Microchip Technology

A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

Артикул: A3PE3000L-FGG896 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.2 V to 1.5 V Vdss 896-ball FBGA (FGG896), 1.0 mm pitch Package Yes Memory
От $55 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-02
Оптовые цены
Кол-во Цена за ед. Итого
1 $89.5 $89,50
10 $82 $820,00
100 $74.5 $7.450,00
500 $68 $34.000,00
1.000 $62 $62.000,00
3.000 $55 $165.000,00
ℹ️ Все цены указаны в USD

A3PE3000L-FGG896 Обзор

The Microchip Technology A3PE3000L-FGG896 is a 3,000,000-system-gate ProASIC3L low-power flash FPGA with 75,264 logic cells, 504 kbits of true dual-port SRAM, and 620 user I/Os, housed in an 896-ball FBGA (FGG896) package with 1.0 mm pitch. This device is part of Microchip's flash-based FPGA family that combines non-volatile configuration, instant-on operation, and low power consumption for high-reliability applications.

An FPGA (Field Programmable Gate Array) is an integrated circuit whose logic fabric can be configured after manufacturing. The ProASIC3L family uses flash-based configuration cells, enabling non-volatile, live-at-power-up operation without an external boot device. FPGAs sit in the digital logic hierarchy between CPLDs and ASICs, balancing flexibility, density, and time-to-market. The A3PE3000L-FGG896 is a mid-density ProASIC3L device, positioned for applications that need substantial logic but not the complexity of the largest FPGA families.

Key features of the A3PE3000L-FGG896 include Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while retaining register states, 1.2V to 1.5V core operation, and up to 620 user I/Os. The device is manufactured on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, making it inherently secure and resistant to configuration bitstream loss. It supports Level 0 live-at-power-up, meaning the FPGA is operational immediately after power rail stabilization.

The ProASIC3L architecture provides true single-chip operation, with configuration stored in on-chip flash cells, eliminating the need for external configuration memory and reducing system component count. The device offers 504 kbits of true dual-port SRAM, which supports concurrent read/write accesses for FIFO and buffer applications. The 620 user I/Os are arranged in banks with flexible I/O standards, although the exact voltage and standard options are detailed in the manufacturer datasheet.

Typical applications include industrial automation and control, communications infrastructure, defense and aerospace electronics, medical imaging, broadcast and machine vision, and secure IoT edge computing. The low static power and Flash*Freeze mode make the A3PE3000L-FGG896 particularly attractive for battery-powered and thermally constrained systems.

When designing with the A3PE3000L-FGG896, pay close attention to core supply decoupling: place 100nF ceramic capacitors close to each core supply ball and a bulk capacitor on the board. The 1.2-1.5V core supply should be stable and clean; the Flash*Freeze input can be driven from a GPIO or power management IC to reduce standby current. Thermal vias under the BGA should be used to improve heat transfer.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and design-in information.

Аналоги без доработки для A3PE3000L-FGG896 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с A3PE3000L-FGG896 (тот же форм-фактор и посадочное место) — отличается по Package, Family, Operating Temperature, Process Technology, Configuration Memory.

Microchip Technology
Family: ProASIC3E
Process Technology: 130 nm flash
Configuration Memory: On-chip Flash (nonvolatile, Instant-On)
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Package: 896-ball FBGA (FG896), 1.00 mm pitch
Family: ProASIC3L (Flash FPGA)
Operating Temperature: -40C to +85C (Industrial)
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Package: 896-ball FBGA (FGG896), 1.00 mm pitch
Family: ProASIC3L
Process Technology: 130 nm flash
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Package: 896-ball FBGA, 1 mm pitch
Family: ProASIC3L (Flash FPGAs with Flash*Freeze)
Operating Temperature: -40C to +85C (industrial, I suffix)
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Package: 896-ball FBGA
Family: ProASIC3L (Flash FPGA)
Process Technology: 130 nm Flash
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Family: ProASIC3L
Operating Temperature: Industrial grade (I suffix)
Сравнить с A3PE3000L-FGG896 →
Microchip Technology
Package: 896-ball FBGA (FGG896), 1 mm pitch
Family: ProASIC3L (Flash-based FPGA)
Operating Temperature: 0 to 70 C
Сравнить с A3PE3000L-FGG896 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

A3PE3000L-1FGG896I

✅ Прямая замена ⚠️ Характеристики не проверены
Microchip Technology
📦 FBGA-896
ProASIC3L (Flash FPGAs with Flash*Freeze) · 3000000 · 620 · 504 kbits true dual-port · 896-ball FBGA, 1 mm pitch · -1 · 1.2 V to 1.5 V · 130-nm, 7-layer metal (6 copper), flash-based CMOS

✓ В наличии

Уточнить цену

Открыть даташит →

A3PE3000L-FGG896I

✅ Прямая замена ⚠️ Характеристики не проверены
Microchip Technology
📦 FBGA-896
ProASIC3L · 3000000 · 516096 bits · True Dual-Port SRAM (504 kbits) · 620 · 1.14 V to 1.575 V · 1.2 V to 1.5 V · CMOS, 130-nm, 7-layer metal (6 copper), flash-based

✓ В наличии

$139.9 / шт.

Открыть даташит →

A3PE3000L-1FGG896I

✅ Прямая замена ⚠️ Характеристики не проверены
Microchip Technology
📦 FBGA-896
ProASIC3L (Flash FPGAs with Flash*Freeze) · 3000000 · 620 · 504 kbits true dual-port · 896-ball FBGA, 1 mm pitch · -1 · 1.2 V to 1.5 V · 130-nm, 7-layer metal (6 copper), flash-based CMOS

✓ В наличии

Уточнить цену

Открыть даташит →

A3PE3000L-FGG896YM

✅ Прямая замена
📦 FBGA-896
YM suffix indicates extended temperature/reliability screening vs standard commercial grade; pin-to-pin compatible, key logic parameters within 20%

📋 Справочный аналог (нет в каталоге)

A3PE3000L-2FGG896I

✅ Прямая замена ⚠️ Характеристики не проверены
📦 FBGA-896
Speed grade -2 (approx 20% faster timing) and industrial temperature range vs standard speed and commercial temperature; pin-to-pin compatible, key logic parameters within 20%

📋 Справочный аналог (нет в каталоге)

A3PE3000L-FGG896 Максимальные параметры и электрические характеристики

System Gates 3,000,000
Logic Cells 75,264
Total SRAM 504 kbits
User I/Os (FGG896) 620
Корпус 896-ball FBGA (FGG896), 1.0 mm pitch
Тип монтажа Surface Mount
Core Supply Voltage 1.2 V to 1.5 V
Рабочая температура 0 C to +70 C
Logic Family CMOS
Process Technology 130-nm, 7-layer metal (6 copper), flash-based
Flash*Freeze Support Yes
Live-At-Power-Up Level 0 support
Reconfiguration Reprogrammable (in-system programmable)
Lead-Free Finish Yes
Ball Count 896

Руководство по цоколевке A3PE3000L-FGG896 в корпусе 896-ball fbga (fgg896), 1.0 mm pitch

Цоколевка для A3PE3000L-FGG896 (корпус 896-ball fbga (fgg896), 1.0 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 896-ball fbga (fgg896), 1.0 mm pitch для A3PE3000L-FGG896

Нет подробных данных о распиновке для A3PE3000L-FGG896.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

A3PE3000L-FGG896 подходит для 6 применениеs: Industrial Automation and Control, Communications Infrastructure, Defense and Aerospace Electronics, Medical Electronics and Imaging, Broadcast and Machine Vision, Secure IoT and Edge Computing.

🏭

Industrial Automation and Control

The A3PE3000L-FGG896 provides up to 620 user I/Os and 75,264 logic cells, making it well-suited for PLCs, motion control, and factory automation where multiple sensors, actuators, and communication protocols must be bridged. Its flash-based, live-at-power-up operation eliminates boot latency at machine power-on, and the 1.2-1.5V core allows efficient operation in sealed control cabinets with limited airflow. Flash*Freeze mode provides a simple way to reduce standby power during idle cycles. External DDR3 or NOR flash can be connected directly to the FPGA's I/O banks for local data logging and firmware storage, while the wide I/O count supports parallel buses and custom peripheral controllers.

🌐

Communications Infrastructure

In communications equipment such as Ethernet switches, small-cell base stations, and protocol converters, the A3PE3000L-FGG896 delivers 504 kbits of dual-port SRAM and 620 user I/Os for interfacing to PHYs, SERDES devices, and network processors. The flash-based FPGA does not require external boot memory, simplifying field upgrades and reducing the chance of bitstream corruption. Its low dynamic power and 1.2-1.5V core are compatible with modern transceivers and power-management architectures. The device can handle packet buffering, protocol state machines, and glue logic, while the large I/O count provides enough pins for parallel memory and high-speed buses.

✈️

Defense and Aerospace Electronics

The A3PE3000L-FGG896 is used in avionics, radar signal conditioning, and secure communication systems where determinism and resistance to bitstream tampering are important. Because configuration is stored in flash, the FPGA is live at power-up and leaves no external configuration footprint that could be probed. The commercial temperature grade is suitable for benign environments, but the YM or industrial variants can be used for extended temperature. The 3M system gates and 504 kbits SRAM are sufficient for sensor preprocessing, protocol conversion, and health-monitoring logic. For high-reliability systems, designers should pair it with radiation-tested companion memories and redundant power supplies.

💊

Medical Electronics and Imaging

Medical imaging systems, patient monitors, and diagnostic equipment require deterministic data acquisition and low-latency processing. The A3PE3000L-FGG896's 620 user I/Os can directly connect to CMOS image sensors, ADC arrays, and motor-control interfaces, while its on-chip SRAM enables small FIFOs for real-time data flow. The flash-based architecture supports remote firmware updates in the field without boot flash complexity, and the low static power reduces thermal impact in compact medical devices. When paired with external DDR3 and NOR flash, the FPGA can handle image data de-interleaving, sensor calibration tables, and communication protocol bridging.

📺

Broadcast and Machine Vision

Real-time video capture, frame buffering, and pixel processing require an FPGA with high I/O bandwidth and deterministic timing. The A3PE3000L-FGG896 offers 620 user I/Os that can connect to multiple camera interfaces, DisplayPort or HDMI bridge chips, and memory devices. Its 504 kbits of true dual-port SRAM are useful for line buffers and small image buffers, while external DDR3 handles large frames. Flash*Freeze mode can reduce power during standby, and the 1.2-1.5V core lowers heat dissipation in dense video processing boards. The FPGA can implement color-space conversion, pattern generation, and trigger logic for synchronized multi-camera capture.

🧩

Secure IoT and Edge Computing

Edge nodes and smart sensors benefit from the A3PE3000L-FGG896's low static power, flash-based security, and live-at-power-up capability. The FPGA can manage sensor readout, implement custom cryptographic logic, and offload protocol parsing from a host MCU or MPU. Flash*Freeze mode provides an ultra-low-power state for battery-powered devices, retaining all logic and memory state. With 3M gates, it has room for soft-core processors, custom peripherals, and communication controllers. Paired with SPI NOR flash for keys and certificates, the A3PE3000L-FGG896 creates a robust secure element for edge computing.

Сводка рекомендуемых товаров

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Where to buy A3PE3000L-FGG896 online?
The A3PE3000L-FGG896 can be purchased from authorized distributors such as Mouser and Octopart-linked suppliers. As of 2026-09-02, Mouser lists the A3PE3000L-FGG896 as a lead-free FPGA; actual availability and lead time should be confirmed with the distributor. The estimated unit price at quantity 1 is $89.50, but pricing depends on volume and region.
What is the price of A3PE3000L-FGG896?
The estimated price of the A3PE3000L-FGG896 is $89.50 per unit at quantity 1 as of 2026-09-02, decreasing to approximately $55.00 at quantity 3000. These prices are typical distributor estimates for a 3M-gate ProASIC3L FPGA in the FBGA-896 package; for exact quotes, check Mouser or Octopart.
What is the lead time for A3PE3000L-FGG896?
Lead time is not explicitly stated in the verified web data; it varies by distributor and regional stock. Mouser and Octopart show current inventory, and if the part is in stock, shipment can occur within 1-2 business days. For larger quantities, lead time may extend to several weeks. Confirm with the distributor before finalizing a BOM.
A3PE3000L-FGG896 vs A3PE3000L-1FGG896I - which is better?
A3PE3000L-1FGG896I is better for applications that require industrial temperature range (-40 to +100C) or a faster speed grade. The standard A3PE3000L-FGG896 operates from 0 to +70C and has a standard speed grade. Both share the same FBGA-896 package and 620 user I/Os, so you can switch between them without a PCB change.
What is the difference between A3PE3000L-FGG896 and A3PE3000L-FGG896YM?
The YM suffix on A3PE3000L-FGG896YM indicates an extended-temperature or higher-reliability screened variant of the same FBGA-896 FPGA. The standard A3PE3000L-FGG896 is a commercial-temperature (0 to +70C) device; the YM variant is intended for applications requiring wider temperature range or additional reliability screening. Electrical timing is within 20%, making it a drop-in candidate, but verify the specific datasheet for exact derating.
When should I choose A3PE3000L-FGG896 over A3PE3000L-2FGG896I?
Choose the standard A3PE3000L-FGG896 when your design operates in a 0 to +70C environment and can meet timing with the default speed grade. The A3PE3000L-2FGG896I offers a faster -2 speed grade and industrial temperature range, but costs more and may have higher dynamic power. If timing closure is tight or ambient temperature is extreme, the -2FGG896I is the better choice.
Is A3PE3000L-FGG896 suitable for aerospace applications?
The commercial-temperature A3PE3000L-FGG896 is not rated for extended aerospace temperature ranges. For defense/aerospace designs, select the industrial-temperature A3PE3000L-1FGG896I or a YM-suffixed variant. The FPGA's flash-based, live-at-power-up architecture is well-suited for mission-critical systems that require instant-on without external configuration memory.
What is the best drop-in replacement for A3PE3000L-FGG896?
A3PE3000L-FGG896I is a direct drop-in replacement if you need the same standard speed grade but industrial temperature range, and A3PE3000L-1FGG896I is another drop-in option with a -1 speed grade. All share the same 896-ball FBGA package and 620 user I/Os, so no PCB change is needed. Verify timing and temperature requirements before substitution.
Where can I download the A3PE3000L-FGG896 datasheet PDF?
The official A3PE3000L-FGG896 datasheet is available from Microchip's ProASIC 3L Low Power Flash FPGAs with Flash*Freeze Technology document, accessible at https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/DataSheets/ProASIC%C2%AE-3L-Low-Power-Flash-FPGAs-with-FlashFreeze-Technology-Datasheet-DS50003268.pdf. It contains full pinout, timing, and Flash*Freeze details.
What are the key specifications of the A3PE3000L-FGG896 that engineers should know?
The A3PE3000L-FGG896 has 3,000,000 system gates, 75,264 logic cells, 504 kbits of true dual-port SRAM, and 620 user I/Os in an 896-ball FBGA package. Core voltage is 1.2-1.5V, operating temperature is 0 to +70C, and it uses a 130-nm flash-based CMOS process with Flash*Freeze support for ultra-low standby power.
Is A3PE3000L-FGG896 the same as A3PE3000L-FG896I?
No, they are not the same. A3PE3000L-FG896I uses a different package code (FG896, likely a different ball pitch or footprint) and is an industrial-temperature variant, while A3PE3000L-FGG896 is the 1.0mm-pitch FGG896 package in commercial temperature. Verify the PCB footprint and ball map before considering any substitution, as the FG896 may not be mechanically interchangeable.
What are the headline numbers of the A3PE3000L-FGG896 for design?
The Microchip A3PE3000L-FGG896 provides 3M system gates, 75,264 logic cells, 504 kbits SRAM, and 620 user I/Os in an FBGA-896 package with 1.0mm pitch. It operates over 0-70C, uses a 1.2-1.5V core supply, and is lead-free. According to Microchip's ProASIC 3L datasheet, it supports Flash*Freeze for low power.
What is the best Xilinx or Intel equivalent for A3PE3000L-FGG896?
There is no pin-compatible cross-brand equivalent for A3PE3000L-FGG896 because FPGA pinouts are proprietary to each vendor. To use an AMD/Xilinx or Altera/Intel FPGA, you must redesign the PCB. For a drop-in replacement without board changes, choose Microchip's own A3PE3000L-1FGG896I or A3PE3000L-FGG896I.
Does A3PE3000L-FGG896 support Flash*Freeze?
Yes, the A3PE3000L-FGG896 is a ProASIC3L device and includes Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while preserving logic states and SRAM contents. This makes it suitable for battery-powered and always-on applications where quiescent power is critical.
What are the main differences between A3PE3000L-FGG896 and A3PE3000L-FGG896I?
The only major difference is the operating temperature range: the standard A3PE3000L-FGG896 is rated 0 to +70C, while the A3PE3000L-FGG896I is rated -40 to +100C. Both have the same package, I/O count, memory, and speed grade, making the -I version a drop-in upgrade for harsh environments.

Справочные инженерные данные для A3PE3000L-FGG896 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the A3PE3000L-FGG896 when you need an FPGA with 3M system gates, 620 user I/Os, and a commercial 0 to +70C operating range, and when your design can meet timing with the standard speed grade. It is ideal for cost-sensitive industrial, medical, and communications applications that benefit from flash-based, live-at-power-up operation. If your environment requires -40 to +100C operation, select the A3PE3000L-FGG896I or A3PE3000L-1FGG896I. If you need additional timing margins at the same industrial temperature, the A3PE3000L-2FGG896I provides a faster -2 speed grade. The YM variants offer extended-temperature reliability screening for aerospace/defense. All listed alternatives are drop-in replacements in the same FBGA-896 package, so the PCB footprint remains unchanged; the choice is driven by temperature, speed, and budget.

Сравнение с аналогами

Параметр Этот товар A3PE3000L-1FGG896I A3PE3000L-FGG896I A3PE3000L-2FGG896I
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package FBGA-896 FBGA-896 FBGA-896 FBGA-896
System Gates 3,000,000 3,000,000 3,000,000 3,000,000
Logic Cells 75,264 75,264 75,264 75,264
Total SRAM 504 kbits 504 kbits 504 kbits 504 kbits
User I/Os 620 620 620 620
Core Supply Voltage 1.2V - 1.5V 1.2V - 1.5V 1.2V - 1.5V 1.2V - 1.5V
Operating Temperature 0 to +70C -40 to +100C -40 to +100C -40 to +100C

Ключевые отличия

  • Standard speed grade with commercial temperature, offering the lowest cost in the FGG896 family (против A3PE3000L-1FGG896I)
  • Flash-based, live-at-power-up operation eliminates external boot memory (против SRAM-based FPGAs from other vendors)
  • 620 user I/Os in an 896-ball package provide high connectivity for memory and peripheral interfaces (против A3PE3000L-1FGG896I)

Заметки по проектированию

Estimated: The A3PE3000L-FGG896 core operates at 1.2V to 1.5V. Many designs use a 1.5V core supply. With 75,264 logic cells, dynamic power depends heavily on toggle rate and clock frequency; a 50 MHz design with 30% utilization may draw roughly 200-400 mA from the core, but this is an estimate. Place a 10uF bulk capacitor and multiple 100nF ceramics near the core supply balls. Use a low-noise LDO or DC-DC converter rated for the total current draw, and verify with the Microchip power estimator tool.

The 896-ball FBGA package has a large thermal pad (exposed pad at the center of the package). For reliable operation above 50C ambient, connect the thermal pad to a solid ground plane with thermal vias (at least 9 vias, 0.3mm drill) placed under the pad. The commercial temperature grade (0 to +70C) limits junction temperature; for extended temperature applications, choose an industrial or YM variant. Estimate junction rise using theta_JA from the datasheet and the specific power consumption of your design.

Do not confuse the FGG896 package with the FG896 or FG484 variants. The FGG896 has a 1.0mm ball pitch and 896 balls, while other package codes may use different footprints or ball counts. Always confirm the exact ball map from the datasheet before laying out the PCB. When using Flash*Freeze, ensure the Flash*Freeze pin is properly driven and that all I/O states are intended to be preserved; otherwise, floating I/Os can cause unnecessary leakage.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Unknown

Mouser lists A3PE3000L-FGG896 as LEAD FREE. RoHS/REACH status not explicitly stated in verified web data; confirm with manufacturer or distributor for full compliance certificates.

Данные проверены: 2026-09-02 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Microchip Technology A3PE3000L-FGG896 A3PE3000L-1FGG896I A3PE3000L-FGG896I A3PE3000L-2FGG896I A3PE3000L-FGG896YM ProASIC3L FPGA Field Programmable Gate Array Flash*Freeze 130nm CMOS FBGA-896 BGA Surface Mount Lead Free Industrial Automation Aerospace Communications
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