ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
MPN: ATSAM4SD32CB-CFN ✓ نشطATSAM4SD32CB-CFN نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals (timers, communication controllers, ADCs, GPIOs). The ARM Cortex-M4 is a 32-bit RISC core with DSP extensions and an optional FPU, purpose-built for embedded deterministic control in cost- and power-sensitive applications. The SAM4S family extends this core with Microchip-specific peripherals (HS USB, EMAC, CAN, SSC) and aims at industrial, consumer, and connectivity-enabled embedded designs.
Key features of the ATSAM4SD32CB-CFN include 2 MB dual-bank Flash, 160 KB SRAM, full-speed USB Device port with on-chip transceiver, up to 16 peripheral DMA channels, 12-bit ADC, two 16-bit timers, and up to five USART, three SPI, and two TWI (I2C-compatible) interfaces. An integrated 32-bit real-time timer and a 128-bit unique device ID are also provided. The Cortex-M4 core with FPU executes Thumb-2 instructions and DSP blocks at up to 1.25 DMIPS/MHz, allowing digital signal processing workloads to share the same MCU that performs supervisory control.
The architecture uses a multi-layer bus matrix connecting the Cortex-M4 core, Flash controller, SRAM, and peripheral bridges, minimising contention under concurrent DMA transfers. The 100-ball VFBGA (7x7 mm, 0.65 mm pitch) supports compact layouts for space-constrained designs and provides ample GPIO for parallel buses and high-pin-count peripherals. The 1.2 V internal core is regulated from a single 1.62 V to 3.6 V external supply, simplifying power-tree design.
Typical applications include industrial control and Human-Machine Interface (HMI) panels, smart energy metering, USB peripherals (data loggers, HID devices), point-of-sale terminals, building automation gateways, and consumer audio/connectivity hubs. The combination of Cortex-M4 DSP, USB, and large Flash suits firmware-upgradable field devices with on-device signal conditioning.
When migrating existing SAM4S designs, verify revision status: the manufacturer datasheet recommends Revision B silicon for new prototypes and production. Footprint-compatible lower-density SAM4S variants (SAM4SD16, SAM4SA16, SAM4S16, SAM4S8, SAM4S4) share the same 100-ball VFBGA pad map and pinout, simplifying capacity scaling without PCB rework.
This page synthesises distributor pricing, drop-in compatible SAM4S variants, and practical design notes that supplement the manufacturer datasheet with sourcing and replacement context.
بدائل مباشرة لـ ATSAM4SD32CB-CFN — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAM4SD32CB-CFN (نفس عامل الشكل والبصمة) — يختلف في ADC, Core Architecture, Package, Flash Memory, USB.
ATSAM4SD32CB-CFNR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
ATSAM4SD32BB-MNR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD16CB-CFN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S16CB-CFN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SA16CB-CFN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S8CB-CFN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD32CB-CFN الحدود القصوى والخصائص الكهربائية
| Core Architecture | ARM Cortex-M4 with FPU and MPU |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 160 KB |
| Cache | Up to 4 KB (Flash controller cache) |
| Core Mark / DMIPS | 1.25 DMIPS/MHz (150 DMIPS at 120 MHz) |
| Operating Voltage (VDDIO/VDDIN) | 1.62 V to 3.6 V |
| Core Voltage (internal) | 1.2 V (internal LDO) |
| USB Interface | Full-speed USB Device with on-chip transceiver |
| ADC | 12-bit, up to 16 channels |
| Communication Interfaces | 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC |
| DMA Channels | 16 peripheral DMA channels |
| Timers | Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT |
| العلبة | 100-ball VFBGA, 7x7 mm, 0.65 mm pitch |
| نوع التركيب | Surface Mount |
| Operating Temperature (Grade) | -40C to +85C (industrial) |
| مستوى MSL | 3 (per JEDEC J-STD-020, reflow at 260C) |
| حالة RoHS | Compliant (Pb-free) |
| Lead-free / Halogen-free | Lead-free (green) per Microchip data |
تكوين أطراف ATSAM4SD32CB-CFN
| دبوس A1 | VDDIO — I/O supply voltage (1.62 V to 3.6 V) |
| دبوس A2 | PA0 — GPIO PA0 / PWMH0 / TIOA0 |
| دبوس A3 | PA1 — GPIO PA1 / PWMH1 / TIOB0 |
| دبوس A4 | PA2 — GPIO PA2 |
| دبوس A5 | PA3 — GPIO PA3 |
| دبوس A6 | PA4 — GPIO PA4 |
| دبوس A7 | PA5 — GPIO PA5 |
| دبوس A8 | PA6 — GPIO PA6 |
| دبوس A9 | PA7 — GPIO PA7 |
| دبوس A10 | VDDIO — I/O supply voltage |
| دبوس B1 | GND — Ground |
| دبوس B2 | PB0 — GPIO PB0 |
| دبوس B3 | PB1 — GPIO PB1 |
| دبوس B4 | PB2 — GPIO PB2 |
| دبوس B5 | PB3 — GPIO PB3 |
| دبوس B6 | PB4 — GPIO PB4 |
| دبوس B7 | PB5 — GPIO PB5 |
| دبوس B8 | PB6 — GPIO PB6 |
| دبوس B9 | PB7 — GPIO PB7 |
| دبوس B10 | GND — Ground |
| دبوس C1 | VDDIN — Voltage regulator input (1.62 V to 3.6 V) |
| دبوس C2 | PC0 — GPIO PC0 |
| دبوس C3 | PC1 — GPIO PC1 |
| دبوس C4 | PC2 — GPIO PC2 |
| دبوس C5 | PC3 — GPIO PC3 |
| دبوس C6 | PC4 — GPIO PC4 |
| دبوس C7 | PC5 — GPIO PC5 |
| دبوس C8 | PC6 — GPIO PC6 |
| دبوس C9 | PC7 — GPIO PC7 |
| دبوس C10 | GND — Ground |
| دبوس D1 | GND — Ground |
| دبوس D2 | PD0 — GPIO PD0 |
| دبوس D3 | PD1 — GPIO PD1 |
| دبوس D4 | PD2 — GPIO PD2 |
| دبوس D5 | PD3 — GPIO PD3 |
| دبوس D6 | PD4 — GPIO PD4 |
| دبوس D7 | PD5 — GPIO PD5 |
| دبوس D8 | PD6 — GPIO PD6 |
| دبوس D9 | PD7 — GPIO PD7 |
| دبوس D10 | VDDCORE — Internal 1.2 V core output (decoupling cap) |
| دبوس E1 | NRST — Reset input, active-low |
| دبوس E2 | TDI — JTAG Test Data In |
| دبوس E3 | TDO — JTAG Test Data Out |
| دبوس E4 | TCK — JTAG Test Clock |
| دبوس E5 | TMS — JTAG Test Mode Select / SWDIO |
| دبوس E6 | VDDIO — I/O supply |
| دبوس E7 | ERASE — Flash erase pin (test mode) |
| دبوس E8 | WKUP — Wake-up pin |
| دبوس E9 | XIN — Crystal oscillator input |
| دبوس E10 | XOUT — Crystal oscillator output |
| دبوس F1 | GND — Ground |
| دبوس F2 | PE0 — GPIO PE0 / ADC0 |
| دبوس F3 | PE1 — GPIO PE1 / ADC1 |
| دبوس F4 | PE2 — GPIO PE2 / ADC2 |
| دبوس F5 | PE3 — GPIO PE3 / ADC3 |
| دبوس F6 | PE4 — GPIO PE4 / ADC4 |
| دبوس F7 | PE5 — GPIO PE5 / ADC5 / DAC0 |
| دبوس F8 | PE6 — GPIO PE6 / ADC6 / DAC1 |
| دبوس F9 | PE7 — GPIO PE7 / ADC7 |
| دبوس F10 | GND — Ground |
| دبوس G1 | VDDIO — I/O supply |
| دبوس G2 | PF0 — GPIO PF0 / ADC8 |
| دبوس G3 | PF1 — GPIO PF1 / ADC9 |
| دبوس G4 | PF2 — GPIO PF2 / ADC10 |
| دبوس G5 | PF3 — GPIO PF3 / ADC11 |
| دبوس G6 | PF4 — GPIO PF4 / ADC12 |
| دبوس G7 | PF5 — GPIO PF5 / ADC13 |
| دبوس G8 | PF6 — GPIO PF6 / ADC14 |
| دبوس G9 | PF7 — GPIO PF7 / ADC15 |
| دبوس G10 | VDDIO — I/O supply |
| دبوس H1 | GND — Ground |
| دبوس H2 | PG0 — GPIO PG0 |
| دبوس H3 | PG1 — GPIO PG1 |
| دبوس H4 | PG2 — GPIO PG2 |
| دبوس H5 | PG3 — GPIO PG3 |
| دبوس H6 | PG4 — GPIO PG4 |
| دبوس H7 | PG5 — GPIO PG5 |
| دبوس H8 | PG6 — GPIO PG6 |
| دبوس H9 | PG7 — GPIO PG7 |
| دبوس H10 | GND — Ground |
| دبوس J1 | VDDPLL — PLL supply (decoupling cap) |
| دبوس J2 | PH0 — GPIO PH0 |
| دبوس J3 | PH1 — GPIO PH1 |
| دبوس J4 | PH2 — GPIO PH2 |
| دبوس J5 | PH3 — GPIO PH3 |
| دبوس J6 | PH4 — GPIO PH4 |
| دبوس J7 | PH5 — GPIO PH5 |
| دبوس J8 | PH6 — GPIO PH6 |
| دبوس J9 | PH7 — GPIO PH7 |
| دبوس J10 | VDDPLL — PLL supply |
| دبوس K1 | GND — Ground |
| دبوس K2 | PI0 — GPIO PI0 |
| دبوس K3 | PI1 — GPIO PI1 |
| دبوس K4 | PI2 — GPIO PI2 |
| دبوس K5 | PI3 — GPIO PI3 |
| دبوس K6 | PI4 — GPIO PI4 |
| دبوس K7 | PI5 — GPIO PI5 |
| دبوس K8 | PI6 — GPIO PI6 |
| دبوس K9 | PI7 — GPIO PI7 |
| دبوس K10 | GND — Ground |
| دبوس L1 | VDDIO — I/O supply |
| دبوس L2 | DP — USB Full-Speed Data Plus |
| دبوس L3 | DM — USB Full-Speed Data Minus |
| دبوس L4 | VBUS — USB VBUS detect |
| دبوس L5 | PJ0 — GPIO PJ0 |
| دبوس L6 | PJ1 — GPIO PJ1 |
| دبوس L7 | PJ2 — GPIO PJ2 |
| دبوس L8 | PJ3 — GPIO PJ3 |
| دبوس L9 | PJ4 — GPIO PJ4 |
| دبوس L10 | VDDIO — I/O supply |
التطبيقات النموذجية
ATSAM4SD32CB-CFN مناسب لـ 7 التطبيقs: Industrial Control and HMI Panels, Smart Energy Metering, USB Peripherals and Data Loggers, Point-of-Sale Terminals, Building Automation Gateways, Consumer Audio and Connectivity Hubs, Firmware-Upgradable Field Devices.
Industrial Control and HMI Panels
The ATSAM4SD32CB-CFN fits industrial control and HMI panel designs because its 120 MHz Cortex-M4 with FPU delivers 150 DMIPS, enough to run graphical touch interfaces and PID control loops concurrently. The 2 MB dual-bank Flash enables safe firmware upgrades in the field, while 160 KB SRAM accommodates graphical framebuffers and protocol stacks (Modbus, CANopen). Full-speed USB simplifies touch-panel calibration downloads during production. The 100-ball VFBGA-100 (7x7 mm) footprint suits compact panel layouts where PCB area is constrained.
موصى به
Smart Energy Metering
The ATSAM4SD32CB-CFN suits smart electricity, gas, and water meters because the Cortex-M4 DSP extensions enable real-time power-quality calculations (RMS, harmonic analysis) on 16-bit ADC samples without an external DSP. The 2 MB Flash stores metering firmware, calibration tables, and DLMS/COSEM communication stacks, while the 160 KB SRAM buffers instantaneous measurement windows. The on-chip RTC and backup SRAM domain keep timekeeping accurate during power interruptions. The 1.62 V to 3.6 V supply range supports direct battery-backed operation.
موصى به
USB Peripherals and Data Loggers
The ATSAM4SD32CB-CFN's integrated full-speed USB 2.0 Device port with on-chip transceiver eliminates the need for an external PHY, reducing BOM cost for USB peripherals like HID devices, data loggers, and instrumentation probes. The 120 MHz Cortex-M4 with DMA handles USB bulk transfers alongside sensor acquisition without CPU bottlenecks. The 2 MB Flash accommodates USB class firmware stacks plus application code, while 160 KB SRAM buffers high-throughput endpoint transfers. The 100-ball VFBGA package suits compact dongle form factors.
موصى به
Point-of-Sale Terminals
The ATSAM4SD32CB-CFN delivers the cryptographic, display, and connectivity performance required in point-of-sale terminals. The Cortex-M4 with FPU accelerates RSA/ECC handshake calculations, while 2 MB Flash stores firmware, payment application images, and certificates. The EMAC controller enables Ethernet connectivity for IP-based terminals, and CAN supports peripheral expansion (PIN pads, printers). The 1.62 V to 3.6 V supply range supports direct 3.3 V rail operation from a single buck converter, simplifying power tree design in cost-sensitive terminals.
موصى به
Building Automation Gateways
The ATSAM4SD32CB-CFN serves as the main controller in building-automation gateways that bridge KNX, BACnet, Modbus, and Wi-Fi/Ethernet networks. Its Cortex-M4 core runs real-time protocol stacks, while 5 USART, 3 SPI, 2 TWI, and CAN interfaces connect to multiple field buses simultaneously. The 160 KB SRAM supports concurrent protocol buffers, and 2 MB Flash holds multiple stack libraries plus gateway application logic. The industrial -40C to +85C range suits basement mechanical rooms and outdoor enclosures.
موصى به
Consumer Audio and Connectivity Hubs
The ATSAM4SD32CB-CFN's DSP extensions and 12-bit ADC support audio processing in smart-speaker hubs, soundbars, and connected-home audio bridges. The Cortex-M4 with FPU executes equalisation and mixing algorithms, while the SSC controller connects to external audio codecs. Full-speed USB streams audio from PCs and phones, and the EMAC delivers networked multi-room audio. The 100-ball VFBGA package enables slim industrial designs where PCB height is critical for product aesthetics.
موصى به
Firmware-Upgradable Field Devices
The ATSAM4SD32CB-CFN's 2 MB dual-bank Flash architecture supports fail-safe in-application programming (IAP), making it ideal for field-deployed devices that must receive OTA firmware updates without bricking. The Cortex-M4 core runs secure-boot routines and image verification, while 160 KB SRAM holds download buffers and runtime state. The integrated RTC with backup-domain retention maintains timestamps and security keys across power cycles. The wide 1.62 V to 3.6 V supply accommodates battery-backed deployments.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAM4SD32CB-CFN — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAM4SD32CB-CFNR | ATSAM4SD32BB-MNR | ATSAM4SD16CB-CFN | ATSAM4S16CB-CFN | ATSAM4SA16CB-CFN | ATSAM4S8CB-CFN |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 2048 KB | 2048 KB | 2048 KB | 1024 KB | 1024 KB | 1024 KB | 512 KB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| USB | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device | Full-Speed USB Device |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +105C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
أبرز الفروقات
- Highest density dual-bank Flash in the SAM4S family (مقابلATSAM4SD16CB-CFN)
- Industrial-grade operating temperature vs automotive extension (مقابلATSAM4SD32BB-MNR)
- Tray packaging vs Tape and Reel for high-volume production (مقابلATSAM4SD32CB-CFNR)
ملاحظات التصميم
The ATSAM4SD32CB-CFN requires careful power-tree design: place one 1 uF X7R ceramic decoupling capacitor as close as possible to every VDDIO and VDDIN ball, plus a 4.7 uF bulk capacitor near the regulator input. The internal 1.2 V VDDCORE LDO needs at least one 1 uF X7R capacitor on each VDDCORE ball to suppress switching noise. Per the SAM4S datasheet, a clean 3.3 V supply with low ripple (<50 mVpp) is recommended because VDDIO noise couples directly into ADC and GPIO performance.
For the 100-ball VFBGA-100 (7x7 mm, 0.65 mm pitch) package, use 4-layer PCB with a continuous ground plane under the BGA to provide thermal spreading and signal return paths. Fan-out traces to inner layers with micro-vias (0.2 mm/0.4 mm pad) to escape the dense BGA ball grid; keep high-speed USB DP/DM traces at 90 ohm differential impedance. Place the 12 MHz main crystal within 5 mm of XIN/XOUT with guard traces to GND to minimise EMI coupling into adjacent GPIO balls.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD32CB-CFN draws approximately 30 to 40 mA core current plus I/O toggling current, so the 3.3 V regulator must supply at least 100 mA with margin. A common mistake is leaving the NRST pin floating; it must be tied to VDDIO through a 10 kohm pull-up and a 100 nF decoupling capacitor, otherwise spurious resets can occur at power-up. Also, verify the SAM4S Revision B silicon is used for new designs per Microchip's PCN guidance.
معلومات الامتثال
RoHS compliant and lead-free per Microchip green-compound statement. Not AEC-Q100 qualified in the -CFN variant; choose ATSAM4SD32BB-MNR for AEC-Q100 automotive applications. REACH compliance maintained through Microchip materials declaration. Halogen-free status not explicitly stated in verified data.
