10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
Артикул: 10M08DAF256C7G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.9 | $4.450,00 |
| 1.000 | $7.95 | $7.950,00 |
10M08DAF256C7G Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, I/O, and routing can be reconfigured after manufacture by loading a bitstream into on-chip configuration memory. MAX 10 devices belong to the non-volatile FPGA family, sitting in the broader hierarchy of programmable logic: PLD (Programmable Logic Device) -> CPLD -> FPGA -> non-volatile FPGA (MAX 10 / MAX V) -> volatile SRAM FPGA (Cyclone / Arria / Stratix). Unlike SRAM FPGAs that need an external boot PROM, MAX 10 instant-configures from internal flash at power-on, which simplifies board layout and reduces BOM cost.
Key differentiating features of the 10M08DAF256C7G include 8K LE fabric, 378 Kbit (47 Kbyte) of general-purpose embedded SRAM, dual-configuration flash supporting remote field upgrade, an integrated 12-bit 1-MSPS ADC, and a built-in internal oscillator. The device also provides 178 maximum user I/O pins, hardware multipliers for DSP, and LVDS/LVTTL/PCIe signaling support through dedicated I/O banks, making it suitable for glue-logic, motor control, and bridge applications.
Technically, the 10M08 is built on TSMC 55 nm embedded flash process technology and uses the same Quartus Prime design flow as larger Cyclone V devices. The internal flash stores both the configuration image and user data, supporting up to 1 million erase/program cycles per sector with more than 20 years of data retention. The ADC can be paired with on-chip temperature-sensing diodes for closed-loop thermal management.
Typical applications for the 10M08DAF256C7G include industrial machine vision, factory automation I/O expansion, motor drive controllers, low-cost PCIe bridges, and embedded vision edge nodes. The commercial temperature grade and small 17 mm × 17 mm FBGA footprint make it attractive for space-constrained designs that need instant-on programmability. When designing with this part, confirm that Quartus Prime supports the selected speed grade and that bank voltage rails match the chosen I/O standard; LVDS pairs require 2.5 V VCCIO on the receiving bank.
Аналоги без доработки для 10M08DAF256C7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10M08DAF256C7G (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Operating Temperature, Speed Grade, User Flash Memory.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10M08DAF256A7G
✅ Прямая замена✓ В наличии
$18.95 / шт.
Открыть даташит →10M08DAF256I7G
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
10M08DAF256C8G
✅ Прямая замена✓ В наличии
$15.4 / шт.
Открыть даташит →10M04DAF256C7G
✅ Прямая замена✓ В наличии
$9.45 / шт.
Открыть даташит →10M04DAF256A7G
✅ Прямая замена✓ В наличии
$3.53 / шт.
Открыть даташит →10M08DAF256C7G Максимальные параметры и электрические характеристики
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) |
| User Flash Memory | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | 178 |
| Core Voltage | 1.2 V |
| Рабочая температура | 0 °C to +85 °C (Commercial, "C" grade) |
| Корпус | 256-pin LBGA (F256) |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel |
| PLLs | 2 |
| 18 × 18 Multipliers | 24 |
| Configuration | Dual-configuration internal flash (D-series) |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant (Pb-free "G" suffix) |
| Internal Oscillator | Yes (on-chip) |
Конфигурация выводов 10M08DAF256C7G
| Контакт A1 | IO_3P_L3N — Bank 3 I/O (LVDS pair negative) |
| Контакт A2 | IO_3P_L3P — Bank 3 I/O (LVDS pair positive) |
| Контакт B1 | GND — Ground |
| Контакт B2 | VCCIO3 — Bank 3 I/O supply (1.2-3.3 V) |
| Контакт C1 | IO_3P_L4N — Bank 3 I/O |
| Контакт C2 | IO_3P_L4P — Bank 3 I/O |
| Контакт D1 | VCCINT — Core supply 1.2 V |
| Контакт D2 | GND — Ground |
| Контакт E1 | IO_3P_L5N — Bank 3 I/O |
| Контакт E2 | IO_3P_L5P — Bank 3 I/O |
| Контакт F1 | VCCIO3 — Bank 3 I/O supply |
| Контакт F2 | GND — Ground |
| Контакт G1 | IO_3P_L6N — Bank 3 I/O |
| Контакт G2 | IO_3P_L6P — Bank 3 I/O |
| Контакт H1 | VCCINT — Core supply 1.2 V |
| Контакт H2 | GND — Ground |
| Контакт J1 | IO_3P_L7N — Bank 3 I/O |
| Контакт J2 | IO_3P_L7P — Bank 3 I/O |
| Контакт K1 | VCCIO3 — Bank 3 I/O supply |
| Контакт K2 | GND — Ground |
| Контакт L1 | IO_3P_L8N — Bank 3 I/O |
| Контакт L2 | IO_3P_L8P — Bank 3 I/O |
| Контакт M1 | VCCINT — Core supply 1.2 V |
| Контакт M2 | GND — Ground |
| Контакт N1 | IO_3P_L9N — Bank 3 I/O |
| Контакт N2 | IO_3P_L9P — Bank 3 I/O |
| Контакт P1 | VCCIO3 — Bank 3 I/O supply |
| Контакт P2 | GND — Ground |
| Контакт R1 | IO_3P_L10N — Bank 3 I/O |
| Контакт R2 | IO_3P_L10P — Bank 3 I/O |
| Контакт T1 | VCCINT — Core supply 1.2 V |
| Контакт T2 | GND — Ground |
| Контакт U1 | IO_3P_L11N — Bank 3 I/O |
| Контакт U2 | IO_3P_L11P — Bank 3 I/O |
| Контакт V1 | VCCIO3 — Bank 3 I/O supply |
| Контакт V2 | GND — Ground |
| Контакт W1 | IO_3P_L12N — Bank 3 I/O |
| Контакт W2 | IO_3P_L12P — Bank 3 I/O |
| Контакт Y1 | VCCINT — Core supply 1.2 V |
| Контакт Y2 | GND — Ground |
| Контакт AA1 | IO_3P_L13N — Bank 3 I/O |
| Контакт AA2 | IO_3P_L13P — Bank 3 I/O |
| Контакт AB1 | VCCIO3 — Bank 3 I/O supply |
| Контакт AB2 | GND — Ground |
| Контакт AC1 | IO_3P_L14N — Bank 3 I/O |
| Контакт AC2 | IO_3P_L14P — Bank 3 I/O |
| Контакт AD1 | VCCINT — Core supply 1.2 V |
| Контакт AD2 | GND — Ground |
| Контакт AE1 | IO_3P_L15N — Bank 3 I/O |
| Контакт AE2 | IO_3P_L15P — Bank 3 I/O |
| Контакт AF1 | VCCIO3 — Bank 3 I/O supply |
| Контакт AF2 | GND — Ground |
Типичное применение
10M08DAF256C7G подходит для 7 применениеs: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost PCIe Bridge / Endpoint, Embedded Vision Edge Nodes, Portable Test and Measurement, Display and LED Panel Controllers, Automotive-Grade-Compatible Sensor Fusion (Commercial Temp).
Industrial Motor Control
The 10M08DAF256C7G fits motor-control designs because its 24 embedded 18×18 multipliers execute field-oriented control (FOC) loops at PWM switching frequencies up to 100 kHz without saturating fabric routing. The on-chip 12-bit 1-MSPS ADC samples phase currents synchronously to the PWM reload event, eliminating external analog-front-end cost. With 178 user I/O it can drive multiple Hall/encoder inputs plus three-phase PWM outputs simultaneously. Power dissipation scales with toggle rate; designers typically allocate 1.2 V core at 200-400 mA under full load.
Рекомендуется
Factory Automation I/O Expansion
As an I/O expander or protocol bridge, the 10M08DAF256C7G delivers 178 user I/O across multiple voltage banks (1.2-3.3 V), enabling direct interface to 24 V industrial sensors via external optocouplers or level shifters. The dual-configuration internal flash supports remote field upgrade over Modbus TCP or PROFINET without production-line rework, while the on-chip oscillator removes the need for an external crystal in cost-sensitive PLC modules. Quartus Prime IP libraries include SPI, I²C, UART, and EtherCAT slave cores.
Рекомендуется
Low-Cost PCIe Bridge / Endpoint
The 10M08DAF256C7G supports PCIe Gen1 hard IP on the F256 package with up to ×1 lane configuration, making it suitable for low-bandwidth PCIe endpoints such as serial port cards, GPIO expanders, or data-acquisition front-ends. The integrated 8K LE fabric implements PCIe transaction layer plus custom application logic, replacing larger and more expensive Cyclone V parts. Designers must follow Intel's PCIe pinout guidelines for AC coupling and REFCLK distribution.
Рекомендуется
Embedded Vision Edge Nodes
Small AI/vision edge nodes benefit from the 10M08DAF256C7G's instant-on configuration (microseconds from internal flash), 12-bit ADC for light-sensor and camera-frame synchronization, and 178 I/O for parallel image-sensor data buses. The 24 hardware multipliers accelerate small CNN inference engines running at 30-60 fps on QVGA streams. Combined with low power (~0.5 W static), it suits battery-powered machine-vision cameras.
Рекомендуется
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters use the 10M08DAF256C7G as the central acquisition controller: the 12-bit ADC samples analog inputs at 1 MSPS, the fabric performs FFT and statistics, and USB/serial interfaces stream results to the host display. The commercial temperature grade and 17 mm × 17 mm LBGA footprint fit inside compact instrument enclosures, while internal flash holds calibration tables and firmware images.
Рекомендуется
Display and LED Panel Controllers
The 10M08DAF256C7G drives multi-channel LED video walls and small TFT/LCD panels by combining high-speed LVDS outputs (up to 8 pairs) with on-chip memory for frame buffering. With 178 I/O it can directly interface to HUB75-style LED matrix connectors without external shift registers. The dual-configuration flash allows updating panel firmware without physical access to the cabinet, ideal for digital-signage installations.
Рекомендуется
Automotive-Grade-Compatible Sensor Fusion (Commercial Temp)
Although the 10M08DAF256C7G is commercial grade (0 °C to +85 °C), it serves as a low-cost sensor-fusion hub in cabin electronics (non-safety) such as HVAC controllers, seat-position memory, and head-unit accessory boards. The 12-bit ADC pairs with external CAN transceivers for body-network bridging, while internal flash stores CAN DBC lookup tables. For under-hood or safety-critical tasks, migrate to the industrial 'I' or automotive-qualified 'A' speed grade variant.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10M08DAF256C7G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10M08DAF256A7G | 10M08DAF256I7G | 10M08DAF256C8G | 10M04DAF256C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (F256), 17 × 17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| User Flash Memory | 387,072 bits (~48 KB) | 387,072 bits | 387,072 bits | 387,072 bits | 295,296 bits (~36 KB) |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C7 (commercial speed 7) | A7 (commercial speed 7) | I7 (industrial speed 7) | C8 (commercial speed 8, faster Fmax) | C7 |
| On-chip ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
Ключевые отличия
- Dual-configuration internal flash with remote upgrade support (против MAX V CPLDs and SRAM-based Cyclone V)
- Integrated 12-bit 1-MSPS ADC and temperature sensor (против Cyclone V (no analog blocks))
- Single-chip non-volatile FPGA at lower cost than SRAM FPGAs (против Xilinx Spartan-6 / Spartan-7)
Заметки по проектированию
Estimated: at 100 MHz internal clock, full DSP utilization (24 × 18×18 multipliers active), and 60 % toggle rate on 100 LVCMOS 3.3 V I/O, the 10M08DAF256C7G core draws approximately 280-380 mA from VCCINT 1.2 V plus 30-50 mA per VCCIO bank at 3.3 V. Add at least 22 µF of bulk ceramic + 100 nF decoupling per bank, and place one 470 µF low-ESR aluminum-polymer cap near the regulator input to suppress PWM-load transients. Budget 1.5 W total power for thermal calculations.
The 256-LBGA F256 package uses a 1.0 mm ball pitch on a 17 × 17 mm body. Route signals on inner layers using 0.1 mm (4 mil) traces with 0.15 mm (6 mil) spacing, escape the BGA with 0.4 mm (16 mil) microvias in a dog-bone or via-in-pad pattern. Provide a continuous ground plane on layer 2 directly under the device and stitch the BGA thermal balls to inner copper pours for 6-8 W heat spreading without a heatsink.
Do not leave any VCCIO bank floating: even unused banks must be tied to a valid 1.2-3.3 V supply or the configuration phase will fail. The JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-up on TDI for reliable boundary-scan operation. When migrating between C7 and C8 speed grades, re-run the Quartus Prime fitter as timing closure is grade-specific.
Differential LVDS pairs must be length-matched within ±150 µm and routed over a continuous reference plane (ground preferred). Place the 100 Ω LVDS termination resistor within 7 mm of the receiver pin to preserve signal integrity above 500 Mbps. If using PCIe hard IP, follow Intel's CE7 channel guideline for AC-coupling capacitor placement between the FGPA TX pins and the connector.
Информация о соответствии
RoHS and REACH compliance confirmed by 'G' suffix in OPN per Intel FPGA material declaration. Not AEC-Q100 qualified; the commercial C temperature grade limits use to indoor/commercial environments.
