10CL006YU256I7G - Cyclone 10 LP FPGA, 6K LE, UFBGA-256 | Intel
MPN: 10CL006YU256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.38 | $9.38 |
| 10 | $8.45 | $84.50 |
| 100 | $7.5 | $750.00 |
| 500 | $6.74 | $3,370.00 |
| 1,000 | $6.1 | $6,100.00 |
Drop-in alternatives for 10CL006YU256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL006YU256C8G
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →10CL006YU256C6G
✅ Drop-In✓ In Stock
$3 / Unit
View Datasheet →10CL006YU256A7G
✅ Drop-In✓ In Stock
$28.92 / Unit
View Datasheet →10CL016YU256I7G
✅ Drop-In✓ In Stock
$17.2 / Unit
View Datasheet →10CL025ZU256I8G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL006YU256I7G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Configurable Logic Blocks (CLBs) | 392 |
| Embedded Memory | 276,480 bits |
| Maximum User I/Os | 176 |
| PLLs | 6 (fractional) |
| Core Voltage | 1.0 V (with internal regulation) |
| Operating Temperature (Industrial) | -40C to +100C |
| Package | 256-UBGA (U256) |
| Mounting Type | Surface Mount |
| Configuration Scheme | AS, PS, JTAG |
| RoHS Status | Compliant |
| Process Technology | TSMC 60 nm low-power |
10CL006YU256I7G 256-ubga (u256) Pin Configuration Guide
Complete pinout information for 10CL006YU256I7G (256-ubga (u256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL006YU256I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL006YU256I7G is suitable for 6 applications: Industrial Motor Control & Drives, Video Surveillance & Image Pre-Processing, IoT Edge Gateways & Protocol Conversion, Display & Video Interface Bridging, Automotive Telematics & Body Electronics, Test & Measurement Instrumentation.
Industrial Motor Control & Drives
The 10CL006YU256I7G's 6 fractional PLLs generate the high-resolution PWM waveforms required for field-oriented control (FOC) of three-phase AC induction and PMSM motors, while its 18x18 hardware multipliers execute the Park/Clarke transforms in real time without CPU loading. With 176 user I/Os in the U256 package, the device easily handles three-phase gate drivers, QEP encoder interfaces, and isolated serial feedback (SPI to gate driver or current sense amplifier) within a single chip. Industrial temperature rating (-40C to +100C) and the part's 1.0V core with internal regulation make it robust for cabinet-mounted drives where ambient temperatures reach 70-85C. Source: Intel Cyclone 10 LP device overview.
Recommended
Video Surveillance & Image Pre-Processing
The 10CL006YU256I7G implements on-chip image pipelines (color space conversion, gamma correction, simple edge detection) for cost-sensitive IP camera designs. Its M9K memory blocks at 276,480 bits buffer at least one full VGA frame line, while 176 I/Os accept parallel video from a CMOS sensor and drive a parallel RGB or MIPI-style bridge. The device supports LVDS output pairs for sending compressed bitstreams to an Ethernet PHY, eliminating the need for a dedicated ASIC. Quartus Prime Lite supports the design flow at no cost, keeping BOM and tool-chain spend low. Source: verified distributor data and Intel Cyclone 10 LP documentation.
Recommended
IoT Edge Gateways & Protocol Conversion
With its low static power (roughly half of Cyclone IV E) and reconfigurable fabric, the 10CL006YU256I7G is well suited to IoT gateways that must adapt legacy industrial protocols (RS-485 Modbus, CAN, SPI sensors) to Ethernet or Wi-Fi. The 6 fractional PLLs derive clocks for Ethernet PHYs, Wi-Fi co-processors, and sensor sampling without external clock generators, while 176 I/Os multiplex multiple UART/SPI/I2C buses. The U256 package reduces PCB footprint for compact DIN-rail or panel-mount enclosures. Source: Intel Cyclone 10 LP device overview and verified distributor specifications.
Recommended
Display & Video Interface Bridging
The 10CL006YU256I7G bridges between incompatible display standards - converting LVDS to MIPI DSI, RGB888 to OpenLDI, or HDMI-derived TMDS signals to parallel RGB LCDs. Its 176 I/Os accommodate multiple parallel display channels and a host CPU interface simultaneously, while the 6K LE fabric handles the line buffers and pixel-clock domain crossings. Designers commonly pair it with HDMI receivers or LCD timing controllers to add a custom video pipeline. Source: Intel Cyclone 10 LP application notes.
Recommended
Automotive Telematics & Body Electronics
The 10CL006YU256I7G (industrial temperature) and 10CL006YU256A7G (automotive temperature grade) both target in-cabin telematics units and body controllers. The 6 fractional PLLs drive CAN-FD transceivers, LIN buses, and Automotive Ethernet PHYs simultaneously, while the U256 package fits the constrained PCB area behind infotainment head units. The device's low static power supports always-on wake-up logic for battery-saving modes. Source: Intel Cyclone 10 LP family overview and automotive temperature variant documentation.
Recommended
Test & Measurement Instrumentation
Test equipment such as logic analyzers, protocol exercisers, and bench-top data loggers use the 10CL006YU256I7G to implement custom stimulus patterns, on-the-fly protocol encoding, and trigger logic. The 276,480 bits of embedded memory buffer captured waveforms, while 176 I/Os connect to high-speed ADC/DAC front-ends. The device's LVDS-capable I/O banks enable direct interfacing with high-speed serial converters without external deserialization. Source: Intel Cyclone 10 LP device handbook.
Recommended
Recommended Products Summary
Engineering reference data for 10CL006YU256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL006YU256C8G | 10CL006YU256C6G | 10CL006YU256A7G | 10CL016YU256I7G | 10CL025ZU256I8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-UBGA (U256) | 256-UBGA (U256) | 256-UBGA (U256) | 256-UBGA (U256) | 256-UBGA (U256) | 256-UBGA (U256) |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 16,272 | 25,920 |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 276,480 | 516,096 | 608,256 |
| Max User I/Os | 176 | 176 | 176 | 176 | 176 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 7 (I7G) | 8 (C8G) | 6 (C6G) | 7 (A7G) | 7 (I7G) | 8 (I8G) |
| PLLs | 6 | 6 | 6 | 6 | 6 | 6 |
Key Differentiators
- Industrial temperature grade at lowest density (vs 10CL006YU256C8G)
- Headroom for design growth within same footprint (vs 10CL006YU256C8G)
- Lower static power than legacy Cyclone IV E (vs EP4CE6U14I7N (Cyclone IV E))
Design Notes
The Cyclone 10 LP core operates from a 1.0V supply with internal regulation; only one or two external rails (1.0V VCORE plus 2.5V/3.3V VCCAUX or VCCIO for I/O banks) are required. Decouple each rail with a 100 nF X7R ceramic placed within 2-3 mm of each supply pin, plus a bulk 10-47 uF tantalum or polymer capacitor near the package. Power sequencing is not strictly required when using the internal regulator, but VCORE must ramp before VCCIO to prevent I/O latch-up.
The U256 UFBGA package has 0.8 mm ball pitch; use NSMD (non-solder-mask-defined) pads with ENIG or OSP surface finish and a 4-6 mil (0.10-0.15 mm) solder mask web. Route signals on inner layers with microvias, and provide at least one continuous ground plane on layer 2 below the BGA for return-path integrity. Intel's Cyclone 10 LP pin connection guidelines recommend a 5x5 via-in-pad array under the package thermal pad area if thermal dissipation is required (this density typically does not need it).
Estimated: configuration failure on first prototypes is the most common issue. Always include pull-ups on the MSEL pins to set the configuration scheme (AS, PS, JTAG), verify that nCONFIG and nSTATUS are pulled high with a 10 kohm resistor, and confirm the configuration clock is present before releasing nCONFIG. Per the Cyclone 10 LP handbook, do NOT leave CONFIG_DONE floating - tie it high through an LED + resistor for visual bring-up confirmation. Also note: .rbf files from Cyclone IV are NOT compatible - recompile in Quartus for the target device.
Compliance Information
RoHS and lead-free compliance per Intel Altera Cyclone 10 LP family datasheet. Industrial temperature variant (I7G suffix). For AEC-Q100-style automotive qualification, use the 10CL006YU256A7G variant instead.
