10CL006YU256A7G - Cyclone 10 LP FPGA, 6K LE, 256-UBGA | Intel
Référence : 10CL006YU256A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.2 | $48,20 |
| 10 | $43.84 | $438,40 |
| 100 | $38.56 | $3 856,00 |
| 500 | $33.75 | $16 875,00 |
| 1 000 | $28.92 | $28 920,00 |
10CL006YU256A7G Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or complete processor subsystems. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their reconfigurability and from microcontrollers by hardware-parallel execution.
Key features of the 10CL006YU256A7G include 6,272 logic elements, 176 maximum user I/Os supporting multiple I/O standards (LVCMOS, LVDS, LVTTL), 270 Kbits of embedded SRAM distributed across 9-bit M9K blocks, 2 PLLs for clock management, and Cyclone 10 LP's industry-leading low static and dynamic power. The 256-pin UBGA package exposes the device's full I/O bank count while keeping board footprint compact.
Cyclone 10 LP devices use a TSMC 60 nm low-power process with on-chip voltage regulation, achieving low dynamic power without sacrificing performance. The architecture includes embedded multipliers, configuration memory (CRAM), and JTAG-based programming via Quartus Prime. The 10CL006 is the smallest density point in the Cyclone 10 LP family, suiting designs that previously would have used small CPLDs or low-end FPGAs.
Typical applications include industrial motor control, video bridging and processing, I/O expansion and protocol translation, low-cost prototyping, and portable/handheld embedded designs. The 176 I/O count and 6K LE capacity comfortably supports bridging between parallel buses (EMIF, SRAM) and high-speed serial interfaces, plus glue logic and state-machine rich designs.
When designing with the 10CL006YU256A7G, ensure your power rail budget accounts for both quiescent and dynamic ICC, and follow Intel's recommended decoupling network on each I/O bank supply. Quartus Prime Lite edition (free) is sufficient for this device, lowering non-recurring engineering cost.
This page synthesizes distributor pricing, drop-in Cyclone 10 LP density alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10CL006YU256A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL006YU256A7G (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Embedded Memory Bits, PLLs.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL006YU256C6G
✅ Remplacement direct✓ En stock
$3 / unité
Voir la fiche technique →10CL006YU256I7G
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →10CL006YU256C8G
✅ Remplacement direct✓ En stock
$24.6 / unité
Voir la fiche technique →10CL006YU256I8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL010YU256C6G
✅ Remplacement direct✓ En stock
$9.6 / unité
Voir la fiche technique →LFE5U-12F-8BG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL006YU256A7G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) |
| Maximum User I/Os | 176 |
| PLLs | 2 |
| Boîtier | 256-UBGA (Ultra FineLine BGA) |
| Température de fonctionnement | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) |
| Type de montage | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power |
| Supply Voltage - Core | 1.2 V (typical) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) |
| Niveau MSL | 3 (per JEDEC J-STD-020, BGA handling) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10CL006YU256A7G 256-ubga (ultra fineline bga)
Configuration des broches du 10CL006YU256A7G (boîtier 256-ubga (ultra fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10CL006YU256A7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10CL006YU256A7G convient pour 6 applications: Industrial Motor Control and Drive, Video Bridging and Display Processing, I/O Expansion and Protocol Translation, Low-Cost Prototyping and Educational Platforms, Automotive In-Vehicle Networks and Sensor Aggregation, Portable and Handheld Embedded Devices.
Industrial Motor Control and Drive
The 10CL006YU256A7G's 6,272 logic elements and 2 PLLs comfortably drive field-oriented control (FOC) loops for small to mid-size BLDC and PMSM motors, while the -40C to +125C temperature grade survives factory-floor environments. Placed between Hall-effect / encoder sensors (3.3V LVCMOS) and the gate driver (5V tolerant I/O bank), the FPGA samples rotor position, computes the Park/Clarke transforms, and generates PWM with sub-microsecond dead-time control. The 176 user I/Os allow direct connection to quadrature encoders, SPI current sensors, and CAN transceivers without external muxing.
Recommandé
Video Bridging and Display Processing
The 10CL006YU256A7G acts as a low-cost video bridge between MIPI CSI-2 / parallel CMOS sensors and RGB / LVDS display panels in cost-sensitive embedded vision products. The 6K LE fabric fits pixel pipelines, gamma correction, and on-screen display (OSD) overlays, while the 176 user I/Os handle 24-bit parallel RGB plus control signals. The FPGA's LVDS I/O bank enables direct connection to flat-panel displays without external serializers, reducing BOM cost in industrial HMIs and portable medical tablets.
Recommandé
I/O Expansion and Protocol Translation
As an I/O expansion hub, the 10CL006YU256A7G bridges between SPI / I2C / UART microcontrollers and high-pin-count parallel peripherals (FPGA-driven character LCDs, keypads, GPIO expanders). The 6,272 LEs implement multi-master bus arbiters, FIFOs, and timing-critical glue logic that a microcontroller cannot service in software. The 256-UBGA package supports the 176 I/O count needed for 32-bit parallel buses plus enough spare I/O for SPI flash, status LEDs, and JTAG programming.
Recommandé
Low-Cost Prototyping and Educational Platforms
Quartus Prime Lite Edition (no license fee) combined with the 10CL006YU256A7G's modest density makes this part ideal for university FPGA labs, maker projects, and proof-of-concept prototypes. Students can implement RISC-V soft cores, custom instruction set simulators, and DSP pipelines without paying for toolchain licenses. The 256-UBGA package exposes enough I/O for typical university peripherals (seven-segment displays, VGA, PS/2 keyboard) while remaining low-cost enough for student kit distribution.
Recommandé
Automotive In-Vehicle Networks and Sensor Aggregation
The 'A7G' automotive temperature grade and 176 I/O count make the 10CL006YU256A7G suited for in-vehicle body controllers that aggregate LIN/CAN sensor traffic and drive discrete actuators. The 6K LE fabric fits the CAN-FD controller, message routing, and diagnostic state machines required for ISO 11898 compliance, while the 256-UBGA package handles the dozens of wake-up inputs needed for body ECU applications. Pair with external CAN transceivers for ISO 11898-2 physical layer.
Recommandé
Portable and Handheld Embedded Devices
Cyclone 10 LP's industry-leading low static power makes the 10CL006YU256A7G ideal for battery-powered instruments, handheld test equipment, and portable data loggers. The 60 nm low-power process with on-chip voltage regulation draws milliwatts during active operation and microamps in sleep, extending battery life versus competing FPGAs. The 256-UBGA package keeps board footprint under 14x14 mm even with 176 I/Os, fitting handheld enclosures where board real estate is at a premium.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL006YU256A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL006YU256C6G | 10CL006YU256I7G | 10CL006YU256C8G | 10CL010YU256C6G | LFE5U-12F-8BG256C |
|---|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-CABGA - same footprint |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Logic Elements / LUTs | 6,272 LE | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 10,320 LE (+64%) | 12,000 LUTs (+91% equivalent) |
| User I/Os | 176 | 176 (same) | 176 (same) | 176 (same) | 176 (same) | 197 (+12%) |
| Embedded Memory | 270 Kbits (30 M9K) | 270 Kbits (same) | 270 Kbits (same) | 270 Kbits (same) | 414 Kbits (+53%) | 320 Kbits EBR (+19%) |
| PLLs | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
| Operating Temperature Grade | -40C to +125C (Automotive / A7G) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Extended) |
| Approximate Unit Price (qty-1) | $48.20 | $42 - $48 (similar) | $46 - $52 (similar) | $52 - $58 (slightly higher) | $62 - $72 (+35%) | $38 - $45 (cross-brand reference) |
Principaux différenciateurs
- Lowest density entry point in Cyclone 10 LP family (vs 10CL010YU256C6G)
- Automotive / industrial temperature grade option in same footprint (vs 10CL006YU256C6G)
- Cross-brand Lattice alternative in same 256-ball footprint (vs LFE5U-12F-8BG256C)
Notes de conception
Estimated: With VCCINT = 1.2 V drawing approximately 200 mA active and VCCIO banks at 3.3 V drawing 50 mA combined, total power budget is ~0.4 W for core and ~0.5 W for I/O. The 256-UBGA exposes multiple VCCINT/VCCIO ball pairs; route them with wide copper pours directly under the BGA. Use 0.1 uF + 10 uF ceramic decoupling on every VCC pin pair. Estimated input is 1.2 V x 0.2 A + 3.3 V x 0.15 A = 0.735 W total budget.
The 256-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with via-in-pad or microvia technology for proper BGA breakout. Per JEDEC MSL-3 handling, the device must be baked at 125C for 24 hours before reflow if the humidity indicator card shows exposure beyond 168 hours floor life. Reflow profile must follow JEDEC J-STD-020 with peak temperature 245C maximum.
Do not confuse 10CL006YU256A7G (this part) with 10CL006YE144A7G (144-pin EQFP package); both share the A7G temperature suffix but the package codes YU256 vs YE144 differ. The 10CL006 is the lowest density in the family; if Quartus reports fitter errors exceeding 90% utilization, step up to 10CL010 or 10CL016 in the same 256-UBGA footprint. Ensure MSEL[3:0] pins are tied to the correct configuration mode (AS = fast standard, JTAG = boundary scan).
Use LVDS only on banks 2, 4, 5, 7 (the true LVDS-capable I/O banks per Cyclone 10 LP pin tables); banks 1, 3, 6, 8 only support LVCMOS/LVTTL. Series-termination resistors (33 ohm) are recommended on high-speed LVCMOS outputs above 50 MHz to control ringing. Configure unused I/O pins as inputs with weak pull-up via Quartus pin assignment, never leave them floating on a production board.
Informations de conformité
RoHS compliant and lead-free per Intel product page. A7G suffix indicates industrial/automotive temperature grade -40C to +125C but is not formal AEC-Q100 qualification (Cyclone 10 LP automotive use requires additional qualification per Intel).
