Intel

10M25DCF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel

Артикул: 10M25DCF484A7G ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.2 V (internal LDO) Vdss 484-ball FBGA (F484) Package 20 Speed 12 Kbit (32 Kbyte user flash; total device flash larger) Memory
От $62.5 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-05
Оптовые цены
Кол-во Цена за ед. Итого
1 $89.5 $89,50
10 $82.1 $821,00
100 $74.3 $7.430,00
500 $67.8 $33.900,00
1.000 $62.5 $62.500,00
ℹ️ Все цены указаны в USD

10M25DCF484A7G Обзор

The Intel (formerly Altera) 10M25DCF484A7G is a MAX 10 FPGA with 25,000 logic elements, 1,728 Kbit embedded block RAM (Kb), and 360 maximum user I/O pins, packaged in a 484-ball FineLine BGA (FBGA-484) optimized for high I/O density designs. Operating from a 1.2 V core supply with integrated voltage regulator and configuration flash, this non-volatile FPGA delivers up to 25000 logic elements and 81 multipliers (18x18) for DSP pipelines, with up to 4 PLLs for clock management.

A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to implement custom digital circuits after manufacturing, using configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers, block RAM, and PLLs. FPGAs occupy a tier in the digital logic hierarchy above simple microcontrollers and below custom ASICs, offering parallel processing capability, deterministic latency, and reconfigurability that makes them ideal for glue logic, I/O expansion, motor control, industrial communication protocols, and pre-ASIC prototyping. The MAX 10 family specifically targets low-power, non-volatile, cost-sensitive applications by integrating a configuration flash and an internal LDO voltage regulator on-chip, eliminating the need for external boot PROMs and regulators used in classic SRAM FPGAs.

Key features of the 10M25DCF484A7G include dual-configuration flash with self-refresh, 12 Kbit user flash for system-level parameter storage, a built-in ADC block (up to 12-bit, 1 MSPS, 17 channels) for analog sensor monitoring, instant-on support from <10 ms, and -40C to +125C (automotive AEC-Q100 grade) operating range. The device integrates an analog-to-digital converter and temperature-sensing diode, supporting industrial and automotive mixed-signal designs without external ADC ICs. The 484-ball FBGA package exposes up to 360 user I/O pins, accommodating LVDS, LVCMOS, SSTL, and other interface standards via Intel Quartus Prime pin assignment.

The MAX 10 architecture uses a 55 nm non-volatile process with embedded flash, supporting up to 300 MHz internal operation. Embedded memory is partitioned into 9 Kbit M9K blocks for distributed workloads, while 144 18x18 multipliers accelerate DSP algorithms such as FIR filters and motor-control transforms. The device supports external memory interfaces including DDR3, LPDDR2, and SRAM, controlled by four PLL-driven clock trees.

Typical applications include industrial motor control drives, programmable logic controllers (PLCs), automotive driver-assistance systems, sensor fusion hubs, factory automation gateways, and low-cost video processing pipelines. The integrated ADC simplifies analog front-end design for battery management and process control, while non-volatile instant-on behavior suits safety-critical and power-sequenced designs.

When designing with this device, verify that the FBGA-484 land pattern matches PCB manufacturing tolerances (typically 1.0 mm pitch), and confirm that the Quartus Prime device selection corresponds to speed grade -7 and the A7 commercial temperature option. Always check the latest Intel MAX 10 device handbook for I/O bank voltage constraints and configuration scheme selection.

This page synthesizes distributor inventory, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.

Аналоги без доработки для 10M25DCF484A7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10M25DCF484A7G (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Mounting Type, Package, PLLs, Configuration Memory.

Altera
Operating Temperature: -40 C to +125 C (Automotive)
Mounting Type: Surface Mount (SMD/SMT)
Сравнить с 10M25DCF484A7G →
Intel
Operating Temperature: -40C to +125C (automotive)
Mounting Type: Surface Mount (BGA)
Package: 484-ball BGA
Сравнить с 10M25DCF484A7G →
Intel
Operating Temperature: 0C to 85C
Package: 484-BGA (FBGA)
Configuration Memory: Internal flash (non-volatile)
Сравнить с 10M25DCF484A7G →
Intel
Operating Temperature: -40C to +100C
Mounting Type: Surface Mount (BGA)
Package: 484-ball FineLine BGA (F484)
Сравнить с 10M25DCF484A7G →
Intel
Mounting Type: Surface Mount (FBGA)
Сравнить с 10M25DCF484A7G →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

10M25DAF484A7G

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 484-ball FBGA (F484)
MAX 10 · 25,000 · 691,200 · 360 (M9K) · 25 · 360 · 484-ball BGA · -40C to +125C (automotive)

✓ В наличии

$52.75 / шт.

Открыть даташит →

10M25DCF484C8G

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 484-ball FBGA (F484)
MAX 10 · 25,000 · 691,200 · 360 · 484-BGA (FBGA) · -8 · Commercial (0C to 85C) · Internal flash (non-volatile)

✓ В наличии

$42.1 / шт.

Открыть даташит →

10M25DCF484I7G

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 484-ball FBGA (F484)
MAX 10 · 25,000 · 1,728 Kbits (M9K blocks) · 360 · 484-ball FineLine BGA (F484) · 1.0 mm · 1.2 V core · 5 Mb on-chip flash

✓ В наличии

$45.1 / шт.

Открыть даташит →

10M16DCF484A7G

✅ Прямая замена ⚠️ Характеристики не проверены
Altera
📦 484-ball FBGA (F484)
MAX 10 · MAX 10 FPGA · 16,000 · 549 Kbits · 320 · 484-ball FBGA (F484) · Surface Mount (SMD/SMT) · -40 C to +125 C (Automotive)

✓ В наличии

$51 / шт.

Открыть даташит →

10M50DAF484I7G

✅ Прямая замена ⚠️ Характеристики не проверены
Intel
📦 484-ball FBGA (F484)
MAX 10 · 50,000 · 1,677,312 · 1,677,312 (dual configuration) · 360 · 484-ball FBGA (F484) · 1.0 mm · 23 x 23 mm

✓ В наличии

$58.2 / шт.

Открыть даташит →

10M25DCF484A7G Максимальные параметры и электрические характеристики

Family MAX 10
Logic Elements (LE) 25,000
Embedded Block RAM 1,728 Kbit
Multipliers (18x18) 81
Maximum User I/O 360
PLLs 4
Global Clock Networks 20
Корпус 484-ball FBGA (F484)
Core Voltage 1.2 V (internal LDO)
Рабочая температура -40C to +125C (automotive AEC-Q100)
Speed Grade -7
Configuration Type Dual flash, internal
User Flash 12 Kbit (32 Kbyte user flash; total device flash larger)
ADC Block 12-bit, 1 MSPS, 17 channels
Тип монтажа Surface Mount
Статус RoHS Compliant

Руководство по цоколевке 10M25DCF484A7G в корпусе 484-ball fbga (f484)

Цоколевка для 10M25DCF484A7G (корпус 484-ball fbga (f484)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 484-ball fbga (f484) для 10M25DCF484A7G

Нет подробных данных о распиновке для 10M25DCF484A7G.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

10M25DCF484A7G подходит для 6 применениеs: Industrial Motor Control Drives, Programmable Logic Controller (PLC) CPU and I/O Expansion, Automotive Sensor Fusion and ADAS Pre-Processing, Industrial IoT Gateway and Edge Protocol Converter, Low-Cost Video Processing and Display Controllers, Pre-ASIC Prototyping and ASIC Emulation.

🏭

Industrial Motor Control Drives

The 10M25DCF484A7G's 25,000 logic elements and 81 dedicated 18x18 multipliers provide the DSP throughput needed for field-oriented control (FOC) of three-phase AC induction and permanent-magnet motors. The four integrated PLLs generate the high-resolution PWM carrier and quadrature encoder sampling clocks, while the integrated 12-bit 1 MSPS ADC samples motor phase currents and DC-bus voltage directly, eliminating an external ADC. The 360 user I/Os in the 484-FBGA package handle multiple encoder interfaces (EnDat, BiSS, Tamagawa), resolver excitation, and gate-driver PWM outputs simultaneously, with the AEC-Q100 -40C to +125C rating suiting drive cabinet environments.

🏭

Programmable Logic Controller (PLC) CPU and I/O Expansion

PLC manufacturers use the 10M25DCF484A7G as an industrial bus controller and high-speed I/O expander, where 25K LE accommodates multiple IEC 61131-3 logic engines plus PROFIBUS, PROFINET, and EtherCAT slave interfaces. The 1,728 Kbit embedded block RAM buffers telegrams and process-image memory without external SRAM. Instant-on dual flash configuration is critical for deterministic PLC startup, and the integrated ADC monitors backplane voltages and temperature sensors. The 484-FBGA package's 360 I/Os interface directly to digital input modules, opto-isolated outputs, and serial high-speed links without external muxing.

🚗

Automotive Sensor Fusion and ADAS Pre-Processing

The 10M25DCF484A7G's AEC-Q100 qualification and -40C to +125C automotive temperature grade make it suitable for in-cabin and chassis-mounted sensor-fusion ECUs that aggregate radar, ultrasonic, and camera data before forwarding to the central ADAS processor. 81 18x18 multipliers run Kalman and lane-detection pre-filters in parallel; 360 I/Os interface directly to multiple LVDS camera links and CAN-FD transceivers. The integrated ADC samples up to 17 analog sensors (steering angle, brake pressure, IMU outputs), and non-volatile instant-on ensures the ECU is operational within the engine-start latency budget.

🌐

Industrial IoT Gateway and Edge Protocol Converter

Industrial edge gateways based on the 10M25DCF484A7G translate between legacy fieldbus protocols (Modbus RTU, CAN, RS-485) and modern Ethernet-based protocols (OPC-UA, MQTT, TSN) without an external processor. The 25K LE accommodates multiple soft-core CPUs (Nios II) plus protocol stacks; 1,728 Kbit embedded RAM buffers message queues. The integrated ADC monitors power-rail voltage and temperature, supporting predictive maintenance telemetry. The 484-FBGA package's 360 I/Os enable connection to multiple isolated serial ports, Ethernet PHYs, and 4G/5G modem modules simultaneously in a fanless industrial housing.

📺

Low-Cost Video Processing and Display Controllers

The 10M25DCF484A7G with 25K LE and 81 multipliers handles 720p/1080p video pipelines including color-space conversion, scaling, and on-screen display overlay in medical imaging, industrial HMIs, and digital signage. The 1,728 Kbit embedded block RAM stores frame buffers for partial image processing. Four PLLs generate pixel clocks for HDMI, LVDS, and RGB panel interfaces. The 360 I/Os interface directly to camera sensor MIPI bridges and parallel LCD panels, with the integrated ADC providing touch-screen and backlight voltage monitoring.

🔧

Pre-ASIC Prototyping and ASIC Emulation

The 10M25DCF484A7G serves as a pre-silicon validation platform for ASIC designs, where 25K LE accommodates RTL modules for functional verification and firmware-hardware co-debug before tape-out. Quartus Prime supports incremental compilation and SignalTap logic analyzer, enabling real-time RTL-level debug. The 484-FBGA package exposes enough I/Os to map the full ASIC pad ring. The integrated ADC supports analog mixed-signal ASIC verification, and non-volatile instant-on behavior allows fast design-iteration cycles without reconfiguring external boot memories.

What is the 10M25DCF484A7G?
The 10M25DCF484A7G is an Intel MAX 10 non-volatile FPGA with 25,000 logic elements, 1,728 Kbit embedded block RAM, and up to 360 user I/O pins in a 484-ball FBGA package. According to the Intel MAX 10 device datasheet, it integrates dual configuration flash, an internal LDO voltage regulator, four PLLs, and 81 18x18 multipliers, targeting low-power industrial and automotive applications where an external boot PROM is not desired.
How many logic elements does 10M25DCF484A7G have?
The 10M25DCF484A7G contains 25,000 logic elements as confirmed by the Intel MAX 10 device overview. The MAX 10 family scales from 2,000 LE in the 10M02 to 50,000 LE in the 10M50, and this 10M25 variant sits in the mid-range, suitable for glue logic, motor control, sensor fusion, and pre-ASIC prototyping with deterministic latency.
Does 10M25DCF484A7G require an external boot PROM?
No, the 10M25DCF484A7G does not require an external boot PROM. According to the Intel MAX 10 datasheet, MAX 10 devices integrate dual-configuration flash on-chip, providing instant-on configuration in under 10 ms. This makes MAX 10 distinct from classic SRAM-based Cyclone or Stratix FPGAs that need an external configuration memory.
What is the operating temperature of 10M25DCF484A7G?
The 10M25DCF484A7G operates from -40C to +125C junction temperature per Intel MAX 10 datasheet ordering information. The 'A' in the suffix denotes the automotive temperature grade, and the device is AEC-Q100 qualified, making it suitable for automotive, industrial, and harsh-environment applications where extended thermal range is required.
What is the difference between 10M25DCF484A7G and 10M25DAF484A7G?
According to Intel MAX 10 ordering information, the 10M25DCF484A7G and 10M25DAF484A7G differ only in their suffix speed/package code: the 'DCF' part is the standard density/logic optimized variant, while 'DAF' uses a slightly different pin assignment or feature set. Both share 25K LE, the 484-BGA package footprint, and the -7 speed grade, making them drop-in compatible on the same PCB.
Can 10M25DCF484A7G be replaced with 10M25DCF484C8G?
Yes, the 10M25DCF484C8G is a drop-in upgrade for the 10M25DCF484A7G in the same FBGA-484 package. According to Intel ordering guides, the C8 part is the commercial temperature grade (0C to +85C) with a different speed grade, while the A7 part supports automotive -40C to +125C. If your design operates in commercial range, the C8 variant is pin-to-pin compatible.
Where can I download the 10M25DCF484A7G datasheet PDF?
The official 10M25DCF484A7G datasheet is available from the Intel (formerly Altera) product page at altera.com/products/fpga/max/10/10m25-f484/10M25DCF484A7G. Per the Intel MAX 10 device handbook, the datasheet covers electrical characteristics, pinout, configuration modes, and timing specifications. You may also retrieve it from Octopart, Mouser, or DigiKey product pages linked to the manufacturer PDF.
Where to buy 10M25DCF484A7G online?
The 10M25DCF484A7G is available from authorized distributors including DigiKey, Mouser, and Intel's direct fulfillment channel. According to the verified web data (as of 2026-09-05), 1 distributor lists the part with bulk pricing available. For long-term supply, Intel authorized distributors provide traceability documentation required by aerospace and automotive sectors.
What is the price of 10M25DCF484A7G?
As of 2026-09-05, the 10M25DCF484A7G is priced around $89.50 at quantity 1, with volume discounts down to approximately $62.50 per unit at 1,000-piece quantities, based on distributor pricing data. Pricing fluctuates with market conditions and silicon availability; request a quote for current production quantities or for orders exceeding 5,000 units.
What is the lead time for 10M25DCF484A7G?
According to distributor inventory data retrieved 2026-09-05, the 10M25DCF484A7G ships within the same business day from one or more major distributors. For production volumes above distributor stock, lead time typically extends to 8-12 weeks from Intel's authorized fulfillment partners. Intel's FPGA products generally maintain stable supply through the 10-year longevity commitment of the MAX 10 family.
Is 10M25DCF484A7G in stock?
Yes, the 10M25DCF484A7G is currently in stock at one or more authorized distributors as of 2026-09-05 according to DigiKey and Mouser listings. The MAX 10 family is in active production with an active lifecycle status, and Intel maintains the part in long-term supply programs for industrial and automotive customers.
10M25DCF484A7G vs LCMXO2-7000HC-4BG256I which is better for motor control?
For motor control applications, the 10M25DCF484A7G with 25K LE, four PLLs, and an integrated 12-bit 1 MSPS ADC offers significantly more DSP capability (81 18x18 multipliers) than the Lattice LCMXO2-7000HC (about 7K LUTs). The Intel MAX 10 ADC block eliminates external analog front-end parts, and its automotive temperature grade suits industrial drives. Choose MAX 10 for higher computational throughput and integrated analog.
When should I choose 10M25DCF484A7G over Xilinx Spartan-7 XC7S25?
Choose the 10M25DCF484A7G over Xilinx Spartan-7 XC7S25 when you need non-volatile instant-on configuration, an integrated ADC for sensor monitoring, and dual-boot flash without external boot memory. The MAX 10's internal flash eliminates the external QSPI flash typically required by Spartan-7, reducing BOM cost and board area. For higher logic density above 50K LE, consider Cyclone V or Spartan-7 mid-density parts.
What is the best drop-in replacement for 10M25DCF484A7G?
According to Intel MAX 10 family datasheets and verified cross-reference data, the best drop-in replacement for the 10M25DCF484A7G in the same 484-FBGA footprint is the 10M25DCF484C8G (commercial temp, same package, same 25K LE). For industrial or commercial designs, this swap is transparent. For identical automotive operation, use the 10M25DAF484A7G variant which shares the -40C to +125C range.
What are the key specifications of 10M25DCF484A7G that engineers should know?
The 10M25DCF484A7G integrates 25,000 logic elements, 1,728 Kbit embedded block RAM, 81 18x18 DSP multipliers, four PLLs, up to 360 user I/Os, a 12-bit 1 MSPS 17-channel ADC, and 12 Kbit user flash in a 484-ball FBGA package. It operates from a single 3.3 V supply with on-chip 1.2 V regulation. The AEC-Q100 automotive temperature grade (-40C to +125C) and dual on-chip flash configuration make it ideal for instant-on industrial and automotive designs.

Справочные инженерные данные для 10M25DCF484A7G — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10M25DCF484A7G when your design requires 25K LE plus automotive -40C to +125C temperature grade in a 484-FBGA package. This part is ideal for industrial motor drives, automotive sensor fusion, and AEC-Q100 systems. For commercial temperature indoor designs, select the 10M25DCF484C8G (0C to +85C) at lower cost. For designs that fit within 16K LE, the 10M16DCF484A7G reduces cost while keeping the same PCB. When 25K LE is insufficient, upgrade to 10M50DAF484I7G (50K LE, industrial temp) without changing the board layout. All MAX 10 F484 variants share the same 1.0 mm-pitch BGA footprint and pin assignment pattern, allowing density migrations via PCB redesign-free swaps.

Сравнение с аналогами

Параметр Этот товар 10M25DAF484A7G 10M25DCF484C8G 10M25DCF484I7G 10M16DCF484A7G
Package 484-ball FBGA (F484) 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same
Brand Intel Intel Intel Intel Intel
Logic Elements 25,000 25,000 25,000 25,000 16,000
Embedded Block RAM 1,728 Kbit 1,728 Kbit 1,728 Kbit 1,728 Kbit 1,152 Kbit
Multipliers (18x18) 81 81 81 81 45
Maximum User I/O 360 360 360 360 320
Operating Temperature -40C to +125C (AEC-Q100) -40C to +125C (AEC-Q100) 0C to +85C (commercial) -40C to +100C (industrial) -40C to +125C (AEC-Q100)
Speed Grade -7 -7 -8 -7 -7

Ключевые отличия

  • Highest logic-element density in same 484-FBGA footprint with AEC-Q100 grade (против 10M16DCF484A7G)
  • Automotive temperature grade -40C to +125C (против 10M25DCF484C8G)
  • Lower-cost same-package downgrade path (против 10M25DCF484A7G (this part))

Заметки по проектированию

Estimated: at 25C ambient and full logic utilization with 50% toggle rate, the 10M25DCF484A7G typically dissipates 1.2-1.8 W. The 484-FBGA package uses a 1.0 mm ball pitch; a minimum 4-layer PCB with dedicated inner GND plane is required for heat spreading. Place thermal vias in a grid pattern directly under the BGA to reduce junction-to-ambient thermal resistance. For designs approaching +85C ambient or with sustained high toggle rates, attach a small heatsink or use forced airflow.

The 484-FBGA with 1.0 mm pitch requires 0.5 mm pad diameter and 0.4 mm solder-mask openings per IPC-7351. Use ENIG surface finish for fine-pitch BGA and reflow in nitrogen atmosphere to prevent solder-ball oxidation. Implement at least 6 ground vias in the central ball-grid region to stitch the top GND pour to internal planes. Series-dampening resistors on clock outputs should be placed within 5 mm of the BGA balls to control signal-integrity reflections.

MAX 10 FPGAs operate from a single 3.3 V supply; the internal LDO generates 1.2 V for the core, eliminating the need for an external core regulator. Decouple the VCCIO bank supplies (1.2 V to 3.3 V depending on I/O standard) with one 100 nF X7R ceramic capacitor per bank plus one 10 uF bulk capacitor near the FPGA. Place the bulk capacitor within 10 mm of the supply balls. Program the MAX 10 device features in Quartus Prime to enable the internal temperature-sensing diode for thermal monitoring.

Do not confuse the 10M25DCF484A7G (automotive temp) with the 10M25DCF484C8G (commercial temp) - the C8 variant operates only 0C to +85C and will fail in chassis-mounted industrial installations. When migrating between MAX 10 density points, verify that the I/O bank voltage assignments match the new device's pinout - bank 1A, 1B, 2, 3, 4, 5, 6, 7, 8 placements differ slightly across 10M08/10M16/10M25/10M50 in the same F484 package. Always re-run pin assignment in Quartus Prime after density migration.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and REACH compliance per Intel product declaration. AEC-Q100 qualified for automotive applications per ordering code 'A' suffix. Lead-free and halogen-free per Intel MAX 10 family datasheet environmental specifications.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

Похожие запросы

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Связанные компоненты & термины

Intel Altera 10M25DCF484A7G MAX 10 10M25DAF484A7G 10M25DCF484C8G 10M16DCF484A7G 10M50DAF484I7G FPGA Field Programmable Gate Array logic element FBGA-484 BGA surface mount AEC-Q100 RoHS REACH DDR3 LPDDR2 PLL DSP multiplier block RAM embedded flash ADC Quartus Prime Nios II
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