10AX115S4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
N.º de pieza: 10AX115S4F45E3LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7415.21 | $7.415,21 |
| 10 | $6900 | $69.000,00 |
| 100 | $6450 | $645.000,00 |
| 500 | $6100 | $3.050.000,00 |
| 1.000 | $5850 | $5.850.000,00 |
10AX115S4F45E3LG Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), dedicated DSP slices, block RAM, transceivers, and routing resources that can be electrically reconfigured post-manufacture to implement custom digital logic, signal-processing pipelines, or hardware accelerators. FPGAs belong to the broader category of programmable logic devices, sitting between general-purpose microcontrollers and fixed-function ASICs in the design-flexibility vs. unit-cost spectrum, and they are widely deployed in networking, video processing, prototyping, and compute-acceleration workloads.
The Arria 10 GX family delivers up to 96 integrated transceivers operating at 17.4 Gbps (chip-to-chip) and 12.5 Gbps (backplane), hardware floating-point DSP blocks rated at up to 1.5 TFLOPS, a hardened memory controller, and partial reconfiguration support. The 'S' suffix in 10AX115S4F45E3LG denotes a transceiver-rich variant that also incorporates PCIe Gen3 hard IP blocks, making it suitable for heterogeneous systems combining high-speed serial links with parallel processing.
Operationally, the device uses a 0.9 V core supply with separate rails for transceivers and I/O banks supporting LVDS, LVCMOS, and DDR3/4 memory interfaces. Compared with the prior Arria V and Stratix V generations, Arria 10 offers roughly 2x the DSP performance per watt and a more integrated hardened protocol stack.
Typical applications include 4K/8K video processing, broadcast infrastructure, 100G/400G networking line cards, radar and DSP front-ends, and ASIC prototyping. When designing with this FPGA, thermal management is critical because of its 624 I/O and 1.15M LE density; a multi-layer PCB with at least 1 oz copper pours and forced-air cooling is recommended. Quartus Prime is the primary toolchain for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, lead-time information, drop-in alternative part numbers, and practical PCB and thermal design notes not found in the manufacturer datasheet. XAIPART cross-references the entire 10AX115 Arria 10 GX family to help engineers choose the right speed grade, temperature grade, and pin-compatible variant for their design.
Alternativas directas para 10AX115S4F45E3LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX115S4F45E3LG (mismo factor de forma y huella) — difiere en Package, Embedded Memory, Speed Grade, Transceivers, Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX115S3F45E2LG
✅ Sustitución directa✓ En stock
$7950 / unidad
Ver hoja de datos →10AX115S2F45E2LG
✅ Sustitución directa✓ En stock
$7100 / unidad
Ver hoja de datos →10AX115N4F45E3LG
✅ Sustitución directa✓ En stock
$7100 / unidad
Ver hoja de datos →10AX090S4F45E3LG
✅ Sustitución directa✓ En stock
$4582.63 / unidad
Ver hoja de datos →10AX115S4F45I3LG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10000 / unidad
Ver hoja de datos →10AX115S4F45E3LG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| Maximum User I/O | 624 |
| Encapsulado | 1932-BBGA, FCBGA, 45 x 45 mm |
| Speed Grade | -3 (E3, extended grade) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) |
| Temperatura de funcionamiento | Extended (industrial grade) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Configuration Memory | On-chip, SRAM-based |
| Hardened PCIe | PCIe Gen3 hard IP |
Guía de configuración de pines de 10AX115S4F45E3LG 1932-bbga, fcbga, 45 x 45 mm
Configuración de pines para 10AX115S4F45E3LG (encapsulado 1932-bbga, fcbga, 45 x 45 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX115S4F45E3LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX115S4F45E3LG es adecuado para 6 aplicacións: 100G/400G Networking Line Cards, 4K/8K Video Processing & Broadcast, ASIC Prototyping & Emulation, Radar & DSP Front-End Processing, Industrial Imaging & Machine Vision, High-Performance Computing Acceleration.
100G/400G Networking Line Cards
The 10AX115S4F45E3LG's 96 transceiver channels at 17.4 Gbps and hardened PCIe Gen3 IP deliver aggregate serial bandwidth well above 1 Tbps, making it a strong fit for 100G/400G Ethernet switch line cards and OTN framer designs. Its 1.15M LEs and 68.86 Mbit block RAM provide the parallelism needed for packet classification and buffer management. Compared with a smaller FPGA, the high density reduces chip count and lowers BOM cost per port, while the F45 package's 45 x 45 mm footprint gives routing room for high-density SERDES break-out.
Recomendado
4K/8K Video Processing & Broadcast
The Arria 10 GX architecture provides dedicated video processing IP, DDR4 memory controllers, and high DSP throughput - ideal for 4K/8K broadcast encoders, frame-rate converters, and video wall controllers. The 624 user I/Os accommodate multi-channel SDI, HDMI 2.0, and DisplayPort 1.4 interfaces simultaneously. Designers benefit from the 68.86 Mbit of embedded memory for line buffering and motion-estimation scratchpads, and the 0.9 V core helps meet broadcast-equipment power budgets. The F45 FCBGA-1932 is thermally robust enough for fan-cooled chassis typical in studio equipment.
Recomendado
ASIC Prototyping & Emulation
With 1.15M logic elements, the 10AX115S4F45E3LG offers capacity to map large ASIC RTL blocks - typically 20-30 million gates of synthesized logic - into a multi-FPGA partitioned prototype. The hardened memory controllers and PCIe Gen3 IP preserve timing fidelity when emulating SoC interconnects. Designers use the abundant user I/Os (624) to break out ASIC testbench stimulus and trace signals. Compared with using older Arria V or Stratix V parts, the 20 nm process and higher DSP count cut prototype compile time and improve achievable clock rates.
Recomendado
Radar & DSP Front-End Processing
The Arria 10 GX's hardware floating-point DSP blocks rated at up to 1.5 TFLOPS suit radar beamforming, FFT processing, and electronic-warfare front-end designs. The 17.4 Gbps transceivers connect directly to high-speed ADCs and DACs typically used in phased-array antennas, reducing latency versus an FPGA with slower SERDES. The 1.15M LE budget accommodates multi-channel FFT pipelines, while the 68.86 Mbit of block RAM serves as window-coefficient storage. Defense and aerospace designs benefit from the extended-grade operating temperature range and BGA package's mechanical robustness.
Recomendado
Industrial Imaging & Machine Vision
High-resolution industrial cameras, multi-sensor inspection systems, and machine-vision controllers require high I/O count, fast DSP throughput, and large embedded memory - exactly what the 10AX115S4F45E3LG provides. The 624 I/Os can interface with multiple Camera Link, CoaXPress, or MIPI CSI-2 sensors simultaneously. The 0.9 V core and hardened PCIe Gen3 IP enable compact Vision Box designs that fit in factory-floor enclosures. The F45 FCBGA-1932 package provides sufficient thermal headroom for passive heatsinks in dust-prone environments.
Recomendado
High-Performance Computing Acceleration
Data-center compute-accelerator cards using FPGAs as inference engines rely on high logic density, large block RAM, and PCIe Gen3 x8/x16 interfaces - all delivered by the 10AX115S4F45E3LG. Its 1.5 TFLOPS DSP throughput accelerates convolutional neural networks and financial Monte-Carlo simulations, while the 68.86 Mbit of embedded memory caches weight tensors to reduce DDR traffic. The 96 transceivers support high-bandwidth host links (PCIe Gen3) and cluster fabrics. The 0.9 V core and 20 nm process keep per-card power within typical 75-150 W accelerator envelopes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX115S4F45E3LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX115S3F45E2LG | 10AX115S2F45E2LG | 10AX115N4F45E3LG | 10AX090S4F45E3LG | 10AX115S4F45I3LG |
|---|---|---|---|---|---|---|
| Package | FCBGA-1932 (F45, 45 x 45 mm) | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) | 900,000 (-22%) | 1,150,000 (same) |
| Speed Grade | -3 (E3) | -2 (E2, slower) | -2 (E2, slower) | -3 (E3, same) | -3 (E3, same) | -3 (I3, industrial) |
| Transceiver Variant | S (transceiver-rich) | S (same) | S (same) | N (transceiver-light) | S (same) | S (same) |
| RoHS / Lead-Free | Yes (LG suffix) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) | Yes (LG) |
Diferenciadores clave
- Highest-density Arria 10 GX with full transceiver suite (frente a 10AX090S4F45E3LG)
- S speed grade provides more transceivers per row than N (frente a 10AX115N4F45E3LG)
- E3 speed grade enables higher Fmax than E2 (frente a 10AX115S3F45E2LG)
Notas de diseño
Estimated: with all 624 I/Os switching at 200 MHz and transceivers at 10 Gbps, the 10AX115S4F45E3LG can dissipate 15-25 W. A multi-layer PCB (at least 12 layers with 1 oz copper on outer layers and 2 oz on inner planes) plus a 45 x 45 mm heatsink or forced-air cooling (>=2 m/s airflow) is required to keep the junction below 100 C. Apply thermal interface material (TIM) between the FCBGA lid and the heatsink; avoid clipping forces that exceed 30 lbf. Refer to the Intel Arria 10 thermal management application note for board-stack-up guidance.
Place 0.1 uF decoupling capacitors within 100 mil of every power pin, plus 10 uF bulk capacitors every 10 mm along the power rails. The FCBGA-1932 package requires microvia (laser-drilled) stack-ups to fan out the inner-row balls; design for 0.5 mm ball pitch and 0.25 mm via pad. Match lengths of high-speed transceiver lanes within 0.127 mm (5 mil) and keep differential pairs at 100 ohm +/- 10% impedance. Reference the Intel Arria 10 PCB design guidelines for via-in-pad recommendations.
Do not under-rate the configuration clock oscillator - the Arria 10 GX requires a stable, low-jitter clock during power-up and configuration. Do not populate the wrong speed grade - substituting -3 with -2 in the same Quartus project file will yield timing failures; always re-run the timing analyzer. Do not exceed the maximum of 96 transceiver channels; SERDES lanes left floating can radiate noise. Finally, verify that the heatsink mounting clip does not short any BGA balls along the package edge.
Información de cumplimiento
RoHS compliance inferred from 'LG' suffix in the ordering code per Intel Arria 10 datasheet conventions. Halogen-free status not verified from provided data. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
