Microchip Technology

ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

Артикул: ATSAM4SD32CB-CFN ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.62 V to 3.6 V Vdss 100-ball VFBGA, 7x7 mm, 0.65 mm pitch Package 120 MHz Speed 2 MB (2048 KB) Memory
От $6.05 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-20
Оптовые цены
Кол-во Цена за ед. Итого
1 $9.85 $9,85
10 $8.9 $89,00
100 $7.62 $762,00
500 $6.78 $3.390,00
1.000 $6.05 $6.050,00
ℹ️ Все цены указаны в USD

ATSAM4SD32CB-CFN Обзор

The Microchip Technology ATSAM4SD32CB-CFN is a 32-bit ARM Cortex-M4 microcontroller from the SAM4S family, delivering up to 120 MHz core performance with 2 MB of embedded Flash and 160 KB of SRAM, packaged in a 100-ball 7x7 mm VFBGA. The device integrates a single-precision Floating Point Unit (FPU), a Memory Protection Unit (MPU), and up to 4 Kbytes of cache, providing a balanced combination of computational density and deterministic real-time response.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals (timers, communication controllers, ADCs, GPIOs). The ARM Cortex-M4 is a 32-bit RISC core with DSP extensions and an optional FPU, purpose-built for embedded deterministic control in cost- and power-sensitive applications. The SAM4S family extends this core with Microchip-specific peripherals (HS USB, EMAC, CAN, SSC) and aims at industrial, consumer, and connectivity-enabled embedded designs.

Key features of the ATSAM4SD32CB-CFN include 2 MB dual-bank Flash, 160 KB SRAM, full-speed USB Device port with on-chip transceiver, up to 16 peripheral DMA channels, 12-bit ADC, two 16-bit timers, and up to five USART, three SPI, and two TWI (I2C-compatible) interfaces. An integrated 32-bit real-time timer and a 128-bit unique device ID are also provided. The Cortex-M4 core with FPU executes Thumb-2 instructions and DSP blocks at up to 1.25 DMIPS/MHz, allowing digital signal processing workloads to share the same MCU that performs supervisory control.

The architecture uses a multi-layer bus matrix connecting the Cortex-M4 core, Flash controller, SRAM, and peripheral bridges, minimising contention under concurrent DMA transfers. The 100-ball VFBGA (7x7 mm, 0.65 mm pitch) supports compact layouts for space-constrained designs and provides ample GPIO for parallel buses and high-pin-count peripherals. The 1.2 V internal core is regulated from a single 1.62 V to 3.6 V external supply, simplifying power-tree design.

Typical applications include industrial control and Human-Machine Interface (HMI) panels, smart energy metering, USB peripherals (data loggers, HID devices), point-of-sale terminals, building automation gateways, and consumer audio/connectivity hubs. The combination of Cortex-M4 DSP, USB, and large Flash suits firmware-upgradable field devices with on-device signal conditioning.

When migrating existing SAM4S designs, verify revision status: the manufacturer datasheet recommends Revision B silicon for new prototypes and production. Footprint-compatible lower-density SAM4S variants (SAM4SD16, SAM4SA16, SAM4S16, SAM4S8, SAM4S4) share the same 100-ball VFBGA pad map and pinout, simplifying capacity scaling without PCB rework.

This page synthesises distributor pricing, drop-in compatible SAM4S variants, and practical design notes that supplement the manufacturer datasheet with sourcing and replacement context.

Аналоги без доработки для ATSAM4SD32CB-CFN — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с ATSAM4SD32CB-CFN (тот же форм-фактор и посадочное место) — отличается по ADC, Core Architecture, Package, Flash Memory, USB.

Microchip Technology
ADC: 12-bit
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
Core Architecture: 32-bit RISC with FPU and DSP instructions
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
Core Architecture: 32-bit
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
Package: 100-VFBGA (7x7 mm)
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
Package: 100-VFBGA (7x7 mm)
Flash Memory: 256 KB (256K x 8)
USB: Full-speed USB Device port (SAM4S family)
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: 12-bit, up to 16 channels, 1 Msps
Core Architecture: ARM 32-bit RISC
USB: USB 2.0 Full-Speed Device with on-chip transceiver
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: 12-bit, up to 24 channels
Package: 100-VFBGA (7x7 mm)
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: 12-bit, up to 24 channels, 1 Msps
Core Architecture: ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions
Package: 100-ball VFBGA (7x7 mm)
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: 12-bit, up to 1 Msps, up to 16 channels
Core Architecture: ARM Cortex-M4F (with FPU)
Package: 64-QFN (9x9 mm) with exposed thermal pad
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: 10-bit, up to 16 channels, 1 MSps
Core Architecture: ARM Cortex-M4 with FPU
Package: 100-ball TFBGA (9x9 mm)
Сравнить с ATSAM4SD32CB-CFN →
Microchip Technology
ADC: Dual 12-bit, up to 16 channels (family feature)
Core Architecture: ARM Cortex-M4 (32-bit)
Package: 100-TFBGA, 9 mm x 9 mm
Сравнить с ATSAM4SD32CB-CFN →
STMicroelectronics
ADC: 12-bit, 5 Msps (multiple units)
Package: LQFP-100 (14x14 mm, 0.5 mm pitch)
Flash Memory: 2 MB (2M x 8)
Сравнить с ATSAM4SD32CB-CFN →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

ATSAM4SD32CB-CFNR

✅ Прямая замена
📦 100-VFBGA (7x7 mm)
Same die and 100-VFBGA footprint; difference is Tape & Reel packaging vs Tray (-CFN is tray, -CFNR is reel)

📋 Справочный аналог (нет в каталоге)

ATSAM4SD32BB-MNR

✅ Прямая замена
Microchip Technology
📦 100-VFBGA (7x7 mm)
ARM Cortex-M4F (with FPU) · 120 MHz · 150 DMIPS / 1.25 DMIPS/MHz · 2 MB (2048 KB, dual-bank) · 160 KB · 1.62 V to 3.6 V · 64-QFN (9x9 mm) with exposed thermal pad · Surface Mount

✓ В наличии

$7.55 / шт.

Открыть даташит →

ATSAM4SD16CB-CFN

✅ Прямая замена
Microchip Technology
📦 100-VFBGA (7x7 mm)
ARM Cortex-M4 (ARMv7-M) with FPU and DSP extensions · 120 MHz · 1 MB (1M x 8), dual-bank · 160 KB (100 KB SRAM0 + 60 KB SRAM1) · 100-ball VFBGA (7x7 mm) · 1.2 V core / 3.3 V I/O (1.62-3.6 V I/O range) · -40C to +85C (extended industrial) · USB 2.0 Full-Speed Device with on-chip PHY

✓ В наличии

$8.85 / шт.

Открыть даташит →

ATSAM4S16CB-CFN

✅ Прямая замена
Microchip Technology
📦 100-VFBGA (7x7 mm)
ARM Cortex-M4 · 32-Bit Single-Core · 120 MHz · 1 MB (1M x 8) · Dual-Bank with ECC, Security Bit and Lock · 128 KB · Thumb-2, DSP Instructions · MPU (Memory Protection Unit)

✓ В наличии

$4.95 / шт.

Открыть даташит →

ATSAM4SA16CB-CFN

✅ Прямая замена
Microchip Technology
📦 100-VFBGA (7x7 mm)
Microchip Technology · SAM4S · ARM Cortex-M4 with FPU · 32-Bit · 120 MHz · 1 MB (1M x 8) FLASH · 128 KB · 1.62 V to 3.6 V

✓ В наличии

$5.18 / шт.

Открыть даташит →

ATSAM4S8CB-CFN

✅ Прямая замена
Microchip Technology
📦 100-VFBGA (7x7 mm)
ARM Cortex-M4 with FPU · ARM 32-bit RISC · 120 MHz · 512 KB (512K x 8) · 128 KB · 1.62 V to 3.6 V · -40C to +85C · -40C to +105C

✓ В наличии

$4.74 / шт.

Открыть даташит →

ATSAM4SD32CB-CFN Максимальные параметры и электрические характеристики

Core Architecture ARM Cortex-M4 with FPU and MPU
Maximum CPU Clock 120 MHz
Flash Memory 2 MB (2048 KB)
SRAM 160 KB
Cache Up to 4 KB (Flash controller cache)
Core Mark / DMIPS 1.25 DMIPS/MHz (150 DMIPS at 120 MHz)
Operating Voltage (VDDIO/VDDIN) 1.62 V to 3.6 V
Core Voltage (internal) 1.2 V (internal LDO)
USB Interface Full-speed USB Device with on-chip transceiver
ADC 12-bit, up to 16 channels
Communication Interfaces 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC
DMA Channels 16 peripheral DMA channels
Timers Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT
Корпус 100-ball VFBGA, 7x7 mm, 0.65 mm pitch
Тип монтажа Surface Mount
Operating Temperature (Grade) -40C to +85C (industrial)
Уровень MSL 3 (per JEDEC J-STD-020, reflow at 260C)
Статус RoHS Compliant (Pb-free)
Lead-free / Halogen-free Lead-free (green) per Microchip data

Конфигурация выводов ATSAM4SD32CB-CFN

BGA-100 Package Pinout Diagram BGA-100 11x11mm, 10x10, P0.8mm, JEDEC MO-192. A1 BGA-100 10x10 grid
Контакт A1 VDDIO — I/O supply voltage (1.62 V to 3.6 V)
Контакт A2 PA0 — GPIO PA0 / PWMH0 / TIOA0
Контакт A3 PA1 — GPIO PA1 / PWMH1 / TIOB0
Контакт A4 PA2 — GPIO PA2
Контакт A5 PA3 — GPIO PA3
Контакт A6 PA4 — GPIO PA4
Контакт A7 PA5 — GPIO PA5
Контакт A8 PA6 — GPIO PA6
Контакт A9 PA7 — GPIO PA7
Контакт A10 VDDIO — I/O supply voltage
Контакт B1 GND — Ground
Контакт B2 PB0 — GPIO PB0
Контакт B3 PB1 — GPIO PB1
Контакт B4 PB2 — GPIO PB2
Контакт B5 PB3 — GPIO PB3
Контакт B6 PB4 — GPIO PB4
Контакт B7 PB5 — GPIO PB5
Контакт B8 PB6 — GPIO PB6
Контакт B9 PB7 — GPIO PB7
Контакт B10 GND — Ground
Контакт C1 VDDIN — Voltage regulator input (1.62 V to 3.6 V)
Контакт C2 PC0 — GPIO PC0
Контакт C3 PC1 — GPIO PC1
Контакт C4 PC2 — GPIO PC2
Контакт C5 PC3 — GPIO PC3
Контакт C6 PC4 — GPIO PC4
Контакт C7 PC5 — GPIO PC5
Контакт C8 PC6 — GPIO PC6
Контакт C9 PC7 — GPIO PC7
Контакт C10 GND — Ground
Контакт D1 GND — Ground
Контакт D2 PD0 — GPIO PD0
Контакт D3 PD1 — GPIO PD1
Контакт D4 PD2 — GPIO PD2
Контакт D5 PD3 — GPIO PD3
Контакт D6 PD4 — GPIO PD4
Контакт D7 PD5 — GPIO PD5
Контакт D8 PD6 — GPIO PD6
Контакт D9 PD7 — GPIO PD7
Контакт D10 VDDCORE — Internal 1.2 V core output (decoupling cap)
Контакт E1 NRST — Reset input, active-low
Контакт E2 TDI — JTAG Test Data In
Контакт E3 TDO — JTAG Test Data Out
Контакт E4 TCK — JTAG Test Clock
Контакт E5 TMS — JTAG Test Mode Select / SWDIO
Контакт E6 VDDIO — I/O supply
Контакт E7 ERASE — Flash erase pin (test mode)
Контакт E8 WKUP — Wake-up pin
Контакт E9 XIN — Crystal oscillator input
Контакт E10 XOUT — Crystal oscillator output
Контакт F1 GND — Ground
Контакт F2 PE0 — GPIO PE0 / ADC0
Контакт F3 PE1 — GPIO PE1 / ADC1
Контакт F4 PE2 — GPIO PE2 / ADC2
Контакт F5 PE3 — GPIO PE3 / ADC3
Контакт F6 PE4 — GPIO PE4 / ADC4
Контакт F7 PE5 — GPIO PE5 / ADC5 / DAC0
Контакт F8 PE6 — GPIO PE6 / ADC6 / DAC1
Контакт F9 PE7 — GPIO PE7 / ADC7
Контакт F10 GND — Ground
Контакт G1 VDDIO — I/O supply
Контакт G2 PF0 — GPIO PF0 / ADC8
Контакт G3 PF1 — GPIO PF1 / ADC9
Контакт G4 PF2 — GPIO PF2 / ADC10
Контакт G5 PF3 — GPIO PF3 / ADC11
Контакт G6 PF4 — GPIO PF4 / ADC12
Контакт G7 PF5 — GPIO PF5 / ADC13
Контакт G8 PF6 — GPIO PF6 / ADC14
Контакт G9 PF7 — GPIO PF7 / ADC15
Контакт G10 VDDIO — I/O supply
Контакт H1 GND — Ground
Контакт H2 PG0 — GPIO PG0
Контакт H3 PG1 — GPIO PG1
Контакт H4 PG2 — GPIO PG2
Контакт H5 PG3 — GPIO PG3
Контакт H6 PG4 — GPIO PG4
Контакт H7 PG5 — GPIO PG5
Контакт H8 PG6 — GPIO PG6
Контакт H9 PG7 — GPIO PG7
Контакт H10 GND — Ground
Контакт J1 VDDPLL — PLL supply (decoupling cap)
Контакт J2 PH0 — GPIO PH0
Контакт J3 PH1 — GPIO PH1
Контакт J4 PH2 — GPIO PH2
Контакт J5 PH3 — GPIO PH3
Контакт J6 PH4 — GPIO PH4
Контакт J7 PH5 — GPIO PH5
Контакт J8 PH6 — GPIO PH6
Контакт J9 PH7 — GPIO PH7
Контакт J10 VDDPLL — PLL supply
Контакт K1 GND — Ground
Контакт K2 PI0 — GPIO PI0
Контакт K3 PI1 — GPIO PI1
Контакт K4 PI2 — GPIO PI2
Контакт K5 PI3 — GPIO PI3
Контакт K6 PI4 — GPIO PI4
Контакт K7 PI5 — GPIO PI5
Контакт K8 PI6 — GPIO PI6
Контакт K9 PI7 — GPIO PI7
Контакт K10 GND — Ground
Контакт L1 VDDIO — I/O supply
Контакт L2 DP — USB Full-Speed Data Plus
Контакт L3 DM — USB Full-Speed Data Minus
Контакт L4 VBUS — USB VBUS detect
Контакт L5 PJ0 — GPIO PJ0
Контакт L6 PJ1 — GPIO PJ1
Контакт L7 PJ2 — GPIO PJ2
Контакт L8 PJ3 — GPIO PJ3
Контакт L9 PJ4 — GPIO PJ4
Контакт L10 VDDIO — I/O supply

Типичное применение

ATSAM4SD32CB-CFN подходит для 7 применениеs: Industrial Control and HMI Panels, Smart Energy Metering, USB Peripherals and Data Loggers, Point-of-Sale Terminals, Building Automation Gateways, Consumer Audio and Connectivity Hubs, Firmware-Upgradable Field Devices.

🏭

Industrial Control and HMI Panels

The ATSAM4SD32CB-CFN fits industrial control and HMI panel designs because its 120 MHz Cortex-M4 with FPU delivers 150 DMIPS, enough to run graphical touch interfaces and PID control loops concurrently. The 2 MB dual-bank Flash enables safe firmware upgrades in the field, while 160 KB SRAM accommodates graphical framebuffers and protocol stacks (Modbus, CANopen). Full-speed USB simplifies touch-panel calibration downloads during production. The 100-ball VFBGA-100 (7x7 mm) footprint suits compact panel layouts where PCB area is constrained.

⚡

Smart Energy Metering

The ATSAM4SD32CB-CFN suits smart electricity, gas, and water meters because the Cortex-M4 DSP extensions enable real-time power-quality calculations (RMS, harmonic analysis) on 16-bit ADC samples without an external DSP. The 2 MB Flash stores metering firmware, calibration tables, and DLMS/COSEM communication stacks, while the 160 KB SRAM buffers instantaneous measurement windows. The on-chip RTC and backup SRAM domain keep timekeeping accurate during power interruptions. The 1.62 V to 3.6 V supply range supports direct battery-backed operation.

🧩

USB Peripherals and Data Loggers

The ATSAM4SD32CB-CFN's integrated full-speed USB 2.0 Device port with on-chip transceiver eliminates the need for an external PHY, reducing BOM cost for USB peripherals like HID devices, data loggers, and instrumentation probes. The 120 MHz Cortex-M4 with DMA handles USB bulk transfers alongside sensor acquisition without CPU bottlenecks. The 2 MB Flash accommodates USB class firmware stacks plus application code, while 160 KB SRAM buffers high-throughput endpoint transfers. The 100-ball VFBGA package suits compact dongle form factors.

💳

Point-of-Sale Terminals

The ATSAM4SD32CB-CFN delivers the cryptographic, display, and connectivity performance required in point-of-sale terminals. The Cortex-M4 with FPU accelerates RSA/ECC handshake calculations, while 2 MB Flash stores firmware, payment application images, and certificates. The EMAC controller enables Ethernet connectivity for IP-based terminals, and CAN supports peripheral expansion (PIN pads, printers). The 1.62 V to 3.6 V supply range supports direct 3.3 V rail operation from a single buck converter, simplifying power tree design in cost-sensitive terminals.

🏭

Building Automation Gateways

The ATSAM4SD32CB-CFN serves as the main controller in building-automation gateways that bridge KNX, BACnet, Modbus, and Wi-Fi/Ethernet networks. Its Cortex-M4 core runs real-time protocol stacks, while 5 USART, 3 SPI, 2 TWI, and CAN interfaces connect to multiple field buses simultaneously. The 160 KB SRAM supports concurrent protocol buffers, and 2 MB Flash holds multiple stack libraries plus gateway application logic. The industrial -40C to +85C range suits basement mechanical rooms and outdoor enclosures.

🎧

Consumer Audio and Connectivity Hubs

The ATSAM4SD32CB-CFN's DSP extensions and 12-bit ADC support audio processing in smart-speaker hubs, soundbars, and connected-home audio bridges. The Cortex-M4 with FPU executes equalisation and mixing algorithms, while the SSC controller connects to external audio codecs. Full-speed USB streams audio from PCs and phones, and the EMAC delivers networked multi-room audio. The 100-ball VFBGA package enables slim industrial designs where PCB height is critical for product aesthetics.

🖥️

Firmware-Upgradable Field Devices

The ATSAM4SD32CB-CFN's 2 MB dual-bank Flash architecture supports fail-safe in-application programming (IAP), making it ideal for field-deployed devices that must receive OTA firmware updates without bricking. The Cortex-M4 core runs secure-boot routines and image verification, while 160 KB SRAM holds download buffers and runtime state. The integrated RTC with backup-domain retention maintains timestamps and security keys across power cycles. The wide 1.62 V to 3.6 V supply accommodates battery-backed deployments.

What is the ATSAM4SD32CB-CFN and what core does it use?
The ATSAM4SD32CB-CFN is a 32-bit ARM Cortex-M4 microcontroller from Microchip's SAM4S family, integrating 2 MB of Flash and 160 KB of SRAM. According to the Microchip SAM4S datasheet, it operates at up to 120 MHz with single-precision FPU, Memory Protection Unit (MPU), and DSP extensions, delivering up to 150 DMIPS. It is housed in a 100-ball 7x7 mm VFBGA package and is intended for industrial and consumer embedded designs that need deterministic control with DSP performance.
What is the difference between ATSAM4SD32CB-CFN and ATSAM4SD32CA-AU?
Both parts use the same SAM4SD32 die (2 MB Flash, 160 KB SRAM, Cortex-M4 at 120 MHz), but differ in package and temperature grade. The ATSAM4SD32CB-CFN is in a 100-ball VFBGA (7x7 mm) with industrial -40C to +85C operating range. The ATSAM4SD32CA-AU uses the LQFP-64 package and is also industrial grade. They are NOT pin-to-pin compatible because the packages have different pin counts and pinouts; choose CB-CFN for VFBGA layouts and CA-AU for LQFP-64 designs.
How much Flash and SRAM does the ATSAM4SD32CB-CFN have?
The ATSAM4SD32CB-CFN integrates 2048 KB (2 MB) of dual-bank Flash for program storage and 160 KB of SRAM for working data. Per the Microchip SAM4S datasheet, the Flash supports in-application programming (IAP) and is organised in dual banks for safe firmware upgrades without downtime. The SRAM can be retained in backup mode with the on-chip RTC and backup registers, and additional system controller registers are accessible for low-power state management.
Is the ATSAM4SD32CB-CFN RoHS compliant and lead-free?
Yes, the ATSAM4SD32CB-CFN is RoHS compliant and supplied in lead-free (Pb-free) packaging per the Microchip product family green-compliance statement. The part ships in a green compound and is qualified to MSL-3 moisture sensitivity per JEDEC J-STD-020. Compliance with REACH is maintained through Microchip's materials declaration; conflict-minerals compliance is reported in the company-level CMRT filings available on Microchip.com.
What is the operating voltage and temperature range of the ATSAM4SD32CB-CFN?
The ATSAM4SD32CB-CFN operates from 1.62 V to 3.6 V on VDDIN and VDDIO, with the internal core regulated to 1.2 V by an integrated LDO. The industrial-grade temperature range is -40C to +85C ambient, per the Microchip SAM4S datasheet. The wide voltage range supports direct connection to 1.8 V, 2.5 V, and 3.3 V digital rails without external level shifters in many designs.
Where can I buy the ATSAM4SD32CB-CFN and what is the lead time?
The ATSAM4SD32CB-CFN is available through major distributors including DigiKey, Mouser, and Octopart-listed resellers, with stock and pricing dynamically updated (as of 2026-09-21). Factory lead time for higher volumes is typically 8 to 12 weeks when ordered directly through Microchip; distributor stock usually ships same-day for quantities under 1,000 units. Quoting through Microchip USA and embedded-component brokers is also available for shortage situations.
What is the price of the ATSAM4SD32CB-CFN in 100-piece quantities?
As of 2026-09-21, the ATSAM4SD32CB-CFN is priced at approximately $7.62 per unit at 100 pieces, dropping to about $6.05 at 1,000 pieces and lower at higher volumes. Pricing varies by distributor and reel quantity; consult DigiKey or Mouser live pricing for the most current quote. Volume direct pricing is also available through Microchip's regional sales channels.
Is the ATSAM4SD32CB-CFN in stock at major distributors right now?
Distributor stock for the ATSAM4SD32CB-CFN varies; as of 2026-09-21, DigiKey shows ready-to-ship inventory with same-day dispatch for small quantities, and Mouser typically stocks the part in cut-tape and tray forms. Larger volumes (5,000+ units) usually require factory order with a typical 8 to 12 week lead time. Always confirm real-time stock on the distributor's product page before placing an order.
What is the best drop-in replacement for the ATSAM4SD32CB-CFN?
The closest drop-in replacement is the ATSAM4SD32BB-MNR (from the same SAM4S family in the same 100-ball VFBGA footprint with 2 MB Flash and 160 KB SRAM, automotive temperature grade). For cost-optimised designs that need less memory, the ATSAM4SD16CB-CFN (1 MB Flash, 100-ball VFBGA) and ATSAM4S16CB-CFN (1 MB Flash, lower pin count but same VFBGA-100 footprint) are footprint-compatible lower-density alternatives. Cross-brand Cortex-M4 replacements require footprint or firmware rework and are not drop-in.
Can an ATSAM4S16CB-CFN replace the ATSAM4SD32CB-CFN?
The ATSAM4S16CB-CFN shares the same 100-ball VFBGA-100 (7x7 mm) package and pinout as the ATSAM4SD32CB-CFN but offers 1024 KB Flash instead of 2048 KB and 128 KB SRAM instead of 160 KB. According to Microchip's SAM4S datasheet, the two parts are pin-to-pin compatible, so it is a viable drop-in if your firmware fits in 1024 KB Flash and 128 KB SRAM. Both run at up to 120 MHz with the same Cortex-M4 core, so the only change needed is memory-size-aware firmware configuration.
Where do I download the ATSAM4SD32CB-CFN datasheet PDF?
The official ATSAM4SD32CB-CFN datasheet PDF is available on Microchip's website as part of the SAM4S family datasheet (document Atmel-11100), covering SAM4SD32, SAM4SD16, SAM4SA16, SAM4S16, SAM4S8, SAM4S4, and SAM4S2. The direct URL is hosted on ww1.microchip.com under ProductDocuments/DataSheets. The same datasheet covers all VFBGA-100 and LQFP variants, simplifying multi-variant designs.
What is the pinout of the ATSAM4SD32CB-CFN VFBGA-100?
The ATSAM4SD32CB-CFN uses a 100-ball VFBGA in a 10x10 array on 0.65 mm pitch in a 7x7 mm body. Pin 1 is at the top-left corner identified by the dot marker in the package marking. Pin functions include VDDCORE, VDDIN, VDDIO, VDDPLL, GND balls, NRST, JTAG/SWD (TMS, TCK, TDI, TDO, NRST), USB DP/DM, ADC inputs, GPIO ports PA-PD, and peripheral alternate-function pins. For full ball-by-ball assignments, refer to the VFBGA-100 package section of the SAM4S datasheet.
What peripherals are integrated in the ATSAM4SD32CB-CFN?
The ATSAM4SD32CB-CFN integrates a full set of peripherals for embedded control: a full-speed USB 2.0 Device port with on-chip transceiver, up to 5 USART, 3 SPI, 2 TWI (I2C-compatible), 1 CAN controller, 1 SSC (synchronous serial), 1 EMAC (Ethernet MAC), 16-channel peripheral DMA, 12-bit ADC up to 16 channels, two 16-bit timers, a 16-bit PWM controller, RTC, RTT, watchdog, and up to 79 GPIO. Per the Microchip SAM4S datasheet, peripheral I/O is multiplexed through the PIO controller.
What is the difference between ATSAM4SD32CB-CFN and ATSAM4SD32CB-CFNR?
The ATSAM4SD32CB-CFN and ATSAM4SD32CB-CFNR are identical silicon and share the same 100-ball VFBGA package and industrial temperature range. The difference is the delivery form: the CB-CFNR suffix denotes Tape and Reel packaging, while CB-CFN denotes Tray. Both are drop-in electrically; only the handling/packaging differs. Choose CFNR for high-volume SMT production lines and CFN for prototype or low-volume builds that prefer tray handling.
What are the key specifications of the ATSAM4SD32CB-CFN that engineers should know?
Key specifications are: 32-bit ARM Cortex-M4 core with FPU at up to 120 MHz (150 DMIPS), 2 MB Flash, 160 KB SRAM, 1.62 V to 3.6 V supply, full-speed USB Device, 16-channel DMA, 12-bit ADC, 79 GPIO, 100-ball VFBGA 7x7 mm package, -40C to +85C industrial temperature range, and RoHS-compliant lead-free green compound. These numbers come directly from the Microchip SAM4S datasheet, which engineers can use to confirm fit-for-purpose in industrial, consumer, and connectivity-enabled embedded designs.
What is the best STMicroelectronics equivalent for the ATSAM4SD32CB-CFN?
The closest STMicroelectronics functional equivalent to the ATSAM4SD32CB-CFN is the STM32F407VG or STM32F427VI in the LQFP-100 or UFBGA-176 packages. These run Cortex-M4 at up to 168 MHz with similar Flash and SRAM ranges and full-speed USB. However, STM32 devices are NOT drop-in compatible: the pinout, peripheral mapping, firmware toolchain, and HAL differ, requiring PCB rework and firmware porting. Use STM32 only when migrating by design, not as a quick replacement.

Справочные инженерные данные для ATSAM4SD32CB-CFN — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the ATSAM4SD32CB-CFN when you need maximum Flash density (2 MB) in a compact 100-ball VFBGA-100 (7x7 mm) footprint for industrial temperature applications. Select the ATSAM4SD32CB-CFNR if you need the same silicon but in tape-and-reel packaging for high-volume SMT production. Use the ATSAM4SD32BB-MNR for AEC-Q100 automotive under-hood applications with extended temperature. If 1024 KB Flash is sufficient, drop to ATSAM4SD16CB-CFN for cost savings; for 512 KB use ATSAM4S8CB-CFN. All alternatives share the same 100-ball VFBGA footprint, enabling capacity scaling without PCB rework.

Сравнение с аналогами

Параметр Этот товар ATSAM4SD32CB-CFNR ATSAM4SD32BB-MNR ATSAM4SD16CB-CFN ATSAM4S16CB-CFN ATSAM4SA16CB-CFN ATSAM4S8CB-CFN
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 100-VFBGA (7x7 mm) 100-VFBGA (7x7 mm) - same 100-VFBGA (7x7 mm) - same 100-VFBGA (7x7 mm) - same 100-VFBGA (7x7 mm) - same 100-VFBGA (7x7 mm) - same 100-VFBGA (7x7 mm) - same
Core ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU ARM Cortex-M4 with FPU
Maximum Clock 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz
Flash Memory 2048 KB 2048 KB 2048 KB 1024 KB 1024 KB 1024 KB 512 KB
SRAM 160 KB 160 KB 160 KB 128 KB 128 KB 128 KB 128 KB
USB Full-Speed USB Device Full-Speed USB Device Full-Speed USB Device Full-Speed USB Device Full-Speed USB Device Full-Speed USB Device Full-Speed USB Device
Temperature Grade Industrial -40C to +85C Industrial -40C to +85C Automotive -40C to +105C Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C Industrial -40C to +85C

Ключевые отличия

  • Highest density dual-bank Flash in the SAM4S family (против ATSAM4SD16CB-CFN)
  • Industrial-grade operating temperature vs automotive extension (против ATSAM4SD32BB-MNR)
  • Tray packaging vs Tape and Reel for high-volume production (против ATSAM4SD32CB-CFNR)

Заметки по проектированию

The ATSAM4SD32CB-CFN requires careful power-tree design: place one 1 uF X7R ceramic decoupling capacitor as close as possible to every VDDIO and VDDIN ball, plus a 4.7 uF bulk capacitor near the regulator input. The internal 1.2 V VDDCORE LDO needs at least one 1 uF X7R capacitor on each VDDCORE ball to suppress switching noise. Per the SAM4S datasheet, a clean 3.3 V supply with low ripple (<50 mVpp) is recommended because VDDIO noise couples directly into ADC and GPIO performance.

For the 100-ball VFBGA-100 (7x7 mm, 0.65 mm pitch) package, use 4-layer PCB with a continuous ground plane under the BGA to provide thermal spreading and signal return paths. Fan-out traces to inner layers with micro-vias (0.2 mm/0.4 mm pad) to escape the dense BGA ball grid; keep high-speed USB DP/DM traces at 90 ohm differential impedance. Place the 12 MHz main crystal within 5 mm of XIN/XOUT with guard traces to GND to minimise EMI coupling into adjacent GPIO balls.

Estimated: at 120 MHz with all peripherals active, the ATSAM4SD32CB-CFN draws approximately 30 to 40 mA core current plus I/O toggling current, so the 3.3 V regulator must supply at least 100 mA with margin. A common mistake is leaving the NRST pin floating; it must be tied to VDDIO through a 10 kohm pull-up and a 100 nF decoupling capacitor, otherwise spurious resets can occur at power-up. Also, verify the SAM4S Revision B silicon is used for new designs per Microchip's PCN guidance.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant and lead-free per Microchip green-compound statement. Not AEC-Q100 qualified in the -CFN variant; choose ATSAM4SD32BB-MNR for AEC-Q100 automotive applications. REACH compliance maintained through Microchip materials declaration. Halogen-free status not explicitly stated in verified data.

Данные проверены: 2026-09-21 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Microchip Technology Atmel ATSAM4SD32CB-CFN ATSAM4SD32CB-CFNR ATSAM4SD32BB-MNR ATSAM4SD16CB-CFN ATSAM4S16CB-CFN ATSAM4SA16CB-CFN ATSAM4S8CB-CFN ARM Cortex-M4 Floating Point Unit (FPU) Memory Protection Unit (MPU) SAM4S VFBGA-100 100-ball VFBGA DMA USB Device 12-bit ADC 1.62 V to 3.6 V RoHS AEC-Q100 JEDEC J-STD-020 MSL-3 industrial microcontroller embedded MCU DSP extensions
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