10AX115S4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN: 10AX115S4F45E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7415.21 | $7,415.21 |
| 10 | $6900 | $69,000.00 |
| 100 | $6450 | $645,000.00 |
| 500 | $6100 | $3,050,000.00 |
| 1,000 | $5850 | $5,850,000.00 |
Drop-in alternatives for 10AX115S4F45E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115S3F45E2LG
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View Datasheet →10AX115S2F45E2LG
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View Datasheet →10AX115N4F45E3LG
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View Datasheet →10AX090S4F45E3LG
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View Datasheet →10AX115S4F45I3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AX115S4F45E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| Maximum User I/O | 624 |
| Package | 1932-BBGA, FCBGA, 45 x 45 mm |
| Speed Grade | -3 (E3, extended grade) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) |
| Operating Temperature | Extended (industrial grade) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Memory | On-chip, SRAM-based |
| Hardened PCIe | PCIe Gen3 hard IP |
10AX115S4F45E3LG 1932-bbga, fcbga, 45 x 45 mm Pin Configuration Guide
Complete pinout information for 10AX115S4F45E3LG (1932-bbga, fcbga, 45 x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115S4F45E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115S4F45E3LG is suitable for 6 applications: 100G/400G Networking Line Cards, 4K/8K Video Processing & Broadcast, ASIC Prototyping & Emulation, Radar & DSP Front-End Processing, Industrial Imaging & Machine Vision, High-Performance Computing Acceleration.
100G/400G Networking Line Cards
The 10AX115S4F45E3LG's 96 transceiver channels at 17.4 Gbps and hardened PCIe Gen3 IP deliver aggregate serial bandwidth well above 1 Tbps, making it a strong fit for 100G/400G Ethernet switch line cards and OTN framer designs. Its 1.15M LEs and 68.86 Mbit block RAM provide the parallelism needed for packet classification and buffer management. Compared with a smaller FPGA, the high density reduces chip count and lowers BOM cost per port, while the F45 package's 45 x 45 mm footprint gives routing room for high-density SERDES break-out.
Recommended
4K/8K Video Processing & Broadcast
The Arria 10 GX architecture provides dedicated video processing IP, DDR4 memory controllers, and high DSP throughput - ideal for 4K/8K broadcast encoders, frame-rate converters, and video wall controllers. The 624 user I/Os accommodate multi-channel SDI, HDMI 2.0, and DisplayPort 1.4 interfaces simultaneously. Designers benefit from the 68.86 Mbit of embedded memory for line buffering and motion-estimation scratchpads, and the 0.9 V core helps meet broadcast-equipment power budgets. The F45 FCBGA-1932 is thermally robust enough for fan-cooled chassis typical in studio equipment.
Recommended
ASIC Prototyping & Emulation
With 1.15M logic elements, the 10AX115S4F45E3LG offers capacity to map large ASIC RTL blocks - typically 20-30 million gates of synthesized logic - into a multi-FPGA partitioned prototype. The hardened memory controllers and PCIe Gen3 IP preserve timing fidelity when emulating SoC interconnects. Designers use the abundant user I/Os (624) to break out ASIC testbench stimulus and trace signals. Compared with using older Arria V or Stratix V parts, the 20 nm process and higher DSP count cut prototype compile time and improve achievable clock rates.
Recommended
Radar & DSP Front-End Processing
The Arria 10 GX's hardware floating-point DSP blocks rated at up to 1.5 TFLOPS suit radar beamforming, FFT processing, and electronic-warfare front-end designs. The 17.4 Gbps transceivers connect directly to high-speed ADCs and DACs typically used in phased-array antennas, reducing latency versus an FPGA with slower SERDES. The 1.15M LE budget accommodates multi-channel FFT pipelines, while the 68.86 Mbit of block RAM serves as window-coefficient storage. Defense and aerospace designs benefit from the extended-grade operating temperature range and BGA package's mechanical robustness.
Recommended
Industrial Imaging & Machine Vision
High-resolution industrial cameras, multi-sensor inspection systems, and machine-vision controllers require high I/O count, fast DSP throughput, and large embedded memory - exactly what the 10AX115S4F45E3LG provides. The 624 I/Os can interface with multiple Camera Link, CoaXPress, or MIPI CSI-2 sensors simultaneously. The 0.9 V core and hardened PCIe Gen3 IP enable compact Vision Box designs that fit in factory-floor enclosures. The F45 FCBGA-1932 package provides sufficient thermal headroom for passive heatsinks in dust-prone environments.
Recommended
High-Performance Computing Acceleration
Data-center compute-accelerator cards using FPGAs as inference engines rely on high logic density, large block RAM, and PCIe Gen3 x8/x16 interfaces - all delivered by the 10AX115S4F45E3LG. Its 1.5 TFLOPS DSP throughput accelerates convolutional neural networks and financial Monte-Carlo simulations, while the 68.86 Mbit of embedded memory caches weight tensors to reduce DDR traffic. The 96 transceivers support high-bandwidth host links (PCIe Gen3) and cluster fabrics. The 0.9 V core and 20 nm process keep per-card power within typical 75-150 W accelerator envelopes.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115S4F45E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115S3F45E2LG | 10AX115S2F45E2LG | 10AX115N4F45E3LG | 10AX090S4F45E3LG | 10AX115S4F45I3LG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1932 (F45, 45 x 45 mm) | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) | 900,000 (-22%) | 1,150,000 (same) |
| Speed Grade | -3 (E3) | -2 (E2, slower) | -2 (E2, slower) | -3 (E3, same) | -3 (E3, same) | -3 (I3, industrial) |
| Transceiver Variant | S (transceiver-rich) | S (same) | S (same) | N (transceiver-light) | S (same) | S (same) |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | [DATA_NEEDED] | 68.86 Mbit |
| Max User I/O | 624 | 624 | 624 | 624 | [DATA_NEEDED] | 624 |
| RoHS / Lead-Free | Yes (LG suffix) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) |
Key Differentiators
- Highest-density Arria 10 GX with full transceiver suite (vs 10AX090S4F45E3LG)
- S speed grade provides more transceivers per row than N (vs 10AX115N4F45E3LG)
- E3 speed grade enables higher Fmax than E2 (vs 10AX115S3F45E2LG)
Design Notes
Estimated: with all 624 I/Os switching at 200 MHz and transceivers at 10 Gbps, the 10AX115S4F45E3LG can dissipate 15-25 W. A multi-layer PCB (at least 12 layers with 1 oz copper on outer layers and 2 oz on inner planes) plus a 45 x 45 mm heatsink or forced-air cooling (>=2 m/s airflow) is required to keep the junction below 100 C. Apply thermal interface material (TIM) between the FCBGA lid and the heatsink; avoid clipping forces that exceed 30 lbf. Refer to the Intel Arria 10 thermal management application note for board-stack-up guidance.
Place 0.1 uF decoupling capacitors within 100 mil of every power pin, plus 10 uF bulk capacitors every 10 mm along the power rails. The FCBGA-1932 package requires microvia (laser-drilled) stack-ups to fan out the inner-row balls; design for 0.5 mm ball pitch and 0.25 mm via pad. Match lengths of high-speed transceiver lanes within 0.127 mm (5 mil) and keep differential pairs at 100 ohm +/- 10% impedance. Reference the Intel Arria 10 PCB design guidelines for via-in-pad recommendations.
Do not under-rate the configuration clock oscillator - the Arria 10 GX requires a stable, low-jitter clock during power-up and configuration. Do not populate the wrong speed grade - substituting -3 with -2 in the same Quartus project file will yield timing failures; always re-run the timing analyzer. Do not exceed the maximum of 96 transceiver channels; SERDES lanes left floating can radiate noise. Finally, verify that the heatsink mounting clip does not short any BGA balls along the package edge.
Compliance Information
RoHS compliance inferred from 'LG' suffix in the ordering code per Intel Arria 10 datasheet conventions. Halogen-free status not verified from provided data. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
