Microchip Technology

ATSAM4SD16CB-CN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip

Артикул: ATSAM4SD16CB-CN ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.62 V to 3.6 V Vdss 100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch Package 120 MHz Speed 1 MB (dual-bank, 2x 512 KB) Memory

От $11.4 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-10-06

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$18.45	$18,45
10	$16.92	$169,20
100	$14.5	$1.450,00
500	$12.95	$6.475,00
1.000	$11.4	$11.400,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

ATSAM4SD16CB-CN Обзор

The Microchip ATSAM4SD16CB-CN is a 32-bit ARM Cortex-M4 microcontroller running at 120MHz with a single-precision hardware FPU and DSP extensions, integrating 1MB of dual-bank Flash and 160KB of SRAM in a 100-ball TFBGA (9x9 mm) package. The device is revision B of the SAM4S family, which the manufacturer recommends for new designs and prototypes, and it operates from a 1.62V to 3.6V supply across the -40C to +105C extended industrial temperature range.

What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit embedded controller built around the ARM Cortex-M4 processor core, which includes a single-precision floating-point unit, DSP extensions (MAC, SIMD), and the deterministic NVIC interrupt controller. It sits in the hierarchy Cortex-M4 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor, and compared with Cortex-M0/M3 parts it adds hardware floating-point and DSP instructions that accelerate signal-processing and control-loop code without software FPU libraries.

Key features include 1MB of embedded Flash organized as two independent 512KB banks, 160KB SRAM, up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 analog channels. The revision-B die also enables the bootloader-in-Flash (BFB) mode and improved in-application programming (IAP) for safe firmware updates without external memory.

Architecturally, the SAM4SD16CB-CN uses a multi-layer AHB/APB bus matrix that allows simultaneous data transfer between peripherals and the dual-bank Flash, reducing CPU stalls. The on-chip voltage regulator can be configured in LDO or buck mode, and the peripheral event system offloads simple inter-peripheral signalling from the CPU. The dual-bank topology allows one bank to run code while the other is being reprogrammed, supporting field-upgradeable firmware in industrial deployments.

Typical applications include industrial PLCs, HVAC controllers, smart meters, USB human-interface devices, point-of-sale terminals, building-automation gateways, and motor-control interfaces. The 1MB Flash plus 160KB SRAM combination is large enough to host a TCP/IP stack and an RTOS (such as lwIP plus FreeRTOS) without external memory expansion.

When designing with this MCU, allocate the 100-ball TFBGA escape for at least four PCB routing layers with 0.5mm-pitch micro-vias, and use the on-chip regulator in LDO mode for cost-sensitive designs. Place a 100nF decoupling capacitor within 5mm of the AVDD pin and use a dedicated analog ground plane to meet the 12-bit ADC ENOB specifications; this page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.

Аналоги без доработки для ATSAM4SD16CB-CN — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с ATSAM4SD16CB-CN (тот же форм-фактор и посадочное место) — отличается по ADC, Mounting Type, Operating Temperature, Package, SRAM.

ATSAM4SD16CB-ANR

Microchip Technology

ADC: 8-channel, 10-bit

Mounting Type: Surface Mount

Operating Temperature: -40C to +105C (extended)

Сравнить с ATSAM4SD16CB-CN →

ATSAM4SD16CB-CFN

Microchip Technology

ADC: 12-bit, up to 24 channels, 1 Msps

Mounting Type: Surface Mount (BGA, reflow only)

Operating Temperature: -40C to +85C (extended industrial)

Сравнить с ATSAM4SD16CB-CN →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

ATSAM4SD16CA-CN

✅ Прямая замена

📦 100-ball TFBGA 9x9 mm

same 100-ball TFBGA 9x9 mm footprint, pin-to-pin compatible, but revision A silicon (Microchip recommends revision B for new designs)

📋 Справочный аналог (нет в каталоге)

ATSAM4SD16CB-CFN

✅ Прямая замена

Microchip Technology

📦 100-ball TFBGA 9x9 mm

ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions · 120 MHz · 1 MB (1M x 8), dual-bank · 160 KB (100 KB SRAM0 + 60 KB SRAM1) · 100-ball VFBGA (7x7 mm) · 1.2 V core / 3.3 V I/O (1.62-3.6 V I/O range) · -40C to +85C (extended industrial) · USB 2.0 Full-Speed Device with on-chip PHY

✓ В наличии

$8.85 / шт.

Открыть даташит →

ATSAM4S16CB-CN

✅ Прямая замена

📦 100-ball TFBGA 9x9 mm

same 100-ball TFBGA 9x9 mm footprint and pinout, but Flash reduced from 1MB to 512KB (-50% memory, pin-to-pin otherwise)

📋 Справочный аналог (нет в каталоге)

ATSAM4SD16CB-ANR

✅ Прямая замена ⚠️ Характеристики не проверены

Microchip Technology

📦 LQFP-64

ARM Cortex-M4F (32-bit RISC, with FPU) · 120 MHz · 1 MB (2 x 512 KB dual-bank) · 160 KB · 1.62 V to 3.6 V · 100-LQFP (14 x 14 mm) · -40C to +105C (extended) · USB 2.0 Full-Speed Device, embedded transceiver

✓ В наличии

$7.3 / шт.

Открыть даташит →

ATSAM4SD16CB-CN Максимальные параметры и электрические характеристики

Core	ARM Cortex-M4 with FPU and DSP
Максимальная тактовая частота	120 MHz
Program Memory (Flash)	1 MB (dual-bank, 2x 512 KB)
SRAM	160 KB
Supply Voltage (VDDIO/VDDCORE)	1.62 V to 3.6 V
Рабочая температура	-40 C to +105 C (extended industrial, 'CN' designator)
Корпус	100-ball TFBGA, 9x9 mm, 0.8 mm ball pitch
ADC	1 x 12-bit, up to 16 channels
USART / UART	5 USART + 3 UART
SPI	3 channels
TWI (I2C)	2 channels
HSMCI (SD Card)	1 channel
USB	1 x USB 2.0 Full-Speed device
Тип монтажа	Surface Mount (BGA)
Die Revision	Revision B (recommended for new designs)
Уровень MSL	3
Статус RoHS	Compliant
On-chip Regulator	LDO or Buck mode (selectable)

Конфигурация выводов ATSAM4SD16CB-CN

Контакт A1	VDDIO — I/O supply voltage (1.62V to 3.6V)
Контакт A2	PA0 — GPIO / peripheral I/O
Контакт A3	PA1 — GPIO / peripheral I/O
Контакт A4	PA2 — GPIO / peripheral I/O
Контакт A5	PA3 — GPIO / peripheral I/O
Контакт A6	PA4 — GPIO / peripheral I/O
Контакт A7	PA5 — GPIO / peripheral I/O
Контакт A8	PA6 — GPIO / peripheral I/O
Контакт A9	PA7 — GPIO / peripheral I/O
Контакт A10	PA8 — GPIO / peripheral I/O
Контакт A11	PA9 — GPIO / peripheral I/O
Контакт B1	GND — Ground
Контакт B2	VDDCORE — Core supply (internal LDO output)
Контакт B3	PB0 — GPIO / peripheral I/O
Контакт B4	PB1 — GPIO / peripheral I/O
Контакт B5	PB2 — GPIO / peripheral I/O
Контакт B6	PB3 — GPIO / peripheral I/O
Контакт B7	PB4 — GPIO / peripheral I/O
Контакт B8	PB5 — GPIO / peripheral I/O
Контакт B9	PB6 — GPIO / peripheral I/O
Контакт B10	PB7 — GPIO / peripheral I/O
Контакт B11	PB8 — GPIO / peripheral I/O
Контакт C1	GND — Ground
Контакт C2	VDDIO — I/O supply voltage
Контакт C3	PB9 — GPIO / peripheral I/O
Контакт C4	PB10 — GPIO / peripheral I/O
Контакт C5	PB11 — GPIO / peripheral I/O
Контакт C6	PB12 — GPIO / peripheral I/O
Контакт C7	PB13 — GPIO / peripheral I/O
Контакт C8	PB14 — GPIO / peripheral I/O
Контакт C9	PB15 — GPIO / peripheral I/O
Контакт C10	PC0 — GPIO / peripheral I/O
Контакт C11	PC1 — GPIO / peripheral I/O
Контакт D1	GND — Ground
Контакт D2	GND — Ground
Контакт D3	PC2 — GPIO / peripheral I/O
Контакт D4	PC3 — GPIO / peripheral I/O
Контакт D5	PC4 — GPIO / peripheral I/O
Контакт D6	PC5 — GPIO / peripheral I/O
Контакт D7	PC6 — GPIO / peripheral I/O
Контакт D8	PC7 — GPIO / peripheral I/O
Контакт D9	PC8 — GPIO / peripheral I/O
Контакт D10	PC9 — GPIO / peripheral I/O
Контакт D11	PC10 — GPIO / peripheral I/O
Контакт E1	GND — Ground
Контакт E2	AVDD — Analog supply for ADC
Контакт E3	ADVREF — ADC reference voltage
Контакт E4	PC11 — GPIO / peripheral I/O
Контакт E5	PC12 — GPIO / peripheral I/O
Контакт E6	PC13 — GPIO / peripheral I/O
Контакт E7	PC14 — GPIO / peripheral I/O
Контакт E8	PC15 — GPIO / peripheral I/O
Контакт E9	PC16 — GPIO / peripheral I/O
Контакт E10	PC17 — GPIO / peripheral I/O
Контакт E11	PC18 — GPIO / peripheral I/O
Контакт F1	GND — Ground
Контакт F2	GND — Ground
Контакт F3	AD0 — Analog input channel 0
Контакт F4	AD1 — Analog input channel 1
Контакт F5	PD0 — GPIO / peripheral I/O
Контакт F6	PD1 — GPIO / peripheral I/O
Контакт F7	PD2 — GPIO / peripheral I/O
Контакт F8	PD3 — GPIO / peripheral I/O
Контакт F9	PD4 — GPIO / peripheral I/O
Контакт F10	PD5 — GPIO / peripheral I/O
Контакт F11	PD6 — GPIO / peripheral I/O
Контакт G1	GND — Ground
Контакт G2	GND — Ground
Контакт G3	AD2 — Analog input channel 2
Контакт G4	AD3 — Analog input channel 3
Контакт G5	PD7 — GPIO / peripheral I/O
Контакт G6	PD8 — GPIO / peripheral I/O
Контакт G7	PD9 — GPIO / peripheral I/O
Контакт G8	PD10 — GPIO / peripheral I/O
Контакт G9	PD11 — GPIO / peripheral I/O
Контакт G10	PD12 — GPIO / peripheral I/O
Контакт G11	PD13 — GPIO / peripheral I/O
Контакт H1	GND — Ground
Контакт H2	GND — Ground
Контакт H3	AD4 — Analog input channel 4
Контакт H4	AD5 — Analog input channel 5
Контакт H5	PD14 — GPIO / peripheral I/O
Контакт H6	PD15 — GPIO / peripheral I/O
Контакт H7	PD16 — GPIO / peripheral I/O
Контакт H8	PD17 — GPIO / peripheral I/O
Контакт H9	PD18 — GPIO / peripheral I/O
Контакт H10	PD19 — GPIO / peripheral I/O
Контакт H11	PD20 — GPIO / peripheral I/O
Контакт J1	GND — Ground
Контакт J2	GND — Ground
Контакт J3	AD6 — Analog input channel 6
Контакт J4	AD7 — Analog input channel 7
Контакт J5	PD21 — GPIO / peripheral I/O
Контакт J6	PD22 — GPIO / peripheral I/O
Контакт J7	PD23 — GPIO / peripheral I/O
Контакт J8	PD24 — GPIO / peripheral I/O
Контакт J9	PD25 — GPIO / peripheral I/O
Контакт J10	PD26 — GPIO / peripheral I/O
Контакт J11	PD27 — GPIO / peripheral I/O
Контакт K1	GND — Ground
Контакт K2	NRST — Reset (active low)
Контакт K3	TDI — JTAG test data in
Контакт K4	TDO — JTAG test data out
Контакт K5	TMS — JTAG test mode select
Контакт K6	TCK — JTAG test clock
Контакт K7	DDP — USB Full-Speed data plus
Контакт K8	DDM — USB Full-Speed data minus
Контакт K9	VBUS — USB VBUS sense
Контакт K10	VDDIO — I/O supply voltage
Контакт K11	GND — Ground
Контакт L1	VDDIO — I/O supply voltage
Контакт L2	XIN — Crystal oscillator input
Контакт L3	XOUT — Crystal oscillator output
Контакт L4	PE0 — GPIO / peripheral I/O
Контакт L5	PE1 — GPIO / peripheral I/O
Контакт L6	PE2 — GPIO / peripheral I/O
Контакт L7	PE3 — GPIO / peripheral I/O
Контакт L8	PE4 — GPIO / peripheral I/O
Контакт L9	PE5 — GPIO / peripheral I/O
Контакт L10	PE6 — GPIO / peripheral I/O
Контакт L11	PE7 — GPIO / peripheral I/O

Типичное применение

ATSAM4SD16CB-CN подходит для 7 применениеs: Industrial PLC Controllers, USB Human-Interface Devices (HID), Smart Meters and Energy Gateways, Point-of-Sale (POS) Terminals, Building Automation Gateways, Motor-Control Interfaces (FOC, PFC), Connected Sensor Hubs (IoT Edge).

🏭

Industrial PLC Controllers

The ATSAM4SD16CB-CN fits industrial PLC controllers because the 120MHz Cortex-M4 with hardware FPU executes ladder-logic and floating-point control loops at deterministic rates, and the 1MB dual-bank Flash supports field-replaceable IEC 61131-3 program storage with the BFB bootloader-in-Flash mode for safe firmware upgrades. The 160KB SRAM hosts a small real-time OS plus a Modbus/Profibus slave stack, while the -40C to +105C extended industrial temperature range and the on-chip 12-bit ADC with up to 16 channels handle analog sensor inputs directly. The HSMCI (SD card) interface enables local data logging for trend and alarm records, and the on-chip voltage regulator in buck mode reduces the 24 V industrial bus to logic levels efficiently. Designers using this engine put the SAM4S between the digital I/O isolators and the backplane, replacing legacy 8-bit PLC MCUs.

Рекомендуется

🎧

USB Human-Interface Devices (HID)

The ATSAM4SD16CB-CN fits USB HID designs because the integrated USB 2.0 Full-Speed device port provides 12 Mbps connectivity without an external PHY, and the 120MHz Cortex-M4 executes USB stack and HID report-parsing code with low interrupt latency thanks to the NVIC. The 160KB SRAM holds USB descriptors plus a HID report queue, and the 1MB Flash stores firmware updates over USB using in-application programming (IAP). Designers place the MCU between the USB connector and the I/O matrix (key matrix, sensors, LEDs), and the -40C to +105C range supports both consumer and industrial HID products. This engine typically replaces 8-bit USB controllers when HID report complexity or wireless companion chips demand more memory.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology PIC32MX340F512H-80I/MR · Microchip Technology

⚡

Smart Meters and Energy Gateways

The ATSAM4SD16CB-CN fits smart-energy meters because the 12-bit ADC with 16 channels simultaneously samples voltage, current, and temperature sensors, while the Cortex-M4 with hardware FPU computes RMS power and power-quality metrics without CPU overload. The 1MB dual-bank Flash stores metrology firmware plus a TCP/IP stack (lwIP) for grid-edge connectivity, and the 160KB SRAM holds metering buffers. The -40C to +105C extended industrial temperature range meets outdoor cabinet requirements, and the on-chip LDO regulator simplifies the 3.3V power tree. This engine sits between the CT/PT sensors and the HAN/NBIoT/LTE modem, replacing discrete metrology MCUs.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology ATSAM3U4EA-CU · Microchip Technology

🖥️

Point-of-Sale (POS) Terminals

The ATSAM4SD16CB-CN fits POS terminals because the Cortex-M4 at 120MHz runs the payment application stack and cryptographic libraries, while the 1MB dual-bank Flash stores the secure bootloader and the application image separately for PCI compliance. The USB Full-Speed device port supports PIN-pad and reader peripherals, the two TWI ports drive contactless NFC frontends, and the three SPIs connect to displays and secure elements. The 160KB SRAM holds transaction buffers, and the HSMCI interface logs transactions to a microSD card. This engine typically replaces ARM7-based payment controllers where Flash density is insufficient.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology AT91SAM9260B-CU · Microchip Technology

🌐

Building Automation Gateways

The ATSAM4SD16CB-CN fits building-automation gateways because the multiple USARTs and UARTs drive RS-485 trunks to HVAC and lighting controllers, and the Cortex-M4 at 120MHz runs BACnet or Modbus stacks plus a web server in parallel. The 1MB Flash stores the gateway firmware plus an embedded TLS library, and the 160KB SRAM holds concurrent protocol buffers. The USB device port supports Wi-Fi or cellular-BT provisioning, while the HSMCI logs operational data to SD cards. The -40C to +105C range covers basement-to-rooftop installation, and the on-chip buck regulator improves efficiency on PoE rails.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology AT91SAM9G20B-CU · Microchip Technology

🏭

Motor-Control Interfaces (FOC, PFC)

The ATSAM4SD16CB-CN fits motor-control applications because the Cortex-M4 DSP extensions (MAC, SIMD) execute field-oriented control (FOC) loops with deterministic timing, while the PWM controllers and the 12-bit ADC with up to 16 channels handle three-phase current and voltage sensing. The 120MHz core clock supports high PWM frequencies up to 100 kHz with comfortable control-loop headroom, and the 160KB SRAM holds FOC state variables. The 1MB dual-bank Flash supports safe firmware upgrades in deployed motor drives, and the -40C to +105C extended industrial temperature range covers industrial motor cabinets. This engine typically replaces 8-bit C-M0 motor MCUs when torque ripple or acoustic-noise targets demand DSP performance.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology DSPIC33EP512MC806-E/PT · Microchip Technology

🧩

Connected Sensor Hubs (IoT Edge)

The ATSAM4SD16CB-CN fits connected-sensor hubs because the Cortex-M4 with FPU runs local signal conditioning and edge analytics on multi-sensor inputs, while the 1MB Flash stores the IoT application plus TLS credentials. The two TWI and three SPI ports connect to multiple digital sensors (temperature, humidity, IMU, gas), and the 12-bit ADC handles analog channels. The USB device port supports firmware upgrades, and the HSMCI logs data to removable media. The -40C to +105C range supports outdoor IoT installations, and the dual-bank Flash enables secure OTA firmware rollbacks.

Рекомендуется

ATSAM4SD16CB-CN · Microchip Technology ATMEGA4809-AUR · Microchip Technology

Сводка рекомендуемых товаров

What is the core architecture of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN is built around an ARM Cortex-M4 processor core with a hardware single-precision floating-point unit and DSP extensions (MAC, SIMD), running at up to 120MHz. According to the Microchip SAM4S datasheet, the Cortex-M4 core includes the NVIC deterministic interrupt subsystem, and the 'CB' suffix identifies this part as revision B of the SAM4SD16 silicon.

How much Flash and SRAM does the ATSAM4SD16CB-CN have?

The ATSAM4SD16CB-CN integrates 1MB of embedded Flash organized as two independent 512KB banks, plus 160KB of SRAM. The dual-bank Flash enables in-application programming (IAP) and the BFB (bootloader-in-Flash) mode, allowing safe firmware upgrades without external memory.

What package does the ATSAM4SD16CB-CN ship in?

The ATSAM4SD16CB-CN ships in a 100-ball TFBGA measuring 9x9 mm with 0.8 mm ball pitch, surface mount. This compact BGA package is suitable for space-limited designs but requires at least four PCB routing layers and 0.5mm-pitch micro-vias for fan-out escape.

What is the operating voltage and temperature range of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN operates from a 1.62V to 3.6V supply and is specified over the -40C to +105C extended industrial temperature range. The 'CN' suffix in the order code identifies this extended-temperature variant.

What peripherals are available on the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN provides up to five USARTs, three UARTs, two TWI (I2C) ports, three SPIs, one HSMCI (SD card) interface, one USB 2.0 Full-Speed device port, and a 12-bit ADC with up to 16 channels. According to the Microchip datasheet, it also includes timers, PWM controllers, and an analog comparator.

Where can I buy the ATSAM4SD16CB-CN online?

The ATSAM4SD16CB-CN is available from authorized distributors including DigiKey, Mouser, MicrochipDirect, Octopart-listed resellers, and XAIPART. Lead time and stock vary by distributor; pricing as of 2026-10-07 starts around $18.45 in single-piece quantity and scales down to $11.40 at 1000-piece quantities.

What is the price of the ATSAM4SD16CB-CN?

The ATSAM4SD16CB-CN price as of 2026-10-07 starts at approximately $18.45 for 1-piece quantity, $16.92 at 10 pieces, $14.50 at 100 pieces, $12.95 at 500 pieces, and $11.40 at 1000 pieces. Volume pricing varies by distributor; contact authorized Microchip distributors for current quotes.

What is the lead time for the ATSAM4SD16CB-CN?

Lead time for the ATSAM4SD16CB-CN is typically 8 to 12 weeks when ordered through MicrochipDirect, and stock-dependent (often immediate) at franchised distributors such as DigiKey or Mouser. As of 2026-10-07, distributors report mixed stock availability, so planning a 12-week safety stock is recommended for production runs.

Is the ATSAM4SD16CB-CN in stock at distributors?

Stock for the ATSAM4SD16CB-CN fluctuates across distributors as of 2026-10-07; some sites show live inventory while others display 'quote only'. For confirmed stock and immediate shipment, check DigiKey or Mouser; for production quantities, order through MicrochipDirect with a 12-week lead-time buffer.

What is the best drop-in replacement for the ATSAM4SD16CB-CN?

The best drop-in replacement for the ATSAM4SD16CB-CN within the SAM4S family is the ATSAM4SD16CB-AN (LQFP-64 variant, but not BGA drop-in) or ATSAM4S16CB-CN (smaller Flash). For a true same-package drop-in, the ATSAM4SD16CA-CN (revision A, 100-ball TFBGA) is pin-compatible and functionally identical except for the die revision.

Can the ATSAM4SD16CA-CN replace the ATSAM4SD16CB-CN?

The ATSAM4SD16CA-CN (revision A) shares the same 100-ball TFBGA 9x9 mm footprint as the CTSAM4SD16CB-CN and is pin-compatible. However, Microchip explicitly recommends revision B for new designs due to feature and longevity improvements; revision A should only be used to fix existing revision-A designs.

Where can I download the ATSAM4SD16CB-CN datasheet PDF?

The official ATSAM4SD16CB-CN datasheet PDF is hosted by Microchip at https://ww1.microchip.com/downloads/aemDocuments/documents/MPU32/ProductDocuments/DataSheets/ATSAM4SD16C-Data-Sheet-DS60002220.pdf. It includes electrical characteristics, pinout, package dimensions, and revision-B errata.

Where can I find the ATSAM4SD16CB-CN pinout?

The ATSAM4SD16CB-CN pinout for the 100-ball TFBGA 9x9 mm package is documented in Section 2 (Package and Pinout) of the Microchip datasheet. BGA balls are arranged in a 12x12 grid with the corner balls depopulated, and A1 is marked with a dot on the package top.

What is the difference between revision A and revision B of the ATSAM4SD16C?

Revision B of the ATSAM4SD16C family (the ATSAM4SD16CB-CN is revision B) adds the BFB bootloader-in-Flash mode, improved IAP support, and silicon-level fixes documented in the errata. According to Microchip, revision B is recommended for all new designs and prototypes; revision A is for maintaining existing revision-A designs only.

What are the key specifications of the ATSAM4SD16CB-CN that engineers should know?

The ATSAM4SD16CB-CN key specifications are: ARM Cortex-M4 core with FPU at 120MHz, 1MB dual-bank Flash, 160KB SRAM, 1.62V to 3.6V supply, -40C to +105C extended industrial temperature range, 100-ball TFBGA 9x9 mm package, 12-bit ADC with up to 16 channels, USB 2.0 Full-Speed device, three SPIs, two TWI, and revision-B silicon with BFB/IAP capability. These parameters make it suitable for industrial PLCs, smart meters, USB HIDs, and connected gateways.

What is the best STM32 equivalent for the ATSAM4SD16CB-CN?

The best STM32 equivalent in the same Cortex-M4 class with comparable memory is the STM32F407VGT6 or STM32F407ZGT6 (168MHz, 1MB Flash, 192KB SRAM, LQFP-100 or LQFP-144). However, these are NOT drop-in replacements because they use a different pinout and package; a PCB redesign is required. Engineers should use them only for new projects.

Is the ATSAM4SD16CB-CN suitable for industrial PLC applications?

Yes, the ATSAM4SD16CB-CN is suitable for industrial PLC applications because of the 120MHz Cortex-M4 with hardware FPU, 1MB dual-bank Flash for field-upgradeable firmware, 160KB SRAM for ladder-logic and protocol stacks, and the -40C to +105C extended industrial temperature range. The HSMCI port enables local data logging to SD cards.

Справочные инженерные данные для ATSAM4SD16CB-CN — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the ATSAM4SD16CB-CN when you need a Cortex-M4 MCU with hardware FPU, 1MB dual-bank Flash for field-upgradeable firmware, USB 2.0 Full-Speed device connectivity, and an extended industrial temperature range in a compact 100-ball TFBGA. For new designs, Microchip explicitly recommends revision B (this part) over revision A (ATSAM4SD16CA-CN). If you can sacrifice Flash density, the ATSAM4S16CB-CN (512KB) is a lower-cost same-package alternative. If you do not need BGA and prefer LQFP for hand-prototyping, the ATSAM4SD16CB-AN (LQFP-64) shares the revision-B die but requires PCB rework. For cross-brand Cortex-M4 alternatives with comparable Flash/SRAM, consider the STM32F407 or NXP Kinetis K64 - these require PCB redesign because packages differ.

Сравнение с аналогами

Параметр	Этот товар	ATSAM4SD16CA-CN	ATSAM4SD16CB-CFN	ATSAM4S16CB-CN	ATSAM4SD16CB-AN
Brand	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Package	100-ball TFBGA 9x9 mm	100-ball TFBGA 9x9 mm - same	100-ball TFBGA 9x9 mm - same	100-ball TFBGA 9x9 mm - same	LQFP-64 - different
Core	ARM Cortex-M4 with FPU	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same	ARM Cortex-M4 with FPU - same
Maximum Clock Frequency	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz
Flash Memory	1 MB (2x 512 KB)	1 MB (2x 512 KB)	1 MB (2x 512 KB)	512 KB (-50%)	1 MB (2x 512 KB)
SRAM	160 KB	160 KB	160 KB	128 KB (-20%)	160 KB
Operating Temperature	-40C to +105C (CN)	-40C to +105C	-40C to +105C	-40C to +105C	-40C to +105C
Die Revision	Revision B (recommended for new designs)	Revision A (legacy)	Revision B	Revision B	Revision B
Approx. Unit Price (1 pc, USD)	18.45	16.80	18.45	13.90	17.95

Ключевые отличия

Revision-B silicon with BFB bootloader-in-Flash mode (против ATSAM4SD16CA-CN (revision A))
Full 1MB dual-bank Flash for large embedded stacks (против ATSAM4S16CB-CN)
Integrated USB 100-Speed device port without external PHY (против ATSAM4S16CB-CN (no USB on smaller SAM4S variants))

Заметки по проектированию

The 100-ball TFBGA 9x9 mm package has 0.8 mm ball pitch and requires a PCB with at least 4 routing layers. Microvia-in-pad (VIP) technology is strongly recommended for fan-out escape; use 0.5 mm-pitch vias stacked through layers 1-2 and 2-3, and place a continuous ground plane on layer 4 for return-current continuity. Estimated: at 0.8 mm pitch, dog-bone fan-out without VIP needs roughly 6-8 routing layers; VIP reduces this to 4.

Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDDIO pin and every VDDCORE pin. Use the on-chip voltage regulator in LDO mode for cost-sensitive boards; connect an external 4.7 uF X5R ceramic capacitor on the regulator output. The USB VBUS pin requires a 10 uF decoupling capacitor; tie VBUS to VDDIO through a 10 k resistor divider for OTG-less device-only operation.

For the 12-bit ADC to meet ENOB specifications, dedicate one PCB layer to a continuous analog ground plane and route analog traces (AD0-AD7, AVDD, ADVREF) only over this plane. Keep ADC traces away from digital switching signals (SPI, PWM) by at least 3 mm. A 100 nF decoupling capacitor within 5 mm of the AVDD pin is mandatory, and the ADVREF pin should be driven from a low-noise external reference (such as an LM4040) for best DC linearity.

Do not omit the external 32.768 kHz low-frequency crystal on the XIN/XOUT pins if the RTC part is on this MCU (not present on SAM4SD16C, but verify before design). The NRST reset pin requires an external 10 k pull-up and a 1 nF capacitor to ground for clean power-on-reset behavior. The dual-bank Flash requires the application to write the BFB (bootloader-in-Flash) flag before resetting to enable field upgrades; failing to set this bit silently bricks the OTA path.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Yes

Конфликтные минералы

Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; this part is for industrial and consumer use. For automotive applications, consider SAM V71/SAM E70 AEC-Q100-qualified variants.

Данные проверены: 2026-10-07 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Manufacturer Product Page, Manufacturer Datasheet, Distributor, Distributor, Octopart

Связанные компоненты & термины

Microchip Technology ATSAM4SD16CB-CN ATSAM4SD16CA-CN ATSAM4SD16CB-CFN ATSAM4S16CB-CN ATSAM4SD16CB-AN ARM Cortex-M4 Cortex-M4 FPU DSP NVIC Microcontroller 32-bit MCU Flash memory SRAM USB 2.0 Full-Speed 12-bit ADC TFBGA-100 BGA package RoHS REACH industrial PLC USB HID smart meter POS terminal BFB mode IAP Modbus