10AX115S4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
Артикул: 10AX115S4F45E3LG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $7415.21 | $7.415,21 |
| 10 | $6900 | $69.000,00 |
| 100 | $6450 | $645.000,00 |
| 500 | $6100 | $3.050.000,00 |
| 1.000 | $5850 | $5.850.000,00 |
10AX115S4F45E3LG Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, transceivers, and routing resources that can be electrically reconfigured post-manufacture to implement custom digital logic, signal-processing pipelines, or hardware accelerators. FPGAs belong to the broader category of programmable logic devices, sitting between general-purpose microcontrollers and fixed-function ASICs in the design-flexibility vs. unit-cost spectrum, and they are widely deployed in networking, video processing, prototyping, and compute-acceleration workloads.
The Arria 10 GX family delivers up to 96 integrated transceivers operating at 17.4 Gbps (chip-to-chip) and 12.5 Gbps (backplane), hardware floating-point DSP blocks rated at up to 1.5 TFLOPS, a hardened memory controller, and partial reconfiguration support. The 'S' suffix in 10AX115S4F45E3LG denotes a transceiver-rich variant that also incorporates PCIe Gen3 hard IP blocks, making it suitable for heterogeneous systems combining high-speed serial links with parallel processing.
Operationally, the device uses a 0.9 V core supply with separate rails for transceivers and I/O banks supporting LVDS, LVCMOS, and DDR3/4 memory interfaces. Compared with the prior Arria V and Stratix V generations, Arria 10 offers roughly 2x the DSP performance per watt and a more integrated hardened protocol stack.
Typical applications include 4K/8K video processing, broadcast infrastructure, 100G/400G networking line cards, radar and DSP front-ends, and ASIC prototyping. When designing with this FPGA, thermal management is critical because of its 624 I/O and 1.15M LE density; a multi-layer PCB with at least 1 oz copper pours and forced-air cooling is recommended. Quartus Prime is the primary toolchain for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, lead-time information, drop-in alternative part numbers, and practical PCB and thermal design notes not found in the manufacturer datasheet. XAIPART cross-references the entire 10AX115 Arria 10 GX family to help engineers choose the right speed grade, temperature grade, and pin-compatible variant for their design.
Аналоги без доработки для 10AX115S4F45E3LG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AX115S4F45E3LG (тот же форм-фактор и посадочное место) — отличается по Package, Embedded Memory, Speed Grade, Transceivers, Temperature Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AX115S3F45E2LG
✅ Прямая замена✓ В наличии
$7950 / шт.
Открыть даташит →10AX115S2F45E2LG
✅ Прямая замена✓ В наличии
$7100 / шт.
Открыть даташит →10AX115N4F45E3LG
✅ Прямая замена✓ В наличии
$7100 / шт.
Открыть даташит →10AX090S4F45E3LG
✅ Прямая замена✓ В наличии
$4582.63 / шт.
Открыть даташит →10AX115S4F45I3LG
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$10000 / шт.
Открыть даташит →10AX115S4F45E3LG Максимальные параметры и электрические характеристики
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| Maximum User I/O | 624 |
| Корпус | 1932-BBGA, FCBGA, 45 x 45 mm |
| Speed Grade | -3 (E3, extended grade) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) |
| Рабочая температура | Extended (industrial grade) |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant |
| Configuration Memory | On-chip, SRAM-based |
| Hardened PCIe | PCIe Gen3 hard IP |
Руководство по цоколевке 10AX115S4F45E3LG в корпусе 1932-bbga, fcbga, 45 x 45 mm
Цоколевка для 10AX115S4F45E3LG (корпус 1932-bbga, fcbga, 45 x 45 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AX115S4F45E3LG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AX115S4F45E3LG подходит для 6 применениеs: 100G/400G Networking Line Cards, 4K/8K Video Processing & Broadcast, ASIC Prototyping & Emulation, Radar & DSP Front-End Processing, Industrial Imaging & Machine Vision, High-Performance Computing Acceleration.
100G/400G Networking Line Cards
The 10AX115S4F45E3LG's 96 transceiver channels at 17.4 Gbps and hardened PCIe Gen3 IP deliver aggregate serial bandwidth well above 1 Tbps, making it a strong fit for 100G/400G Ethernet switch line cards and OTN framer designs. Its 1.15M LEs and 68.86 Mbit block RAM provide the parallelism needed for packet classification and buffer management. Compared with a smaller FPGA, the high density reduces chip count and lowers BOM cost per port, while the F45 package's 45 x 45 mm footprint gives routing room for high-density SERDES break-out.
Рекомендуется
4K/8K Video Processing & Broadcast
The Arria 10 GX architecture provides dedicated video processing IP, DDR4 memory controllers, and high DSP throughput - ideal for 4K/8K broadcast encoders, frame-rate converters, and video wall controllers. The 624 user I/Os accommodate multi-channel SDI, HDMI 2.0, and DisplayPort 1.4 interfaces simultaneously. Designers benefit from the 68.86 Mbit of embedded memory for line buffering and motion-estimation scratchpads, and the 0.9 V core helps meet broadcast-equipment power budgets. The F45 FCBGA-1932 is thermally robust enough for fan-cooled chassis typical in studio equipment.
Рекомендуется
ASIC Prototyping & Emulation
With 1.15M logic elements, the 10AX115S4F45E3LG offers capacity to map large ASIC RTL blocks - typically 20-30 million gates of synthesized logic - into a multi-FPGA partitioned prototype. The hardened memory controllers and PCIe Gen3 IP preserve timing fidelity when emulating SoC interconnects. Designers use the abundant user I/Os (624) to break out ASIC testbench stimulus and trace signals. Compared with using older Arria V or Stratix V parts, the 20 nm process and higher DSP count cut prototype compile time and improve achievable clock rates.
Рекомендуется
Radar & DSP Front-End Processing
The Arria 10 GX's hardware floating-point DSP blocks rated at up to 1.5 TFLOPS suit radar beamforming, FFT processing, and electronic-warfare front-end designs. The 17.4 Gbps transceivers connect directly to high-speed ADCs and DACs typically used in phased-array antennas, reducing latency versus an FPGA with slower SERDES. The 1.15M LE budget accommodates multi-channel FFT pipelines, while the 68.86 Mbit of block RAM serves as window-coefficient storage. Defense and aerospace designs benefit from the extended-grade operating temperature range and BGA package's mechanical robustness.
Рекомендуется
Industrial Imaging & Machine Vision
High-resolution industrial cameras, multi-sensor inspection systems, and machine-vision controllers require high I/O count, fast DSP throughput, and large embedded memory - exactly what the 10AX115S4F45E3LG provides. The 624 I/Os can interface with multiple Camera Link, CoaXPress, or MIPI CSI-2 sensors simultaneously. The 0.9 V core and hardened PCIe Gen3 IP enable compact Vision Box designs that fit in factory-floor enclosures. The F45 FCBGA-1932 package provides sufficient thermal headroom for passive heatsinks in dust-prone environments.
Рекомендуется
High-Performance Computing Acceleration
Data-center compute-accelerator cards using FPGAs as inference engines rely on high logic density, large block RAM, and PCIe Gen3 x8/x16 interfaces - all delivered by the 10AX115S4F45E3LG. Its 1.5 TFLOPS DSP throughput accelerates convolutional neural networks and financial Monte-Carlo simulations, while the 68.86 Mbit of embedded memory caches weight tensors to reduce DDR traffic. The 96 transceivers support high-bandwidth host links (PCIe Gen3) and cluster fabrics. The 0.9 V core and 20 nm process keep per-card power within typical 75-150 W accelerator envelopes.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AX115S4F45E3LG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AX115S3F45E2LG | 10AX115S2F45E2LG | 10AX115N4F45E3LG | 10AX090S4F45E3LG | 10AX115S4F45I3LG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1932 (F45, 45 x 45 mm) | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) | 900,000 (-22%) | 1,150,000 (same) |
| Speed Grade | -3 (E3) | -2 (E2, slower) | -2 (E2, slower) | -3 (E3, same) | -3 (E3, same) | -3 (I3, industrial) |
| Transceiver Variant | S (transceiver-rich) | S (same) | S (same) | N (transceiver-light) | S (same) | S (same) |
| RoHS / Lead-Free | Yes (LG suffix) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) |
Ключевые отличия
- Highest-density Arria 10 GX with full transceiver suite (против 10AX090S4F45E3LG)
- S speed grade provides more transceivers per row than N (против 10AX115N4F45E3LG)
- E3 speed grade enables higher Fmax than E2 (против 10AX115S3F45E2LG)
Заметки по проектированию
Estimated: with all 624 I/Os switching at 200 MHz and transceivers at 10 Gbps, the 10AX115S4F45E3LG can dissipate 15-25 W. A multi-layer PCB (at least 12 layers with 1 oz copper on outer layers and 2 oz on inner planes) plus a 45 x 45 mm heatsink or forced-air cooling (>=2 m/s airflow) is required to keep the junction below 100 C. Apply thermal interface material (TIM) between the FCBGA lid and the heatsink; avoid clipping forces that exceed 30 lbf. Refer to the Intel Arria 10 thermal management application note for board-stack-up guidance.
Place 0.1 uF decoupling capacitors within 100 mil of every power pin, plus 10 uF bulk capacitors every 10 mm along the power rails. The FCBGA-1932 package requires microvia (laser-drilled) stack-ups to fan out the inner-row balls; design for 0.5 mm ball pitch and 0.25 mm via pad. Match lengths of high-speed transceiver lanes within 0.127 mm (5 mil) and keep differential pairs at 100 ohm +/- 10% impedance. Reference the Intel Arria 10 PCB design guidelines for via-in-pad recommendations.
Do not under-rate the configuration clock oscillator - the Arria 10 GX requires a stable, low-jitter clock during power-up and configuration. Do not populate the wrong speed grade - substituting -3 with -2 in the same Quartus project file will yield timing failures; always re-run the timing analyzer. Do not exceed the maximum of 96 transceiver channels; SERDES lanes left floating can radiate noise. Finally, verify that the heatsink mounting clip does not short any BGA balls along the package edge.
Информация о соответствии
RoHS compliance inferred from 'LG' suffix in the ordering code per Intel Arria 10 datasheet conventions. Halogen-free status not verified from provided data. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
