A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
Артикул: A3PE3000L-FGG896 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82 | $820,00 |
| 100 | $74.5 | $7.450,00 |
| 500 | $68 | $34.000,00 |
| 1.000 | $62 | $62.000,00 |
| 3.000 | $55 | $165.000,00 |
A3PE3000L-FGG896 Обзор
An FPGA (Field Programmable Gate Array) is an integrated circuit whose logic fabric can be configured after manufacturing. The ProASIC3L family uses flash-based configuration cells, enabling non-volatile, live-at-power-up operation without an external boot device. FPGAs sit in the digital logic hierarchy between CPLDs and ASICs, balancing flexibility, density, and time-to-market. The A3PE3000L-FGG896 is a mid-density ProASIC3L device, positioned for applications that need substantial logic but not the complexity of the largest FPGA families.
Key features of the A3PE3000L-FGG896 include Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while retaining register states, 1.2V to 1.5V core operation, and up to 620 user I/Os. The device is manufactured on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, making it inherently secure and resistant to configuration bitstream loss. It supports Level 0 live-at-power-up, meaning the FPGA is operational immediately after power rail stabilization.
The ProASIC3L architecture provides true single-chip operation, with configuration stored in on-chip flash cells, eliminating the need for external configuration memory and reducing system component count. The device offers 504 kbits of true dual-port SRAM, which supports concurrent read/write accesses for FIFO and buffer applications. The 620 user I/Os are arranged in banks with flexible I/O standards, although the exact voltage and standard options are detailed in the manufacturer datasheet.
Typical applications include industrial automation and control, communications infrastructure, defense and aerospace electronics, medical imaging, broadcast and machine vision, and secure IoT edge computing. The low static power and Flash*Freeze mode make the A3PE3000L-FGG896 particularly attractive for battery-powered and thermally constrained systems.
When designing with the A3PE3000L-FGG896, pay close attention to core supply decoupling: place 100nF ceramic capacitors close to each core supply ball and a bulk capacitor on the board. The 1.2-1.5V core supply should be stable and clean; the Flash*Freeze input can be driven from a GPIO or power management IC to reduce standby current. Thermal vias under the BGA should be used to improve heat transfer.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and design-in information.
Аналоги без доработки для A3PE3000L-FGG896 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с A3PE3000L-FGG896 (тот же форм-фактор и посадочное место) — отличается по Package, Family, Operating Temperature, Process Technology, Configuration Memory.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
A3PE3000L-1FGG896I
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Уточнить цену
Открыть даташит →A3PE3000L-FGG896I
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$139.9 / шт.
Открыть даташит →A3PE3000L-1FGG896I
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Уточнить цену
Открыть даташит →A3PE3000L-FGG896YM
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A3PE3000L-2FGG896I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
A3PE3000L-FGG896 Максимальные параметры и электрические характеристики
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| Total SRAM | 504 kbits |
| User I/Os (FGG896) | 620 |
| Корпус | 896-ball FBGA (FGG896), 1.0 mm pitch |
| Тип монтажа | Surface Mount |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Рабочая температура | 0 C to +70 C |
| Logic Family | CMOS |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based |
| Flash*Freeze Support | Yes |
| Live-At-Power-Up | Level 0 support |
| Reconfiguration | Reprogrammable (in-system programmable) |
| Lead-Free Finish | Yes |
| Ball Count | 896 |
Руководство по цоколевке A3PE3000L-FGG896 в корпусе 896-ball fbga (fgg896), 1.0 mm pitch
Цоколевка для A3PE3000L-FGG896 (корпус 896-ball fbga (fgg896), 1.0 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для A3PE3000L-FGG896.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
A3PE3000L-FGG896 подходит для 6 применениеs: Industrial Automation and Control, Communications Infrastructure, Defense and Aerospace Electronics, Medical Electronics and Imaging, Broadcast and Machine Vision, Secure IoT and Edge Computing.
Industrial Automation and Control
The A3PE3000L-FGG896 provides up to 620 user I/Os and 75,264 logic cells, making it well-suited for PLCs, motion control, and factory automation where multiple sensors, actuators, and communication protocols must be bridged. Its flash-based, live-at-power-up operation eliminates boot latency at machine power-on, and the 1.2-1.5V core allows efficient operation in sealed control cabinets with limited airflow. Flash*Freeze mode provides a simple way to reduce standby power during idle cycles. External DDR3 or NOR flash can be connected directly to the FPGA's I/O banks for local data logging and firmware storage, while the wide I/O count supports parallel buses and custom peripheral controllers.
Рекомендуется
Communications Infrastructure
In communications equipment such as Ethernet switches, small-cell base stations, and protocol converters, the A3PE3000L-FGG896 delivers 504 kbits of dual-port SRAM and 620 user I/Os for interfacing to PHYs, SERDES devices, and network processors. The flash-based FPGA does not require external boot memory, simplifying field upgrades and reducing the chance of bitstream corruption. Its low dynamic power and 1.2-1.5V core are compatible with modern transceivers and power-management architectures. The device can handle packet buffering, protocol state machines, and glue logic, while the large I/O count provides enough pins for parallel memory and high-speed buses.
Рекомендуется
Defense and Aerospace Electronics
The A3PE3000L-FGG896 is used in avionics, radar signal conditioning, and secure communication systems where determinism and resistance to bitstream tampering are important. Because configuration is stored in flash, the FPGA is live at power-up and leaves no external configuration footprint that could be probed. The commercial temperature grade is suitable for benign environments, but the YM or industrial variants can be used for extended temperature. The 3M system gates and 504 kbits SRAM are sufficient for sensor preprocessing, protocol conversion, and health-monitoring logic. For high-reliability systems, designers should pair it with radiation-tested companion memories and redundant power supplies.
Рекомендуется
Medical Electronics and Imaging
Medical imaging systems, patient monitors, and diagnostic equipment require deterministic data acquisition and low-latency processing. The A3PE3000L-FGG896's 620 user I/Os can directly connect to CMOS image sensors, ADC arrays, and motor-control interfaces, while its on-chip SRAM enables small FIFOs for real-time data flow. The flash-based architecture supports remote firmware updates in the field without boot flash complexity, and the low static power reduces thermal impact in compact medical devices. When paired with external DDR3 and NOR flash, the FPGA can handle image data de-interleaving, sensor calibration tables, and communication protocol bridging.
Рекомендуется
Broadcast and Machine Vision
Real-time video capture, frame buffering, and pixel processing require an FPGA with high I/O bandwidth and deterministic timing. The A3PE3000L-FGG896 offers 620 user I/Os that can connect to multiple camera interfaces, DisplayPort or HDMI bridge chips, and memory devices. Its 504 kbits of true dual-port SRAM are useful for line buffers and small image buffers, while external DDR3 handles large frames. Flash*Freeze mode can reduce power during standby, and the 1.2-1.5V core lowers heat dissipation in dense video processing boards. The FPGA can implement color-space conversion, pattern generation, and trigger logic for synchronized multi-camera capture.
Рекомендуется
Secure IoT and Edge Computing
Edge nodes and smart sensors benefit from the A3PE3000L-FGG896's low static power, flash-based security, and live-at-power-up capability. The FPGA can manage sensor readout, implement custom cryptographic logic, and offload protocol parsing from a host MCU or MPU. Flash*Freeze mode provides an ultra-low-power state for battery-powered devices, retaining all logic and memory state. With 3M gates, it has room for soft-core processors, custom peripherals, and communication controllers. Paired with SPI NOR flash for keys and certificates, the A3PE3000L-FGG896 creates a robust secure element for edge computing.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для A3PE3000L-FGG896 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | A3PE3000L-1FGG896I | A3PE3000L-FGG896I | A3PE3000L-2FGG896I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FBGA-896 | FBGA-896 | FBGA-896 | FBGA-896 |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 |
| Total SRAM | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| User I/Os | 620 | 620 | 620 | 620 |
| Core Supply Voltage | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V |
| Operating Temperature | 0 to +70C | -40 to +100C | -40 to +100C | -40 to +100C |
Ключевые отличия
- Standard speed grade with commercial temperature, offering the lowest cost in the FGG896 family (против A3PE3000L-1FGG896I)
- Flash-based, live-at-power-up operation eliminates external boot memory (против SRAM-based FPGAs from other vendors)
- 620 user I/Os in an 896-ball package provide high connectivity for memory and peripheral interfaces (против A3PE3000L-1FGG896I)
Заметки по проектированию
Estimated: The A3PE3000L-FGG896 core operates at 1.2V to 1.5V. Many designs use a 1.5V core supply. With 75,264 logic cells, dynamic power depends heavily on toggle rate and clock frequency; a 50 MHz design with 30% utilization may draw roughly 200-400 mA from the core, but this is an estimate. Place a 10uF bulk capacitor and multiple 100nF ceramics near the core supply balls. Use a low-noise LDO or DC-DC converter rated for the total current draw, and verify with the Microchip power estimator tool.
The 896-ball FBGA package has a large thermal pad (exposed pad at the center of the package). For reliable operation above 50C ambient, connect the thermal pad to a solid ground plane with thermal vias (at least 9 vias, 0.3mm drill) placed under the pad. The commercial temperature grade (0 to +70C) limits junction temperature; for extended temperature applications, choose an industrial or YM variant. Estimate junction rise using theta_JA from the datasheet and the specific power consumption of your design.
Do not confuse the FGG896 package with the FG896 or FG484 variants. The FGG896 has a 1.0mm ball pitch and 896 balls, while other package codes may use different footprints or ball counts. Always confirm the exact ball map from the datasheet before laying out the PCB. When using Flash*Freeze, ensure the Flash*Freeze pin is properly driven and that all I/O states are intended to be preserved; otherwise, floating I/Os can cause unnecessary leakage.
Информация о соответствии
Mouser lists A3PE3000L-FGG896 as LEAD FREE. RoHS/REACH status not explicitly stated in verified web data; confirm with manufacturer or distributor for full compliance certificates.