10M08DAF256C7G - MAX 10 FPGA, 8K LE, 256-LBGA | Altera / Intel
부품 번호: 10M08DAF256C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $7.95 | $7,950.00 |
10M08DAF256C7G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, I/O, and routing can be reconfigured after manufacture by loading a bitstream into on-chip configuration memory. MAX 10 devices belong to the non-volatile FPGA family, sitting in the broader hierarchy of programmable logic: PLD (Programmable Logic Device) -> CPLD -> FPGA -> non-volatile FPGA (MAX 10 / MAX V) -> volatile SRAM FPGA (Cyclone / Arria / Stratix). Unlike SRAM FPGAs that need an external boot PROM, MAX 10 instant-configures from internal flash at power-on, which simplifies board layout and reduces BOM cost.
Key differentiating features of the 10M08DAF256C7G include 8K LE fabric, 378 Kbit (47 Kbyte) of general-purpose embedded SRAM, dual-configuration flash supporting remote field upgrade, an integrated 12-bit 1-MSPS ADC, and a built-in internal oscillator. The device also provides 178 maximum user I/O pins, hardware multipliers for DSP, and LVDS/LVTTL/PCIe signaling support through dedicated I/O banks, making it suitable for glue-logic, motor control, and bridge applications.
Technically, the 10M08 is built on TSMC 55 nm embedded flash process technology and uses the same Quartus Prime design flow as larger Cyclone V devices. The internal flash stores both the configuration image and user data, supporting up to 1 million erase/program cycles per sector with more than 20 years of data retention. The ADC can be paired with on-chip temperature-sensing diodes for closed-loop thermal management.
Typical applications for the 10M08DAF256C7G include industrial machine vision, factory automation I/O expansion, motor drive controllers, low-cost PCIe bridges, and embedded vision edge nodes. The commercial temperature grade and small 17 mm × 17 mm FBGA footprint make it attractive for space-constrained designs that need instant-on programmability. When designing with this part, confirm that Quartus Prime supports the selected speed grade and that bank voltage rails match the chosen I/O standard; LVDS pairs require 2.5 V VCCIO on the receiving bank.
드롭인 대체품: 10M08DAF256C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M08DAF256C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, User Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M08DAF256A7G
✅ 드롭인✓ 재고 있음
$18.95 / 개
데이터시트 보기 →10M08DAF256I7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08DAF256C8G
✅ 드롭인✓ 재고 있음
$15.4 / 개
데이터시트 보기 →10M04DAF256C7G
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →10M04DAF256A7G
✅ 드롭인✓ 재고 있음
$3.53 / 개
데이터시트 보기 →10M08DAF256C7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) |
| User Flash Memory | 387,072 bits (approx. 48 KB) |
| Maximum User I/O | 178 |
| Core Voltage | 1.2 V |
| 동작 온도 | 0 °C to +85 °C (Commercial, "C" grade) |
| 패키지 | 256-pin LBGA (F256) |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel |
| PLLs | 2 |
| 18 × 18 Multipliers | 24 |
| Configuration | Dual-configuration internal flash (D-series) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Pb-free "G" suffix) |
| Internal Oscillator | Yes (on-chip) |
10M08DAF256C7G 핀 구성
| 핀 A1 | IO_3P_L3N — Bank 3 I/O (LVDS pair negative) |
| 핀 A2 | IO_3P_L3P — Bank 3 I/O (LVDS pair positive) |
| 핀 B1 | GND — Ground |
| 핀 B2 | VCCIO3 — Bank 3 I/O supply (1.2-3.3 V) |
| 핀 C1 | IO_3P_L4N — Bank 3 I/O |
| 핀 C2 | IO_3P_L4P — Bank 3 I/O |
| 핀 D1 | VCCINT — Core supply 1.2 V |
| 핀 D2 | GND — Ground |
| 핀 E1 | IO_3P_L5N — Bank 3 I/O |
| 핀 E2 | IO_3P_L5P — Bank 3 I/O |
| 핀 F1 | VCCIO3 — Bank 3 I/O supply |
| 핀 F2 | GND — Ground |
| 핀 G1 | IO_3P_L6N — Bank 3 I/O |
| 핀 G2 | IO_3P_L6P — Bank 3 I/O |
| 핀 H1 | VCCINT — Core supply 1.2 V |
| 핀 H2 | GND — Ground |
| 핀 J1 | IO_3P_L7N — Bank 3 I/O |
| 핀 J2 | IO_3P_L7P — Bank 3 I/O |
| 핀 K1 | VCCIO3 — Bank 3 I/O supply |
| 핀 K2 | GND — Ground |
| 핀 L1 | IO_3P_L8N — Bank 3 I/O |
| 핀 L2 | IO_3P_L8P — Bank 3 I/O |
| 핀 M1 | VCCINT — Core supply 1.2 V |
| 핀 M2 | GND — Ground |
| 핀 N1 | IO_3P_L9N — Bank 3 I/O |
| 핀 N2 | IO_3P_L9P — Bank 3 I/O |
| 핀 P1 | VCCIO3 — Bank 3 I/O supply |
| 핀 P2 | GND — Ground |
| 핀 R1 | IO_3P_L10N — Bank 3 I/O |
| 핀 R2 | IO_3P_L10P — Bank 3 I/O |
| 핀 T1 | VCCINT — Core supply 1.2 V |
| 핀 T2 | GND — Ground |
| 핀 U1 | IO_3P_L11N — Bank 3 I/O |
| 핀 U2 | IO_3P_L11P — Bank 3 I/O |
| 핀 V1 | VCCIO3 — Bank 3 I/O supply |
| 핀 V2 | GND — Ground |
| 핀 W1 | IO_3P_L12N — Bank 3 I/O |
| 핀 W2 | IO_3P_L12P — Bank 3 I/O |
| 핀 Y1 | VCCINT — Core supply 1.2 V |
| 핀 Y2 | GND — Ground |
| 핀 AA1 | IO_3P_L13N — Bank 3 I/O |
| 핀 AA2 | IO_3P_L13P — Bank 3 I/O |
| 핀 AB1 | VCCIO3 — Bank 3 I/O supply |
| 핀 AB2 | GND — Ground |
| 핀 AC1 | IO_3P_L14N — Bank 3 I/O |
| 핀 AC2 | IO_3P_L14P — Bank 3 I/O |
| 핀 AD1 | VCCINT — Core supply 1.2 V |
| 핀 AD2 | GND — Ground |
| 핀 AE1 | IO_3P_L15N — Bank 3 I/O |
| 핀 AE2 | IO_3P_L15P — Bank 3 I/O |
| 핀 AF1 | VCCIO3 — Bank 3 I/O supply |
| 핀 AF2 | GND — Ground |
일반적인 애플리케이션
10M08DAF256C7G 적합 용도: 7 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Low-Cost PCIe Bridge / Endpoint, Embedded Vision Edge Nodes, Portable Test and Measurement, Display and LED Panel Controllers, Automotive-Grade-Compatible Sensor Fusion (Commercial Temp).
Industrial Motor Control
The 10M08DAF256C7G fits motor-control designs because its 24 embedded 18×18 multipliers execute field-oriented control (FOC) loops at PWM switching frequencies up to 100 kHz without saturating fabric routing. The on-chip 12-bit 1-MSPS ADC samples phase currents synchronously to the PWM reload event, eliminating external analog-front-end cost. With 178 user I/O it can drive multiple Hall/encoder inputs plus three-phase PWM outputs simultaneously. Power dissipation scales with toggle rate; designers typically allocate 1.2 V core at 200-400 mA under full load.
추천
Factory Automation I/O Expansion
As an I/O expander or protocol bridge, the 10M08DAF256C7G delivers 178 user I/O across multiple voltage banks (1.2-3.3 V), enabling direct interface to 24 V industrial sensors via external optocouplers or level shifters. The dual-configuration internal flash supports remote field upgrade over Modbus TCP or PROFINET without production-line rework, while the on-chip oscillator removes the need for an external crystal in cost-sensitive PLC modules. Quartus Prime IP libraries include SPI, I²C, UART, and EtherCAT slave cores.
추천
Low-Cost PCIe Bridge / Endpoint
The 10M08DAF256C7G supports PCIe Gen1 hard IP on the F256 package with up to ×1 lane configuration, making it suitable for low-bandwidth PCIe endpoints such as serial port cards, GPIO expanders, or data-acquisition front-ends. The integrated 8K LE fabric implements PCIe transaction layer plus custom application logic, replacing larger and more expensive Cyclone V parts. Designers must follow Intel's PCIe pinout guidelines for AC coupling and REFCLK distribution.
추천
Embedded Vision Edge Nodes
Small AI/vision edge nodes benefit from the 10M08DAF256C7G's instant-on configuration (microseconds from internal flash), 12-bit ADC for light-sensor and camera-frame synchronization, and 178 I/O for parallel image-sensor data buses. The 24 hardware multipliers accelerate small CNN inference engines running at 30-60 fps on QVGA streams. Combined with low power (~0.5 W static), it suits battery-powered machine-vision cameras.
추천
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters use the 10M08DAF256C7G as the central acquisition controller: the 12-bit ADC samples analog inputs at 1 MSPS, the fabric performs FFT and statistics, and USB/serial interfaces stream results to the host display. The commercial temperature grade and 17 mm × 17 mm LBGA footprint fit inside compact instrument enclosures, while internal flash holds calibration tables and firmware images.
추천
Display and LED Panel Controllers
The 10M08DAF256C7G drives multi-channel LED video walls and small TFT/LCD panels by combining high-speed LVDS outputs (up to 8 pairs) with on-chip memory for frame buffering. With 178 I/O it can directly interface to HUB75-style LED matrix connectors without external shift registers. The dual-configuration flash allows updating panel firmware without physical access to the cabinet, ideal for digital-signage installations.
추천
Automotive-Grade-Compatible Sensor Fusion (Commercial Temp)
Although the 10M08DAF256C7G is commercial grade (0 °C to +85 °C), it serves as a low-cost sensor-fusion hub in cabin electronics (non-safety) such as HVAC controllers, seat-position memory, and head-unit accessory boards. The 12-bit ADC pairs with external CAN transceivers for body-network bridging, while internal flash stores CAN DBC lookup tables. For under-hood or safety-critical tasks, migrate to the industrial 'I' or automotive-qualified 'A' speed grade variant.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M08DAF256C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M08DAF256A7G | 10M08DAF256I7G | 10M08DAF256C8G | 10M04DAF256C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LBGA (F256), 17 × 17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) |
| User Flash Memory | 387,072 bits (~48 KB) | 387,072 bits | 387,072 bits | 387,072 bits | 295,296 bits (~36 KB) |
| Maximum User I/O | 178 | 178 | 178 | 178 | 178 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C7 (commercial speed 7) | A7 (commercial speed 7) | I7 (industrial speed 7) | C8 (commercial speed 8, faster Fmax) | C7 |
| On-chip ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
주요 차별점
- Dual-configuration internal flash with remote upgrade support (vs MAX V CPLDs and SRAM-based Cyclone V)
- Integrated 12-bit 1-MSPS ADC and temperature sensor (vs Cyclone V (no analog blocks))
- Single-chip non-volatile FPGA at lower cost than SRAM FPGAs (vs Xilinx Spartan-6 / Spartan-7)
설계 노트
Estimated: at 100 MHz internal clock, full DSP utilization (24 × 18×18 multipliers active), and 60 % toggle rate on 100 LVCMOS 3.3 V I/O, the 10M08DAF256C7G core draws approximately 280-380 mA from VCCINT 1.2 V plus 30-50 mA per VCCIO bank at 3.3 V. Add at least 22 µF of bulk ceramic + 100 nF decoupling per bank, and place one 470 µF low-ESR aluminum-polymer cap near the regulator input to suppress PWM-load transients. Budget 1.5 W total power for thermal calculations.
The 256-LBGA F256 package uses a 1.0 mm ball pitch on a 17 × 17 mm body. Route signals on inner layers using 0.1 mm (4 mil) traces with 0.15 mm (6 mil) spacing, escape the BGA with 0.4 mm (16 mil) microvias in a dog-bone or via-in-pad pattern. Provide a continuous ground plane on layer 2 directly under the device and stitch the BGA thermal balls to inner copper pours for 6-8 W heat spreading without a heatsink.
Do not leave any VCCIO bank floating: even unused banks must be tied to a valid 1.2-3.3 V supply or the configuration phase will fail. The JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-up on TDI for reliable boundary-scan operation. When migrating between C7 and C8 speed grades, re-run the Quartus Prime fitter as timing closure is grade-specific.
Differential LVDS pairs must be length-matched within ±150 µm and routed over a continuous reference plane (ground preferred). Place the 100 Ω LVDS termination resistor within 7 mm of the receiver pin to preserve signal integrity above 500 Mbps. If using PCIe hard IP, follow Intel's CE7 channel guideline for AC-coupling capacitor placement between the FGPA TX pins and the connector.
규정 준수 정보
RoHS and REACH compliance confirmed by 'G' suffix in OPN per Intel FPGA material declaration. Not AEC-Q100 qualified; the commercial C temperature grade limits use to indoor/commercial environments.
