10CL006YU256A7G - Cyclone 10 LP FPGA, 6K LE, 256-UBGA | Intel
Артикул: 10CL006YU256A7G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $48.2 | $48,20 |
| 10 | $43.84 | $438,40 |
| 100 | $38.56 | $3.856,00 |
| 500 | $33.75 | $16.875,00 |
| 1.000 | $28.92 | $28.920,00 |
10CL006YU256A7G Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or complete processor subsystems. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their reconfigurability and from microcontrollers by hardware-parallel execution.
Key features of the 10CL006YU256A7G include 6,272 logic elements, 176 maximum user I/Os supporting multiple I/O standards (LVCMOS, LVDS, LVTTL), 270 Kbits of embedded SRAM distributed across 9-bit M9K blocks, 2 PLLs for clock management, and Cyclone 10 LP's industry-leading low static and dynamic power. The 256-pin UBGA package exposes the device's full I/O bank count while keeping board footprint compact.
Cyclone 10 LP devices use a TSMC 60 nm low-power process with on-chip voltage regulation, achieving low dynamic power without sacrificing performance. The architecture includes embedded multipliers, configuration memory (CRAM), and JTAG-based programming via Quartus Prime. The 10CL006 is the smallest density point in the Cyclone 10 LP family, suiting designs that previously would have used small CPLDs or low-end FPGAs.
Typical applications include industrial motor control, video bridging and processing, I/O expansion and protocol translation, low-cost prototyping, and portable/handheld embedded designs. The 176 I/O count and 6K LE capacity comfortably supports bridging between parallel buses (EMIF, SRAM) and high-speed serial interfaces, plus glue logic and state-machine rich designs.
When designing with the 10CL006YU256A7G, ensure your power rail budget accounts for both quiescent and dynamic ICC, and follow Intel's recommended decoupling network on each I/O bank supply. Quartus Prime Lite edition (free) is sufficient for this device, lowering non-recurring engineering cost.
This page synthesizes distributor pricing, drop-in Cyclone 10 LP density alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для 10CL006YU256A7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10CL006YU256A7G (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Embedded Memory Bits, PLLs.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10CL006YU256C6G
✅ Прямая замена✓ В наличии
$3 / шт.
Открыть даташит →10CL006YU256I7G
✅ Прямая замена✓ В наличии
$6.1 / шт.
Открыть даташит →10CL006YU256C8G
✅ Прямая замена✓ В наличии
$24.6 / шт.
Открыть даташит →10CL006YU256I8G
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
10CL010YU256C6G
✅ Прямая замена✓ В наличии
$9.6 / шт.
Открыть даташит →LFE5U-12F-8BG256C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
10CL006YU256A7G Максимальные параметры и электрические характеристики
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) |
| Maximum User I/Os | 176 |
| PLLs | 2 |
| Корпус | 256-UBGA (Ultra FineLine BGA) |
| Рабочая температура | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) |
| Тип монтажа | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power |
| Supply Voltage - Core | 1.2 V (typical) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) |
| Уровень MSL | 3 (per JEDEC J-STD-020, BGA handling) |
| Статус RoHS | Compliant |
Руководство по цоколевке 10CL006YU256A7G в корпусе 256-ubga (ultra fineline bga)
Цоколевка для 10CL006YU256A7G (корпус 256-ubga (ultra fineline bga)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10CL006YU256A7G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10CL006YU256A7G подходит для 6 применениеs: Industrial Motor Control and Drive, Video Bridging and Display Processing, I/O Expansion and Protocol Translation, Low-Cost Prototyping and Educational Platforms, Automotive In-Vehicle Networks and Sensor Aggregation, Portable and Handheld Embedded Devices.
Industrial Motor Control and Drive
The 10CL006YU256A7G's 6,272 logic elements and 2 PLLs comfortably drive field-oriented control (FOC) loops for small to mid-size BLDC and PMSM motors, while the -40C to +125C temperature grade survives factory-floor environments. Placed between Hall-effect / encoder sensors (3.3V LVCMOS) and the gate driver (5V tolerant I/O bank), the FPGA samples rotor position, computes the Park/Clarke transforms, and generates PWM with sub-microsecond dead-time control. The 176 user I/Os allow direct connection to quadrature encoders, SPI current sensors, and CAN transceivers without external muxing.
Рекомендуется
Video Bridging and Display Processing
The 10CL006YU256A7G acts as a low-cost video bridge between MIPI CSI-2 / parallel CMOS sensors and RGB / LVDS display panels in cost-sensitive embedded vision products. The 6K LE fabric fits pixel pipelines, gamma correction, and on-screen display (OSD) overlays, while the 176 user I/Os handle 24-bit parallel RGB plus control signals. The FPGA's LVDS I/O bank enables direct connection to flat-panel displays without external serializers, reducing BOM cost in industrial HMIs and portable medical tablets.
Рекомендуется
I/O Expansion and Protocol Translation
As an I/O expansion hub, the 10CL006YU256A7G bridges between SPI / I2C / UART microcontrollers and high-pin-count parallel peripherals (FPGA-driven character LCDs, keypads, GPIO expanders). The 6,272 LEs implement multi-master bus arbiters, FIFOs, and timing-critical glue logic that a microcontroller cannot service in software. The 256-UBGA package supports the 176 I/O count needed for 32-bit parallel buses plus enough spare I/O for SPI flash, status LEDs, and JTAG programming.
Рекомендуется
Low-Cost Prototyping and Educational Platforms
Quartus Prime Lite Edition (no license fee) combined with the 10CL006YU256A7G's modest density makes this part ideal for university FPGA labs, maker projects, and proof-of-concept prototypes. Students can implement RISC-V soft cores, custom instruction set simulators, and DSP pipelines without paying for toolchain licenses. The 256-UBGA package exposes enough I/O for typical university peripherals (seven-segment displays, VGA, PS/2 keyboard) while remaining low-cost enough for student kit distribution.
Рекомендуется
Automotive In-Vehicle Networks and Sensor Aggregation
The 'A7G' automotive temperature grade and 176 I/O count make the 10CL006YU256A7G suited for in-vehicle body controllers that aggregate LIN/CAN sensor traffic and drive discrete actuators. The 6K LE fabric fits the CAN-FD controller, message routing, and diagnostic state machines required for ISO 11898 compliance, while the 256-UBGA package handles the dozens of wake-up inputs needed for body ECU applications. Pair with external CAN transceivers for ISO 11898-2 physical layer.
Рекомендуется
Portable and Handheld Embedded Devices
Cyclone 10 LP's industry-leading low static power makes the 10CL006YU256A7G ideal for battery-powered instruments, handheld test equipment, and portable data loggers. The 60 nm low-power process with on-chip voltage regulation draws milliwatts during active operation and microamps in sleep, extending battery life versus competing FPGAs. The 256-UBGA package keeps board footprint under 14x14 mm even with 176 I/Os, fitting handheld enclosures where board real estate is at a premium.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10CL006YU256A7G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10CL006YU256C6G | 10CL006YU256I7G | 10CL006YU256C8G | 10CL010YU256C6G | LFE5U-12F-8BG256C |
|---|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-CABGA - same footprint |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Logic Elements / LUTs | 6,272 LE | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 10,320 LE (+64%) | 12,000 LUTs (+91% equivalent) |
| User I/Os | 176 | 176 (same) | 176 (same) | 176 (same) | 176 (same) | 197 (+12%) |
| Embedded Memory | 270 Kbits (30 M9K) | 270 Kbits (same) | 270 Kbits (same) | 270 Kbits (same) | 414 Kbits (+53%) | 320 Kbits EBR (+19%) |
| PLLs | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
| Operating Temperature Grade | -40C to +125C (Automotive / A7G) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Extended) |
| Approximate Unit Price (qty-1) | $48.20 | $42 - $48 (similar) | $46 - $52 (similar) | $52 - $58 (slightly higher) | $62 - $72 (+35%) | $38 - $45 (cross-brand reference) |
Ключевые отличия
- Lowest density entry point in Cyclone 10 LP family (против 10CL010YU256C6G)
- Automotive / industrial temperature grade option in same footprint (против 10CL006YU256C6G)
- Cross-brand Lattice alternative in same 256-ball footprint (против LFE5U-12F-8BG256C)
Заметки по проектированию
Estimated: With VCCINT = 1.2 V drawing approximately 200 mA active and VCCIO banks at 3.3 V drawing 50 mA combined, total power budget is ~0.4 W for core and ~0.5 W for I/O. The 256-UBGA exposes multiple VCCINT/VCCIO ball pairs; route them with wide copper pours directly under the BGA. Use 0.1 uF + 10 uF ceramic decoupling on every VCC pin pair. Estimated input is 1.2 V x 0.2 A + 3.3 V x 0.15 A = 0.735 W total budget.
The 256-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with via-in-pad or microvia technology for proper BGA breakout. Per JEDEC MSL-3 handling, the device must be baked at 125C for 24 hours before reflow if the humidity indicator card shows exposure beyond 168 hours floor life. Reflow profile must follow JEDEC J-STD-020 with peak temperature 245C maximum.
Do not confuse 10CL006YU256A7G (this part) with 10CL006YE144A7G (144-pin EQFP package); both share the A7G temperature suffix but the package codes YU256 vs YE144 differ. The 10CL006 is the lowest density in the family; if Quartus reports fitter errors exceeding 90% utilization, step up to 10CL010 or 10CL016 in the same 256-UBGA footprint. Ensure MSEL[3:0] pins are tied to the correct configuration mode (AS = fast standard, JTAG = boundary scan).
Use LVDS only on banks 2, 4, 5, 7 (the true LVDS-capable I/O banks per Cyclone 10 LP pin tables); banks 1, 3, 6, 8 only support LVCMOS/LVTTL. Series-termination resistors (33 ohm) are recommended on high-speed LVCMOS outputs above 50 MHz to control ringing. Configure unused I/O pins as inputs with weak pull-up via Quartus pin assignment, never leave them floating on a production board.
Информация о соответствии
RoHS compliant and lead-free per Intel product page. A7G suffix indicates industrial/automotive temperature grade -40C to +125C but is not formal AEC-Q100 qualification (Cyclone 10 LP automotive use requires additional qualification per Intel).
