A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
부품 번호: A3PE3000L-FGG896 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $74.5 | $7,450.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $62 | $62,000.00 |
| 3,000 | $55 | $165,000.00 |
A3PE3000L-FGG896 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit whose logic fabric can be configured after manufacturing. The ProASIC3L family uses flash-based configuration cells, enabling non-volatile, live-at-power-up operation without an external boot device. FPGAs sit in the digital logic hierarchy between CPLDs and ASICs, balancing flexibility, density, and time-to-market. The A3PE3000L-FGG896 is a mid-density ProASIC3L device, positioned for applications that need substantial logic but not the complexity of the largest FPGA families.
Key features of the A3PE3000L-FGG896 include Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while retaining register states, 1.2V to 1.5V core operation, and up to 620 user I/Os. The device is manufactured on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, making it inherently secure and resistant to configuration bitstream loss. It supports Level 0 live-at-power-up, meaning the FPGA is operational immediately after power rail stabilization.
The ProASIC3L architecture provides true single-chip operation, with configuration stored in on-chip flash cells, eliminating the need for external configuration memory and reducing system component count. The device offers 504 kbits of true dual-port SRAM, which supports concurrent read/write accesses for FIFO and buffer applications. The 620 user I/Os are arranged in banks with flexible I/O standards, although the exact voltage and standard options are detailed in the manufacturer datasheet.
Typical applications include industrial automation and control, communications infrastructure, defense and aerospace electronics, medical imaging, broadcast and machine vision, and secure IoT edge computing. The low static power and Flash*Freeze mode make the A3PE3000L-FGG896 particularly attractive for battery-powered and thermally constrained systems.
When designing with the A3PE3000L-FGG896, pay close attention to core supply decoupling: place 100nF ceramic capacitors close to each core supply ball and a bulk capacitor on the board. The 1.2-1.5V core supply should be stable and clean; the Flash*Freeze input can be driven from a GPIO or power management IC to reduce standby current. Thermal vias under the BGA should be used to improve heat transfer.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and design-in information.
드롭인 대체품: A3PE3000L-FGG896 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-FGG896 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Operating Temperature, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1FGG896I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$139.9 / 개
데이터시트 보기 →A3PE3000L-1FGG896I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896YM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-2FGG896I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-FGG896 최대 정격 & 전기적 특성
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| Total SRAM | 504 kbits |
| User I/Os (FGG896) | 620 |
| 패키지 | 896-ball FBGA (FGG896), 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Core Supply Voltage | 1.2 V to 1.5 V |
| 동작 온도 | 0 C to +70 C |
| Logic Family | CMOS |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based |
| Flash*Freeze Support | Yes |
| Live-At-Power-Up | Level 0 support |
| Reconfiguration | Reprogrammable (in-system programmable) |
| Lead-Free Finish | Yes |
| Ball Count | 896 |
A3PE3000L-FGG896 896-ball fbga (fgg896), 1.0 mm pitch 핀 구성 가이드
A3PE3000L-FGG896(896-ball fbga (fgg896), 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-FGG896.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-FGG896 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Communications Infrastructure, Defense and Aerospace Electronics, Medical Electronics and Imaging, Broadcast and Machine Vision, Secure IoT and Edge Computing.
Industrial Automation and Control
The A3PE3000L-FGG896 provides up to 620 user I/Os and 75,264 logic cells, making it well-suited for PLCs, motion control, and factory automation where multiple sensors, actuators, and communication protocols must be bridged. Its flash-based, live-at-power-up operation eliminates boot latency at machine power-on, and the 1.2-1.5V core allows efficient operation in sealed control cabinets with limited airflow. Flash*Freeze mode provides a simple way to reduce standby power during idle cycles. External DDR3 or NOR flash can be connected directly to the FPGA's I/O banks for local data logging and firmware storage, while the wide I/O count supports parallel buses and custom peripheral controllers.
추천
Communications Infrastructure
In communications equipment such as Ethernet switches, small-cell base stations, and protocol converters, the A3PE3000L-FGG896 delivers 504 kbits of dual-port SRAM and 620 user I/Os for interfacing to PHYs, SERDES devices, and network processors. The flash-based FPGA does not require external boot memory, simplifying field upgrades and reducing the chance of bitstream corruption. Its low dynamic power and 1.2-1.5V core are compatible with modern transceivers and power-management architectures. The device can handle packet buffering, protocol state machines, and glue logic, while the large I/O count provides enough pins for parallel memory and high-speed buses.
추천
Defense and Aerospace Electronics
The A3PE3000L-FGG896 is used in avionics, radar signal conditioning, and secure communication systems where determinism and resistance to bitstream tampering are important. Because configuration is stored in flash, the FPGA is live at power-up and leaves no external configuration footprint that could be probed. The commercial temperature grade is suitable for benign environments, but the YM or industrial variants can be used for extended temperature. The 3M system gates and 504 kbits SRAM are sufficient for sensor preprocessing, protocol conversion, and health-monitoring logic. For high-reliability systems, designers should pair it with radiation-tested companion memories and redundant power supplies.
추천
Medical Electronics and Imaging
Medical imaging systems, patient monitors, and diagnostic equipment require deterministic data acquisition and low-latency processing. The A3PE3000L-FGG896's 620 user I/Os can directly connect to CMOS image sensors, ADC arrays, and motor-control interfaces, while its on-chip SRAM enables small FIFOs for real-time data flow. The flash-based architecture supports remote firmware updates in the field without boot flash complexity, and the low static power reduces thermal impact in compact medical devices. When paired with external DDR3 and NOR flash, the FPGA can handle image data de-interleaving, sensor calibration tables, and communication protocol bridging.
추천
Broadcast and Machine Vision
Real-time video capture, frame buffering, and pixel processing require an FPGA with high I/O bandwidth and deterministic timing. The A3PE3000L-FGG896 offers 620 user I/Os that can connect to multiple camera interfaces, DisplayPort or HDMI bridge chips, and memory devices. Its 504 kbits of true dual-port SRAM are useful for line buffers and small image buffers, while external DDR3 handles large frames. Flash*Freeze mode can reduce power during standby, and the 1.2-1.5V core lowers heat dissipation in dense video processing boards. The FPGA can implement color-space conversion, pattern generation, and trigger logic for synchronized multi-camera capture.
추천
Secure IoT and Edge Computing
Edge nodes and smart sensors benefit from the A3PE3000L-FGG896's low static power, flash-based security, and live-at-power-up capability. The FPGA can manage sensor readout, implement custom cryptographic logic, and offload protocol parsing from a host MCU or MPU. Flash*Freeze mode provides an ultra-low-power state for battery-powered devices, retaining all logic and memory state. With 3M gates, it has room for soft-core processors, custom peripherals, and communication controllers. Paired with SPI NOR flash for keys and certificates, the A3PE3000L-FGG896 creates a robust secure element for edge computing.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-FGG896 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1FGG896I | A3PE3000L-FGG896I | A3PE3000L-2FGG896I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FBGA-896 | FBGA-896 | FBGA-896 | FBGA-896 |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 |
| Total SRAM | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| User I/Os | 620 | 620 | 620 | 620 |
| Core Supply Voltage | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V | 1.2V - 1.5V |
| Operating Temperature | 0 to +70C | -40 to +100C | -40 to +100C | -40 to +100C |
주요 차별점
- Standard speed grade with commercial temperature, offering the lowest cost in the FGG896 family (vs A3PE3000L-1FGG896I)
- Flash-based, live-at-power-up operation eliminates external boot memory (vs SRAM-based FPGAs from other vendors)
- 620 user I/Os in an 896-ball package provide high connectivity for memory and peripheral interfaces (vs A3PE3000L-1FGG896I)
설계 노트
Estimated: The A3PE3000L-FGG896 core operates at 1.2V to 1.5V. Many designs use a 1.5V core supply. With 75,264 logic cells, dynamic power depends heavily on toggle rate and clock frequency; a 50 MHz design with 30% utilization may draw roughly 200-400 mA from the core, but this is an estimate. Place a 10uF bulk capacitor and multiple 100nF ceramics near the core supply balls. Use a low-noise LDO or DC-DC converter rated for the total current draw, and verify with the Microchip power estimator tool.
The 896-ball FBGA package has a large thermal pad (exposed pad at the center of the package). For reliable operation above 50C ambient, connect the thermal pad to a solid ground plane with thermal vias (at least 9 vias, 0.3mm drill) placed under the pad. The commercial temperature grade (0 to +70C) limits junction temperature; for extended temperature applications, choose an industrial or YM variant. Estimate junction rise using theta_JA from the datasheet and the specific power consumption of your design.
Do not confuse the FGG896 package with the FG896 or FG484 variants. The FGG896 has a 1.0mm ball pitch and 896 balls, while other package codes may use different footprints or ball counts. Always confirm the exact ball map from the datasheet before laying out the PCB. When using Flash*Freeze, ensure the Flash*Freeze pin is properly driven and that all I/O states are intended to be preserved; otherwise, floating I/Os can cause unnecessary leakage.
규정 준수 정보
Mouser lists A3PE3000L-FGG896 as LEAD FREE. RoHS/REACH status not explicitly stated in verified web data; confirm with manufacturer or distributor for full compliance certificates.
