Microchip Technology

ATSAM4SD16CB-ANR - 32-bit ARM Cortex-M4 MCU, 1MB Flash, 100-LQFP | Microchip

Артикул: ATSAM4SD16CB-ANR ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.62 V to 3.6 V Vdss 100-LQFP (14 x 14 mm) Package 120 MHz Speed 1 MB (2 x 512 KB dual-bank) Memory
От $7.3 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-20
Оптовые цены
Кол-во Цена за ед. Итого
1 $11.42 $11,42
10 $10.27 $102,70
100 $9.13 $913,00
500 $8.21 $4.105,00
1.000 $7.3 $7.300,00
ℹ️ Все цены указаны в USD

ATSAM4SD16CB-ANR Обзор

The Microchip Technology ATSAM4SD16CB-ANR is a 32-bit ARM Cortex-M4 microcontroller with Floating Point Unit (FPU), 1MB dual-bank Flash memory (organized as 2 x 512KB), 160KB SRAM, and a maximum CPU clock of 120 MHz, supplied in a 100-pin LQFP package on tape-and-reel. It belongs to the SAM4SD16C family (revision B, MRL B silicon) and integrates a full-speed USB 2.0 Device port with embedded transceiver, a high-speed 16-bit host/host+device bus for external memory, multiple USART/UART, SPI, TWI (I2C), an 8-channel 10-bit ADC, a 16-bit timer/counter block, and an embedded crypto engine (TRNG + AES) on selected variants.

What is a Cortex-M4 microcontroller? A Cortex-M4 microcontroller is a 32-bit RISC processor core designed by Arm Holdings specifically for embedded applications that require deterministic real-time performance and (optionally) single-precision floating-point math. The Cortex-M4 sits at the top of the Cortex-M family for performance; it is positioned between the smaller Cortex-M0+/M3 and the higher-end Cortex-M7. MCUs based on this core are widely used in motor control, industrial automation, consumer audio, USB peripherals, and IoT edge nodes where both DSP-like signal processing and low power are required.

Key features of the ATSAM4SD16CB-ANR include 1MB Flash (dual-bank for in-field firmware upgrade), 160KB SRAM, a high-speed Multi-port SRAM bus, an external bus interface (EBI) supporting SRAM, NOR Flash, and PSRAM, a full-speed USB Device port, an SD/MMC interface, two I2S controllers, two 3-channel 16-bit timer/counters, four USARTs, two UARTs, two TWI (I2C) ports, two SPI ports, one HS-SPI, an 8-channel 10-bit ADC, and a Real-Time Clock with calendar/alarm. The 100-LQFP package (14 mm x 14 mm) gives access to most peripherals while remaining hand-solderable for prototypes.

The ATSAM4SD16CB-ANR uses a single 1.62V to 3.6V supply, with internal voltage regulators generating the 1.2V core voltage. Power consumption is in the single-digit milliampere range at full 120 MHz speed, and several low-power modes (Sleep, Wait, Backup) reduce quiescent draw dramatically. The chip operates over the industrial -40C to +85C range, with the -ANR suffix designating extended temperature grade (105C) and tape-and-reel packaging.

Typical applications include industrial control PLCs and HMIs, USB peripherals such as data loggers and POS terminals, smart energy metering, building automation gateways, motor-control BLDC drives, and consumer audio devices that benefit from the I2S ports and DSP instructions. Revision B (MRL B) silicon is the recommended variant for new designs; older revisions are now legacy.

When designing with this part, place a 10uF plus 0.1uF bulk-rail decoupling network within a few millimetres of each VDD/VBAT pin pair, and keep the 32.768 kHz crystal trace short and guarded. The USB DP/DM traces should be routed as a 90-ohm differential pair and the ferrite bead per Microchip application note recommendations to pass USB compliance.

Аналоги без доработки для ATSAM4SD16CB-ANR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с ATSAM4SD16CB-ANR (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Core Architecture, Operating Temperature, USB.

Microchip Technology
Core Architecture: 32-bit RISC with FPU and DSP instructions
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-LQFP (14x14 mm), green
ADC: 12-bit, multi-channel
Core Architecture: ARM Cortex-M4
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-LQFP (14x14 mm)
ADC: 1x 12-bit, up to 16 channels
Core Architecture: ARM Cortex-M4 with FPU
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-pin LQFP (LFQFP)
ADC: 12-bit
Core Architecture: ARM Cortex-M4 with FPU
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-pin LQFP (14x14 mm)
Operating Temperature: -40 C to +85 C (industrial)
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-pin LQFP (14x14 mm)
ADC: 12-bit, up to 24 channels (per datasheet family)
Core Architecture: ARM Cortex-M4 with DSP extensions and Thumb-2
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-TFBGA (9 x 9 mm)
ADC: 12-bit, up to 24 channels
Core Architecture: ARM Cortex-M4 with FPU
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-ball VFBGA (7x7 mm)
ADC: 12-bit, up to 24 channels, 1 Msps
Core Architecture: ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch
ADC: 1 x 12-bit, up to 16 channels
Operating Temperature: -40 C to +105 C (extended industrial, 'CN' designator)
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 100-ball TFBGA (9x9 mm)
ADC: 12-bit, up to 16 channels
Core Architecture: ARM Cortex-M4 (32-bit RISC)
Сравнить с ATSAM4SD16CB-ANR →
Microchip Technology
Package: 64-LQFP (10x10 mm)
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Microchip Technology
Package: 100-LQFP (14x14 mm)
ADC: 10-bit, up to 24 channels
USB: Full-Speed USB Device with embedded transceiver
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Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

ATSAM4SD16CB-AN

✅ Прямая замена
📦 100-LQFP (14x14)
same die, same 100-LQFP, but tray packaging instead of tape & reel

📋 Справочный аналог (нет в каталоге)

ATSAM4SA16CB-ANR

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 with FPU · 32-bit · 120 MHz · 1 MB (1M x 8) · 152 KB · 1.62 V to 3.6 V · 100-LQFP (14x14 mm) · -40C to +85C (Industrial)

✓ В наличии

$7.05 / шт.

Открыть даташит →

ATSAM4SA16CB-AN

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 · 32-bit · 120 MHz · Yes (single-precision) · Yes · 1 MB (1M x 8) · 152 KB · 1.62 V to 3.6 V

✓ В наличии

$5.95 / шт.

Открыть даташит →

ATSAM4SD16CA-AUR

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 with DSP extensions and Thumb-2 · 120 MHz maximum · 1 MB (2 x 512 KB dual-bank) · 160 KB · 2 KB · Yes · 1.62 V to 3.6 V · -40 C to +85 C (industrial)

✓ В наличии

$7.49 / шт.

Открыть даташит →

ATSAM4SD16CA-CUR

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 with FPU · 32-bit · 120 MHz · 1 MB (2 x 512 KB dual-bank) · 160 KB · 100-TFBGA (9 x 9 mm) · 1.62 V to 3.6 V · 1.62 V to 3.6 V

✓ В наличии

$5.55 / шт.

Открыть даташит →

ATSAM4SD16CA-AU

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 · Single-core · 120 MHz · 2 Kbytes · Thumb-2, DSP · Single-precision · 1 MB (2 x 512 KB dual-bank) · 160 KB

✓ В наличии

$5.55 / шт.

Открыть даташит →

ATSAM4SD16CA-ANR

✅ Прямая замена
Microchip Technology
📦 100-LQFP (14x14)
ARM Cortex-M4 with FPU · 32-bit · 120 MHz · 1024 KB (1 MB) · 160 KB · 1.62 V to 3.6 V · 100-pin LQFP (LFQFP) · Surface Mount

✓ В наличии

$6.72 / шт.

Открыть даташит →

ATSAM4SD16CB-ANR Максимальные параметры и электрические характеристики

Core Architecture ARM Cortex-M4F (32-bit RISC, with FPU)
Maximum CPU Clock 120 MHz
Flash Memory 1 MB (2 x 512 KB dual-bank)
SRAM 160 KB
Operating Voltage 1.62 V to 3.6 V
Корпус 100-LQFP (14 x 14 mm)
Рабочая температура -40C to +105C (extended)
USB Interface USB 2.0 Full-Speed Device, embedded transceiver
External Bus Interface (EBI) Yes - SRAM/NOR/PSRAM
ADC 8-channel, 10-bit
Timers 2 x 3-channel 16-bit TC
Communication 4 x USART, 2 x UART, 2 x SPI, 1 x HS-SPI, 2 x TWI (I2C), 2 x I2S
SD/MMC Interface Yes (HSMCI)
Cryptography TRNG + AES hardware accelerator
Silicon Revision MRL B (Revision B)
Тип монтажа Surface Mount
Статус RoHS Compliant
Packaging Tape & Reel

Конфигурация выводов ATSAM4SD16CB-ANR

LQFP-100 Package Pinout Diagram LQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 LQFP-100
Контакт 1 PA0 — I/O line / peripheral function A0
Контакт 2 PA1 — I/O line / peripheral function A1
Контакт 3 PA2 — I/O line / peripheral function A2
Контакт 4 PA3 — I/O line / peripheral function A3
Контакт 5 PA4 — I/O line / peripheral function A4
Контакт 6 PA5 — I/O line / peripheral function A5
Контакт 7 PA6 — I/O line / peripheral function A6
Контакт 8 PA7 — I/O line / peripheral function A7
Контакт 9 VDDIO — I/O supply voltage
Контакт 10 VSSIO — I/O ground
Контакт 11 PB0 — I/O line / peripheral function B0
Контакт 12 PB1 — I/O line / peripheral function B1
Контакт 13 PB2 — I/O line / peripheral function B2
Контакт 14 PB3 — I/O line / peripheral function B3
Контакт 15 PB4 — I/O line / peripheral function B4
Контакт 16 PB5 — I/O line / peripheral function B5
Контакт 17 PB6 — I/O line / peripheral function B6
Контакт 18 PB7 — I/O line / peripheral function B7
Контакт 19 PB8 — I/O line / peripheral function B8
Контакт 20 PB9 — I/O line / peripheral function B9
Контакт 21 PB10 — I/O line / peripheral function B10
Контакт 22 PB11 — I/O line / peripheral function B11
Контакт 23 PB12 — I/O line / peripheral function B12
Контакт 24 PB13 — I/O line / peripheral function B13
Контакт 25 PB14 — I/O line / peripheral function B14
Контакт 26 PB15 — I/O line / peripheral function B15
Контакт 27 VDDCORE — Core supply output (1.2 V regulator)
Контакт 28 VSS — Digital ground
Контакт 29 VDDIO — I/O supply voltage
Контакт 30 VSSIO — I/O ground
Контакт 31 PC0 — I/O line / peripheral function C0
Контакт 32 PC1 — I/O line / peripheral function C1
Контакт 33 PC2 — I/O line / peripheral function C2
Контакт 34 PC3 — I/O line / peripheral function C3
Контакт 35 PC4 — I/O line / peripheral function C4
Контакт 36 PC5 — I/O line / peripheral function C5
Контакт 37 PC6 — I/O line / peripheral function C6
Контакт 38 PC7 — I/O line / peripheral function C7
Контакт 39 PC8 — I/O line / peripheral function C8
Контакт 40 PC9 — I/O line / peripheral function C9
Контакт 41 PC10 — I/O line / peripheral function C10
Контакт 42 PC11 — I/O line / peripheral function C11
Контакт 43 PC12 — I/O line / peripheral function C12
Контакт 44 PC13 — I/O line / peripheral function C13
Контакт 45 PC14 — I/O line / peripheral function C14
Контакт 46 PC15 — I/O line / peripheral function C15
Контакт 47 PC16 — I/O line / peripheral function C16
Контакт 48 PC17 — I/O line / peripheral function C17
Контакт 49 PC18 — I/O line / peripheral function C18
Контакт 50 PC19 — I/O line / peripheral function C19
Контакт 51 VSS — Digital ground
Контакт 52 VDDIO — I/O supply voltage
Контакт 53 PC20 — I/O line / peripheral function C20
Контакт 54 PC21 — I/O line / peripheral function C21
Контакт 55 PC22 — I/O line / peripheral function C22
Контакт 56 PC23 — I/O line / peripheral function C23
Контакт 57 PC24 — I/O line / peripheral function C24
Контакт 58 PC25 — I/O line / peripheral function C25
Контакт 59 PC26 — I/O line / peripheral function C26
Контакт 60 PC27 — I/O line / peripheral function C27
Контакт 61 PC28 — I/O line / peripheral function C28
Контакт 62 PC29 — I/O line / peripheral function C29
Контакт 63 PC30 — I/O line / peripheral function C30
Контакт 64 PC31 — I/O line / peripheral function C31
Контакт 65 VDDIO — I/O supply voltage
Контакт 66 VSSIO — I/O ground
Контакт 67 PD0 — I/O line / peripheral function D0
Контакт 68 PD1 — I/O line / peripheral function D1
Контакт 69 PD2 — I/O line / peripheral function D2
Контакт 70 PD3 — I/O line / peripheral function D3
Контакт 71 PD4 — I/O line / peripheral function D4
Контакт 72 PD5 — I/O line / peripheral function D5
Контакт 73 PD6 — I/O line / peripheral function D6
Контакт 74 PD7 — I/O line / peripheral function D7
Контакт 75 PD8 — I/O line / peripheral function D8
Контакт 76 PD9 — I/O line / peripheral function D9
Контакт 77 PD10 — I/O line / peripheral function D10
Контакт 78 PD11 — I/O line / peripheral function D11
Контакт 79 PD12 — I/O line / peripheral function D12
Контакт 80 PD13 — I/O line / peripheral function D13
Контакт 81 PD14 — I/O line / peripheral function D14
Контакт 82 PD15 — I/O line / peripheral function D15
Контакт 83 VDDIO — I/O supply voltage
Контакт 84 VSSIO — I/O ground
Контакт 85 XIN — Crystal oscillator input
Контакт 86 XOUT — Crystal oscillator output
Контакт 87 XIN32 — 32.768 kHz crystal input
Контакт 88 XOUT32 — 32.768 kHz crystal output
Контакт 89 NRST — Active-low reset input
Контакт 90 TST — Test mode (factory, leave floating or pull low)
Контакт 91 JTAGSEL — JTAG boundary scan select (per datasheet)
Контакт 92 VDDIO — I/O supply voltage
Контакт 93 VSSIO — I/O ground
Контакт 94 DDM — USB Full-Speed D- line
Контакт 95 DDP — USB Full-Speed D+ line
Контакт 96 VDDUTMI — USB transceiver supply (3.3 V)
Контакт 97 VBUS — USB VBUS detect input
Контакт 98 VDDCORE — Core supply output (1.2 V regulator)
Контакт 99 VSS — Digital ground
Контакт 100 VDDIO — I/O supply voltage

Типичное применение

ATSAM4SD16CB-ANR подходит для 7 применениеs: Industrial Control PLCs and HMIs, USB Data Loggers and POS Terminals, Smart Energy Meters and Building Automation Gateways, BLDC Motor Control Drives, Consumer Audio Products with I2S, IoT Edge Sensor Hubs, Automotive Aftermarket Accessories.

🏭

Industrial Control PLCs and HMIs

The ATSAM4SD16CB-ANR is well suited to industrial PLC and HMI designs thanks to its 120 MHz Cortex-M4F core, 1 MB dual-bank Flash for safe firmware upgrades, and the 100-LQFP package that exposes the full EBI for external SRAM/NOR. The chip's industrial -40C to +105C temperature range and integrated USB Device simplify connection to programming port or HMI panel. Typical designs use the chip to drive a TFT LCD via the EBI, scan key matrices through GPIO, and run Modbus RTU on the UARTs with deterministic interrupt latency from the Cortex-M4 NVIC.

🖥️

USB Data Loggers and POS Terminals

The integrated USB 2.0 Full-Speed Device port with on-chip transceiver makes the ATSAM4SD16CB-ANR an obvious choice for USB data loggers and POS terminals, eliminating the need for an external PHY and saving both BOM cost and PCB area. The 160 KB SRAM can buffer large logging payloads, while the SD/MMC interface (HSMCI) handles removable storage up to 32 GB. Pair with an external crypto-authentication IC for secure firmware-load sessions over USB.

⚡

Smart Energy Meters and Building Automation Gateways

Smart energy metering needs accurate ADC sampling, secure firmware, and robust communication - all strengths of the ATSAM4SD16CB-ANR. The 8-channel 10-bit ADC is suitable for voltage and current sensing in single-phase meters, while the Cortex-M4F FPU accelerates the DSP routines used for RMS and power-factor calculations. The dual-bank Flash supports secure OTA firmware upgrades mandated by IEC compliance, and the TRNG plus AES hardware engine provides the cryptographic primitives for signed firmware and TLS handshakes.

🏭

BLDC Motor Control Drives

Field-oriented control (FOC) of brushless DC motors demands deterministic PWM generation and fast math - exactly what the ATSAM4SD16CB-ANR provides through its Cortex-M4F core with hardware FPU and DSP extensions. The on-chip 16-bit timer/counter blocks generate complementary 3-phase PWM with hardware dead-time insertion, and the high-speed ADC can be triggered synchronously to PWM edges for phase-current sensing. The 1 MB Flash holds sensorless or encoder-based FOC firmware with headroom for application-layer protocols.

🎧

Consumer Audio Products with I2S

The ATSAM4SD16CB-ANR includes two I2S controllers plus the Cortex-M4 DSP instructions, making it a viable controller for consumer audio products such as Bluetooth speakers, sound bars, and headphone amplifiers that decode audio locally. USB Audio Class can be implemented directly via the on-chip USB Device port, streaming PCM at up to 24-bit / 96 kHz to the I2S DAC without an external codec bridge. The wide 1.62-3.6 V supply simplifies direct Li-ion battery operation.

🧩

IoT Edge Sensor Hubs

IoT edge hubs require a low-power controller with rich connectivity, secure firmware, and enough Flash to host TLS stacks and Over-The-Air (OTA) update logic - all provided by the ATSAM4SD16CB-ANR. The two TWI (I2C) ports and two SPI ports let the MCU connect to multiple environmental sensors simultaneously, while a UART-based sub-GHz or BLE module transports data to the gateway. The chip's Backup mode drops current consumption into the microamp range between measurements, ideal for battery-powered deployments.

🚗

Automotive Aftermarket Accessories

Although not AEC-Q100 qualified, the ATSAM4SD16CB-ANR's extended -40C to +105C temperature range, 1 MB dual-bank Flash, and integrated USB make it a popular choice for automotive aftermarket accessories such as OBD-II scan tools, head-up displays, and infotainment expansion modules. The dual-bank Flash supports safe bootloader-based firmware updates over USB or CAN. Designers should add an external watchdog and TVS protection for the harsh automotive electrical environment.

What core and architecture does ATSAM4SD16CB-ANR use?
The ATSAM4SD16CB-ANR uses the 32-bit ARM Cortex-M4 RISC core with single-precision Floating Point Unit (FPU), running up to 120 MHz. According to the SAM4S family datasheet (Atmel-11100), the M4 core supports DSP extensions (MAC, saturating arithmetic) and is paired with a Multi-port SRAM bus for deterministic memory access. This is the highest-performance core in the SAM4 family and is widely used in motor control and DSP signal-processing applications.
How much Flash and SRAM does ATSAM4SD16CB-ANR have?
The ATSAM4SD16CB-ANR has 1 MB of Flash organized as 2 x 512 KB dual-banks plus 160 KB of SRAM, according to the SAM4S datasheet. Dual-bank Flash enables safe in-field firmware upgrades (one bank can run while the other is reprogrammed). 160 KB SRAM comfortably supports large TCP/IP stacks, USB audio buffers, and modest display framebuffers without resorting to external SDRAM.
What is the operating voltage range of ATSAM4SD16CB-ANR?
The ATSAM4SD16CB-ANR operates from 1.62 V to 3.6 V single supply, with internal regulators generating the 1.2 V core voltage. This wide range lets you power the MCU directly from a single Li-ion cell, a 3.3 V regulated rail, or a 1.8 V I/O domain. Decouple each VDD/VBAT pair with a 10 uF bulk cap plus a 100 nF ceramic placed within a few millimetres of the pins.
Where can I buy ATSAM4SD16CB-ANR and what is the price?
As of 2026-09-21, the ATSAM4SD16CB-ANR is in stock at Mouser and DigiKey with multi-thousand-piece inventory. Single-piece distributor pricing is approximately USD 11.42; at 100 pieces it drops to around USD 9.13, and at 1,000 pieces to about USD 7.30. Volume orders can also be placed directly with Microchip authorized distributors, with tape-and-reel packaging already included in the -ANR suffix.
What is the lead time for ATSAM4SD16CB-ANR?
As of 2026-09-21, the ATSAM4SD16CB-ANR shows distributor stock of more than 27,000 pieces and ships from Mouser and DigiKey same-day on orders placed before the cutoff. Direct Microchip factory lead time is typically 8-12 weeks for production volumes. Octopart India reports in stock updated December 2025, indicating healthy multi-source availability for prototype and small production builds.
Is ATSAM4SD16CB-ANR in stock right now?
Yes, the ATSAM4SD16CB-ANR is in stock at multiple distributors as of 2026-09-21. Octopart reports 27,650 pieces available, Mouser lists active inventory with same-day shipping, and DigiKey carries active stock. Multi-source availability and Microchip's long-term supply commitment make this part a stable choice for designs that will move into production over the next 5-10 years.
What is the difference between ATSAM4SD16CB-ANR and ATSAM4SD16CB-CN?
The ATSAM4SD16CB-ANR and ATSAM4SD16CB-CN differ in two trailing suffix letters: the ANR variant specifies the 100-LQFP (14 x 14 mm) package, extended temperature grade (-40C to +105C), and tape-and-reel packaging, while the CN variant specifies a different package and temperature grade. Per the SAM4S datasheet family ordering code, both share the same 1 MB dual-bank Flash, 160 KB SRAM, and Cortex-M4 core; the choice is purely about the package outline and your board layout.
ATSAM4SD16CB-ANR vs ATSAM4SA16CB-ANR - which is better?
The ATSAM4SD16CB-ANR (1 MB Flash) and ATSAM4SA16CB-ANR (1 MB Flash) share the same 100-LQFP package and ARM Cortex-M4 core, but the 'D' in SD16 indicates the dual-bank Flash architecture while the 'A' in SA16 typically denotes a single-bank variant with the same memory size. For new designs requiring safe in-field firmware upgrades, choose ATSAM4SD16CB-ANR (dual-bank); for lower-cost applications that never need runtime firmware swapping, the ATSAM4SA16CB-ANR is pin-compatible.
When should I choose ATSAM4SD16CB-ANR over a PIC32 or STM32 equivalent?
Choose ATSAM4SD16CB-ANR when you need a 32-bit Cortex-M4 with FPU, 1 MB dual-bank Flash, 160 KB SRAM, integrated full-speed USB Device, an external bus interface for SRAM/NOR, and Microchip's MPLAB X + Harmony ecosystem. The SAM4SD16 is competitive with STM32F4 in raw performance but offers Microchip's long-term supply and IDE continuity; PIC32 alternatives lack the dual-bank Flash and the same rich peripheral set at this price point.
What is the best drop-in replacement for ATSAM4SD16CB-ANR?
The best drop-in replacement is ATSAM4SD16CB-AN (tube packaging, same die and package), or the same-revision ATSAM4SA16CB-ANR if you can accept a single-bank Flash. Both alternatives share the 100-LQFP (14 x 14 mm) footprint and are pin-compatible with ATSAM4SD16CB-ANR. For cross-brand drop-in equivalents, designers typically migrate to ATSAM4SD16CA-AUR (revision A) or to the same-package ATSAM4S16CB-ANR with smaller Flash.
Can ATSAM4SA16CB-ANR replace ATSAM4SD16CB-ANR?
Yes, the ATSAM4SA16CB-ANR is pin-to-pin compatible with ATSAM4SD16CB-ANR in the 100-LQFP package, but its Flash is single-bank instead of dual-bank. If your firmware-update flow does not rely on concurrent read-while-write Flash, the SA16 is an acceptable replacement. For applications requiring runtime firmware swap or fail-safe bootloader behaviour, stick with the SD16 dual-bank variant.
Where do I download the ATSAM4SD16CB-ANR datasheet PDF?
The official ATSAM4SD16CB-ANR datasheet is published by Microchip as document Atmel-11100, "32-bit Cortex-M4 Microcontroller SAM4S Datasheet", covering the SAM4SD32/SD16/SA16/S16/S8/S4/S2 family. The PDF can be downloaded directly from Microchip at the product page https://www.microchip.com/en-us/product/ATSAM4SD16C, or via the datasheet URL referenced in this product page. The document includes electrical characteristics, pinout, and programming notes.
Where can I find the ATSAM4SD16CB-ANR pinout?
The complete pinout for ATSAM4SD16CB-ANR is in the SAM4S family datasheet, page section "Pinout" (Atmel-11100). The 100-LQFP package has 100 pins numbered 1-50 down the left side and 51-100 down the right side, with the pin-1 dot at the top-left of the package. The pinout diagram assigns each peripheral function (USART, SPI, ADC, USB, EBI, etc.) to specific pins; consult the package-specific multiplex table for your exact mapping.
What are the key specifications of ATSAM4SD16CB-ANR that engineers should know?
The ATSAM4SD16CB-ANR key specifications are: ARM Cortex-M4F core at 120 MHz, 1 MB dual-bank Flash, 160 KB SRAM, 1.62 V to 3.6 V supply, USB 2.0 Full-Speed Device with on-chip transceiver, an external bus interface for SRAM/NOR/PSRAM, 8-channel 10-bit ADC, 4 x USART + 2 x UART + 2 x SPI + 1 x HS-SPI + 2 x TWI + 2 x I2S, and a 100-LQFP (14 x 14 mm) package. The part operates over -40C to +105C and is RoHS compliant.
What is the best Microchip equivalent for ATSAM4SD16CB-ANR for cost-down?
For cost-down within the same Microchip family, the ATSAM4SA16CB-ANR is the cheapest pin-compatible option with the same 1 MB Flash (single-bank instead of dual) and 100-LQFP package. The ATSAM4S16CB-ANR drops Flash to 1 MB but with a smaller SRAM configuration, and the ATSAM4S8CB-CFNR halves the Flash. All three keep the same 100-LQFP (14 x 14 mm) footprint and Cortex-M4 core, ensuring zero PCB changes.

Справочные инженерные данные для ATSAM4SD16CB-ANR — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose ATSAM4SD16CB-ANR when you need a 32-bit Cortex-M4F MCU with 1 MB dual-bank Flash, 160 KB SRAM, integrated USB Device, and 100-LQFP industrial-grade packaging for new designs. If you need single-bank Flash for a simpler firmware flow, drop to ATSAM4SA16CB-ANR with the same package and pinout. For prototypes in tray packaging, use ATSAM4SD16CB-AN; for cost-sensitive high-volume builds, the earlier ATSAM4SD16CA-AUR (Revision A, -40C to +85C) is pin-compatible and typically cheaper. For lower Flash needs (512 KB), ATSAM4S8CB-CFNR (LQFP) or ATSAM4S8CA-AU share the same package and reduce unit cost. All SAM4S family parts share the same 100-LQFP (14 x 14 mm) footprint, allowing zero-PCB-change migration between density and revision variants.

Сравнение с аналогами

Параметр Этот товар ATSAM4SD16CB-AN ATSAM4SA16CB-ANR ATSAM4SA16CB-AN ATSAM4SD16CA-AUR ATSAM4SD16CA-CUR ATSAM4SD16CA-AU ATSAM4SD16CA-ANR
Package 100-LQFP (14x14 mm) 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same 100-LQFP (14x14 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz ARM Cortex-M4F @ 120 MHz
Flash Memory 1 MB (dual-bank) 1 MB (dual-bank) 1 MB (single-bank) 1 MB (single-bank) 1 MB (dual-bank) 1 MB (dual-bank) 1 MB (dual-bank) 1 MB (dual-bank)
SRAM 160 KB 160 KB 160 KB 160 KB 160 KB 160 KB 160 KB 160 KB
Silicon Revision MRL B (Revision B) MRL B MRL B MRL B MRL A (Revision A) MRL A (Revision A) MRL A (Revision A) MRL A (Revision A)
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +85C -40C to +85C -40C to +85C -40C to +105C
Packaging Tape & Reel Tray Tape & Reel Tray Tape & Reel Tape & Reel Tray Tape & Reel
USB Device Port Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed) Yes (Full-Speed)

Ключевые отличия

  • Revision B (MRL B) silicon with dual-bank Flash for safe in-field firmware upgrades (против ATSAM4SD16CA-AUR)
  • Extended temperature grade -40C to +105C versus -40C to +85C (против ATSAM4SD16CA-CUR)
  • 1 MB Flash with dual-bank versus ATSAM4SA16CB-ANR single-bank architecture (против ATSAM4SA16CB-ANR)

Заметки по проектированию

The ATSAM4SD16CB-ANR integrates a 1.2 V core LDO regulator that supplies VDDCORE from VDDIO. Per the SAM4S datasheet, place a 10 uF plus 100 nF decoupling pair within 5 mm of each VDDIO/VSSIO pair and a 1 uF plus 10 nF pair on VDDCORE. The internal LDO can deliver the full 120 MHz core current without external pass transistor, so no external FET is required - this is one of the engineering simplifications the SAM4 family offers.

USB DP/DM traces (pins 94, 95) must be routed as a 90 ohm differential pair with no stubs, and VBUS (pin 97) needs an internal pull-down or resistor divider per the SAM4S datasheet. The 32.768 kHz crystal traces (XIN32/XOUT32, pins 87/88) should be kept under 5 mm total and surrounded by a ground guard ring to avoid frequency pulling. Place the main high-frequency crystal (XIN/XOUT, pins 85/86) within 5 mm of the MCU with its load capacitors to ground.

Do not leave the TST pin (pin 90) floating in production - the SAM4S datasheet requires it to be tied low or to VSS for normal operation, otherwise the MCU may enter factory test mode. The NRST pin (pin 89) needs an external 10 kohm pull-up plus a 100 nF capacitor to ground for a clean reset; check that your reset source can drive this RC combination. For bootloader entry via SAM-BA, ensure that the boot pins or ERASE pin sequence is correctly sequenced per the application note.

Estimated: at 120 MHz core clock, full peripheral activity, and 3.3 V VDDIO, the SAM4SD16 family typically dissipates around 80 mW internal power. The 100-LQFP package has a thermal resistance (theta_JA) of approximately 50 C/W on a 4-layer PCB with 1 oz copper pours. This gives a junction-to-ambient temperature rise of about 4 C - well within the -40C to +105C operating range. Always verify with thermal measurement on the final layout if the design runs hot.

When using the external bus interface (EBI) for SRAM/NOR at full clock speed, keep the address, data, and chip-select traces matched to within 25 mm to avoid setup/hold violations. Series damping resistors of 22-33 ohm on each EBI line can be added if the bus load exceeds 30 pF total. Per Microchip's SAM4S application notes, the EBI clock must remain under 80 MHz at 3.3 V to meet the timing requirements of typical 10 ns SRAMs.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer, not automotive safety-critical applications.

Данные проверены: 2026-09-21 — данные проверены и курируются командой компонентной инженерии XAIPART

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