E3F29E2LG | 10AS048E2F29I2LG | 10AS048E2F29I2SG | 10AS048E2F29E2LG | 10AS048E2F29E2SG | 10AS048E1F29I1HG | 10AS048E2F29I1HG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA F29 (29x29 mm) | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | 3 | 3 | 2 | 2 | 2 | 2 | 1 | 1 |
| Temperature Grade | Industrial (I) | Extended (E) | Industrial (I) | Industrial (I) | Extended (E) | Extended (E) | Industrial (I) | Industrial (I) |
| HPS CPU | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Process Technology | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC |
| Drop-in Compatibility | Reference | Yes - same die, different temp grade | Yes - same die, slower speed grade | Yes - same die, packaging suffix variant | Yes - same die, slower speed + extended temp | Yes - same die, slower speed + extended temp + suffix | Yes - same die, slowest speed grade | Yes - same die, slowest speed grade + suffix |
Key Differentiators
- Hard ARM Cortex-A9 dual-core HPS integrated on-die (vs Pure FPGA (non-SoC) Arria 10 GX 10AX048E3F29I2LG)
- Higher transceiver bandwidth than Cyclone V SoC family (vs Cyclone V SoC 5CSEBA6U23I7 (Cyclone V SE/SoC))
- Mid-range cost-vs-performance vs Stratix 10 SoC (vs Stratix 10 SX 1SX280HN3F43E3VG)
Design Notes
Estimated: The Arria 10 SX 480K-LE SoC FPGA requires at least six separate power rails - core (~0.9 V, up to several amps), HPS core (~0.9 V), HPS I/O, FPGA I/O banks (1.2 V-3.0 V depending on standard), transceiver supplies, and auxiliary. Power sequencing must follow Intel's Arria 10 Power Management User Guide to avoid latch-up during ramp. A multi-phase digital controller such as the Intel Enpirion EM12x030 or similar is recommended for the core rail. Add bulk decoupling of 10x22uF MLCC plus 0.1uF per rail pin near the BGA; place a 1 mF tantalum or polymer cap on the input side to absorb inrush.
Estimated: At sustained full utilization (480K LE at 400 MHz, 28 Gbps transceivers active, HPS at 1.5 GHz with both cores loaded), the F29 FC-FBGA dissipates approximately 15-20 W. The package thermal resistance (theta_JA) is in the low single-digit C/W range when the PCB lands properly expose the die through the BGA thermal lands. Required: a thermal via array stitched directly under the BGA's thermal balls, connected to inner-layer copper planes, plus a top-side heatsink with thermal interface material. Without adequate thermal design, the device will throttle or trip thermal shutdown well before industrial -40C to +100C TJ limits are reached.
The 780-FBGA F29 package (29x29 mm) requires a high-density interconnect PCB with at least 12 layers (signal/ground/power) to route memory, transceivers, and PCIe signals at target impedance. Use 0.4 mm ball pitch escape rules with microvia stacks and stagger the breakout so that any single layer's fanout fits within the 0.4 mm grid. Reference Intel's Arria 10 GX/GT/SX PCB Design Guidelines for stackup recommendations. The DDR3/DDR4 memory interface must be routed with matched-length groups to within 25 ps skew per byte lane to meet 1600 MT/s operation.
Do not confuse the Arria 10 SX (10AS048) with the Arria 10 GX (10AX048) - the SX integrates the hard processor system while the GX does not. Board designs that mistakenly swap SX and GX parts will lose the entire HPS subsystem. Also note that the 'I' in 10AS048E3F29I2LG denotes industrial temperature grade; using an industrial part in an extended-temperature chassis design is fine, but using an extended-grade part where industrial is required (e.g., for warranty) is not. Always validate the Ordering Part Number suffix against Intel's Arria 10 Ordering Information table before PCB assembly.
Compliance Information
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. Intel's automotive Arria 10 variants carry a separate 'automotive' ordering code.
