ATSAM4SD16CB-ANR - 32-bit ARM Cortex-M4 MCU, 1MB Flash, 100-LQFP | Microchip
Référence : ATSAM4SD16CB-ANR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.27 | $102,70 |
| 100 | $9.13 | $913,00 |
| 500 | $8.21 | $4 105,00 |
| 1 000 | $7.3 | $7 300,00 |
ATSAM4SD16CB-ANR Présentation
What is a Cortex-M4 microcontroller? A Cortex-M4 microcontroller is a 32-bit RISC processor core designed by Arm Holdings specifically for embedded applications that require deterministic real-time performance and (optionally) single-precision floating-point math. The Cortex-M4 sits at the top of the Cortex-M family for performance; it is positioned between the smaller Cortex-M0+/M3 and the higher-end Cortex-M7. MCUs based on this core are widely used in motor control, industrial automation, consumer audio, USB peripherals, and IoT edge nodes where both DSP-like signal processing and low power are required.
Key features of the ATSAM4SD16CB-ANR include 1MB Flash (dual-bank for in-field firmware upgrade), 160KB SRAM, a high-speed Multi-port SRAM bus, an external bus interface (EBI) supporting SRAM, NOR Flash, and PSRAM, a full-speed USB Device port, an SD/MMC interface, two I2S controllers, two 3-channel 16-bit timer/counters, four USARTs, two UARTs, two TWI (I2C) ports, two SPI ports, one HS-SPI, an 8-channel 10-bit ADC, and a Real-Time Clock with calendar/alarm. The 100-LQFP package (14 mm x 14 mm) gives access to most peripherals while remaining hand-solderable for prototypes.
The ATSAM4SD16CB-ANR uses a single 1.62V to 3.6V supply, with internal voltage regulators generating the 1.2V core voltage. Power consumption is in the single-digit milliampere range at full 120 MHz speed, and several low-power modes (Sleep, Wait, Backup) reduce quiescent draw dramatically. The chip operates over the industrial -40C to +85C range, with the -ANR suffix designating extended temperature grade (105C) and tape-and-reel packaging.
Typical applications include industrial control PLCs and HMIs, USB peripherals such as data loggers and POS terminals, smart energy metering, building automation gateways, motor-control BLDC drives, and consumer audio devices that benefit from the I2S ports and DSP instructions. Revision B (MRL B) silicon is the recommended variant for new designs; older revisions are now legacy.
When designing with this part, place a 10uF plus 0.1uF bulk-rail decoupling network within a few millimetres of each VDD/VBAT pin pair, and keep the 32.768 kHz crystal trace short and guarded. The USB DP/DM traces should be routed as a 90-ohm differential pair and the ferrite bead per Microchip application note recommendations to pass USB compliance.
Alternatives de remplacement direct pour ATSAM4SD16CB-ANR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD16CB-ANR (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Operating Temperature, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16CB-AN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SA16CB-ANR
✅ Remplacement direct✓ En stock
$7.05 / unité
Voir la fiche technique →ATSAM4SA16CB-AN
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →ATSAM4SD16CA-AUR
✅ Remplacement direct✓ En stock
$7.49 / unité
Voir la fiche technique →ATSAM4SD16CA-CUR
✅ Remplacement direct✓ En stock
$5.55 / unité
Voir la fiche technique →ATSAM4SD16CA-AU
✅ Remplacement direct✓ En stock
$5.55 / unité
Voir la fiche technique →ATSAM4SD16CA-ANR
✅ Remplacement direct✓ En stock
$6.72 / unité
Voir la fiche technique →ATSAM4SD16CB-ANR Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4F (32-bit RISC, with FPU) |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Operating Voltage | 1.62 V to 3.6 V |
| Boîtier | 100-LQFP (14 x 14 mm) |
| Température de fonctionnement | -40C to +105C (extended) |
| USB Interface | USB 2.0 Full-Speed Device, embedded transceiver |
| External Bus Interface (EBI) | Yes - SRAM/NOR/PSRAM |
| ADC | 8-channel, 10-bit |
| Timers | 2 x 3-channel 16-bit TC |
| Communication | 4 x USART, 2 x UART, 2 x SPI, 1 x HS-SPI, 2 x TWI (I2C), 2 x I2S |
| SD/MMC Interface | Yes (HSMCI) |
| Cryptography | TRNG + AES hardware accelerator |
| Silicon Revision | MRL B (Revision B) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Packaging | Tape & Reel |
Configuration des broches de ATSAM4SD16CB-ANR
| Broche 1 | PA0 — I/O line / peripheral function A0 |
| Broche 2 | PA1 — I/O line / peripheral function A1 |
| Broche 3 | PA2 — I/O line / peripheral function A2 |
| Broche 4 | PA3 — I/O line / peripheral function A3 |
| Broche 5 | PA4 — I/O line / peripheral function A4 |
| Broche 6 | PA5 — I/O line / peripheral function A5 |
| Broche 7 | PA6 — I/O line / peripheral function A6 |
| Broche 8 | PA7 — I/O line / peripheral function A7 |
| Broche 9 | VDDIO — I/O supply voltage |
| Broche 10 | VSSIO — I/O ground |
| Broche 11 | PB0 — I/O line / peripheral function B0 |
| Broche 12 | PB1 — I/O line / peripheral function B1 |
| Broche 13 | PB2 — I/O line / peripheral function B2 |
| Broche 14 | PB3 — I/O line / peripheral function B3 |
| Broche 15 | PB4 — I/O line / peripheral function B4 |
| Broche 16 | PB5 — I/O line / peripheral function B5 |
| Broche 17 | PB6 — I/O line / peripheral function B6 |
| Broche 18 | PB7 — I/O line / peripheral function B7 |
| Broche 19 | PB8 — I/O line / peripheral function B8 |
| Broche 20 | PB9 — I/O line / peripheral function B9 |
| Broche 21 | PB10 — I/O line / peripheral function B10 |
| Broche 22 | PB11 — I/O line / peripheral function B11 |
| Broche 23 | PB12 — I/O line / peripheral function B12 |
| Broche 24 | PB13 — I/O line / peripheral function B13 |
| Broche 25 | PB14 — I/O line / peripheral function B14 |
| Broche 26 | PB15 — I/O line / peripheral function B15 |
| Broche 27 | VDDCORE — Core supply output (1.2 V regulator) |
| Broche 28 | VSS — Digital ground |
| Broche 29 | VDDIO — I/O supply voltage |
| Broche 30 | VSSIO — I/O ground |
| Broche 31 | PC0 — I/O line / peripheral function C0 |
| Broche 32 | PC1 — I/O line / peripheral function C1 |
| Broche 33 | PC2 — I/O line / peripheral function C2 |
| Broche 34 | PC3 — I/O line / peripheral function C3 |
| Broche 35 | PC4 — I/O line / peripheral function C4 |
| Broche 36 | PC5 — I/O line / peripheral function C5 |
| Broche 37 | PC6 — I/O line / peripheral function C6 |
| Broche 38 | PC7 — I/O line / peripheral function C7 |
| Broche 39 | PC8 — I/O line / peripheral function C8 |
| Broche 40 | PC9 — I/O line / peripheral function C9 |
| Broche 41 | PC10 — I/O line / peripheral function C10 |
| Broche 42 | PC11 — I/O line / peripheral function C11 |
| Broche 43 | PC12 — I/O line / peripheral function C12 |
| Broche 44 | PC13 — I/O line / peripheral function C13 |
| Broche 45 | PC14 — I/O line / peripheral function C14 |
| Broche 46 | PC15 — I/O line / peripheral function C15 |
| Broche 47 | PC16 — I/O line / peripheral function C16 |
| Broche 48 | PC17 — I/O line / peripheral function C17 |
| Broche 49 | PC18 — I/O line / peripheral function C18 |
| Broche 50 | PC19 — I/O line / peripheral function C19 |
| Broche 51 | VSS — Digital ground |
| Broche 52 | VDDIO — I/O supply voltage |
| Broche 53 | PC20 — I/O line / peripheral function C20 |
| Broche 54 | PC21 — I/O line / peripheral function C21 |
| Broche 55 | PC22 — I/O line / peripheral function C22 |
| Broche 56 | PC23 — I/O line / peripheral function C23 |
| Broche 57 | PC24 — I/O line / peripheral function C24 |
| Broche 58 | PC25 — I/O line / peripheral function C25 |
| Broche 59 | PC26 — I/O line / peripheral function C26 |
| Broche 60 | PC27 — I/O line / peripheral function C27 |
| Broche 61 | PC28 — I/O line / peripheral function C28 |
| Broche 62 | PC29 — I/O line / peripheral function C29 |
| Broche 63 | PC30 — I/O line / peripheral function C30 |
| Broche 64 | PC31 — I/O line / peripheral function C31 |
| Broche 65 | VDDIO — I/O supply voltage |
| Broche 66 | VSSIO — I/O ground |
| Broche 67 | PD0 — I/O line / peripheral function D0 |
| Broche 68 | PD1 — I/O line / peripheral function D1 |
| Broche 69 | PD2 — I/O line / peripheral function D2 |
| Broche 70 | PD3 — I/O line / peripheral function D3 |
| Broche 71 | PD4 — I/O line / peripheral function D4 |
| Broche 72 | PD5 — I/O line / peripheral function D5 |
| Broche 73 | PD6 — I/O line / peripheral function D6 |
| Broche 74 | PD7 — I/O line / peripheral function D7 |
| Broche 75 | PD8 — I/O line / peripheral function D8 |
| Broche 76 | PD9 — I/O line / peripheral function D9 |
| Broche 77 | PD10 — I/O line / peripheral function D10 |
| Broche 78 | PD11 — I/O line / peripheral function D11 |
| Broche 79 | PD12 — I/O line / peripheral function D12 |
| Broche 80 | PD13 — I/O line / peripheral function D13 |
| Broche 81 | PD14 — I/O line / peripheral function D14 |
| Broche 82 | PD15 — I/O line / peripheral function D15 |
| Broche 83 | VDDIO — I/O supply voltage |
| Broche 84 | VSSIO — I/O ground |
| Broche 85 | XIN — Crystal oscillator input |
| Broche 86 | XOUT — Crystal oscillator output |
| Broche 87 | XIN32 — 32.768 kHz crystal input |
| Broche 88 | XOUT32 — 32.768 kHz crystal output |
| Broche 89 | NRST — Active-low reset input |
| Broche 90 | TST — Test mode (factory, leave floating or pull low) |
| Broche 91 | JTAGSEL — JTAG boundary scan select (per datasheet) |
| Broche 92 | VDDIO — I/O supply voltage |
| Broche 93 | VSSIO — I/O ground |
| Broche 94 | DDM — USB Full-Speed D- line |
| Broche 95 | DDP — USB Full-Speed D+ line |
| Broche 96 | VDDUTMI — USB transceiver supply (3.3 V) |
| Broche 97 | VBUS — USB VBUS detect input |
| Broche 98 | VDDCORE — Core supply output (1.2 V regulator) |
| Broche 99 | VSS — Digital ground |
| Broche 100 | VDDIO — I/O supply voltage |
Applications typiques
ATSAM4SD16CB-ANR convient pour 7 applications: Industrial Control PLCs and HMIs, USB Data Loggers and POS Terminals, Smart Energy Meters and Building Automation Gateways, BLDC Motor Control Drives, Consumer Audio Products with I2S, IoT Edge Sensor Hubs, Automotive Aftermarket Accessories.
Industrial Control PLCs and HMIs
The ATSAM4SD16CB-ANR is well suited to industrial PLC and HMI designs thanks to its 120 MHz Cortex-M4F core, 1 MB dual-bank Flash for safe firmware upgrades, and the 100-LQFP package that exposes the full EBI for external SRAM/NOR. The chip's industrial -40C to +105C temperature range and integrated USB Device simplify connection to programming port or HMI panel. Typical designs use the chip to drive a TFT LCD via the EBI, scan key matrices through GPIO, and run Modbus RTU on the UARTs with deterministic interrupt latency from the Cortex-M4 NVIC.
Recommandé
USB Data Loggers and POS Terminals
The integrated USB 2.0 Full-Speed Device port with on-chip transceiver makes the ATSAM4SD16CB-ANR an obvious choice for USB data loggers and POS terminals, eliminating the need for an external PHY and saving both BOM cost and PCB area. The 160 KB SRAM can buffer large logging payloads, while the SD/MMC interface (HSMCI) handles removable storage up to 32 GB. Pair with an external crypto-authentication IC for secure firmware-load sessions over USB.
Recommandé
Smart Energy Meters and Building Automation Gateways
Smart energy metering needs accurate ADC sampling, secure firmware, and robust communication - all strengths of the ATSAM4SD16CB-ANR. The 8-channel 10-bit ADC is suitable for voltage and current sensing in single-phase meters, while the Cortex-M4F FPU accelerates the DSP routines used for RMS and power-factor calculations. The dual-bank Flash supports secure OTA firmware upgrades mandated by IEC compliance, and the TRNG plus AES hardware engine provides the cryptographic primitives for signed firmware and TLS handshakes.
Recommandé
BLDC Motor Control Drives
Field-oriented control (FOC) of brushless DC motors demands deterministic PWM generation and fast math - exactly what the ATSAM4SD16CB-ANR provides through its Cortex-M4F core with hardware FPU and DSP extensions. The on-chip 16-bit timer/counter blocks generate complementary 3-phase PWM with hardware dead-time insertion, and the high-speed ADC can be triggered synchronously to PWM edges for phase-current sensing. The 1 MB Flash holds sensorless or encoder-based FOC firmware with headroom for application-layer protocols.
Recommandé
Consumer Audio Products with I2S
The ATSAM4SD16CB-ANR includes two I2S controllers plus the Cortex-M4 DSP instructions, making it a viable controller for consumer audio products such as Bluetooth speakers, sound bars, and headphone amplifiers that decode audio locally. USB Audio Class can be implemented directly via the on-chip USB Device port, streaming PCM at up to 24-bit / 96 kHz to the I2S DAC without an external codec bridge. The wide 1.62-3.6 V supply simplifies direct Li-ion battery operation.
Recommandé
IoT Edge Sensor Hubs
IoT edge hubs require a low-power controller with rich connectivity, secure firmware, and enough Flash to host TLS stacks and Over-The-Air (OTA) update logic - all provided by the ATSAM4SD16CB-ANR. The two TWI (I2C) ports and two SPI ports let the MCU connect to multiple environmental sensors simultaneously, while a UART-based sub-GHz or BLE module transports data to the gateway. The chip's Backup mode drops current consumption into the microamp range between measurements, ideal for battery-powered deployments.
Recommandé
Automotive Aftermarket Accessories
Although not AEC-Q100 qualified, the ATSAM4SD16CB-ANR's extended -40C to +105C temperature range, 1 MB dual-bank Flash, and integrated USB make it a popular choice for automotive aftermarket accessories such as OBD-II scan tools, head-up displays, and infotainment expansion modules. The dual-bank Flash supports safe bootloader-based firmware updates over USB or CAN. Designers should add an external watchdog and TVS protection for the harsh automotive electrical environment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD16CB-ANR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16CB-AN | ATSAM4SA16CB-ANR | ATSAM4SA16CB-AN | ATSAM4SD16CA-AUR | ATSAM4SD16CA-CUR | ATSAM4SD16CA-AU | ATSAM4SD16CA-ANR |
|---|---|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (single-bank) | 1 MB (single-bank) | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (dual-bank) |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB |
| Silicon Revision | MRL B (Revision B) | MRL B | MRL B | MRL B | MRL A (Revision A) | MRL A (Revision A) | MRL A (Revision A) | MRL A (Revision A) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
| USB Device Port | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) |
Principaux différenciateurs
- Revision B (MRL B) silicon with dual-bank Flash for safe in-field firmware upgrades (vs ATSAM4SD16CA-AUR)
- Extended temperature grade -40C to +105C versus -40C to +85C (vs ATSAM4SD16CA-CUR)
- 1 MB Flash with dual-bank versus ATSAM4SA16CB-ANR single-bank architecture (vs ATSAM4SA16CB-ANR)
Notes de conception
The ATSAM4SD16CB-ANR integrates a 1.2 V core LDO regulator that supplies VDDCORE from VDDIO. Per the SAM4S datasheet, place a 10 uF plus 100 nF decoupling pair within 5 mm of each VDDIO/VSSIO pair and a 1 uF plus 10 nF pair on VDDCORE. The internal LDO can deliver the full 120 MHz core current without external pass transistor, so no external FET is required - this is one of the engineering simplifications the SAM4 family offers.
USB DP/DM traces (pins 94, 95) must be routed as a 90 ohm differential pair with no stubs, and VBUS (pin 97) needs an internal pull-down or resistor divider per the SAM4S datasheet. The 32.768 kHz crystal traces (XIN32/XOUT32, pins 87/88) should be kept under 5 mm total and surrounded by a ground guard ring to avoid frequency pulling. Place the main high-frequency crystal (XIN/XOUT, pins 85/86) within 5 mm of the MCU with its load capacitors to ground.
Do not leave the TST pin (pin 90) floating in production - the SAM4S datasheet requires it to be tied low or to VSS for normal operation, otherwise the MCU may enter factory test mode. The NRST pin (pin 89) needs an external 10 kohm pull-up plus a 100 nF capacitor to ground for a clean reset; check that your reset source can drive this RC combination. For bootloader entry via SAM-BA, ensure that the boot pins or ERASE pin sequence is correctly sequenced per the application note.
Estimated: at 120 MHz core clock, full peripheral activity, and 3.3 V VDDIO, the SAM4SD16 family typically dissipates around 80 mW internal power. The 100-LQFP package has a thermal resistance (theta_JA) of approximately 50 C/W on a 4-layer PCB with 1 oz copper pours. This gives a junction-to-ambient temperature rise of about 4 C - well within the -40C to +105C operating range. Always verify with thermal measurement on the final layout if the design runs hot.
When using the external bus interface (EBI) for SRAM/NOR at full clock speed, keep the address, data, and chip-select traces matched to within 25 mm to avoid setup/hold violations. Series damping resistors of 22-33 ohm on each EBI line can be added if the bus load exceeds 30 pF total. Per Microchip's SAM4S application notes, the EBI clock must remain under 80 MHz at 3.3 V to meet the timing requirements of typical 10 ns SRAMs.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer, not automotive safety-critical applications.
